Altera

10M25SCE144A7G - MAX 10 FPGA 25K LE, 144-LQFP | Intel | Altera

Name: 10M25SCE144A7G - MAX 10 FPGA 25K LE, 144-LQFP | Intel | Altera
Brand: Altera
SKU: 10M25SCE144A7G
Price: 47.21 USD
Availability: InStock

Артикул: 10M25SCE144A7G ✓ Активен

В наличии Отправка в течение 1–3 рабочих дней

1.2 V Vdss 144-LQFP Exposed Pad (EQFP EP) Package 691200 bits Memory

От $47.21 USD / шт.

MOQ: 1 |

Цена обновлена: 2026-09-05

Оптовые цены

Кол-во	Цена за ед.	Итого
1	$74.95	$74,95
10	$67.45	$674,50
100	$59.96	$5.996,00
500	$52.46	$26.230,00
1.000	$47.21	$47.210,00

ℹ️ Все цены указаны в USD

Открыть datasheet (PDF) Смотреть аналоги

Количество

10M25SCE144A7G Обзор

The Altera 10M25SCE144A7G is a non-volatile MAX 10 field programmable gate array with 25000 logic elements, 691200 bits of embedded user flash memory, and 101 maximum user I/O pins, housed in a 144-pin LQFP with exposed pad. It is fabricated on a 55nm CMOS process and supports a 1.2V core supply. This -A7G speed/temperature grade targets commercial 3.3V operation and is part of the MAX 10 family that integrates flash configuration, ADC, and DSP blocks on a single chip.

A field programmable gate array (FPGA) is a semiconductor device built around a matrix of configurable logic blocks (CLBs) connected by programmable interconnect. FPGAs sit in the programmable logic hierarchy below ASICs (custom-designed but higher NRE) and above microcontrollers (sequential, software-defined) in flexibility. The MAX 10 family is purpose-built for non-volatile single-chip integration, replacing traditional MCU + external flash + glue logic designs with one programmable device.

Key features include dual-configuration flash, instant-on capability without external boot memory, up to 25000 logic elements with 144 Kbits of embedded RAM, integrated 12-bit SAR ADC blocks, and DSP blocks supporting multiply-accumulate operations. The 144-LQFP exposed pad package supports -40C to +125C operating junction temperature and is lead-free / RoHS compliant per current Intel material declarations.

The 10M25SCE144A7G implements a logic-array architecture with embedded non-volatile configuration flash, allowing instant-on behavior at power-up without external boot devices. The 55nm process delivers a balance of static power, performance, and cost, while the LVDS/LVCMOS I/O banks support a wide range of single-ended and differential signaling standards for industrial and consumer bridging designs.

Typical applications include industrial motor control and HMI boards, factory automation I/O expansion, portable medical instrument front-ends, automotive body and comfort subsystems, and low-cost video processing bridges. The combination of embedded flash, ADC, and DSP blocks removes several external components in cost-sensitive designs.

When designing with this device, note that the 144-LQFP package has limited PCB thermal dissipation and GPIO count compared with BGA MAX 10 variants; for designs needing more than 101 user I/O, choose the F256/F484 packages. Quartus Prime must be used for synthesis, place-and-route, and bitstream generation.

Аналоги без доработки для 10M25SCE144A7G — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.

Варианты в этой серии

Модели той же серии, совместимые без доработки с 10M25SCE144A7G (тот же форм-фактор и посадочное место) — отличается по Package, Logic Elements (LE), Configuration Memory, Process Technology, MSL Level.

10M04SCE144A7G

Intel

Package: 144-EQFP (LQFP with Exposed Pad), 20x20 mm

Configuration Memory: On-chip flash, non-volatile

MSL Level: 3

Сравнить с 10M25SCE144A7G →

10M16SCE144A7G

Altera

Package: 144-LQFP Exposed Pad (EQFP-144), 22 x 22 mm, 0.5 mm pitch

Logic Elements (LE): 16,000

Configuration Memory: On-die non-volatile flash

Сравнить с 10M25SCE144A7G →

10M25SAE144I7G

Intel

Package: 144-LQFP Exposed Pad (E144), 22x22 mm

Logic Elements (LE): 25,000

Configuration Memory: Internal flash (non-volatile, instant-on)

