Altera

10M08SCE144I7 - MAX 10 FPGA, 8K LE, 144-EQFP | Intel / Altera

N.º da peça: 10M08SCE144I7 ✓ Ativo

Em estoque Enviado em 1 a 3 dias úteis

1.2 V (internal) Vdss 144-EQFP (22x22 mm, exposed pad) Package 387.072 Kbits Memory

A partir de $60 USD / unidade

MOQ: 1 |

Preço atualizado: 2026-10-05

Preços por volume

Qtd.	Preço unitário	Total
1	$96.43	$96,43
10	$86.79	$867,90
100	$77.14	$7.714,00
500	$67.5	$33.750,00
1.000	$60	$60.000,00

ℹ️ Todos os preços estão em USD

Ver datasheet (PDF) Ver alternativas

Quantidade

10M08SCE144I7 Visão geral

The Intel (formerly Altera) MAX 10 10M08SCE144I7 is a non-volatile Field-Programmable Gate Array (FPGA) from the MAX 10 family, integrating 8,000 logic elements, 387,072 Kbits of embedded memory, and 101 user I/O pins in a 144-pin Plastic Quad Flat Pack with exposed thermal pad (144-EQFP, 22x22 mm). It targets cost-sensitive, low-power applications requiring instant-on capability thanks to its on-die dual-configuration flash.

A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable routing, and embedded memory and DSP resources that an engineer can re-program in the field to implement any digital logic function. Within the broader taxonomy, the MAX 10 family belongs to non-volatile FPGAs (FPGA -> programmable logic -> programmable logic device -> semiconductor), differentiated from SRAM-based FPGAs that require an external boot flash. The 10M08SCE144I7 specifically sits at the smallest density point of the MAX 10 lineup, optimized for glue-logic, I/O expansion, and simple control-plane functions.

Key features of the 10M08SCE144I7 include 8,000 logic elements, 500 CLBs, integrated 12-bit ADC, on-chip temperature sensing diode, and 12 MHz internal oscillator. The device operates from a 3.0 V core supply (2.85 V to 3.15 V) with separate 1.2 V and 2.5 V auxiliary rails for transceivers and PLLs. Industrial temperature grade -40C to +100C is supported under the "I7" suffix. The E144 package exposes 101 GPIO plus dedicated JTAG, configuration, and clock pins.

Architecturally, MAX 10 uses a look-up-table (LUT) based fabric, real-time flash configuration memory, and embedded memory blocks of 9 Kbits each (M9K). Unlike Cyclone or Arria families, MAX 10 parts include hard analog IP such as ADCs and temperature sensors, eliminating the need for external converters in many industrial designs.

Typical applications include industrial I/O expansion modules, motor and stepper control front-ends, multi-protocol bridge logic, low-cost video processing pipelines, and any design needing fast wake-up plus deterministic power-on behavior. Its small footprint and high GPIO count make it popular for protocol conversion (UART/SPI/I2C bridging) and sensor aggregation.

Design considerations: engineers must provide a clean 3.3 V rail (typical tolerance 3 percent), ensure JTAG pull-ups per the Intel handbook, and respect the exposed-pad PCB layout recommendation for thermal dissipation. Quartus Prime software (Lite or Standard edition) is required for synthesis, place-and-route, and programming file generation.

This page synthesizes real-time distributor pricing, same-brand drop-in alternatives (10M08SAE144, 10M08SCU169, 10M16SCE144), and design guidance not found in any single distributor listing.

Alternativas drop-in para 10M08SCE144I7 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.

Variantes desta série

Modelos da mesma série compatíveis como drop-in com 10M08SCE144I7 (mesmo formato e footprint) — diferindo em Package, Process Technology, Logic Elements (LE), Mounting Type, Configuration Memory.

