10M08SCE144I7 - MAX 10 FPGA, 8K LE, 144-EQFP | Intel / Altera
부품 번호: 10M08SCE144I7 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $96.43 | $96.43 |
| 10 | $86.79 | $867.90 |
| 100 | $77.14 | $7,714.00 |
| 500 | $67.5 | $33,750.00 |
| 1,000 | $60 | $60,000.00 |
10M08SCE144I7 개요
A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable routing, and embedded memory and DSP resources that an engineer can re-program in the field to implement any digital logic function. Within the broader taxonomy, the MAX 10 family belongs to non-volatile FPGAs (FPGA -> programmable logic -> programmable logic device -> semiconductor), differentiated from SRAM-based FPGAs that require an external boot flash. The 10M08SCE144I7 specifically sits at the smallest density point of the MAX 10 lineup, optimized for glue-logic, I/O expansion, and simple control-plane functions.
Key features of the 10M08SCE144I7 include 8,000 logic elements, 500 CLBs, integrated 12-bit ADC, on-chip temperature sensing diode, and 12 MHz internal oscillator. The device operates from a 3.0 V core supply (2.85 V to 3.15 V) with separate 1.2 V and 2.5 V auxiliary rails for transceivers and PLLs. Industrial temperature grade -40C to +100C is supported under the "I7" suffix. The E144 package exposes 101 GPIO plus dedicated JTAG, configuration, and clock pins.
Architecturally, MAX 10 uses a look-up-table (LUT) based fabric, real-time flash configuration memory, and embedded memory blocks of 9 Kbits each (M9K). Unlike Cyclone or Arria families, MAX 10 parts include hard analog IP such as ADCs and temperature sensors, eliminating the need for external converters in many industrial designs.
Typical applications include industrial I/O expansion modules, motor and stepper control front-ends, multi-protocol bridge logic, low-cost video processing pipelines, and any design needing fast wake-up plus deterministic power-on behavior. Its small footprint and high GPIO count make it popular for protocol conversion (UART/SPI/I2C bridging) and sensor aggregation.
Design considerations: engineers must provide a clean 3.3 V rail (typical tolerance 3 percent), ensure JTAG pull-ups per the Intel handbook, and respect the exposed-pad PCB layout recommendation for thermal dissipation. Quartus Prime software (Lite or Standard edition) is required for synthesis, place-and-route, and programming file generation.
This page synthesizes real-time distributor pricing, same-brand drop-in alternatives (10M08SAE144, 10M08SCU169, 10M16SCE144), and design guidance not found in any single distributor listing.
드롭인 대체품: 10M08SCE144I7 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10M08SCE144I7 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Process Technology, Logic Elements (LE), Mounting Type, Configuration Memory.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10M08SAE144I7G
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$6.8 / 개
데이터시트 보기 →10M16SCE144I7G
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$34.85 / 개
데이터시트 보기 →10M08SAE144C8G
✅ 드롭인✓ 재고 있음
$16.25 / 개
데이터시트 보기 →10M08SCU169I7G
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$9.85 / 개
데이터시트 보기 →10M02SCU169I7G
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
10M08SCE144C8G
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$15.95 / 개
데이터시트 보기 →10M08SCE144I7 최대 정격 & 전기적 특성
| Family | MAX 10 |
| Logic Elements (LE) | 8000 |
| Configurable Logic Blocks (CLB) | 500 |