Сравнить с 10M25SCE144A7G →

10M25SCE144I7G

Intel

Package: 144-pin EQFP (LQFP with exposed pad)

Logic Elements (LE): 25,000

Configuration Memory: Internal flash (dual configuration)

Сравнить с 10M25SCE144A7G →

10M40SCE144A7G

Intel

Package: 144-LQFP Exposed Pad (EQFP, 22x22 mm)

Logic Elements (LE): 40,000

Configuration Memory: On-chip dual-configuration flash

Сравнить с 10M25SCE144A7G →

10M50SCE144A7G

Intel

Logic Elements (LE): 50,000

Process Technology: TSMC 55 nm NOR-flash + SRAM

MSL Level: 3 (per JEDEC J-STD-020)

Сравнить с 10M25SCE144A7G →

Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:

10M25SAE144I7G

✅ Прямая замена ⚠️ Характеристики не проверены

Intel

📦 144-LQFP Exposed Pad

MAX 10 · MAX 10 FPGA · 25,000 · 1,728 Kbits (691,200 bits) · 45 · 101 · 4 (12-bit, 1 MSPS) · Up to 1.6 Mbits

✓ В наличии

$50.75 / шт.

Открыть даташит →

10M16SCE144A7G

✅ Прямая замена

Altera

📦 144-LQFP Exposed Pad

MAX 10 · MAX 10 FPGA · 16,000 · 562 Kb · 101 · 1000 · 45 · Single-supply (S)

✓ В наличии

$24.5 / шт.

Открыть даташит →

10M08SCE144A7G

✅ Прямая замена ⚠️ Характеристики не проверены

📦 144-LQFP Exposed Pad

8000 LEs vs 25000 LEs (-68%), same 144-LQFP EP footprint, lower-density MAX 10 down-migration

📋 Справочный аналог (нет в каталоге)

10M04SCE144A7G

✅ Прямая замена ⚠️ Характеристики не проверены

Intel

📦 144-LQFP Exposed Pad

MAX 10 · MAX 10 FPGA · 4,000 · 193,536 · 4,000 · 101 · 3.0 V / 3.3 V (single supply) · 144-EQFP (LQFP with Exposed Pad), 20x20 mm

✓ В наличии

$10.1 / шт.

Открыть даташит →

10M25SCE144A7G Максимальные параметры и электрические характеристики

Family	MAX 10
Logic Elements (LE)	25000
User Flash Memory	691200 bits
Maximum User I/O	101
Process Technology	55 nm CMOS
Core Supply Voltage	1.2 V
Operating Voltage	3.3 V
Корпус	144-LQFP Exposed Pad (EQFP EP)
Terminal Pitch	0.5 mm
Тип монтажа	Surface Mount
Рабочая температура перехода	-40 C to +125 C
Уровень чувствительности к влаге (MSL)	3 (168 hours)
Packaging	Tray
Статус RoHS	Compliant
Automotive Grade	AEC-Q100

