XC6SLX75-3CSG484C - Spartan-6 LX FPGA, 74K Logic Cells, 484-BGA | AMD
N.º da peça: XC6SLX75-3CSG484C ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $168 | $168,00 |
| 10 | $152.5 | $1.525,00 |
| 100 | $138 | $13.800,00 |
| 500 | $124.75 | $62.375,00 |
| 1.000 | $112 | $112.000,00 |
XC6SLX75-3CSG484C Visão geral
What is a Spartan-6 FPGA? The Spartan-6 family is the sixth generation of Xilinx's low-cost, high-volume FPGA line, sitting within the broader taxonomy of programmable logic devices (PLD) -> FPGA -> SRAM-based FPGA -> low-power FPGA. Built on a mature 45 nm process, Spartan-6 devices combine programmable logic fabric, Block RAM, DSP slices, and hard IP cores (clock management, PCIe, memory controllers) into a single die, offering ASIC-like integration at FPGA-like flexibility.
Key features of the XC6SLX75 include 5831 Configurable Logic Blocks (CLBs), up to 309 Kbits of Block RAM, a maximum internal operating frequency of 667 MHz, and 328 user I/O pins. The device is offered in the -3 speed grade (the highest performance tier of the LX family), commercial temperature range (0 to 85 C), and supports supply voltages from 1.2 V core to 3.3 V I/O. Integrated hard IP includes DSP48A1 slices for fixed- and floating-point arithmetic, SelectIO with support for multiple I/O voltages, and a memory controller block for DDR, DDR2, DDR3, and LPDDR.
The LX sub-family is positioned below the LXT (which adds transceivers) and above the Spartan-6 lower-density LX devices. Architecture highlights include 6-input LUTs, dual-port Block RAM with byte-wide parity, and dedicated 18 x 18 multipliers. The 45 nm process yields approximately 50% lower static power than the prior Spartan-3A generation while supporting higher clock rates through dedicated carry chains and pipelined DSP blocks.
Typical applications for the XC6SLX75-3CSG484C include industrial motor control and machine vision, video processing pipelines (display controllers, surveillance DVRs), wireline communication bridges, automotive driver assistance, and consumer display interfaces. The 484-BGA footprint and high I/O count suit designs that need many LVCMOS or LVDS pairs.
When designing with this device, provide multiple decoupling caps around the BGA and follow AMD's PCB layout guidelines for chip-scale BGAs (escape routing for the 1.0 mm pitch grid). Use the ISE Design Suite (iMPACT + ISE Project Navigator) or Vivado (legacy support) for bitstream generation and JTAG programming.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not typically aggregated on DigiKey or Mouser product pages.
Alternativas drop-in para XC6SLX75-3CSG484C — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com XC6SLX75-3CSG484C (mesmo formato e footprint) — diferindo em Package, Process Technology, Speed Grade, Block RAM, Family.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
XC6SLX75-3CSG484I
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
XC6SLX75-2CSG484C
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
XC6SLX75-3NCSG484C
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
XC6SLX75T-3CSG484C
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
XC6SLX100-3CSG484C
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
XC6SLX45-3FGG484C
✅ Drop-In✓ Em estoque
$12.1 / unidade
Ver ficha técnica →XC6SLX75-3CSG484C Classificações máximas e características elétricas
| Family | Spartan-6 LX |
| Logic Cells | 74,637 |
| System Gates | 3,170,304 |
| Configurable Logic Blocks (CLBs) | 5,831 |
| Maximum Internal Frequency | 667 MHz |
| Block RAM | 309 Kbits (1728 Kbits) |
| DSP Slices | 132 (DSP48A1) |
| User I/O Pins | 328 |
| Speed Grade | -3 (highest performance) |
| Temperatura de operação | 0 C to 85 C (Commercial) |
| Tensão de alimentação | 1.2 V core, 1.2 V-3.3 V I/O |
| Encapsulamento | 484-ball CSBGA (CSPBGA), 23 x 23 mm, 1.0 mm pitch |
| Tipo de montagem | Surface Mount |
| Process Technology | 45 nm low-power CMOS |
| Status RoHS | Compliant |
Configuração de pinos do XC6SLX75-3CSG484C
| Pino A1 | GND — Ground reference |
| Pino A2 | IO_L1N_0 — I/O bank 0, pair N, logic location L1 |
| Pino B1 | VCCAUX — Auxiliary supply (2.5 V or 3.3 V) |
| Pino B2 | IO_L1P_0 — I/O bank 0, pair P, logic location L1 |
| Pino C1 | IO_L2N_0 — I/O bank 0, pair N |
| Pino C2 | IO_L2P_0 — I/O bank 0, pair P |
| Pino D1 | VCCO_0 — I/O bank 0 supply voltage |
| Pino D2 | IO_L3N_0 — I/O bank 0, pair N |
| Pino E1 | IO_L3P_0 — I/O bank 0, pair P |
| Pino E2 | VCCINT — Internal core supply (1.2 V) |
Aplicações típicas
XC6SLX75-3CSG484C é adequado para 7 aplicaçãos: Industrial Motor Control and Drives, Video Surveillance and Machine Vision, Display Controllers and Video Walls, Wireline Communication Bridges, Automotive Driver Assistance (ADAS) Prototyping, Consumer Display and Home Entertainment, Industrial IoT Edge Gateways.