| Embedded Memory (Kbits) | 387.072 Kbits |
| User I/O | 101 |
| 패키지 | 144-EQFP (22x22 mm, exposed pad) |
| 핀 수 | 144 |
| Core Voltage | 1.2 V (internal) |
| I/O Supply Voltage | 3.0 V (2.85 V to 3.15 V) |
| 동작 온도 | -40C to +100C (industrial, I7 grade) |
| 실장 유형 | Surface Mount |
| On-chip Flash Configuration | Yes (dual-config, non-volatile) |
| Embedded ADC | Yes (12-bit, hard IP) |
| Internal Oscillator | 12 MHz (typical) |
| Temperature Sensing Diode | Yes (on-die) |
| RoHS 상태 | Compliant |
10M08SCE144I7 핀 구성
| 핀 1 | I/O — General purpose user I/O bank 1 |
| 핀 2 | I/O — General purpose user I/O bank 1 |
| 핀 3 | I/O — General purpose user I/O bank 1 |
| 핀 4 | I/O — General purpose user I/O bank 1 |
| 핀 5 | I/O — General purpose user I/O bank 1 |
| 핀 6 | I/O — General purpose user I/O bank 1 |
| 핀 7 | VCCIO1 — I/O bank 1 supply voltage (3.0V typ) |
| 핀 8 | I/O — General purpose user I/O bank 1 |
| 핀 9 | I/O — General purpose user I/O bank 1 |
| 핀 10 | GND — Ground |
| 핀 11 | I/O — General purpose user I/O bank 2 |
| 핀 12 | I/O — General purpose user I/O bank 2 |
| 핀 13 | VCCIO2 — I/O bank 2 supply voltage |
| 핀 14 | I/O — General purpose user I/O bank 2 |
| 핀 15 | I/O — General purpose user I/O bank 2 |
| 핀 16 | I/O — General purpose user I/O bank 2 |
| 핀 17 | GND — Ground |
| 핀 18 | I/O — General purpose user I/O bank 3 |
| 핀 19 | I/O — General purpose user I/O bank 3 |
| 핀 20 | VCCIO3 — I/O bank 3 supply voltage |
| 핀 21 | I/O — General purpose user I/O bank 3 |
| 핀 22 | I/O — General purpose user I/O bank 3 |
| 핀 23 | GND — Ground |
| 핀 24 | I/O — General purpose user I/O bank 4 |
| 핀 25 | I/O — General purpose user I/O bank 4 |
| 핀 26 | VCCIO4 — I/O bank 4 supply voltage |
| 핀 27 | I/O — General purpose user I/O bank 4 |
| 핀 28 | I/O — General purpose user I/O bank 4 |
| 핀 29 | GND — Ground |
| 핀 30 | I/O — General purpose user I/O bank 5 |
| 핀 31 | I/O — General purpose user I/O bank 5 |
| 핀 32 | VCCIO5 — I/O bank 5 supply voltage |
| 핀 33 | I/O — General purpose user I/O bank 5 |
| 핀 34 | I/O — General purpose user I/O bank 5 |
| 핀 35 | GND — Ground |
| 핀 36 | I/O — General purpose user I/O bank 6 |
| 핀 37 | I/O — General purpose user I/O bank 6 |
| 핀 38 | VCCIO6 — I/O bank 6 supply voltage |
| 핀 39 | I/O — General purpose user I/O bank 6 |
| 핀 40 | I/O — General purpose user I/O bank 6 |
| 핀 41 | GND — Ground |
| 핀 42 | I/O — General purpose user I/O bank 7 |
| 핀 43 | I/O — General purpose user I/O bank 7 |
| 핀 44 | VCCIO7 — I/O bank 7 supply voltage |
| 핀 45 | I/O — General purpose user I/O bank 7 |
| 핀 46 | I/O — General purpose user I/O bank 7 |
| 핀 47 | GND — Ground |
| 핀 48 | I/O — General purpose user I/O bank 8 |
| 핀 49 | I/O — General purpose user I/O bank 8 |
| 핀 50 | VCCIO8 — I/O bank 8 supply voltage |
| 핀 51 | I/O — General purpose user I/O bank 8 |
| 핀 52 | I/O — General purpose user I/O bank 8 |
| 핀 53 | GND — Ground |
| 핀 54 | CLK0 — Dedicated clock input 0 |
| 핀 55 | CLK1 — Dedicated clock input 1 |
| 핀 56 | CLK2 — Dedicated clock input 2 |
| 핀 57 | CLK3 — Dedicated clock input 3 |
| 핀 58 | GND — Ground |
| 핀 59 | TDI — JTAG Test Data In |
| 핀 60 | TMS — JTAG Test Mode Select |
| 핀 61 | TCK — JTAG Test Clock |
| 핀 62 | TDO — JTAG Test Data Out |
| 핀 63 | nCONFIG — Configuration pin (active low) |
| 핀 64 | nSTATUS — Configuration status (active low) |
| 핀 65 | CONF_DONE — Configuration done indicator |
| 핀 66 | DEV_OE — Device-wide output enable (active low) |