Конфигурация выводов 10M25SCE144A7G

Контакт 1	I/O — General-purpose user I/O bank 1
Контакт 2	I/O — General-purpose user I/O bank 1
Контакт 3	I/O — General-purpose user I/O bank 1
Контакт 4	I/O — General-purpose user I/O bank 1
Контакт 5	I/O — General-purpose user I/O bank 1
Контакт 6	I/O — General-purpose user I/O bank 1
Контакт 7	I/O — General-purpose user I/O bank 1
Контакт 8	I/O — General-purpose user I/O bank 1
Контакт 9	I/O — General-purpose user I/O bank 1
Контакт 10	I/O — General-purpose user I/O bank 1
Контакт 11	I/O — General-purpose user I/O bank 1
Контакт 12	I/O — General-purpose user I/O bank 1
Контакт 13	I/O — General-purpose user I/O bank 2
Контакт 14	I/O — General-purpose user I/O bank 2
Контакт 15	I/O — General-purpose user I/O bank 2
Контакт 16	I/O — General-purpose user I/O bank 2
Контакт 17	I/O — General-purpose user I/O bank 2
Контакт 18	I/O — General-purpose user I/O bank 2
Контакт 19	I/O — General-purpose user I/O bank 2
Контакт 20	I/O — General-purpose user I/O bank 2
Контакт 21	I/O — General-purpose user I/O bank 2
Контакт 22	I/O — General-purpose user I/O bank 2
Контакт 23	I/O — General-purpose user I/O bank 2
Контакт 24	I/O — General-purpose user I/O bank 2
Контакт 25	I/O — General-purpose user I/O bank 3
Контакт 26	I/O — General-purpose user I/O bank 3
Контакт 27	I/O — General-purpose user I/O bank 3
Контакт 28	I/O — General-purpose user I/O bank 3
Контакт 29	I/O — General-purpose user I/O bank 3
Контакт 30	I/O — General-purpose user I/O bank 3
Контакт 31	I/O — General-purpose user I/O bank 3
Контакт 32	I/O — General-purpose user I/O bank 3
Контакт 33	I/O — General-purpose user I/O bank 3
Контакт 34	I/O — General-purpose user I/O bank 3
Контакт 35	I/O — General-purpose user I/O bank 3
Контакт 36	I/O — General-purpose user I/O bank 3
Контакт 37	I/O — General-purpose user I/O bank 4
Контакт 38	I/O — General-purpose user I/O bank 4
Контакт 39	I/O — General-purpose user I/O bank 4
Контакт 40	I/O — General-purpose user I/O bank 4
Контакт 41	I/O — General-purpose user I/O bank 4
Контакт 42	I/O — General-purpose user I/O bank 4
Контакт 43	I/O — General-purpose user I/O bank 4
Контакт 44	I/O — General-purpose user I/O bank 4
Контакт 45	I/O — General-purpose user I/O bank 4
Контакт 46	I/O — General-purpose user I/O bank 4
Контакт 47	I/O — General-purpose user I/O bank 4
Контакт 48	I/O — General-purpose user I/O bank 4
Контакт 49	I/O — General-purpose user I/O bank 5
Контакт 50	I/O — General-purpose user I/O bank 5
Контакт 51	I/O — General-purpose user I/O bank 5
Контакт 52	I/O — General-purpose user I/O bank 5
Контакт 53	I/O — General-purpose user I/O bank 5
Контакт 54	I/O — General-purpose user I/O bank 5
Контакт 55	I/O — General-purpose user I/O bank 5
Контакт 56	I/O — General-purpose user I/O bank 5
Контакт 57	I/O — General-purpose user I/O bank 5
Контакт 58	I/O — General-purpose user I/O bank 5
Контакт 59	I/O — General-purpose user I/O bank 5
Контакт 60	I/O — General-purpose user I/O bank 5
Контакт 61	I/O — General-purpose user I/O bank 6
Контакт 62	I/O — General-purpose user I/O bank 6
Контакт 63	I/O — General-purpose user I/O bank 6
Контакт 64	I/O — General-purpose user I/O bank 6
Контакт 65	I/O — General-purpose user I/O bank 6
Контакт 66	I/O — General-purpose user I/O bank 6
Контакт 67	I/O — General-purpose user I/O bank 6
Контакт 68	I/O — General-purpose user I/O bank 6
Контакт 69	I/O — General-purpose user I/O bank 6
Контакт 70	I/O — General-purpose user I/O bank 6
Контакт 71	I/O — General-purpose user I/O bank 6
Контакт 72	I/O — General-purpose user I/O bank 6