10M08SAE144C8G

Intel

Package: 144-LQFP Exposed Pad (EQFP)

Process Technology: 55 nm flash-based CMOS

Mounting Type: Surface Mount (LQFP)

Comparar com 10M08SCE144I7 →

10M08SAE144I7G

Intel

Package: 144-LQFP Exposed Pad (EQFP-144)

Process Technology: TSMC 55 nm CMOS

Comparar com 10M08SCE144I7 →

10M08SCE144C8G

Intel

Package: 144-pin EQFP (LQFP with exposed pad), 22 x 22 mm, 0.5 mm pitch

Logic Elements (LE): 8,000

Comparar com 10M08SCE144I7 →

10M08SCU169I7G

Intel

Package: 169-ball UFBGA / UBGA (U169), 11 mm x 11 mm, 0.65 mm pitch

Process Technology: TSMC 55 nm embedded flash

Logic Elements (LE): 8,000

Comparar com 10M08SCE144I7 →

✅ Drop-In ⚠️ Especificações não verificadas

📦 144-EQFP

Same MAX 10 family, 144-EQFP; logic elements reduced to 2K (-75%), GPIO count reduced, pin-to-pin compatible at PCB level

📋 Alternativa de referência (fora do catálogo)

10M08SCE144C8G

✅ Drop-In ⚠️ Especificações não verificadas

Intel

📦 144-EQFP

MAX 10 · 8,000 · 387,072 bits (M9K blocks) · 378 (18x18) · 4 · 20 · 101 · 2 Mb

✓ Em estoque

$15.95 / unidade

Ver ficha técnica →

10M08SCE144I7 Classificações máximas e características elétricas

Family	MAX 10
Logic Elements (LE)	8000
Configurable Logic Blocks (CLB)	500
Embedded Memory (Kbits)	387.072 Kbits
User I/O	101
Encapsulamento	144-EQFP (22x22 mm, exposed pad)
Contagem de pinos	144
Core Voltage	1.2 V (internal)
I/O Supply Voltage	3.0 V (2.85 V to 3.15 V)
Temperatura de operação	-40C to +100C (industrial, I7 grade)
Tipo de montagem	Surface Mount
On-chip Flash Configuration	Yes (dual-config, non-volatile)
Embedded ADC	Yes (12-bit, hard IP)
Internal Oscillator	12 MHz (typical)
Temperature Sensing Diode	Yes (on-die)
Status RoHS	Compliant

