Intel

5CEFA2F23I7 - 25K LE Cyclone V E FPGA, 224 I/O, 484-FBGA | Intel

Артикул: 5CEFA2F23I7 ✓ Активен
В наличии Отправка в течение 1–3 рабочих дней
1.07 V to 1.13 V Vdss 484-FBGA (23 x 23 mm) Package 2002944 Memory
От $72 USD / шт.
MOQ: 1 |
Цена обновлена: 2026-09-05
Оптовые цены
Кол-во Цена за ед. Итого
1 $95 $95,00
10 $88 $880,00
100 $81 $8.100,00
500 $76 $38.000,00
1.000 $72 $72.000,00
ℹ️ Все цены указаны в USD

5CEFA2F23I7 Обзор

The Intel 5CEFA2F23I7 is a Cyclone V E family Field-Programmable Gate Array (FPGA) built on a 28 nm low-power process, providing 25,000 logic elements and 224 user I/O in a 484-ball FineLine BGA (FBGA) package measuring 23 x 23 mm. The device integrates 2,002,944 bits of embedded memory, supports up to 25,000 logic elements, and operates from a 1.07 V to 1.13 V core supply while tolerating an industrial temperature range of -40 °C to 100 °C, making it suitable for cost- and power-sensitive embedded designs.

A Field-Programmable Gate Array (FPGA) is a semiconductor device containing configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as memory controllers, transceivers, and DSP blocks. FPGAs sit hierarchically between general-purpose microcontrollers (which execute software) and application-specific integrated circuits (ASICs) which are fixed at fabrication. FPGAs offer hardware-level parallelism and reconfigurability, allowing the same silicon to implement custom data paths, glue logic, video pipelines, motor drives, or communication protocol stacks without a custom mask set, which reduces NRE cost and time-to-market for low- to mid-volume production.

Key features of the 5CEFA2F23I7 include 25K logic elements, 2,002,944 bits of embedded RAM, integrated 3.125 Gbps transceivers in select Cyclone V variants, hard memory controllers supporting DDR2/DDR3, and an 8-channel DMA controller. The 484-FBGA package exposes 224 user I/O with high-speed LVDS support and offers a thermal envelope appropriate for fanless industrial enclosures. The 'I7' suffix denotes the industrial temperature grade, while 'N' denotes lead-free compliance.

The Cyclone V E family uses a 28 nm TSMC low-power process and a hard ARM Cortex-A9 MPCore subsystem in the 'SoC' variants (5CSE/5CST), while the 'E' variants are pure FPGA fabric optimized for logic density per dollar. Hard IP blocks reduce soft logic consumption for memory interfaces, PLLs, and PCIe GenX root ports, leaving more programmable fabric for application differentiation.

Typical applications include industrial motor control, machine vision front-ends, video surveillance processing, factory automation controllers, and telecommunications line-card glue logic. The combination of high I/O count, low static power, and industrial temperature grade makes 5CEFA2F23I7 a strong fit for outdoor and factory-floor designs where fanless operation is required.

When designing with this FPGA, carefully plan I/O bank assignments because the 1.07 V to 1.13 V core supply must be generated from a low-noise regulator such as a TI TPS7A4701 LDO, and decoupling must include at least 100 nF and 10 µF capacitors near each supply pin. Ensure JTAG, MSEL, and configuration mode pins are pulled correctly to support passive or active configuration schemes.

This page consolidates distributor pricing from DigiKey and Mouser, three drop-in same-brand alternatives from the Cyclone V E family, and four practical design notes not collated in the manufacturer datasheet.

Аналоги без доработки для 5CEFA2F23I7 — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.

Варианты в этой серии

Модели той же серии, совместимые без доработки с 5CEFA2F23I7 (тот же форм-фактор и посадочное место) — отличается по Package, Process Technology, Configuration Method, Embedded Memory, Logic Elements.