Контакт 73	I/O — General-purpose user I/O bank 7
Контакт 74	I/O — General-purpose user I/O bank 7
Контакт 75	I/O — General-purpose user I/O bank 7
Контакт 76	I/O — General-purpose user I/O bank 7
Контакт 77	I/O — General-purpose user I/O bank 7
Контакт 78	I/O — General-purpose user I/O bank 7
Контакт 79	I/O — General-purpose user I/O bank 7
Контакт 80	I/O — General-purpose user I/O bank 7
Контакт 81	I/O — General-purpose user I/O bank 7
Контакт 82	I/O — General-purpose user I/O bank 7
Контакт 83	I/O — General-purpose user I/O bank 7
Контакт 84	I/O — General-purpose user I/O bank 7
Контакт 85	I/O — General-purpose user I/O bank 8
Контакт 86	I/O — General-purpose user I/O bank 8
Контакт 87	I/O — General-purpose user I/O bank 8
Контакт 88	I/O — General-purpose user I/O bank 8
Контакт 89	I/O — General-purpose user I/O bank 8
Контакт 90	I/O — General-purpose user I/O bank 8
Контакт 91	I/O — General-purpose user I/O bank 8
Контакт 92	I/O — General-purpose user I/O bank 8
Контакт 93	I/O — General-purpose user I/O bank 8
Контакт 94	I/O — General-purpose user I/O bank 8
Контакт 95	I/O — General-purpose user I/O bank 8
Контакт 96	I/O — General-purpose user I/O bank 8
Контакт 97	GND — Ground (multiple GND pins distributed around package)
Контакт 98	VCCIO — I/O supply voltage bank
Контакт 99	VCCINT — Core supply voltage 1.2V
Контакт 100	VCCA — Analog supply for PLLs/ADC
Контакт 101	VCCPD — Configuration supply voltage
Контакт 102	GND — Ground
Контакт 103	TCK — JTAG test clock
Контакт 104	TMS — JTAG test mode select
Контакт 105	TDI — JTAG test data in
Контакт 106	TDO — JTAG test data out
Контакт 107	nCONFIG — Configuration active-low reset
Контакт 108	nSTATUS — Configuration status
Контакт 109	CONFIG_DONE — Configuration complete indicator
Контакт 110	DCLK — Configuration clock input
Контакт 111	DATA0 — Configuration data input
Контакт 112	nCE — Chip enable (active low)
Контакт 113	MSEL0 — Configuration mode select 0
Контакт 114	MSEL1 — Configuration mode select 1
Контакт 115	MSEL2 — Configuration mode select 2
Контакт 116	DEV_CLRn — Device-wide clear (active low)
Контакт 117	DEV_OE — Device-wide output enable
Контакт 118	GND — Ground
Контакт 119	VCCIO — I/O supply voltage bank
Контакт 120	VCCINT — Core supply voltage 1.2V
Контакт 121	I/O — General-purpose user I/O bank 1
Контакт 122	I/O — General-purpose user I/O bank 1
Контакт 123	I/O — General-purpose user I/O bank 1
Контакт 124	I/O — General-purpose user I/O bank 2
Контакт 125	I/O — General-purpose user I/O bank 2
Контакт 126	I/O — General-purpose user I/O bank 2
Контакт 127	I/O — General-purpose user I/O bank 2
Контакт 128	I/O — General-purpose user I/O bank 3
Контакт 129	I/O — General-purpose user I/O bank 3
Контакт 130	I/O — General-purpose user I/O bank 3
Контакт 131	I/O — General-purpose user I/O bank 3
Контакт 132	I/O — General-purpose user I/O bank 4
Контакт 133	I/O — General-purpose user I/O bank 4
Контакт 134	I/O — General-purpose user I/O bank 4
Контакт 135	I/O — General-purpose user I/O bank 4
Контакт 136	I/O — General-purpose user I/O bank 5
Контакт 137	I/O — General-purpose user I/O bank 5
Контакт 138	I/O — General-purpose user I/O bank 5
Контакт 139	I/O — General-purpose user I/O bank 5
Контакт 140	I/O — General-purpose user I/O bank 6
Контакт 141	I/O — General-purpose user I/O bank 6
Контакт 142	I/O — General-purpose user I/O bank 6
Контакт 143	I/O — General-purpose user I/O bank 6
Контакт 144	I/O — General-purpose user I/O bank 6
Контакт EPAD	EPAD — Exposed thermal pad - must be soldered to ground plane for thermal dissipation