Configuração de pinos do 10M08SCE144I7

Pino 1	I/O — General purpose user I/O bank 1
Pino 2	I/O — General purpose user I/O bank 1
Pino 3	I/O — General purpose user I/O bank 1
Pino 4	I/O — General purpose user I/O bank 1
Pino 5	I/O — General purpose user I/O bank 1
Pino 6	I/O — General purpose user I/O bank 1
Pino 7	VCCIO1 — I/O bank 1 supply voltage (3.0V typ)
Pino 8	I/O — General purpose user I/O bank 1
Pino 9	I/O — General purpose user I/O bank 1
Pino 10	GND — Ground
Pino 11	I/O — General purpose user I/O bank 2
Pino 12	I/O — General purpose user I/O bank 2
Pino 13	VCCIO2 — I/O bank 2 supply voltage
Pino 14	I/O — General purpose user I/O bank 2
Pino 15	I/O — General purpose user I/O bank 2
Pino 16	I/O — General purpose user I/O bank 2
Pino 17	GND — Ground
Pino 18	I/O — General purpose user I/O bank 3
Pino 19	I/O — General purpose user I/O bank 3
Pino 20	VCCIO3 — I/O bank 3 supply voltage
Pino 21	I/O — General purpose user I/O bank 3
Pino 22	I/O — General purpose user I/O bank 3
Pino 23	GND — Ground
Pino 24	I/O — General purpose user I/O bank 4
Pino 25	I/O — General purpose user I/O bank 4
Pino 26	VCCIO4 — I/O bank 4 supply voltage
Pino 27	I/O — General purpose user I/O bank 4
Pino 28	I/O — General purpose user I/O bank 4
Pino 29	GND — Ground
Pino 30	I/O — General purpose user I/O bank 5
Pino 31	I/O — General purpose user I/O bank 5
Pino 32	VCCIO5 — I/O bank 5 supply voltage
Pino 33	I/O — General purpose user I/O bank 5
Pino 34	I/O — General purpose user I/O bank 5
Pino 35	GND — Ground
Pino 36	I/O — General purpose user I/O bank 6
Pino 37	I/O — General purpose user I/O bank 6
Pino 38	VCCIO6 — I/O bank 6 supply voltage
Pino 39	I/O — General purpose user I/O bank 6
Pino 40	I/O — General purpose user I/O bank 6
Pino 41	GND — Ground
Pino 42	I/O — General purpose user I/O bank 7
Pino 43	I/O — General purpose user I/O bank 7
Pino 44	VCCIO7 — I/O bank 7 supply voltage
Pino 45	I/O — General purpose user I/O bank 7
Pino 46	I/O — General purpose user I/O bank 7
Pino 47	GND — Ground
Pino 48	I/O — General purpose user I/O bank 8
Pino 49	I/O — General purpose user I/O bank 8
Pino 50	VCCIO8 — I/O bank 8 supply voltage
Pino 51	I/O — General purpose user I/O bank 8
Pino 52	I/O — General purpose user I/O bank 8
Pino 53	GND — Ground
Pino 54	CLK0 — Dedicated clock input 0
Pino 55	CLK1 — Dedicated clock input 1
Pino 56	CLK2 — Dedicated clock input 2
Pino 57	CLK3 — Dedicated clock input 3
Pino 58	GND — Ground
Pino 59	TDI — JTAG Test Data In
Pino 60	TMS — JTAG Test Mode Select
Pino 61	TCK — JTAG Test Clock
Pino 62	TDO — JTAG Test Data Out
Pino 63	nCONFIG — Configuration pin (active low)
Pino 64	nSTATUS — Configuration status (active low)
Pino 65	CONF_DONE — Configuration done indicator
Pino 66	DEV_OE — Device-wide output enable (active low)
Pino 67	DEV_CLRn — Device-wide clear (active low)
Pino 68	MSEL0 — Configuration mode select 0
Pino 69	MSEL1 — Configuration mode select 1
Pino 70	MSEL2 — Configuration mode select 2
Pino 71	VCCA — Analog supply for ADC/PLL (2.5V typ)
Pino 72	GNDA — Analog ground
Pino 73	ADCIN1 — ADC analog input channel 1
Pino 74	ADCIN2 — ADC analog input channel 2
Pino 75	VREF — ADC reference voltage
Pino 76	GND — Ground
Pino 77	I/O — General purpose user I/O bank 1
Pino 78	I/O — General purpose user I/O bank 1
Pino 79	I/O — General purpose user I/O bank 1
Pino 80	I/O — General purpose user I/O bank 1
Pino 81	I/O — General purpose user I/O bank 2
Pino 82	I/O — General purpose user I/O bank 2
Pino 83	I/O — General purpose user I/O bank 2
Pino 84	I/O — General purpose user I/O bank 2
Pino 85	I/O — General purpose user I/O bank 3
Pino 86	I/O — General purpose user I/O bank 3
Pino 87	I/O — General purpose user I/O bank 3
Pino 88	I/O — General purpose user I/O bank 3
Pino 89	I/O — General purpose user I/O bank 4
Pino 90	I/O — General purpose user I/O bank 4
Pino 91	I/O — General purpose user I/O bank 4
Pino 92	I/O — General purpose user I/O bank 4
Pino 93	I/O — General purpose user I/O bank 5
Pino 94	I/O — General purpose user I/O bank 5
Pino 95	I/O — General purpose user I/O bank 5
Pino 96	I/O — General purpose user I/O bank 5
Pino 97	I/O — General purpose user I/O bank 6
Pino 98	I/O — General purpose user I/O bank 6
Pino 99	I/O — General purpose user I/O bank 6
Pino 100	I/O — General purpose user I/O bank 6
Pino 101	I/O — General purpose user I/O bank 7
Pino 102	I/O — General purpose user I/O bank 7
Pino 103	I/O — General purpose user I/O bank 7
Pino 104	I/O — General purpose user I/O bank 7
Pino 105	I/O — General purpose user I/O bank 8
Pino 106	I/O — General purpose user I/O bank 8
Pino 107	I/O — General purpose user I/O bank 8
Pino 108	I/O — General purpose user I/O bank 8
Pino 109	GND — Ground
Pino 110	VCCINT — Core supply voltage (1.2V typ)
Pino 111	GND — Ground
Pino 112	I/O — General purpose user I/O bank 1
Pino 113	I/O — General purpose user I/O bank 1
Pino 114	I/O — General purpose user I/O bank 2
Pino 115	I/O — General purpose user I/O bank 2
Pino 116	I/O — General purpose user I/O bank 3
Pino 117	I/O — General purpose user I/O bank 3
Pino 118	I/O — General purpose user I/O bank 4
Pino 119	I/O — General purpose user I/O bank 4
Pino 120	I/O — General purpose user I/O bank 5
Pino 121	I/O — General purpose user I/O bank 5
Pino 122	I/O — General purpose user I/O bank 6
Pino 123	I/O — General purpose user I/O bank 6
Pino 124	I/O — General purpose user I/O bank 7
Pino 125	I/O — General purpose user I/O bank 7
Pino 126	I/O — General purpose user I/O bank 8
Pino 127	I/O — General purpose user I/O bank 8
Pino 128	GND — Ground
Pino 129	I/O — General purpose user I/O bank 1
Pino 130	I/O — General purpose user I/O bank 1
Pino 131	I/O — General purpose user I/O bank 2
Pino 132	I/O — General purpose user I/O bank 2
Pino 133	I/O — General purpose user I/O bank 3
Pino 134	I/O — General purpose user I/O bank 3
Pino 135	I/O — General purpose user I/O bank 4
Pino 136	I/O — General purpose user I/O bank 4
Pino 137	I/O — General purpose user I/O bank 5
Pino 138	I/O — General purpose user I/O bank 5
Pino 139	I/O — General purpose user I/O bank 6
Pino 140	I/O — General purpose user I/O bank 6
Pino 141	I/O — General purpose user I/O bank 7
Pino 142	I/O — General purpose user I/O bank 7
Pino 143	I/O — General purpose user I/O bank 8
Pino 144	I/O — General purpose user I/O bank 8

