MPC875ZT66 vs MPC875VR66 Karşılaştırma
Ayrıntılı yan yana karşılaştırma MPC875ZT66 tarafından NXP Semiconductors ve MPC875VR66 tarafından NXP SemiconductorsAnahtar özellikleri, elektriksel parametreleri, ambalajı, yaşam döngüsü durumu, fiyatlandırma ve mevcudiyeti karşılaştırarak tasarım gereksinimleriniz için en iyi bileşeni belirleyin.
NXP Semiconductors
MPC875ZT66 - 66MHz 32-Bit PowerQUICC Processor | NXP
MPC875ZT66 ✗ Son Kullanım ZamanıNXP Semiconductors
MPC875VR66 - 66MHz PowerQUICC MPC8xx 32-Bit MPU | NXP
MPC875VR66 ⚠ Son Satın AlmaÖzellik Karşılaştırması
| Parametre | MPC875ZT66 | MPC875VR66 |
|---|---|---|
| Marka | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Yaşam Döngüsü Durumu | Hayat Dönemi Sonu | Son Alış Zamanı |
| Processor Type | MPC8xx communications processor | — |
| Architecture | Power Architecture | — |
| Core Count | 1 core | — |
| Data Width | 32-bit | — |
| Azami Saat Hızı | 66 MHz | — |
| Besleme Gerilimi | 3.3 V | 3.3 V |
| Process Technology | 0.18 µm | 0.18 µm CMOS |
| İşletim Sıcaklığı Aralığı | 0 °C to 95 °C | — |
| Package Type | 256-pin PBGA (23 mm x 23 mm) | — |
| Package Code | HBGA | — |
| Terminal Count | 256 | — |
| Package Shape | Square | — |
| Peak Reflow Temperature | 245 °C | — |
| Application Category | Networking and communications applications | — |
| RoHS Durumu | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification status] | — |
| Lead-Free Status | [DATA_NEEDED: lead-free status] | — |
| Halogen-Free Status | [DATA_NEEDED: halogen-free status] | — |
| Pinout | [DATA_NEEDED: complete numbered pinout] | — |
| Product Type | — | Microprocessor (MPU) |
| Series | — | PowerQUICC MPC8xx |
| Core Architecture | — | MPC8xx (PowerPC) - 32-bit |
| Core Clock Frequency | — | 66 MHz |
| Performance | — | 87 MIPS |
| Number of Cores | — | 1 |
| İşletim Sıcaklığı | — | 0 °C to +95 °C |
| Paket | — | 256-PBGA (23 x 23 mm) |
| Ball Pitch | — | 1.27 mm |
| Montaj Türü | — | Surface Mount |
| Operating Mounting Type | — | Tray |
| Integrated Peripherals | — | CPM (Communications Processor Module), SCC, HDLC, UART, SPI |
| External Memory Interface | — | Yes - SDRAM / Flash / ROM (32-bit address bus) |