Industrial Motor Control and Drives
The XC6SLX75-3CSG484C fits industrial motor control because its 132 DSP48A1 slices handle field-oriented control (FOC) math for 3-phase inverters at high PWM rates, while 328 user I/Os support encoder feedback, hall sensors, and multi-axis PWM outputs. The -3 speed grade sustains 100+ MHz system clocks needed for sub-microsecond current-loop updates. Designers typically instantiate 4-6 motor control IP cores in a single LX75, integrating the entire drive on one FPGA.
Recomendado
Video Surveillance and Machine Vision
The XC6SLX75's 309 Kbits of Block RAM buffers video line data while 132 DSP slices perform real-time image processing (filtering, edge detection, motion estimation). With 328 I/Os the LX75 can ingest parallel camera data, drive HDMI/DVI outputs, and interface to DDR2 memory buffers. The -3 speed grade comfortably hits pixel-clock rates up to 150 MHz for 1080p60 pipelines.
Recomendado
Display Controllers and Video Walls
The LX75's 328 I/Os and SelectIO support multiple LVDS pairs, enabling direct connection to LCD panels, multi-display video walls, and projected-capacitive touch overlays. Block RAM serves as frame buffer while DSP slices handle color space conversion and scaler pipelines. The 45 nm process keeps power low enough for embedded display units without active cooling.
Recomendado
Wireline Communication Bridges
For protocol bridging applications (SPI to Ethernet, UART to PCIe, CAN-FD to LVDS), the XC6SLX75-3CSG484C implements multiple soft cores simultaneously thanks to 5,831 CLBs and 132 DSP slices. The 484-CSBGA package is commonly used in telecom line-card designs where pin density matters. AMD's Ethernet MAC and PCIe soft-IP cores port cleanly to the LX75.
Recomendado
Automotive Driver Assistance (ADAS) Prototyping
For ADAS proof-of-concept and pre-production, the XC6SLX75-3CSG484C implements sensor-fusion pre-processing at the -3 speed grade. 328 I/Os aggregate multiple camera and radar front-ends, while DSP48A1 slices execute fixed-point FFT and Kalman filters. Note that production automotive deployments typically migrate to automotive-qualified families; the LX75 here is used in development and rapid-prototyping roles.
Recomendado
Consumer Display and Home Entertainment
Consumer set-top boxes, media streamers, and projection systems benefit from the LX75's balance of logic, memory, and DSP at low cost. The 484-CSBGA package integrates cleanly with HDMI receivers, audio DACs, and Wi-Fi/Bluetooth modules. Designers leverage the LX75 for video scaling, deinterlacing, and audio mixing while an external host handles UI rendering.