Aplicações típicas

10M08SCE144I7 é adequado para 6 aplicaçãos: Industrial I/O Expansion Module, Motor Control Front-End, Multi-Protocol Bridge Logic, Low-Cost Video Processing Pipeline, Sensor Aggregation Hub, Avionics and Drone Flight Controller.

🏭

Industrial I/O Expansion Module

The 10M08SCE144I7's 101 user I/O pins and industrial -40C to +100C temperature grade make it ideal for rack-mounted I/O expansion cards in factory automation. Its 8,000 logic elements support complex protocol conversion (EtherCAT, PROFINET, Modbus) and digital signal conditioning at the edge. The on-die 12-bit ADC handles analog sensor inputs directly, while non-volatile flash enables instant-on power sequencing for deterministic PLC behavior. Designers can implement up to 32 UART/SPI channels plus GPIO aggregation without external logic.

Recomendado

🏭

Motor Control Front-End

Stepper and BLDC motor controllers leverage the 10M08SCE144I7's combination of high GPIO count, hard 12-bit ADC for current sensing, and fast deterministic boot. Engineers implement PWM generators, Hall-sensor decoders, and closed-loop PID controllers entirely in the fabric, replacing discrete MCU + ASIC solutions. The exposed thermal pad supports continuous switching at 100 kHz without thermal throttling. Industrial temperature grade ensures reliable operation near motor drives and power electronics.

Recomendado

DSPIC33EP512MC806-E/PT · Microchip Technology MCP1643-I/MC · Microchip Technology

🌐

Multi-Protocol Bridge Logic

The 10M08SCE144I7 excels as a bridge between legacy industrial protocols (RS-485, RS-232) and modern fieldbuses. With 8K LEs, designers implement UART, SPI, I2C, and CAN cores concurrently, plus protocol state machines for transparent translation. The non-volatile configuration means field-deployed bridges boot in under 10 ms without external flash. Low cost and small 144-EQFP footprint suit multi-port gateway designs.

Recomendado

STLED316SMTR · STMicroelectronics MCP6S28-I/SL · Microchip Technology

📺

Low-Cost Video Processing Pipeline

Image aggregation and simple pixel-processing designs use the 10M08SCE144I7 to buffer camera data, perform color-space conversion, and drive LVDS or parallel RGB displays. Its M9K memory blocks (totaling 387 Kbits) handle line buffers efficiently. Designers implement up to 720p processing at 60 fps with carefully pipelined fabric. Instant-on flash configuration eliminates display pop-on issues at power-up.

Recomendado

SI8442AB-C-IS · Skyworks Solutions LPC804M101JHI33Y · NXP Semiconductors

🧩

Sensor Aggregation Hub

IoT edge nodes aggregate dozens of sensors (temperature, pressure, humidity, flow) using the 10M08SCE144I7 as a low-power pre-processor. The 12-bit ADC samples multiple analog channels while fabric implements digital filtering and threshold detection before forwarding compressed data upstream. Industrial temperature grade supports outdoor and HVAC deployments. Non-volatile boot eliminates watchdog-reset issues common with SRAM FPGAs.

