EP3SE260H780I4 vs EP3SE260H780C4L 비교
다음의 상세 나란히 비교: EP3SE260H780I4 제조: Intel 및 EP3SE260H780C4L 제조: Intel. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
사양 비교
| 파라미터 | EP3SE260H780I4 | EP3SE260H780C4L |
|---|---|---|
| 브랜드 | Intel | Intel |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | NRND | NRND |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $1,390.00 | $1,190.00 |
| Family | Stratix III Enhanced (Stratix III E) | Stratix III E |
| Logic Elements | 255,000 | 255,000 |
| Logic Cells | 255,000 | — |
| Logic Array Blocks (LABs) | 10,200 | — |
| Adaptive Logic Modules (ALMs) | approximately 203,200 | — |
| Maximum User I/Os | 488 | — |
| Process Technology | 65 nm CMOS | — |
| Core Voltage | 1.1 V | 0.9 V (nominal) |
| Embedded RAM (total) | approximately 14.4 Mbit (M9K/M144K blocks) | — |
| DSP Blocks | approximately 768 (18x18 multipliers) | — |
| Maximum Operating Frequency | up to 450 MHz core / 717 MHz per Partstack record | — |
| 패키지 | 780-ball FC-HFBGA (HBGA) | 780-ball FCBGA (HBGA 33x33 mm) |
| 동작 온도 | -40C to +100C (industrial, 'I' grade) | — |
| Speed Grade | 4 | C4 (middle/slow tier) |
| 실장 유형 | Surface Mount (BGA) | Surface Mount (flip-chip BGA) |
| Configuration Schemes | JTAG, Passive Serial, Fast Passive Parallel, Active Serial | — |
| RoHS 상태 | [DATA_NEEDED: RoHS compliance status] | Compliant (lead-free per datasheet) |
| LABs/CLBs | — | 10,200 |
| Total RAM Bits | — | 16,672,768 (16.7 Mbit) |
| User I/O Count | — | 488 |
| 동작 접합 온도 | — | 0C to +85C (commercial) |
| MSL 레벨 | — | [DATA_NEEDED: MSL level] |
| Transceivers | — | Up to 24 multi-gigabit transceivers |
| Memory Interface | — | DDR3, DDR2, QDRII+, RLDRAM II controllers |
| Configuration Mode | — | PS, FPP, JTAG with EPCS/EPCQ |