XC7A50T-2FGG484I - Artix-7 FPGA, 250 I/O | AMD
N.º da peça: XC7A50T-2FGG484I ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $35.81 | $35,81 |
| 10 | $33.5 | $335,00 |
| 100 | $31.2 | $3.120,00 |
| 500 | $29 | $14.500,00 |
| 1.000 | $27.5 | $27.500,00 |
XC7A50T-2FGG484I Visão geral
An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer after manufacturing to implement arbitrary digital logic functions. FPGAs sit within the broader category of programmable logic devices (PLDs), which are themselves a subset of application-specific integrated circuits (ASICs) but with the key advantage of reconfigurability. The Artix-7 family is positioned as the low-cost, high-performance-per-watt tier within the Xilinx 7-series, balancing logic density, DSP capability, and transceiver performance for cost-sensitive applications.
Key features include 150 DSP48E1 slices for high-speed signal processing, 5 clock management tiles (CMTs) with MMCM and PLL, and support for multiple I/O standards including LVCMOS, LVDS, and HSTL. The device integrates analog mixed-signal (AMS) blocks for on-chip voltage and temperature monitoring. The FGG484 package provides a 23x23mm footprint with 1.0mm ball pitch, enabling moderate-density PCB designs without requiring advanced manufacturing processes.
Architecturally, the Artix-7 fabric is built on a 28nm high-k metal gate (HKMG) process, delivering up to 2.9 Tb/s of aggregate I/O bandwidth. The configurable logic blocks (CLBs) contain 8 6-input LUTs and 16 flip-flops each, providing flexible logic implementation. The block RAM is organized as 36Kb dual-port blocks that can be cascaded or split into two independent 18Kb blocks, supporting various memory configurations.
Typical applications include motor control, industrial networking, software-defined radio, medical imaging, and low-cost video processing. The 250 I/Os and 150 DSP slices make it well-suited for real-time signal processing and interface bridging. The industrial temperature grade ensures reliable operation in harsh environments.
When designing with this device, ensure adequate decoupling on all power rails (VCCINT, VCCAUX, VCCO) and follow AMD's power-on sequencing requirements. The configuration bitstream can be stored in external SPI flash or loaded via JTAG, with support for multi-boot and fallback configurations.
Alternativas drop-in para XC7A50T-2FGG484I — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com XC7A50T-2FGG484I (mesmo formato e footprint) — diferindo em Block RAM, Logic Cells, Process Technology, Operating Temperature, Package.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
XC7A50T-2FGG484C
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
XC7A50T-1FGG484I
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
XC7A50T-1FGG484C
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
XC7A75T-2FGG484I
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$59.89 / unidade
Ver ficha técnica →XC7A100T-2FGG484I
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$45.9375 / unidade
Ver ficha técnica →XC7A50T-2FGG484I Classificações máximas e características elétricas
| Family | Artix-7 |
| Logic Cells | 52160 |
| Block RAM | 2764800 bits |
| DSP Slices | 150 |
| Number of I/Os | 250 |
| Encapsulamento | 484-BBGA (FGG484) |
| Core Supply Voltage | 0.95 V to 1.05 V |
| Temperatura de operação | -40°C to +100°C |
| Speed Grade | -2 |
| Configuration | SRAM-based, external SPI flash or JTAG |
| Clock Management | 5 CMTs (MMCM/PLL) |
| I/O Standards | LVCMOS, LVDS, HSTL, SSTL |
| Process Technology | 28nm HKMG |
| Status RoHS | Compliant |
| Tipo de montagem | Surface Mount |
Configuração de pinos do XC7A50T-2FGG484I
| Pino A1 | IO_L1P_T0 — User I/O bank 0, differential pair P |
| Pino A2 | IO_L1N_T0 — User I/O bank 0, differential pair N |
| Pino B1 | IO_L2P_T0 — User I/O bank 0, differential pair P |
| Pino B2 | IO_L2N_T0 — User I/O bank 0, differential pair N |
| Pino C1 | VCCINT — Core logic power supply (1.0V) |
| Pino C2 | GND — Ground |
| Pino D1 | VCCAUX — Auxiliary power supply (1.8V) |
| Pino D2 | VCCO_0 — I/O bank 0 power supply |
| Pino E1 | IO_L3P_T0 — User I/O bank 0, differential pair P |
| Pino E2 | IO_L3N_T0 — User I/O bank 0, differential pair N |
| Pino F1 | IO_L4P_T0 — User I/O bank 0, differential pair P |
| Pino F2 | IO_L4N_T0 — User I/O bank 0, differential pair N |
Aplicações típicas
XC7A50T-2FGG484I é adequado para 6 aplicaçãos: Motor Control, Industrial Networking, Software-Defined Radio, Medical Imaging, Video Processing, Test and Measurement.
Motor Control
The XC7A50T-2FGG484I is ideal for motor control applications due to its 150 DSP slices and 250 I/Os, which enable high-speed PWM generation and encoder feedback processing. The industrial temperature range ensures reliable operation in factory environments. The FPGA's parallel processing capability allows multiple motor axes to be controlled simultaneously with deterministic timing, improving system performance and reducing CPU load.