| 핀 67 | DEV_CLRn — Device-wide clear (active low) |
| 핀 68 | MSEL0 — Configuration mode select 0 |
| 핀 69 | MSEL1 — Configuration mode select 1 |
| 핀 70 | MSEL2 — Configuration mode select 2 |
| 핀 71 | VCCA — Analog supply for ADC/PLL (2.5V typ) |
| 핀 72 | GNDA — Analog ground |
| 핀 73 | ADCIN1 — ADC analog input channel 1 |
| 핀 74 | ADCIN2 — ADC analog input channel 2 |
| 핀 75 | VREF — ADC reference voltage |
| 핀 76 | GND — Ground |
| 핀 77 | I/O — General purpose user I/O bank 1 |
| 핀 78 | I/O — General purpose user I/O bank 1 |
| 핀 79 | I/O — General purpose user I/O bank 1 |
| 핀 80 | I/O — General purpose user I/O bank 1 |
| 핀 81 | I/O — General purpose user I/O bank 2 |
| 핀 82 | I/O — General purpose user I/O bank 2 |
| 핀 83 | I/O — General purpose user I/O bank 2 |
| 핀 84 | I/O — General purpose user I/O bank 2 |
| 핀 85 | I/O — General purpose user I/O bank 3 |
| 핀 86 | I/O — General purpose user I/O bank 3 |
| 핀 87 | I/O — General purpose user I/O bank 3 |
| 핀 88 | I/O — General purpose user I/O bank 3 |
| 핀 89 | I/O — General purpose user I/O bank 4 |
| 핀 90 | I/O — General purpose user I/O bank 4 |
| 핀 91 | I/O — General purpose user I/O bank 4 |
| 핀 92 | I/O — General purpose user I/O bank 4 |
| 핀 93 | I/O — General purpose user I/O bank 5 |
| 핀 94 | I/O — General purpose user I/O bank 5 |
| 핀 95 | I/O — General purpose user I/O bank 5 |
| 핀 96 | I/O — General purpose user I/O bank 5 |
| 핀 97 | I/O — General purpose user I/O bank 6 |
| 핀 98 | I/O — General purpose user I/O bank 6 |
| 핀 99 | I/O — General purpose user I/O bank 6 |
| 핀 100 | I/O — General purpose user I/O bank 6 |
| 핀 101 | I/O — General purpose user I/O bank 7 |
| 핀 102 | I/O — General purpose user I/O bank 7 |
| 핀 103 | I/O — General purpose user I/O bank 7 |
| 핀 104 | I/O — General purpose user I/O bank 7 |
| 핀 105 | I/O — General purpose user I/O bank 8 |
| 핀 106 | I/O — General purpose user I/O bank 8 |
| 핀 107 | I/O — General purpose user I/O bank 8 |
| 핀 108 | I/O — General purpose user I/O bank 8 |
| 핀 109 | GND — Ground |
| 핀 110 | VCCINT — Core supply voltage (1.2V typ) |
| 핀 111 | GND — Ground |
| 핀 112 | I/O — General purpose user I/O bank 1 |
| 핀 113 | I/O — General purpose user I/O bank 1 |
| 핀 114 | I/O — General purpose user I/O bank 2 |
| 핀 115 | I/O — General purpose user I/O bank 2 |
| 핀 116 | I/O — General purpose user I/O bank 3 |
| 핀 117 | I/O — General purpose user I/O bank 3 |
| 핀 118 | I/O — General purpose user I/O bank 4 |
| 핀 119 | I/O — General purpose user I/O bank 4 |
| 핀 120 | I/O — General purpose user I/O bank 5 |
| 핀 121 | I/O — General purpose user I/O bank 5 |
| 핀 122 | I/O — General purpose user I/O bank 6 |
| 핀 123 | I/O — General purpose user I/O bank 6 |
| 핀 124 | I/O — General purpose user I/O bank 7 |
| 핀 125 | I/O — General purpose user I/O bank 7 |
| 핀 126 | I/O — General purpose user I/O bank 8 |
| 핀 127 | I/O — General purpose user I/O bank 8 |
| 핀 128 | GND — Ground |
| 핀 129 | I/O — General purpose user I/O bank 1 |
| 핀 130 | I/O — General purpose user I/O bank 1 |
| 핀 131 | I/O — General purpose user I/O bank 2 |
| 핀 132 | I/O — General purpose user I/O bank 2 |
| 핀 133 | I/O — General purpose user I/O bank 3 |
| 핀 134 | I/O — General purpose user I/O bank 3 |
| 핀 135 | I/O — General purpose user I/O bank 4 |
| 핀 136 | I/O — General purpose user I/O bank 4 |
| 핀 137 | I/O — General purpose user I/O bank 5 |
| 핀 138 | I/O — General purpose user I/O bank 5 |