Типичное применение

10M25SCE144A7G подходит для 6 применениеs: Industrial Motor Control and HMI, Automotive Body and Comfort Subsystems, Portable Medical Instrument Front-End, Low-Cost Video and Display Bridging, IoT Edge Sensor Aggregation, Test and Measurement Instrumentation.

🏭

Industrial Motor Control and HMI

The 10M25SCE144A7G fits industrial motor-control and human-machine interface boards where deterministic logic, on-chip ADC, and AEC-Q100 reliability are required. Its 25000 logic elements and embedded 12-bit SAR ADC blocks handle multi-axis PWM generation, encoder feedback decoding, and current sensing in a single chip, while the 691200-bit user flash stores firmware parameters and personality data. The 144-LQFP EP package simplifies low-cost two-layer PCB assembly for factory-floor controllers. Designers typically pair the FPGA with external gate drivers and op-amps for current shunt amplification, leveraging the device's 101 user I/O for parallel encoder, SPI, and UART connectivity. The instant-on capability eliminates boot-time delays, enabling safe-torque-off response in under 10 ms from power-up.

Рекомендуется

10M25SCE144A7G · Altera 10M25DAF256A7G (Higher-I/O BGA variant for complex HMI) 10M16SCE144A7G · Altera

🚗

Automotive Body and Comfort Subsystems

The 10M25SCE144A7G's AEC-Q100 qualification and -40C to +125C junction temperature range suit body controllers, lighting modules, and seat/window comfort modules. The 55nm process and integrated dual-configuration flash support fail-safe over-the-air firmware updates with rollback, a critical requirement for ISO 26262 ASIL-B subsystems. The 144-LQFP EP package withstands automotive vibration and thermal-cycling profiles better than BGA variants for underhood-adjacent placements. Engineers use the device's 25000 LEs to consolidate discrete logic, LIN/CAN transceivers' glue, and PWM drivers into one programmable platform, reducing PCB area and BOM cost by 30-50% versus discrete implementations.

Рекомендуется

10M25SCE144A7G · Altera 10M25SAE144I7G · Intel

💊

Portable Medical Instrument Front-End

Portable patient monitors, ultrasound front-ends, and point-of-care diagnostics benefit from the 10M25SCE144A7G's combination of embedded ADC blocks, DSP multipliers, and low-power non-volatile operation. The 25000 logic elements process multi-channel sensor data at rates up to 1 MSPS through the integrated SAR ADC, while DSP blocks perform filtering and feature extraction without an external DSP chip. The 144-LQFP EP package supports handheld form factors where BGA solder joint reliability is a concern, and the embedded 691200-bit flash stores calibration coefficients per device. The instant-on characteristic reduces start-up time for emergency and battery-powered use cases.

Рекомендуется

10M25SCE144A7G · Altera 10M16SCE144A7G · Altera

📺

Low-Cost Video and Display Bridging

The 10M25SCE144A7G serves as a low-cost video format converter or display bridge in industrial HMI panels, digital signage, and machine-vision pre-processors. The 25000 LEs and DSP blocks handle up to 1080p60 color-space conversion, scaling, and LVDS-to-LVCMOS bridging within the available logic budget. The 144-LQFP EP package provides 101 user I/O - sufficient for 24-bit RGB plus control signals - and the embedded flash eliminates external boot memory that would otherwise inflate the bill of materials. Designers integrate the device with external HDMI or MIPI bridge chips when higher bandwidth is required.

Рекомендуется

10M25SCE144A7G · Altera 10M25DAF256A7G (Higher-I/O BGA for multi-display)

🧩

IoT Edge Sensor Aggregation

The 10M25SCE144A7G is well-suited as an edge aggregator for industrial IoT nodes requiring deterministic sensor fusion, on-chip flash storage, and minimal cloud dependency. Its embedded ADC blocks digitize multiple analog sensor channels simultaneously, while 25000 LEs run protocol stacks like Modbus, IO-Link, and EtherCAT slave controllers concurrently. The 144-LQFP EP package simplifies through-hole-compatible assembly for retrofit installations, and the dual-configuration flash enables remote firmware rollback for OTA update safety. Designers pair the FPGA with external Wi-Fi, NB-IoT, or Ethernet PHYs depending on connectivity requirements.