Recomendado
Industrial Networking
The XC7A50T-2FGG484I supports industrial networking protocols like EtherCAT and PROFINET through its 250 I/Os and high-speed transceivers. The FPGA can implement protocol stacks in hardware, providing low-latency and deterministic communication. The 2.7 Mb block RAM is sufficient for packet buffering, while the 150 DSP slices handle CRC and error checking. This makes it suitable for real-time control networks in factory automation.
Recomendado
Software-Defined Radio
The XC7A50T-2FGG484I is well-suited for software-defined radio (SDR) applications due to its 150 DSP slices and 2.7 Mb block RAM, which enable digital down-conversion, filtering, and demodulation. The 250 I/Os interface with high-speed ADCs and DACs, while the 5 CMTs provide flexible clock generation. The industrial temperature range supports deployment in harsh RF environments, and the low power consumption of the 28nm process is ideal for portable SDR systems.
Recomendado
Medical Imaging
The XC7A50T-2FGG484I is used in medical imaging systems such as ultrasound and CT scanners for real-time signal processing. The 150 DSP slices handle beamforming and image filtering, while the 2.7 Mb block RAM stores intermediate results. The 250 I/Os interface with image sensors and display controllers. The industrial temperature range ensures reliable operation in clinical environments, and the FPGA's reconfigurability allows for algorithm updates without hardware changes.
Recomendado
Video Processing
The XC7A50T-2FGG484I is suitable for low-cost video processing applications such as surveillance cameras and video conferencing systems. The 250 I/Os support multiple video input/output standards, while the 150 DSP slices handle color space conversion and scaling. The 2.7 Mb block RAM is used for line buffers and frame storage. The industrial temperature range allows deployment in outdoor security cameras, and the FPGA's parallel architecture enables real-time processing of multiple video streams.
Recomendado
Test and Measurement
The XC7A50T-2FGG484I is used in test and measurement equipment such as oscilloscopes and logic analyzers for high-speed data acquisition and triggering. The 250 I/Os interface with high-speed ADCs, while the 150 DSP slices implement digital triggering and signal analysis. The 2.7 Mb block RAM stores acquisition buffers. The industrial temperature range ensures stable operation in lab environments, and the FPGA's reconfigurability allows for firmware updates to add new measurement features.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para XC7A50T-2FGG484I — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | XC7A50T-2FGG484C | XC7A50T-1FGG484I | XC7A50T-1FGG484C | XC7A75T-2FGG484I | XC7A100T-2FGG484I |
|---|---|---|---|---|---|---|
| Package | 484-BBGA (FGG484) | 484-BBGA (FGG484) - same | 484-BBGA (FGG484) - same | 484-BBGA (FGG484) - same | 484-BBGA (FGG484) - same | 484-BBGA (FGG484) - same |
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Logic Cells | 52160 | 52160 | 52160 | 52160 | 75520 | 101440 |
| Block RAM | 2764800 bits | 2764800 bits | 2764800 bits | 2764800 bits | 3870720 bits | 4866048 bits |
| DSP Slices | 150 | 150 | 150 | 150 | 180 | 240 |
| Number of I/Os | 250 | 250 | 250 | 250 | 285 | 285 |
| Speed Grade | -2 | -2 | -1 | -1 | -2 | -2 |
| Temperature Grade | Industrial (-40°C to +100°C) | Commercial (0°C to +85°C) | Industrial (-40°C to +100°C) | Commercial (0°C to +85°C) | Industrial (-40°C to +100°C) | Industrial (-40°C to +100°C) |
Principais diferenciais
- Industrial temperature grade (vs XC7A50T-2FGG484C)
- Faster -2 speed grade (vs XC7A50T-1FGG484I)
- Cost-optimized logic density (vs XC7A100T-2FGG484I)
Notas de projeto
The XC7A50T-2FGG484I requires multiple power rails: VCCINT (1.0V), VCCAUX (1.8V), and VCCO (per I/O bank). Use a dedicated power management IC or LDOs with proper sequencing. AMD recommends powering VCCINT first, followed by VCCAUX and VCCO. Ensure adequate decoupling with 100nF and 10uF capacitors on each rail.
The FGG484 package has a 1.0mm ball pitch, requiring careful PCB layout. Use 4-layer or more boards with dedicated power and ground planes. Route high-speed signals with controlled impedance (50 ohm single-ended, 100 ohm differential). Place decoupling capacitors as close to the FPGA power pins as possible to minimize inductance.
The XC7A50T-2FGG484I can dissipate significant power under heavy logic utilization. The industrial temperature grade allows operation up to +100°C junction temperature. Use a thermal pad or heatsink if power dissipation exceeds 2W. Ensure adequate airflow in the enclosure to maintain junction temperature within limits.
Informações de conformidade
RoHS compliant per distributor listings. Not AEC-Q100 qualified as it is an FPGA, not an automotive-grade IC.