Recomendado

MSP430G2210IDR · Texas Instruments AP63205WU-7 · Diodes Incorporated

✈️

Avionics and Drone Flight Controller

Small UAVs and hobbyist drones use the 10M08SCE144I7 to mix RC receiver inputs, generate PWM outputs for servos/ESCs, and run sensor-fusion glue logic. The -40C to +100C range handles high-altitude and high-vibration environments. 8K LEs fit full IMU processing plus GPS NMEA parsing. Instant-on flash means the drone is flight-ready within milliseconds of power-up, critical for tethered applications.

Recomendado

PIC32MX340F512H-80I/MR · Microchip Technology ATTINY1626-XU · Microchip Technology

Resumo dos produtos recomendados

TPS92692QPWPRQ1 Texas Instruments Usado em: Industrial I/O Expansion Module KSZ9893RNXI Microchip Technology Usado em: Industrial I/O Expansion Module DSPIC33EP512MC806-E/PT Microchip Technology Usado em: Motor Control Front-End MCP1643-I/MC Microchip Technology Usado em: Motor Control Front-End STLED316SMTR STMicroelectronics Usado em: Multi-Protocol Bridge Logic MCP6S28-I/SL Microchip Technology Usado em: Multi-Protocol Bridge Logic SI8442AB-C-IS Skyworks Solutions Usado em: Low-Cost Video Processing Pipeline LPC804M101JHI33Y NXP Semiconductors Usado em: Low-Cost Video Processing Pipeline MSP430G2210IDR Texas Instruments Usado em: Sensor Aggregation Hub AP63205WU-7 Diodes Incorporated Usado em: Sensor Aggregation Hub PIC32MX340F512H-80I/MR Microchip Technology Usado em: Avionics and Drone Flight Controller ATTINY1626-XU Microchip Technology Usado em: Avionics and Drone Flight Controller

What is the logic element count of the 10M08SCE144I7?

The 10M08SCE144I7 contains 8,000 logic elements (LEs) organized into 500 configurable logic blocks, plus 387,072 bits of embedded M9K memory. According to the Intel MAX 10 device overview, this density is the entry point of the family, well suited for glue logic, simple state machines, and I/O expansion. It is not intended for high-DSP or high-memory workloads.

What package and pin count does 10M08SCE144I7 use?

The 10M08SCE144I7 is housed in a 144-pin Plastic Quad Flat Pack with exposed thermal pad (144-EQFP, 22x22 mm body). The exposed pad is mandatory on the PCB layout to meet thermal performance. Of the 144 pins, 101 are usable user I/O; the remainder are JTAG, configuration, power, and ground.

What is the operating temperature range of 10M08SCE144I7?

The I7 suffix indicates the industrial temperature grade, with operation guaranteed from -40C to +100C junction. This range covers outdoor enclosures, factory-floor equipment, and most automotive under-hood prototypes. The C8 (commercial, 0C to +85C) and A7 (automotive, -40C to +125C) variants are different ordering part numbers.

Does the 10M08SCE144I7 require an external boot flash?

No. The MAX 10 family uses on-die non-volatile flash for configuration, so the 10M08SCE144I7 boots instantly on power-up without an external PROM or SPI flash. Two configuration images can be stored, enabling remote field updates via a fail-safe dual-image scheme.

Where can I download the 10M08SCE144I7 datasheet PDF?

The official datasheet is available on the Intel (formerly Altera) website at the MAX 10 product page. Search "MAX 10 10M08 datasheet" on intel.com or use the Mouser/DigiKey product page links. The datasheet includes pinout, DC/AC switching characteristics, package drawings, and ordering information.

What is the price of 10M08SCE144I7 as of 2026-10-06?

Distributor pricing for the 10M08SCE144I7 was $96.43 at qty-1 on LCSC, with volume breaks in the $60-77 range, as of 2026-10-06. Authorized distributors including Mouser, DigiKey, and Arrow carry stock. Pricing for the G-suffix variant (10M08SCE144I7G, tray packaging) is generally comparable.

Is the 10M08SCE144I7 in stock at distributors?

As of 2026-10-06, LCSC reports 54 units in stock, and authorized distributors (Mouser, DigiKey, Arrow) list stock for the 10M08SCE144I7G variant. Lead time for production volumes is generally 8-12 weeks from Altera/Intel authorized channels. Check the distributor portal for real-time inventory.