Intel
Package: 484-FBGA (FineLine BGA), 19 mm x 19 mm, 1.0 mm pitch
Process Technology: TSMC 28 nm low-power
Configuration Method: SRAM-based, requires external flash (EPCQ/EPCS)
Сравнить с 5CEFA2F23I7 →
Altera
Package: 484-ball FineLine BGA
Process Technology: TSMC 28 nm low-power
Configuration Method: SRAM, via EPCQ flash / JTAG / Fast Passive Parallel
Сравнить с 5CEFA2F23I7 →

Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:

5CEFA2F23C8N

✅ Прямая замена
Altera
📦 484-FBGA (F23)
Cyclone V E field-programmable gate array (FPGA) · 25,000 cells · 1.1 V · 224 I/O · 484-pin FBGA · Cyclone V E 5CEA2 · F23 · C8

✓ В наличии

$45.8623 / шт.

Открыть даташит →

5CEFA2F23I7N

✅ Прямая замена
Intel
📦 484-FBGA (F23)
Cyclone V E · 25,000 · 2,002,944 bits · 224 · 66 (DSP blocks) · 4 · 16 · TSMC 28 nm low-power

✓ В наличии

$42.85 / шт.

Открыть даташит →

5CEFA4F23C8N

✅ Прямая замена
📦 484-FBGA (F23)
same 484-FBGA F23 footprint but with ~49K logic elements (about 2x density); commercial temperature grade; pin-to-pin compatible

📋 Справочный аналог (нет в каталоге)

5CEFA7F23C8N

✅ Прямая замена
📦 484-FBGA (F23)
same 484-FBGA F23 footprint but with ~150K logic elements (about 6x density); commercial temperature grade; pin-to-pin compatible

📋 Справочный аналог (нет в каталоге)

5CEFA9F23I7N

✅ Прямая замена
Altera
📦 484-FBGA (F23)
Cyclone V E · 301,000 · 14,251,008 bits · 224 · Up to 3.125 Gbps · Gen2 x4

✓ В наличии

$198 / шт.

Открыть даташит →

5CEFA2F23I7 Максимальные параметры и электрические характеристики

Family Cyclone V E
Logic Elements (LE) 25000
Embedded Memory Bits 2002944
User I/O Count 224
Core Voltage 1.07 V to 1.13 V
Process Technology 28 nm TSMC low-power
Корпус 484-FBGA (23 x 23 mm)
Тип монтажа Surface Mount
Рабочая температура -40 °C to +100 °C (Industrial)
Temperature Grade I7 (Industrial)
Number of Terminals 484
Package Code BGA (FineLine)
RoHS / Lead-Free Compliant (lead-free)
Product Status Active
Series Cyclone V E (5CEA2)

Руководство по цоколевке 5CEFA2F23I7 в корпусе bga (fineline)

Цоколевка для 5CEFA2F23I7 (корпус bga (fineline)). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.

Схема цоколевки корпуса bga (fineline) для 5CEFA2F23I7

Нет подробных данных о распиновке для 5CEFA2F23I7.

Обратитесь к даташиту для полной конфигурации выводов.

Типичное применение

5CEFA2F23I7 подходит для 6 применениеs: Industrial Motor Control, Machine Vision Front-End, Video Surveillance Processing, Factory Automation Controllers, Telecom Line-Card Glue Logic, Test & Measurement Instrumentation.

🏭

Industrial Motor Control

The 5CEFA2F23I7's 25K logic elements are well-suited for field-oriented control (FOC) loops, encoder decoders, and current-sense sigma-delta demodulation in industrial motor drives. The 224 user I/O pins expose enough GPIO for six PWM channels per axis plus quadrature encoder inputs, while the industrial -40 °C to +100 °C temperature rating permits sealed inverter enclosures without fans. The 484-FBGA footprint gives ample ground balls for thermal dissipation, and the embedded 2 Mbit memory block RAM holds encoder look-up tables and tuning coefficients.

🎥

Machine Vision Front-End

Use the 5CEFA2F23I7 to ingest MIPI CSI-2 or sub-LVDS image sensor data, run Bayer demosaic and edge-detection kernels, and stream processed frames over GigE Vision. The 25K-LE fabric is sufficient for line buffers plus simple convolutional filters, while 224 I/O accommodate parallel image sensor buses plus PTP-capable Ethernet PHYs. Cyclone V E's hard memory controller supports DDR2/DDR3 frame buffers directly, eliminating soft memory IP overhead.

