EP3SE260H780I4 vs EP3SE260H780C4L Сравнение
Подробное сравнение бок о бок EP3SE260H780I4 от Intel и EP3SE260H780C4L от Intel. Сравните ключевые характеристики, электрические параметры, упаковку, статус жизненного цикла, цены и наличие, чтобы выбрать лучший компонент для ваших требований.
Сравнение характеристик
| Параметр | EP3SE260H780I4 | EP3SE260H780C4L |
|---|---|---|
| Бренд | Intel | Intel |
| Категория | FPGA & CPLD | FPGA & CPLD |
| Статус жизненного цикла | NRND | NRND |
| Наличие | In Stock | In Stock |
| Цена за единицу (USD) | $1.390,00 | $1.190,00 |
| Family | Stratix III Enhanced (Stratix III E) | Stratix III E |
| Logic Elements | 255,000 | 255,000 |
| Logic Cells | 255,000 | — |
| Logic Array Blocks (LABs) | 10,200 | — |
| Adaptive Logic Modules (ALMs) | approximately 203,200 | — |
| Maximum User I/Os | 488 | — |
| Process Technology | 65 nm CMOS | — |
| Core Voltage | 1.1 V | 0.9 V (nominal) |
| Embedded RAM (total) | approximately 14.4 Mbit (M9K/M144K blocks) | — |
| DSP Blocks | approximately 768 (18x18 multipliers) | — |
| Maximum Operating Frequency | up to 450 MHz core / 717 MHz per Partstack record | — |
| Корпус | 780-ball FC-HFBGA (HBGA) | 780-ball FCBGA (HBGA 33x33 mm) |
| Рабочая температура | -40C to +100C (industrial, 'I' grade) | — |
| Speed Grade | 4 | C4 (middle/slow tier) |
| Тип монтажа | Surface Mount (BGA) | Surface Mount (flip-chip BGA) |
| Configuration Schemes | JTAG, Passive Serial, Fast Passive Parallel, Active Serial | — |
| Статус RoHS | [DATA_NEEDED: RoHS compliance status] | Compliant (lead-free per datasheet) |
| LABs/CLBs | — | 10,200 |
| Total RAM Bits | — | 16,672,768 (16.7 Mbit) |
| User I/O Count | — | 488 |
| Рабочая температура перехода | — | 0C to +85C (commercial) |
| Уровень MSL | — | [DATA_NEEDED: MSL level] |
| Transceivers | — | Up to 24 multi-gigabit transceivers |
| Memory Interface | — | DDR3, DDR2, QDRII+, RLDRAM II controllers |
| Configuration Mode | — | PS, FPP, JTAG with EPCS/EPCQ |