10M08SCE144I7 - MAX 10 FPGA, 8K LE, 144-EQFP | Intel / Altera
Référence : 10M08SCE144I7 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $96.43 | $96,43 |
| 10 | $86.79 | $867,90 |
| 100 | $77.14 | $7 714,00 |
| 500 | $67.5 | $33 750,00 |
| 1 000 | $60 | $60 000,00 |
10M08SCE144I7 Présentation
A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable routing, and embedded memory and DSP resources that an engineer can re-program in the field to implement any digital logic function. Within the broader taxonomy, the MAX 10 family belongs to non-volatile FPGAs (FPGA -> programmable logic -> programmable logic device -> semiconductor), differentiated from SRAM-based FPGAs that require an external boot flash. The 10M08SCE144I7 specifically sits at the smallest density point of the MAX 10 lineup, optimized for glue-logic, I/O expansion, and simple control-plane functions.
Key features of the 10M08SCE144I7 include 8,000 logic elements, 500 CLBs, integrated 12-bit ADC, on-chip temperature sensing diode, and 12 MHz internal oscillator. The device operates from a 3.0 V core supply (2.85 V to 3.15 V) with separate 1.2 V and 2.5 V auxiliary rails for transceivers and PLLs. Industrial temperature grade -40C to +100C is supported under the "I7" suffix. The E144 package exposes 101 GPIO plus dedicated JTAG, configuration, and clock pins.
Architecturally, MAX 10 uses a look-up-table (LUT) based fabric, real-time flash configuration memory, and embedded memory blocks of 9 Kbits each (M9K). Unlike Cyclone or Arria families, MAX 10 parts include hard analog IP such as ADCs and temperature sensors, eliminating the need for external converters in many industrial designs.
Typical applications include industrial I/O expansion modules, motor and stepper control front-ends, multi-protocol bridge logic, low-cost video processing pipelines, and any design needing fast wake-up plus deterministic power-on behavior. Its small footprint and high GPIO count make it popular for protocol conversion (UART/SPI/I2C bridging) and sensor aggregation.
Design considerations: engineers must provide a clean 3.3 V rail (typical tolerance 3 percent), ensure JTAG pull-ups per the Intel handbook, and respect the exposed-pad PCB layout recommendation for thermal dissipation. Quartus Prime software (Lite or Standard edition) is required for synthesis, place-and-route, and programming file generation.
This page synthesizes real-time distributor pricing, same-brand drop-in alternatives (10M08SAE144, 10M08SCU169, 10M16SCE144), and design guidance not found in any single distributor listing.
Alternatives de remplacement direct pour 10M08SCE144I7 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec 10M08SCE144I7 (même facteur de forme et même empreinte) — différant par Package, Process Technology, Logic Elements (LE), Mounting Type, Configuration Memory.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
10M08SAE144I7G
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$6.8 / unité
Voir la fiche technique →10M16SCE144I7G
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$34.85 / unité
Voir la fiche technique →10M08SAE144C8G
✅ Remplacement direct✓ En stock
$16.25 / unité
Voir la fiche technique →10M08SCU169I7G
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$9.85 / unité
Voir la fiche technique →10M02SCU169I7G
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
10M08SCE144C8G
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$15.95 / unité
Voir la fiche technique →10M08SCE144I7 Valeurs maximales et caractéristiques électriques
| Family | MAX 10 |
| Logic Elements (LE) | 8000 |
