EP3C25F324C6N vs EP3C25F324C7N Сравнение
Подробное сравнение бок о бок EP3C25F324C6N от Intel и EP3C25F324C7N от Intel. Сравните ключевые характеристики, электрические параметры, упаковку, статус жизненного цикла, цены и наличие, чтобы выбрать лучший компонент для ваших требований.
Сравнение характеристик
| Параметр | EP3C25F324C6N | EP3C25F324C7N |
|---|---|---|
| Бренд | Intel | Intel |
| Категория | FPGA & CPLD | FPGA & CPLD |
| Статус жизненного цикла | Активен | Активен |
| Наличие | In Stock | In Stock |
| Цена за единицу (USD) | $62,30 | $0,00 |
| Series | Cyclone III | — |
| Family | Cyclone III (low-power, low-cost FPGA) | — |
| Logic Elements (LE) | 24,624 | — |
| Total Memory Bits | 608,256 bits | — |
| Embedded Memory Blocks | M9K blocks, 66 total | — |
| Embedded Multipliers | 66 (18x18) | — |
| DSP Blocks | 66 dedicated 18x18 multipliers | — |
| User I/O Pins | 215 | — |
| Number of I/O Banks | 8 | — |
| PLLs | 4 general-purpose PLLs | — |
| Корпус | 324-BGA (FBGA-324), fine-pitch | 324-ball FBGA |
| Speed Grade | C6 (commercial) | — |
| Рабочая температура | 0C to +85C (commercial) | — |
| Process Technology | TSMC 65 nm low-power (LP) | 65 nm |
| Configuration Schemes | Passive Serial, Fast Passive Parallel, JTAG | — |
| Lead-Free / RoHS | Yes (lead-free, RoHS compliant) | — |
| Тип монтажа | Surface Mount | Surface Mount |
| Product Type | — | Field Programmable Gate Array (FPGA) |
| Device Family | — | Cyclone III |
| Logic Cells | — | 24,624 cells |
| Embedded Memory | — | 608,256 bits |
| Available I/O Pins | — | 215 I/O |
| Maximum Listed Frequency | — | 437.5 MHz |
| Core Voltage | — | 1.2 V |
| Terminal Count | — | 324 terminals |
| Terminal Form | — | Ball |
| Package Code | — | BGA |
| Package Shape | — | Rectangular |
| Temperature Grading | — | Other |
| Programmability | — | Field programmable |
| Статус RoHS | — | [DATA_NEEDED: RoHS status] |
| REACH Status | — | [DATA_NEEDED: REACH status] |
| AEC-Q100 Qualification | — | [DATA_NEEDED: AEC-Q100 qualification] |