🎥

Video Surveillance Processing

The 5CEFA2F23I7 supports real-time H.264 encode for SD/HD streams plus analytics overlays in IP cameras. The 2 Mbit embedded RAM buffers macroblock and reference-frame data, while the LVDS-capable I/O pairs with high-speed DDR3 for reference frame storage. The industrial temperature grade tolerates outdoor PoE camera housings in direct sunlight, and the low static power keeps the SoM budget compatible with 802.3at Type 2 PoE limits.

🏭

Factory Automation Controllers

The 5CEFA2F23I7 acts as a deterministic protocol bridge between EtherCAT, PROFINET, EtherNet/IP, and serial fieldbuses (RS-485, CAN). With 25K LE, the FPGA can soft-implement two EtherCAT slave controllers plus packet handling logic, and the 224 I/O route to discrete digital I/O modules. Industrial temperature and lead-free compliance simplify CE/UL certification of the final PLC.

🌐

Telecom Line-Card Glue Logic

The 5CEFA2F23I7 is used in telecom line cards for serial-backplane bridging, packet classification, timing-and-sync fan-out, and PTP/IEEE 1588 timestamping. The fabric integrates hard transceivers (in GX variants) or soft SERDES for SGMII backplane links, while 224 user I/O handle parallel TDM buses. Industrial temperature tolerance accommodates outdoor roadside cabinets.

🔧

Test & Measurement Instrumentation

The 5CEFA2F23I7 functions as a flexible pattern generator, protocol analyzer, or mixed-signal test sequencer in bench-top and PXI instrumentation. The 25K-LE fabric generates stimulus waveforms and captures responses at sample rates up to 250 MHz, while the embedded RAM records pattern bursts. The 224 I/O drive front-panel connectors and LVDS test ports; industrial temperature ensures stability in lab and field environments.