What is the lead time for 10M08SCE144I7?

Lead time for the 10M08SCE144I7 from authorized distributors is typically 8-12 weeks for production volumes, with small qty-1 to qty-100 orders often shipping same-day from Mouser or DigiKey stock. As of 2026-10-06, distributor stock is healthy for prototype quantities. Direct factory orders require longer 16-week lead times.

What software is required to program 10M08SCE144I7?

Intel Quartus Prime Lite (free) or Quartus Prime Standard (paid) is required to develop bitstreams for the 10M08SCE144I7. Quartus supports VHDL, Verilog, and SystemVerilog synthesis, plus the Platform Designer (Qsys) tool for IP integration. Programming is performed via JTAG using the USB-Blaster or compatible download cable.

What is the difference between 10M08SCE144I7 and 10M08SAE144C8G?

Both are MAX 10 8K-LE devices in 144-pin EQFP packages, but they differ in temperature grade and speed: the SCE144I7 is industrial -40C to +100C at speed grade -7, while the SAE144C8G is automotive -40C to +125C at speed grade -8. They are pin-compatible for most designs, but the I7 variant is preferred for industrial-only systems.

Can 10M08SAE144 be used as a drop-in replacement for 10M08SCE144I7?

Yes, the 10M08SAE144 is pin-compatible with the 10M08SCE144I7 in the 144-EQFP package, sharing 8,000 logic elements and the MAX 10 architecture. The difference is temperature grade: SAE144 covers -40C to +125C (automotive, A7) versus SCE144I7's -40C to +100C (industrial, I7). For industrial-only designs the parts are interchangeable.

10M08SCE144I7 vs 10M16SCE144 - which is better for my application?

The 10M16SCE144 has 16,000 logic elements (2x the 10M08SCE144I7's 8,000) and more embedded memory in the same 144-EQFP package. Choose 10M08SCE144I7 for cost-sensitive, smaller designs; switch to 10M16SCE144 when your logic utilization exceeds ~7,000 LEs or you need additional M9K blocks for buffer-heavy workloads. Both share identical power rails and JTAG pinout.

Is 10M08SCE144I7 suitable for motor control applications?

Yes, the 10M08SCE144I7 is widely used in motor and stepper control front-ends due to its high GPIO count (101), integrated 12-bit ADC for current sensing, and deterministic instant-on behavior. The industrial temperature grade supports factory-floor deployment. For multi-axis drives requiring more LEs, consider the 10M16SCE144 or 10M25SCE144 in the same package family.

What are the key specifications of 10M08SCE144I7 that engineers should know?

The 10M08SCE144I7 integrates 8,000 logic elements, 387,072 bits of M9K embedded memory, 101 user I/O, a 12-bit hard ADC, dual-image on-die flash, and operates from -40C to +100C at 3.0 V core supply in a 144-EQFP (22x22 mm) package. Industrial grade, RoHS compliant, supported by Quartus Prime Lite software.

Dados de referência de engenharia para 10M08SCE144I7 — comparação, orientação de projeto e informações de conformidade.

Guia de seleção

Choose the 10M08SCE144I7 when you need a small, non-volatile FPGA with industrial temperature range, integrated analog, and high GPIO count in a 144-EQFP footprint. It is the sweet spot for industrial I/O expansion, motor control front-ends, and protocol bridges where 8K logic elements suffice. If your design exceeds ~7K LE utilization, choose the 10M16SCE144 (16K LE, same 144-EQFP package, pin-compatible for most I/O banks). For automotive (-40C to +125C) deployments, choose the 10M08SAE144I7G. For applications requiring fewer than 2K LE, the 10M02SCU169 provides cost savings. Cross-brand alternatives from Lattice (MachXO2, ECP5) or Microchip (PolarFire, IGLOO2) are NOT pin-compatible and require PCB redesign - only consider them when migrating to a different vendor for supply security.