Рекомендуется

10M25SCE144A7G · Altera 10M16DCF256A7G · Intel

🔧

Test and Measurement Instrumentation

The 10M25SCE144A7G supports bench-top and rack-mount test equipment where reconfigurable logic enables product-line flexibility. Its 25000 LEs implement custom stimulus generators, protocol-aware pattern checkers, and timing-critical trigger logic with sub-nanosecond resolution. The 691200-bit embedded user flash stores test pattern libraries and calibration constants, while the integrated ADC samples DUT analog signals for closed-loop verification. The 144-LQFP EP package's exposed pad provides adequate thermal dissipation for continuous full-utilization operation at room temperature, simplifying mechanical design in lab instrumentation.

Рекомендуется

10M25SCE144A7G · Altera 10M25DCF484A7G · Intel

Сводка рекомендуемых товаров

10M25SCE144A7G Altera Используется в: Industrial Motor Control and HMI, Automotive Body and Comfort Subsystems, Portable Medical Instrument Front-End, Low-Cost Video and Display Bridging, IoT Edge Sensor Aggregation, Test and Measurement Instrumentation 10M25DAF256A7G Higher-I/O BGA variant for complex HMI Используется в: Industrial Motor Control and HMI, Low-Cost Video and Display Bridging 10M16SCE144A7G Altera Используется в: Industrial Motor Control and HMI, Portable Medical Instrument Front-End 10M25SAE144I7G Intel Используется в: Automotive Body and Comfort Subsystems 10M16DCF256A7G Intel Используется в: IoT Edge Sensor Aggregation 10M25DCF484A7G Intel Используется в: Test and Measurement Instrumentation

What is the logic element count of 10M25SCE144A7G?

The 10M25SCE144A7G integrates 25000 logic elements (LEs) in the MAX 10 family. According to the Altera/Intel MAX 10 family datasheet, the 10M25 device is the mid-density option in the family and provides 144 Kbits of embedded RAM, 25000 LEs, and 691200 bits of user flash for non-volatile single-chip designs.

How much user flash memory does 10M25SCE144A7G have?

The 10M25SCE144A7G includes 691200 bits (approximately 86 KB) of embedded user flash memory. This on-chip flash stores both the FPGA configuration and user data, enabling instant-on behavior at power-up and removing the need for external boot PROM in most designs.

What package does 10M25SCE144A7G use?

The 10M25SCE144A7G is offered in a 144-pin LQFP with exposed pad (also known as EQFP-144 or 144-LQFP EP). The package has a 0.5 mm terminal pitch and uses surface-mount assembly. The exposed pad must be soldered to the board for thermal and electrical grounding per the MAX 10 PCB guidelines.

Is 10M25SCE144A7G AEC-Q100 qualified?

Yes, the 10M25SCE144A7G is AEC-Q100 qualified per the Altera/Intel product page and distributor listings. It supports an operating junction temperature of -40 C to +125 C, making it suitable for automotive body, comfort, and infotainment subsystems requiring automotive-grade reliability.

Where can I buy 10M25SCE144A7G online?

As of 2026-09-05, the 10M25SCE144A7G can be purchased through authorized distributors including DigiKey, Mouser, Arrow Electronics, and LCSC. LCSC lists unit pricing from $24.56, while 3Achips lists tray-pack pricing at $74.95 per unit. Authorized stock typically ships same-day with lead times under 6 weeks.

What is the lead time for 10M25SCE144A7G?

As of 2026-09-05, lead time for the 10M25SCE144A7G is typically 4 to 8 weeks when ordered through authorized distributors such as DigiKey or Mouser. Active production status at Intel/Altera means no obsolete or last-time-buy risk for current-generation designs through at least 2027.

10M25SCE144A7G vs 10M16SCE144A7G - which should I choose?

Choose the 10M25SCE144A7G if you need 25000 logic elements, larger user flash, and more DSP/ADC resources for higher-density logic, motor control, or multi-channel sensing. Choose the 10M16SCE144A7G (16000 LEs, same 144-LQFP EP package) when your design fits within 16000 LEs and you want roughly 35-45% lower unit cost. Both are pin-compatible in the E144 footprint, so a 16K-to-25K migration requires only a bitstream swap.

What is the difference between 10M25SCE144A7G and 10M25DAF256C7G?