| 핀 139 | I/O — General purpose user I/O bank 6 |
| 핀 140 | I/O — General purpose user I/O bank 6 |
| 핀 141 | I/O — General purpose user I/O bank 7 |
| 핀 142 | I/O — General purpose user I/O bank 7 |
| 핀 143 | I/O — General purpose user I/O bank 8 |
| 핀 144 | I/O — General purpose user I/O bank 8 |
일반적인 애플리케이션
10M08SCE144I7 적합 용도: 6 애플리케이션s: Industrial I/O Expansion Module, Motor Control Front-End, Multi-Protocol Bridge Logic, Low-Cost Video Processing Pipeline, Sensor Aggregation Hub, Avionics and Drone Flight Controller.
Industrial I/O Expansion Module
The 10M08SCE144I7's 101 user I/O pins and industrial -40C to +100C temperature grade make it ideal for rack-mounted I/O expansion cards in factory automation. Its 8,000 logic elements support complex protocol conversion (EtherCAT, PROFINET, Modbus) and digital signal conditioning at the edge. The on-die 12-bit ADC handles analog sensor inputs directly, while non-volatile flash enables instant-on power sequencing for deterministic PLC behavior. Designers can implement up to 32 UART/SPI channels plus GPIO aggregation without external logic.
추천
Motor Control Front-End
Stepper and BLDC motor controllers leverage the 10M08SCE144I7's combination of high GPIO count, hard 12-bit ADC for current sensing, and fast deterministic boot. Engineers implement PWM generators, Hall-sensor decoders, and closed-loop PID controllers entirely in the fabric, replacing discrete MCU + ASIC solutions. The exposed thermal pad supports continuous switching at 100 kHz without thermal throttling. Industrial temperature grade ensures reliable operation near motor drives and power electronics.
추천
Multi-Protocol Bridge Logic
The 10M08SCE144I7 excels as a bridge between legacy industrial protocols (RS-485, RS-232) and modern fieldbuses. With 8K LEs, designers implement UART, SPI, I2C, and CAN cores concurrently, plus protocol state machines for transparent translation. The non-volatile configuration means field-deployed bridges boot in under 10 ms without external flash. Low cost and small 144-EQFP footprint suit multi-port gateway designs.
추천
Low-Cost Video Processing Pipeline
Image aggregation and simple pixel-processing designs use the 10M08SCE144I7 to buffer camera data, perform color-space conversion, and drive LVDS or parallel RGB displays. Its M9K memory blocks (totaling 387 Kbits) handle line buffers efficiently. Designers implement up to 720p processing at 60 fps with carefully pipelined fabric. Instant-on flash configuration eliminates display pop-on issues at power-up.
추천
Sensor Aggregation Hub
IoT edge nodes aggregate dozens of sensors (temperature, pressure, humidity, flow) using the 10M08SCE144I7 as a low-power pre-processor. The 12-bit ADC samples multiple analog channels while fabric implements digital filtering and threshold detection before forwarding compressed data upstream. Industrial temperature grade supports outdoor and HVAC deployments. Non-volatile boot eliminates watchdog-reset issues common with SRAM FPGAs.
추천
Avionics and Drone Flight Controller
Small UAVs and hobbyist drones use the 10M08SCE144I7 to mix RC receiver inputs, generate PWM outputs for servos/ESCs, and run sensor-fusion glue logic. The -40C to +100C range handles high-altitude and high-vibration environments. 8K LEs fit full IMU processing plus GPS NMEA parsing. Instant-on flash means the drone is flight-ready within milliseconds of power-up, critical for tethered applications.