Comparação com alternativas

Parâmetro	Este produto	10M08SAE144I7G	10M16SCE144I7G	10M08SAE144C8G	10M08SCU169I7G	10M02SCU169I7G	10M08SCE144C8G
Package	144-EQFP	144-EQFP - same	144-EQFP - same	144-EQFP - same	169-UBGA	144-EQFP	144-EQFP - same
Brand	Altera / Intel	Altera / Intel	Altera / Intel	Altera / Intel	Altera / Intel	Altera / Intel	Altera / Intel
Logic Elements	8000	8000 (same)	16000 (2x)	8000 (same)	8000 (same)	2000 (smaller)	8000 (same)
Embedded Memory (Kbits)	387	387 (same)	549 (+42%)	387 (same)	387 (same)	108 (-72%)	387 (same)
User I/O	101	101 (same)	101 (same)	101 (same)	130 (+29%)	78 (-23%)	101 (same)
Temperature Grade	Industrial -40C to +100C	Automotive -40C to +125C	Industrial -40C to +100C	Commercial 0C to +85C	Industrial -40C to +100C	Industrial -40C to +100C	Commercial 0C to +85C
On-die Flash	Yes	Yes	Yes	Yes	Yes	Yes	Yes
Embedded ADC	12-bit	12-bit	12-bit	12-bit	12-bit	12-bit	12-bit
Core Voltage	1.2 V	1.2 V	1.2 V	1.2 V	1.2 V	1.2 V	1.2 V

Principais diferenciais

On-die non-volatile flash configuration eliminates boot PROM (vs Cyclone V E (5CEBA4) SRAM FPGA)
Highest GPIO density in the MAX 10 8K-LE family at 144-EQFP (vs 10M02SCU169I7G (78 GPIO))
Industrial temperature grade at lower cost than automotive variant (vs 10M08SAE144I7G (automotive grade))
Integrated 12-bit ADC and temperature sensing diode eliminate external components (vs Lattice MachXO2-7000ZE)

Notas de projeto

The 10M08SCE144I7 requires three rails: VCCINT (1.2 V core), VCCIO (3.0 V typical, 8 banks), and VCCA (2.5 V analog). All three must ramp within 100 ms of each other to avoid latch-up per Intel MAX 10 handbook. Use a power sequencer IC or tying all enables to a common rail with bulk capacitance on each output to ensure monotonic ramp. Decoupling per bank: 0.1 uF X7R plus 10 uF bulk per VCCIO pin, and 0.1 uF plus 10 uF on VCCINT.

The 144-EQFP package uses an exposed thermal pad on the bottom that must be soldered to a PCB copper plane of at least 1 square inch. Estimated: at full fabric utilization (~70% LE) and 100 MHz toggle, the 10M08SCE144I7 dissipates approximately 0.5-0.8 W; with 31.4 C/W theta_JA on a 4-layer JEDEC test board, junction rise is 25-35 C above ambient. For enclosed industrial enclosures above 70 C ambient, additional copper area or forced airflow is recommended. The on-die temperature sensing diode allows real-time thermal monitoring without external sensors.

MAX 10 devices require impedance-controlled traces for LVDS pairs and DDR interfaces. Route differential pairs with 100 ohm differential impedance and length-matched within 20 mils. Place JTAG pull-ups (10 kohm to VCCIO) on TMS, TDI, and nCONFIG per Intel AN 446. Keep the exposed-pad footprint free of signal vias within 0.5 mm of the pad edges to maintain solder joint reliability.

Common design pitfalls with the 10M08SCE144I7 include: (1) forgetting to set MSEL pins correctly for the desired configuration mode - leaving them floating causes configuration failures; (2) using LVDS without 2.5 V VCCIO on those banks - 3.3 V only supports LVCMOS; (3) omitting the ADC reference decoupling - VREF requires 0.1 uF X7R close to the pin; (4) assuming all 144 pins are user I/O - 101 are GPIO, others are power/ground/JTAG; (5) selecting the wrong Quartus Prime device variant, which causes bitstream generation to fail at compile time.

Informações de conformidade

RoHS

Compliant

REACH

Compliant

AEC-Q100

Not Applicable

Sem chumbo

Yes

Sem halogênios

Unknown

Minerais de conflito

Compliant

RoHS compliant per Altera/Intel product page. Industrial temperature grade (I7 suffix) is NOT AEC-Q100 qualified; choose SAE144I7G with A7 suffix for AEC-Q100 automotive.

Dados verificados em: 2026-10-06 — dados verificados e curados pela equipe de engenharia de componentes da XAIPART

Fontes: Distributor, Distributor, Manufacturer Product Page, Distributor, Distributor, Octopart, Distributor

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