MPC875ZT66 vs MPC875VR66 对比

详细并排对比 MPC875ZT66 出自 NXP Semiconductors 和 MPC875VR66 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
MPC875ZT66 MPC875ZT66 - 66MHz 32-Bit PowerQUICC Processor | NXP

MPC875ZT66 - 66MHz 32-Bit PowerQUICC Processor | NXP

MPC875ZT66 ✗ 停产
NXP Semiconductors
MPC875VR66 MPC875VR66 - 66MHz PowerQUICC MPC8xx 32-Bit MPU | NXP

MPC875VR66 - 66MHz PowerQUICC MPC8xx 32-Bit MPU | NXP

MPC875VR66 ⚠ 最后一次采购

规格对比

参数 MPC875ZT66 MPC875VR66
品牌 NXP Semiconductors NXP Semiconductors
分类 Microcontrollers Microcontrollers
生命周期状态 停产 最后采购期
Processor Type MPC8xx communications processor —
Architecture Power Architecture —
Core Count 1 core —
Data Width 32-bit —
最大时钟频率 66 MHz —
电源电压 3.3 V 3.3 V
Process Technology 0.18 µm 0.18 µm CMOS
工作温度范围 0 °C to 95 °C —
Package Type 256-pin PBGA (23 mm x 23 mm) —
Package Code HBGA —
Terminal Count 256 —
Package Shape Square —
Peak Reflow Temperature 245 °C —
Application Category Networking and communications applications —
RoHS 状态 [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status]
REACH Status [DATA_NEEDED: REACH status] —
AEC-Q100 Qualification [DATA_NEEDED: AEC-Q100 qualification status] —
Lead-Free Status [DATA_NEEDED: lead-free status] —
Halogen-Free Status [DATA_NEEDED: halogen-free status] —
Pinout [DATA_NEEDED: complete numbered pinout] —
Product Type — Microprocessor (MPU)
Series — PowerQUICC MPC8xx
Core Architecture — MPC8xx (PowerPC) - 32-bit
Core Clock Frequency — 66 MHz
Performance — 87 MIPS
Number of Cores — 1
工作温度 — 0 °C to +95 °C
封装 — 256-PBGA (23 x 23 mm)
Ball Pitch — 1.27 mm
安装类型 — Surface Mount
Operating Mounting Type — Tray
Integrated Peripherals — CPM (Communications Processor Module), SCC, HDLC, UART, SPI
External Memory Interface — Yes - SDRAM / Flash / ROM (32-bit address bus)

数据手册与资源

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