Recomendado
Industrial IoT Edge Gateways
The XC6SLX75-3CSG484C serves as the protocol-conversion brain in industrial IoT gateways, where 5,831 CLBs handle multiple Modbus, PROFINET, EtherCAT, and OPC-UA stacks concurrently. 328 I/Os accept digital and analog field inputs, while the LX75's low static power keeps the gateway in fan-less enclosures. The -3 grade delivers headroom for real-time control loops over Ethernet.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para XC6SLX75-3CSG484C — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | XC6SLX75-3CSG484I | XC6SLX75-2CSG484C | XC6SLX75-3NCSG484C | XC6SLX75T-3CSG484C | XC6SLX100-3CSG484C |
|---|---|---|---|---|---|---|
| Package | 484-ball CSBGA (23 x 23 mm, 1.0 mm pitch) | 484-ball CSBGA - same | 484-ball CSBGA - same | 484-ball CSBGA - same | 484-ball CSBGA - same | 484-ball CSBGA - same |
| Brand | AMD / Xilinx | AMD / Xilinx | AMD / Xilinx | AMD / Xilinx | AMD / Xilinx | AMD / Xilinx |
| Logic Cells | 74,637 | 74,637 (same) | 74,637 (same) | 74,637 (same) | 74,637 (same) | 101,261 (+36%) |
| Speed Grade | -3 (highest) | -3 (same) | -2 (~10-15% lower Fmax) | -3N (encryption, similar Fmax) | -3 (same) | -3 (same) |
| Operating Temperature | 0 C to 85 C (Commercial) | -40 C to +100 C (Industrial) | 0 C to 85 C (same) | 0 C to 85 C (same) | 0 C to 85 C (same) | 0 C to 85 C (same) |
| Block RAM | 309 Kbits | 309 Kbits (same) | 309 Kbits (same) | 309 Kbits (same) | 309 Kbits (same) | 319 Kbits (+3%) |
| DSP48A1 Slices | 132 | 132 (same) | 132 (same) | 132 (same) | 132 (same) | 180 (+36%) |
| User I/O Pins | 328 | 328 (same) | 328 (same) | 328 (same) | 328 (same) | 338 (+3%) |
| Serial Transceivers | None (LX sub-family) | None (LX) | None (LX) | None (LX) | 4x GTP up to 3.2 Gbps (LXT) | None (LX) |
Principais diferenciais
- Highest performance -3 speed grade in Spartan-6 LX family (vs XC6SLX75-2CSG484C)
- Commercial temperature range for cost-sensitive designs (vs XC6SLX75-3CSG484I)
- 74,637 logic cells with 132 DSP slices in 484-CSBGA (vs XC6SLX45-3FGG484C)
Notas de projeto
The 484-ball CSBGA uses a 1.0 mm ball pitch, which requires 4-layer (minimum) PCB routing with micro-via escape. Follow AMD's UG12736 PCB design guide for Spartan-6: place at least 8-10 decoupling capacitors (100 nF, 10 uF bulk) within 5 mm of the BGA footprint, route VCCINT and VCCAUX on dedicated power planes, and use guard traces between high-speed differential pairs. Estimated: with 2 oz copper on outer layers and 1 oz on inner layers, a 6-layer stack-up is recommended for designs exceeding 150 MHz I/O rates.
Spartan-6 LX requires four supply rails: VCCINT (1.2 V core), VCCAUX (2.5 V or 3.3 V auxiliary), VCCO_0..VCCO_3 (per-bank I/O voltage, 1.2 V-3.3 V), and a separate VCC_BATT or VBATT for battery-backed RAM if used. Power-on sequencing is flexible; consult DS162 for the recommended sequence (VCCINT before VCCAUX before VCCO, or simultaneous within 50 ms). Estimated: with 50% logic utilization and 100 MHz clock, the LX75 draws approximately 300-500 mA from VCCINT; use the Xilinx Power Estimator spreadsheet for design-specific budgeting.
Common pitfalls when designing with the XC6SLX75-3CSG484C include: (1) using the wrong ISE/Vivado version - Spartan-6 is supported only in ISE 14.7 and Vivado with legacy devices; (2) ignoring the JTAG TAP chain when sharing pins with user I/O; (3) omitting the DONE and INIT pins pull-ups required for configuration reliability; (4) using the wrong bitstream format (.bit vs .bin vs .mcs) for the chosen configuration mode (Master SPI, Slave Serial, JTAG). Source: AMD Spartan-6 configuration user guide UG380.
Informações de conformidade
RoHS compliance per AMD/Xilinx product page. Not AEC-Q100 qualified; for automotive AEC-Q100 applications use Xilinx XA6SLX75-2CSG484I or a newer automotive-grade part. Halogen-free status not explicitly stated in provided data.