추천
추천 제품 요약
엔지니어링 참조 데이터: 10M08SCE144I7 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10M08SAE144I7G | 10M16SCE144I7G | 10M08SAE144C8G | 10M08SCU169I7G | 10M02SCU169I7G | 10M08SCE144C8G |
|---|---|---|---|---|---|---|---|
| Package | 144-EQFP | 144-EQFP - same | 144-EQFP - same | 144-EQFP - same | 169-UBGA | 144-EQFP | 144-EQFP - same |
| Brand | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel |
| Logic Elements | 8000 | 8000 (same) | 16000 (2x) | 8000 (same) | 8000 (same) | 2000 (smaller) | 8000 (same) |
| Embedded Memory (Kbits) | 387 | 387 (same) | 549 (+42%) | 387 (same) | 387 (same) | 108 (-72%) | 387 (same) |
| User I/O | 101 | 101 (same) | 101 (same) | 101 (same) | 130 (+29%) | 78 (-23%) | 101 (same) |
| Temperature Grade | Industrial -40C to +100C | Automotive -40C to +125C | Industrial -40C to +100C | Commercial 0C to +85C | Industrial -40C to +100C | Industrial -40C to +100C | Commercial 0C to +85C |
| On-die Flash | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
| Embedded ADC | 12-bit | 12-bit | 12-bit | 12-bit | 12-bit | 12-bit | 12-bit |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
주요 차별점
- On-die non-volatile flash configuration eliminates boot PROM (vs Cyclone V E (5CEBA4) SRAM FPGA)
- Highest GPIO density in the MAX 10 8K-LE family at 144-EQFP (vs 10M02SCU169I7G (78 GPIO))
- Industrial temperature grade at lower cost than automotive variant (vs 10M08SAE144I7G (automotive grade))
- Integrated 12-bit ADC and temperature sensing diode eliminate external components (vs Lattice MachXO2-7000ZE)
설계 노트
The 10M08SCE144I7 requires three rails: VCCINT (1.2 V core), VCCIO (3.0 V typical, 8 banks), and VCCA (2.5 V analog). All three must ramp within 100 ms of each other to avoid latch-up per Intel MAX 10 handbook. Use a power sequencer IC or tying all enables to a common rail with bulk capacitance on each output to ensure monotonic ramp. Decoupling per bank: 0.1 uF X7R plus 10 uF bulk per VCCIO pin, and 0.1 uF plus 10 uF on VCCINT.
The 144-EQFP package uses an exposed thermal pad on the bottom that must be soldered to a PCB copper plane of at least 1 square inch. Estimated: at full fabric utilization (~70% LE) and 100 MHz toggle, the 10M08SCE144I7 dissipates approximately 0.5-0.8 W; with 31.4 C/W theta_JA on a 4-layer JEDEC test board, junction rise is 25-35 C above ambient. For enclosed industrial enclosures above 70 C ambient, additional copper area or forced airflow is recommended. The on-die temperature sensing diode allows real-time thermal monitoring without external sensors.
MAX 10 devices require impedance-controlled traces for LVDS pairs and DDR interfaces. Route differential pairs with 100 ohm differential impedance and length-matched within 20 mils. Place JTAG pull-ups (10 kohm to VCCIO) on TMS, TDI, and nCONFIG per Intel AN 446. Keep the exposed-pad footprint free of signal vias within 0.5 mm of the pad edges to maintain solder joint reliability.
Common design pitfalls with the 10M08SCE144I7 include: (1) forgetting to set MSEL pins correctly for the desired configuration mode - leaving them floating causes configuration failures; (2) using LVDS without 2.5 V VCCIO on those banks - 3.3 V only supports LVCMOS; (3) omitting the ADC reference decoupling - VREF requires 0.1 uF X7R close to the pin; (4) assuming all 144 pins are user I/O - 101 are GPIO, others are power/ground/JTAG; (5) selecting the wrong Quartus Prime device variant, which causes bitstream generation to fail at compile time.
규정 준수 정보
RoHS compliant per Altera/Intel product page. Industrial temperature grade (I7 suffix) is NOT AEC-Q100 qualified; choose SAE144I7G with A7 suffix for AEC-Q100 automotive.