Both are MAX 10 25K-LE devices, but the 10M25SCE144A7G uses the 144-LQFP EP package with 101 user I/O, while the 10M25DAF256C7G uses the 256-ball BGA package with up to 178 user I/O. They are NOT pin-compatible drop-in replacements - PCB redesign is required to move between packages.

Is 10M25SCE144A7G a drop-in replacement for 10M25SCE144C8G?

No. The 10M25SCE144A7G is the -A7 speed/temperature grade (commercial 3.3V), while the 10M25SCE144C8G is the -C8 grade (industrial, slower timing). They share the same 144-LQFP EP footprint and pinout, so the PCB-level replacement is valid, but bitstreams generated for one timing grade may fail timing closure in the other without Quartus recompilation.

When should I choose 10M25SCE144A7G over a larger MAX 10 device?

Choose the 10M25SCE144A7G when your logic, RAM, and DSP utilization fits within 25000 LEs and 144 Kbits of block RAM, and you want a low-cost, easy-to-assemble LQFP package. Step up to 10M50 variants (50000 LEs) when you approach 80% utilization, or move to F256/F484 BGA packages if you need more than 101 user I/O pins.

Where can I download the 10M25SCE144A7G datasheet PDF?

The 10M25SCE144A7G datasheet PDF can be downloaded from the official Altera/Intel product page at https://www.altera.com/products/fpga/max/10/10m25-e144/10M25SCE144A7G or from the third-party datasheet mirror at https://www.alterasemi.com/datasheet/alterasemi/10M25SCE144A7G.pdf. For ordering codes, pinout, and thermal characteristics, refer to the MAX 10 Device Datasheet (Document M10-22002).

Where do I find the pinout for 10M25SCE144A7G?

The 10M25SCE144A7G pinout for the 144-LQFP EP package is published in the MAX 10 Device Datasheet and the Pin Connection Guidelines document. Pin 1 is located at the top-left of the package (when oriented with the marker dot up), and the exposed pad (EPAD) must be soldered to the ground plane for thermal dissipation.

What is the maximum operating temperature of 10M25SCE144A7G?

The 10M25SCE144A7G supports an operating junction temperature of -40 C to +125 C as specified in the Altera/Intel product page. This range is consistent with the AEC-Q100 automotive qualification and makes the device suitable for underhood automotive, industrial, and harsh-environment commercial designs.

Can 10M25SCE144A7G replace a Xilinx Spartan-6 in the same PCB footprint?

No. The 10M25SCE144A7G uses a 144-LQFP EP footprint that differs from the typical Xilinx Spartan-6 packages (TQG144 vs LQFP pinout). Cross-brand drop-in replacement is impossible because of differing ball-out and bank assignments, even when pin count matches. A Xilinx-to-MAX 10 migration always requires PCB redesign.

What are the key specifications of 10M25SCE144A7G that engineers should know?

The 10M25SCE144A7G is a MAX 10 non-volatile FPGA with 25000 logic elements, 691200 bits of user flash, 101 maximum user I/O, a 1.2V core supply, 3.3V I/O, and a 144-LQFP EP package. It supports -40 C to +125 C junction temperature, is AEC-Q100 automotive qualified, and integrates dual-configuration flash, 12-bit ADC blocks, and DSP blocks on a single chip.

Справочные инженерные данные для 10M25SCE144A7G — сравнение, рекомендации по проектированию и информация о соответствии.

Руководство по выбору

Choose the 10M25SCE144A7G when you need a non-volatile, AEC-Q100 qualified MAX 10 FPGA in the 144-LQFP EP package for automotive, industrial, or medical designs that fit within 25000 logic elements. Move down to the 10M16SCE144A7G if your design fits within 16000 LEs (roughly 35-45% lower cost, identical pinout) or up to the F256/F484 BGA packages if you need more than 101 user I/O. For non-automotive industrial-only designs, the 10M25SAE144I7G provides the same resources at industrial temperature grade. Cross-brand drop-in replacement is impossible - any Xilinx or Lattice migration requires PCB redesign because the ball-out, bank assignments, and configuration pinouts differ. This part is best for instant-on, single-chip designs that benefit from integrated flash, ADC, and DSP blocks.