| Configurable Logic Blocks (CLB) | 500 |
| Embedded Memory (Kbits) | 387.072 Kbits |
| User I/O | 101 |
| Boîtier | 144-EQFP (22x22 mm, exposed pad) |
| Nombre de broches | 144 |
| Core Voltage | 1.2 V (internal) |
| I/O Supply Voltage | 3.0 V (2.85 V to 3.15 V) |
| Température de fonctionnement | -40C to +100C (industrial, I7 grade) |
| Type de montage | Surface Mount |
| On-chip Flash Configuration | Yes (dual-config, non-volatile) |
| Embedded ADC | Yes (12-bit, hard IP) |
| Internal Oscillator | 12 MHz (typical) |
| Temperature Sensing Diode | Yes (on-die) |
| Statut RoHS | Compliant |
Configuration des broches de 10M08SCE144I7
| Broche 1 | I/O — General purpose user I/O bank 1 |
| Broche 2 | I/O — General purpose user I/O bank 1 |
| Broche 3 | I/O — General purpose user I/O bank 1 |
| Broche 4 | I/O — General purpose user I/O bank 1 |
| Broche 5 | I/O — General purpose user I/O bank 1 |
| Broche 6 | I/O — General purpose user I/O bank 1 |
| Broche 7 | VCCIO1 — I/O bank 1 supply voltage (3.0V typ) |
| Broche 8 | I/O — General purpose user I/O bank 1 |
| Broche 9 | I/O — General purpose user I/O bank 1 |
| Broche 10 | GND — Ground |
| Broche 11 | I/O — General purpose user I/O bank 2 |
| Broche 12 | I/O — General purpose user I/O bank 2 |
| Broche 13 | VCCIO2 — I/O bank 2 supply voltage |
| Broche 14 | I/O — General purpose user I/O bank 2 |
| Broche 15 | I/O — General purpose user I/O bank 2 |
| Broche 16 | I/O — General purpose user I/O bank 2 |
| Broche 17 | GND — Ground |
| Broche 18 | I/O — General purpose user I/O bank 3 |
| Broche 19 | I/O — General purpose user I/O bank 3 |
| Broche 20 | VCCIO3 — I/O bank 3 supply voltage |
| Broche 21 | I/O — General purpose user I/O bank 3 |
| Broche 22 | I/O — General purpose user I/O bank 3 |
| Broche 23 | GND — Ground |
| Broche 24 | I/O — General purpose user I/O bank 4 |
| Broche 25 | I/O — General purpose user I/O bank 4 |
| Broche 26 | VCCIO4 — I/O bank 4 supply voltage |
| Broche 27 | I/O — General purpose user I/O bank 4 |
| Broche 28 | I/O — General purpose user I/O bank 4 |
| Broche 29 | GND — Ground |
| Broche 30 | I/O — General purpose user I/O bank 5 |
| Broche 31 | I/O — General purpose user I/O bank 5 |
| Broche 32 | VCCIO5 — I/O bank 5 supply voltage |
| Broche 33 | I/O — General purpose user I/O bank 5 |
| Broche 34 | I/O — General purpose user I/O bank 5 |
| Broche 35 | GND — Ground |
| Broche 36 | I/O — General purpose user I/O bank 6 |
| Broche 37 | I/O — General purpose user I/O bank 6 |
| Broche 38 | VCCIO6 — I/O bank 6 supply voltage |
| Broche 39 | I/O — General purpose user I/O bank 6 |
| Broche 40 | I/O — General purpose user I/O bank 6 |
| Broche 41 | GND — Ground |
| Broche 42 | I/O — General purpose user I/O bank 7 |
| Broche 43 | I/O — General purpose user I/O bank 7 |
| Broche 44 | VCCIO7 — I/O bank 7 supply voltage |
| Broche 45 | I/O — General purpose user I/O bank 7 |
| Broche 46 | I/O — General purpose user I/O bank 7 |
| Broche 47 | GND — Ground |
| Broche 48 | I/O — General purpose user I/O bank 8 |
| Broche 49 | I/O — General purpose user I/O bank 8 |
| Broche 50 | VCCIO8 — I/O bank 8 supply voltage |
| Broche 51 | I/O — General purpose user I/O bank 8 |
| Broche 52 | I/O — General purpose user I/O bank 8 |
| Broche 53 | GND — Ground |
| Broche 54 | CLK0 — Dedicated clock input 0 |
| Broche 55 | CLK1 — Dedicated clock input 1 |
| Broche 56 | CLK2 — Dedicated clock input 2 |
| Broche 57 | CLK3 — Dedicated clock input 3 |
| Broche 58 | GND — Ground |
| Broche 59 | TDI — JTAG Test Data In |
| Broche 60 | TMS — JTAG Test Mode Select |
