MPC875ZT66 vs MPC875VR66 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng MPC875ZT66 sa pamamagitan ng NXP Semiconductors at MPC875VR66 sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
NXP Semiconductors
MPC875VR66 - 66MHz PowerQUICC MPC8xx 32-Bit MPU | NXP
MPC875VR66 ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | MPC875ZT66 | MPC875VR66 |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Kategorya | Microcontrollers | Microcontrollers |
| Katayuan ng Lifecycle | Tapus ng Buhay | Huling Pagbili |
| Processor Type | MPC8xx communications processor | — |
| Architecture | Power Architecture | — |
| Core Count | 1 core | — |
| Data Width | 32-bit | — |
| Maksimum na Taktiko ng Oras | 66 MHz | — |
| Volte ng Pagbibigay | 3.3 V | 3.3 V |
| Process Technology | 0.18 µm | 0.18 µm CMOS |
| Hanay ng Temperature na Operasyon | 0 °C to 95 °C | — |
| Package Type | 256-pin PBGA (23 mm x 23 mm) | — |
| Package Code | HBGA | — |
| Terminal Count | 256 | — |
| Package Shape | Square | — |
| Peak Reflow Temperature | 245 °C | — |
| Application Category | Networking and communications applications | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification status] | — |
| Lead-Free Status | [DATA_NEEDED: lead-free status] | — |
| Halogen-Free Status | [DATA_NEEDED: halogen-free status] | — |
| Pinout | [DATA_NEEDED: complete numbered pinout] | — |
| Product Type | — | Microprocessor (MPU) |
| Series | — | PowerQUICC MPC8xx |
| Core Architecture | — | MPC8xx (PowerPC) - 32-bit |
| Core Clock Frequency | — | 66 MHz |
| Performance | — | 87 MIPS |
| Number of Cores | — | 1 |
| Temperature na Operasyon | — | 0 °C to +95 °C |
| Packhaging | — | 256-PBGA (23 x 23 mm) |
| Ball Pitch | — | 1.27 mm |
| Uri ng Pagpapasok | — | Surface Mount |
| Operating Mounting Type | — | Tray |
| Integrated Peripherals | — | CPM (Communications Processor Module), SCC, HDLC, UART, SPI |
| External Memory Interface | — | Yes - SDRAM / Flash / ROM (32-bit address bus) |