EP3C25F324C6N vs EP3C25F324C7N 对比

详细并排对比 EP3C25F324C6N 出自 Intel 和 EP3C25F324C7N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Intel
EP3C25F324C7N EP3C25F324C7N - 24,624-Cell Cyclone III FPGA | Intel

EP3C25F324C7N - 24,624-Cell Cyclone III FPGA | Intel

EP3C25F324C7N ✓ 量产中

规格对比

参数 EP3C25F324C6N EP3C25F324C7N
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $62.30 $0.00
Series Cyclone III —
Family Cyclone III (low-power, low-cost FPGA) —
Logic Elements (LE) 24,624 —
Total Memory Bits 608,256 bits —
Embedded Memory Blocks M9K blocks, 66 total —
Embedded Multipliers 66 (18x18) —
DSP Blocks 66 dedicated 18x18 multipliers —
User I/O Pins 215 —
Number of I/O Banks 8 —
PLLs 4 general-purpose PLLs —
封装 324-BGA (FBGA-324), fine-pitch 324-ball FBGA
Speed Grade C6 (commercial) —
工作温度 0C to +85C (commercial) —
Process Technology TSMC 65 nm low-power (LP) 65 nm
Configuration Schemes Passive Serial, Fast Passive Parallel, JTAG —
Lead-Free / RoHS Yes (lead-free, RoHS compliant) —
安装类型 Surface Mount Surface Mount
Product Type — Field Programmable Gate Array (FPGA)
Device Family — Cyclone III
Logic Cells — 24,624 cells
Embedded Memory — 608,256 bits
Available I/O Pins — 215 I/O
Maximum Listed Frequency — 437.5 MHz
Core Voltage — 1.2 V
Terminal Count — 324 terminals
Terminal Form — Ball
Package Code — BGA
Package Shape — Rectangular
Temperature Grading — Other
Programmability — Field programmable
RoHS 状态 — [DATA_NEEDED: RoHS status]
REACH Status — [DATA_NEEDED: REACH status]
AEC-Q100 Qualification — [DATA_NEEDED: AEC-Q100 qualification]

数据手册与资源

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