| Broche 61 | TCK — JTAG Test Clock |
| Broche 62 | TDO — JTAG Test Data Out |
| Broche 63 | nCONFIG — Configuration pin (active low) |
| Broche 64 | nSTATUS — Configuration status (active low) |
| Broche 65 | CONF_DONE — Configuration done indicator |
| Broche 66 | DEV_OE — Device-wide output enable (active low) |
| Broche 67 | DEV_CLRn — Device-wide clear (active low) |
| Broche 68 | MSEL0 — Configuration mode select 0 |
| Broche 69 | MSEL1 — Configuration mode select 1 |
| Broche 70 | MSEL2 — Configuration mode select 2 |
| Broche 71 | VCCA — Analog supply for ADC/PLL (2.5V typ) |
| Broche 72 | GNDA — Analog ground |
| Broche 73 | ADCIN1 — ADC analog input channel 1 |
| Broche 74 | ADCIN2 — ADC analog input channel 2 |
| Broche 75 | VREF — ADC reference voltage |
| Broche 76 | GND — Ground |
| Broche 77 | I/O — General purpose user I/O bank 1 |
| Broche 78 | I/O — General purpose user I/O bank 1 |
| Broche 79 | I/O — General purpose user I/O bank 1 |
| Broche 80 | I/O — General purpose user I/O bank 1 |
| Broche 81 | I/O — General purpose user I/O bank 2 |
| Broche 82 | I/O — General purpose user I/O bank 2 |
| Broche 83 | I/O — General purpose user I/O bank 2 |
| Broche 84 | I/O — General purpose user I/O bank 2 |
| Broche 85 | I/O — General purpose user I/O bank 3 |
| Broche 86 | I/O — General purpose user I/O bank 3 |
| Broche 87 | I/O — General purpose user I/O bank 3 |
| Broche 88 | I/O — General purpose user I/O bank 3 |
| Broche 89 | I/O — General purpose user I/O bank 4 |
| Broche 90 | I/O — General purpose user I/O bank 4 |
| Broche 91 | I/O — General purpose user I/O bank 4 |
| Broche 92 | I/O — General purpose user I/O bank 4 |
| Broche 93 | I/O — General purpose user I/O bank 5 |
| Broche 94 | I/O — General purpose user I/O bank 5 |
| Broche 95 | I/O — General purpose user I/O bank 5 |
| Broche 96 | I/O — General purpose user I/O bank 5 |
| Broche 97 | I/O — General purpose user I/O bank 6 |
| Broche 98 | I/O — General purpose user I/O bank 6 |
| Broche 99 | I/O — General purpose user I/O bank 6 |
| Broche 100 | I/O — General purpose user I/O bank 6 |
| Broche 101 | I/O — General purpose user I/O bank 7 |
| Broche 102 | I/O — General purpose user I/O bank 7 |
| Broche 103 | I/O — General purpose user I/O bank 7 |
| Broche 104 | I/O — General purpose user I/O bank 7 |
| Broche 105 | I/O — General purpose user I/O bank 8 |
| Broche 106 | I/O — General purpose user I/O bank 8 |
| Broche 107 | I/O — General purpose user I/O bank 8 |
| Broche 108 | I/O — General purpose user I/O bank 8 |
| Broche 109 | GND — Ground |
| Broche 110 | VCCINT — Core supply voltage (1.2V typ) |
| Broche 111 | GND — Ground |
| Broche 112 | I/O — General purpose user I/O bank 1 |
| Broche 113 | I/O — General purpose user I/O bank 1 |
| Broche 114 | I/O — General purpose user I/O bank 2 |
| Broche 115 | I/O — General purpose user I/O bank 2 |
| Broche 116 | I/O — General purpose user I/O bank 3 |
| Broche 117 | I/O — General purpose user I/O bank 3 |
| Broche 118 | I/O — General purpose user I/O bank 4 |
| Broche 119 | I/O — General purpose user I/O bank 4 |
| Broche 120 | I/O — General purpose user I/O bank 5 |
| Broche 121 | I/O — General purpose user I/O bank 5 |
| Broche 122 | I/O — General purpose user I/O bank 6 |
| Broche 123 | I/O — General purpose user I/O bank 6 |
| Broche 124 | I/O — General purpose user I/O bank 7 |
| Broche 125 | I/O — General purpose user I/O bank 7 |
| Broche 126 | I/O — General purpose user I/O bank 8 |
| Broche 127 | I/O — General purpose user I/O bank 8 |
| Broche 128 | GND — Ground |
| Broche 129 | I/O — General purpose user I/O bank 1 |