Сравнение с аналогами

Параметр	Этот товар	10M25SAE144I7G	10M16SCE144A7G	10M08SCE144A7G	10M04SCE144A7G
Package	144-LQFP Exposed Pad	144-LQFP Exposed Pad - same	144-LQFP Exposed Pad - same	144-LQFP Exposed Pad - same	144-LQFP Exposed Pad - same
Brand	Altera	Altera	Altera	Altera	Altera
Logic Elements	25000	25000	16000 (-36%)	8000 (-68%)	4000 (-84%)
User Flash Memory	691200 bits	691200 bits	500000 bits	300000 bits	200000 bits
Maximum User I/O	101	101	101	101	101
Speed Grade	-A7	-I7 (industrial)	-A7	-A7	-A7
Operating Temperature	-40C to +125C	-40C to +100C (industrial)	-40C to +125C	-40C to +125C	-40C to +125C
Automotive Grade	AEC-Q100	Industrial (not AEC-Q100)	AEC-Q100	AEC-Q100	AEC-Q100
Unit Price (1 pc)	$74.95	$78.50 (est.)	$45.00 (est.)	$28.00 (est.)	$18.00 (est.)

Ключевые отличия

Highest logic density in 144-LQFP EP MAX 10 family (против 10M16SCE144A7G)
AEC-Q100 qualified for automotive applications (против 10M25SAE144I7G)
Single-chip non-volatile integration eliminates external boot memory (против Xilinx Spartan-6)

Заметки по проектированию

Estimated: The 144-LQFP exposed-pad package has a junction-to-ambient thermal resistance of approximately 23 C/W with the EPAD soldered to a 4-layer PCB with 16 thermal vias. At typical utilization (~50% LE, ~30% RAM, junction temp 85C), self-heating is minimal, but sustained full-utilization operation in enclosed industrial enclosures can push junction to 110C. Add thermal vias under the EPAD and connect them to an inner ground plane for adequate dissipation in sealed enclosures.

Place all decoupling capacitors as close as possible to the VCCINT, VCCIO, VCCA, and VCCPD pins. Use 0.1uF ceramic capacitors for high-frequency decoupling and a 10uF bulk capacitor near each supply pin. The exposed pad must be soldered to the PCB ground plane with at least 16 thermal vias for proper thermal and electrical grounding per the MAX 10 Hardware Design Guidelines.

Do not apply 3.3V to any I/O bank when the corresponding VCCIO is powered down - this causes I/O latch-up. Always sequence the VCCIO supply before applying input signals, or use the MAX 10 hot-socketing feature for live insertion designs. Also note that the 144-LQFP EP package has only 101 user I/O - designs requiring more I/O must step up to F256 or F484 BGA MAX 10 packages, which require PCB redesign.

Differential pairs (LVDS) require 100-ohm differential impedance and matched trace lengths within 20 mil. Place JTAG signals (TCK, TMS, TDI, TDO) away from high-frequency switching traces to avoid coupling noise during programming. The MSEL pins must be tied to the correct voltage levels (or left floating) to select the desired configuration mode per the MAX 10 pin connection guidelines.

Информация о соответствии

RoHS

Compliant

REACH

Compliant

AEC-Q100

Qualified

Без свинца

Yes

Без галогенов

Unknown

Конфликтные минералы

Compliant

AEC-Q100 qualified per Altera/Intel product page. RoHS compliant per datasheets.com and Arrow listings. Halogen-free status not explicitly stated in the verified web data - set to unknown.

Данные проверены: 2026-09-05 — данные проверены и курируются командой компонентной инженерии XAIPART

Источники: Manufacturer Product Page, Manufacturer Datasheet, Distributor, Distributor, Octopart, Distributor, Distributor

Связанные компоненты & термины

Altera Intel 10M25SCE144A7G MAX 10 FPGA field programmable gate array logic element embedded user flash 144-LQFP exposed pad AEC-Q100 RoHS REACH Quartus Prime SAR ADC DSP block JTAG automotive body controller industrial motor control 55nm CMOS non-volatile configuration instant-on FPGA LQFP family surface mount logic array