MPC875ZT66 vs MPC875VR66 Сравнение
Подробное сравнение бок о бок MPC875ZT66 от NXP Semiconductors и MPC875VR66 от NXP Semiconductors. Сравните ключевые характеристики, электрические параметры, упаковку, статус жизненного цикла, цены и наличие, чтобы выбрать лучший компонент для ваших требований.
NXP Semiconductors
MPC875ZT66 - 66MHz 32-Bit PowerQUICC Processor | NXP
MPC875ZT66 ✗ Снят с производстваNXP Semiconductors
MPC875VR66 - 66MHz PowerQUICC MPC8xx 32-Bit MPU | NXP
MPC875VR66 ⚠ Последняя закупкаСравнение характеристик
| Параметр | MPC875ZT66 | MPC875VR66 |
|---|---|---|
| Бренд | NXP Semiconductors | NXP Semiconductors |
| Категория | Microcontrollers | Microcontrollers |
| Статус жизненного цикла | Снято с производства | Последняя закупка |
| Processor Type | MPC8xx communications processor | — |
| Architecture | Power Architecture | — |
| Core Count | 1 core | — |
| Data Width | 32-bit | — |
| Максимальная тактовая частота | 66 MHz | — |
| Напряжение питания | 3.3 V | 3.3 V |
| Process Technology | 0.18 µm | 0.18 µm CMOS |
| Диапазон рабочих температур | 0 °C to 95 °C | — |
| Package Type | 256-pin PBGA (23 mm x 23 mm) | — |
| Package Code | HBGA | — |
| Terminal Count | 256 | — |
| Package Shape | Square | — |
| Peak Reflow Temperature | 245 °C | — |
| Application Category | Networking and communications applications | — |
| Статус RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification status] | — |
| Lead-Free Status | [DATA_NEEDED: lead-free status] | — |
| Halogen-Free Status | [DATA_NEEDED: halogen-free status] | — |
| Pinout | [DATA_NEEDED: complete numbered pinout] | — |
| Product Type | — | Microprocessor (MPU) |
| Series | — | PowerQUICC MPC8xx |
| Core Architecture | — | MPC8xx (PowerPC) - 32-bit |
| Core Clock Frequency | — | 66 MHz |
| Performance | — | 87 MIPS |
| Number of Cores | — | 1 |
| Рабочая температура | — | 0 °C to +95 °C |
| Корпус | — | 256-PBGA (23 x 23 mm) |
| Ball Pitch | — | 1.27 mm |
| Тип монтажа | — | Surface Mount |
| Operating Mounting Type | — | Tray |
| Integrated Peripherals | — | CPM (Communications Processor Module), SCC, HDLC, UART, SPI |
| External Memory Interface | — | Yes - SDRAM / Flash / ROM (32-bit address bus) |