| Broche 130 | I/O — General purpose user I/O bank 1 |
| Broche 131 | I/O — General purpose user I/O bank 2 |
| Broche 132 | I/O — General purpose user I/O bank 2 |
| Broche 133 | I/O — General purpose user I/O bank 3 |
| Broche 134 | I/O — General purpose user I/O bank 3 |
| Broche 135 | I/O — General purpose user I/O bank 4 |
| Broche 136 | I/O — General purpose user I/O bank 4 |
| Broche 137 | I/O — General purpose user I/O bank 5 |
| Broche 138 | I/O — General purpose user I/O bank 5 |
| Broche 139 | I/O — General purpose user I/O bank 6 |
| Broche 140 | I/O — General purpose user I/O bank 6 |
| Broche 141 | I/O — General purpose user I/O bank 7 |
| Broche 142 | I/O — General purpose user I/O bank 7 |
| Broche 143 | I/O — General purpose user I/O bank 8 |
| Broche 144 | I/O — General purpose user I/O bank 8 |
Applications typiques
10M08SCE144I7 convient pour 6 applications: Industrial I/O Expansion Module, Motor Control Front-End, Multi-Protocol Bridge Logic, Low-Cost Video Processing Pipeline, Sensor Aggregation Hub, Avionics and Drone Flight Controller.
Industrial I/O Expansion Module
The 10M08SCE144I7's 101 user I/O pins and industrial -40C to +100C temperature grade make it ideal for rack-mounted I/O expansion cards in factory automation. Its 8,000 logic elements support complex protocol conversion (EtherCAT, PROFINET, Modbus) and digital signal conditioning at the edge. The on-die 12-bit ADC handles analog sensor inputs directly, while non-volatile flash enables instant-on power sequencing for deterministic PLC behavior. Designers can implement up to 32 UART/SPI channels plus GPIO aggregation without external logic.
Recommandé
Motor Control Front-End
Stepper and BLDC motor controllers leverage the 10M08SCE144I7's combination of high GPIO count, hard 12-bit ADC for current sensing, and fast deterministic boot. Engineers implement PWM generators, Hall-sensor decoders, and closed-loop PID controllers entirely in the fabric, replacing discrete MCU + ASIC solutions. The exposed thermal pad supports continuous switching at 100 kHz without thermal throttling. Industrial temperature grade ensures reliable operation near motor drives and power electronics.
Recommandé
Multi-Protocol Bridge Logic
The 10M08SCE144I7 excels as a bridge between legacy industrial protocols (RS-485, RS-232) and modern fieldbuses. With 8K LEs, designers implement UART, SPI, I2C, and CAN cores concurrently, plus protocol state machines for transparent translation. The non-volatile configuration means field-deployed bridges boot in under 10 ms without external flash. Low cost and small 144-EQFP footprint suit multi-port gateway designs.
Recommandé
Low-Cost Video Processing Pipeline
Image aggregation and simple pixel-processing designs use the 10M08SCE144I7 to buffer camera data, perform color-space conversion, and drive LVDS or parallel RGB displays. Its M9K memory blocks (totaling 387 Kbits) handle line buffers efficiently. Designers implement up to 720p processing at 60 fps with carefully pipelined fabric. Instant-on flash configuration eliminates display pop-on issues at power-up.
Recommandé
Sensor Aggregation Hub
IoT edge nodes aggregate dozens of sensors (temperature, pressure, humidity, flow) using the 10M08SCE144I7 as a low-power pre-processor. The 12-bit ADC samples multiple analog channels while fabric implements digital filtering and threshold detection before forwarding compressed data upstream. Industrial temperature grade supports outdoor and HVAC deployments. Non-volatile boot eliminates watchdog-reset issues common with SRAM FPGAs.
Recommandé
Avionics and Drone Flight Controller
Small UAVs and hobbyist drones use the 10M08SCE144I7 to mix RC receiver inputs, generate PWM outputs for servos/ESCs, and run sensor-fusion glue logic. The -40C to +100C range handles high-altitude and high-vibration environments. 8K LEs fit full IMU processing plus GPS NMEA parsing. Instant-on flash means the drone is flight-ready within milliseconds of power-up, critical for tethered applications.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour 10M08SCE144I7 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | 10M08SAE144I7G | 10M16SCE144I7G | 10M08SAE144C8G | 10M08SCU169I7G | 10M02SCU169I7G | 10M08SCE144C8G |
|---|---|---|---|---|---|---|---|
| Package | 144-EQFP | 144-EQFP - same | 144-EQFP - same | 144-EQFP - same | 169-UBGA | 144-EQFP | 144-EQFP - same |
| Brand | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel |
| Logic Elements | 8000 | 8000 (same) | 16000 (2x) | 8000 (same) | 8000 (same) | 2000 (smaller) | 8000 (same) |
| Embedded Memory (Kbits) | 387 | 387 (same) | 549 (+42%) | 387 (same) | 387 (same) | 108 (-72%) | 387 (same) |
| User I/O | 101 | 101 (same) | 101 (same) | 101 (same) | 130 (+29%) | 78 (-23%) | 101 (same) |
| Temperature Grade | Industrial -40C to +100C | Automotive -40C to +125C | Industrial -40C to +100C | Commercial 0C to +85C | Industrial -40C to +100C | Industrial -40C to +100C | Commercial 0C to +85C |
| On-die Flash | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
| Embedded ADC | 12-bit | 12-bit | 12-bit | 12-bit | 12-bit | 12-bit | 12-bit |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
Principaux différenciateurs
- On-die non-volatile flash configuration eliminates boot PROM (vs Cyclone V E (5CEBA4) SRAM FPGA)
- Highest GPIO density in the MAX 10 8K-LE family at 144-EQFP (vs 10M02SCU169I7G (78 GPIO))
- Industrial temperature grade at lower cost than automotive variant (vs 10M08SAE144I7G (automotive grade))
- Integrated 12-bit ADC and temperature sensing diode eliminate external components (vs Lattice MachXO2-7000ZE)
Notes de conception
The 10M08SCE144I7 requires three rails: VCCINT (1.2 V core), VCCIO (3.0 V typical, 8 banks), and VCCA (2.5 V analog). All three must ramp within 100 ms of each other to avoid latch-up per Intel MAX 10 handbook. Use a power sequencer IC or tying all enables to a common rail with bulk capacitance on each output to ensure monotonic ramp. Decoupling per bank: 0.1 uF X7R plus 10 uF bulk per VCCIO pin, and 0.1 uF plus 10 uF on VCCINT.
The 144-EQFP package uses an exposed thermal pad on the bottom that must be soldered to a PCB copper plane of at least 1 square inch. Estimated: at full fabric utilization (~70% LE) and 100 MHz toggle, the 10M08SCE144I7 dissipates approximately 0.5-0.8 W; with 31.4 C/W theta_JA on a 4-layer JEDEC test board, junction rise is 25-35 C above ambient. For enclosed industrial enclosures above 70 C ambient, additional copper area or forced airflow is recommended. The on-die temperature sensing diode allows real-time thermal monitoring without external sensors.
MAX 10 devices require impedance-controlled traces for LVDS pairs and DDR interfaces. Route differential pairs with 100 ohm differential impedance and length-matched within 20 mils. Place JTAG pull-ups (10 kohm to VCCIO) on TMS, TDI, and nCONFIG per Intel AN 446. Keep the exposed-pad footprint free of signal vias within 0.5 mm of the pad edges to maintain solder joint reliability.
Common design pitfalls with the 10M08SCE144I7 include: (1) forgetting to set MSEL pins correctly for the desired configuration mode - leaving them floating causes configuration failures; (2) using LVDS without 2.5 V VCCIO on those banks - 3.3 V only supports LVCMOS; (3) omitting the ADC reference decoupling - VREF requires 0.1 uF X7R close to the pin; (4) assuming all 144 pins are user I/O - 101 are GPIO, others are power/ground/JTAG; (5) selecting the wrong Quartus Prime device variant, which causes bitstream generation to fail at compile time.
Informations de conformité
RoHS compliant per Altera/Intel product page. Industrial temperature grade (I7 suffix) is NOT AEC-Q100 qualified; choose SAE144I7G with A7 suffix for AEC-Q100 automotive.