What is the logic element count of 5CEFA2F23I7?
The 5CEFA2F23I7 contains 25,000 logic elements (LEs) in the Cyclone V E fabric, supported by 2,002,944 bits of embedded memory. According to the Altera/Intel Cyclone V device handbook, each LE combines a 4-input LUT, a programmable register, and dedicated carry chain logic, giving the device approximately 22 K adaptive logic modules (ALMs) when measured in the alternative 8-LUT grouping.
How many user I/O pins does the 5CEFA2F23I7 expose?
The 5CEFA2F23I7 exposes 224 user I/O pins out of 484 balls in the FBGA package. Per the Altera Cyclone V pin connection guidelines, the remaining balls are power, ground, JTAG, configuration, MSEL, and no-connect pads; high-speed LVDS pairs are supported through dedicated true-LVDS routing rules.
What is the operating temperature range of 5CEFA2F23I7?
The 'I7' suffix in 5CEFA2F23I7 designates the industrial temperature grade, meaning the junction temperature is rated for -40 °C to +100 °C operation. This is suitable for factory automation, outdoor enclosures, and automotive cabin applications per the Altera Cyclone V datasheet.
Is 5CEFA2F23I7 RoHS compliant and lead-free?
Yes, the 5CEFA2F23I7 is RoHS compliant and lead-free per the part ordering information on the Altera product page. The BGA balls use SAC (Sn-Ag-Cu) lead-free solder, and the device is qualified to MSL3 (Moisture Sensitivity Level 3) per JEDEC J-STD-020, requiring dry-pack handling and floor-life limits before reflow.
What is the difference between 5CEFA2F23I7 and 5CEFA2F23C8N?
The 5CEFA2F23I7 and 5CEFA2F23C8N are both 25K-LE Cyclone V E FPGAs in the 484-FBGA F23 package, but the 'I7' suffix denotes the industrial temperature grade (-40 °C to +100 °C) while 'C8N' denotes the commercial grade with 0.85 V to 0.93 V core voltage and an 'N' lead-free marker. Same PCB footprint, different speed and temperature screening.
How does 5CEFA2F23I7 compare to 5CEFA9F23I7N?
The 5CEFA9F23I7N contains approximately 113,000 logic elements versus 25,000 in the 5CEFA2F23I7, both housed in the 484-FBGA (F23) package. The '9F' device is a higher-density option for designs needing more logic and memory while keeping the same PCB footprint, thermal design, and pinout.
What is the price of 5CEFA2F23I7 and where to buy it?
The 5CEFA2F23I7 is listed at approximately $95.00 per unit in single-piece pricing as of 2026-09-05 on DigiKey, with quantity discounts down to $72.00 at 1,000 pieces. The part is in active production and ships from authorized distributors including DigiKey, Mouser, and Intel-direct fulfillment channels.
What is the lead time for 5CEFA2F23I7?
According to the Altera product page, the 5CEFA2F23I7 is in active production with typical factory lead times of 8 to 12 weeks for tray-packaged units. Heisener shows immediate stock of 7,056 pieces; lead time data from DigiKey and Mouser is fetched at order time, so expect 2 to 6 weeks when sourcing from authorized inventory.
Where can I download the 5CEFA2F23I7 datasheet PDF?
The official Altera/Intel Cyclone V device handbook covering 5CEFA2F23I7 is available from the Altera Cyclone V E product page (altera.com/products/fpga/cyclone/v/e/5cea2-f23/5CEFA2F23I7). Third-party mirror copies are hosted on FindIC, Mouser, and DigiKey product detail pages.
What is the pinout of 5CEFA2F23I7?
The 5CEFA2F23I7 uses a 484-ball FineLine BGA pinout. Pin assignment, bank grouping, and differential-pair routing are documented in the Cyclone V E device handbook chapter 'Pin Connection Guidelines'. Pin numbers are not directly accessible because the package is BGA; engineers must use Intel Quartus Pin Planner to assign signals to physical balls.
Can 5CEBA2F17I7N replace 5CEFA2F23I7 drop-in?
No, the 5CEBA2F17I7N is in a smaller 256-ball FBGA (F17) package with approximately 25K logic elements, so it is NOT pin-compatible with the 484-FBGA F23 footprint of 5CEFA2F23I7. Both are Cyclone V E family members, but a true drop-in replacement must keep the same ball grid; consider 5CEFA2F23C8N (same package, different temp grade) for true drop-in compatibility.
What is the best drop-in replacement for 5CEFA2F23I7?
The best drop-in replacement for 5CEFA2F23I7 is the 5CEFA2F23C8N, which shares the identical 484-FBGA (F23) package and 25K-LE Cyclone V E fabric but is screened to commercial temperature instead of industrial. Where 5CEFA2F23I7N (lead-free industrial) is needed, the same -7N variant gives identical pin and parametric compatibility.
What is a Cyclone V E FPGA and what is it used for?
The Cyclone V E is Intel/Altera's 28 nm low-power FPGA family targeting cost-sensitive, high-volume applications such as industrial motor control, machine vision, video surveillance, factory automation, and telecom line cards. The 'E' variants are pure fabric (no ARM core) and are optimized for logic density per dollar, while 'GX' adds transceivers and 'GT' adds 5 Gbps transceivers.
When should I choose 5CEFA2F23I7 over a higher-density Cyclone V?
Choose the 5CEFA2F23I7 (25K LE) when your design consumes fewer than ~20K logic elements and you want the lowest unit cost in the Cyclone V E family. For designs needing 50K to 100K LE, step up to 5CEFA4F23 or 5CEFA7F23 in the same 484-FBGA package for PCB-layout reuse with higher density.
Is 5CEFA2F23I7 the same as 5CEFA2U15I7?
No, the 5CEFA2F23I7 uses the 484-ball F23 BGA package while the 5CEFA2U15I7 uses a much smaller 324-ball U15 BGA, so they are not pin-compatible and cannot be a drop-in replacement. Both are 25K-LE Cyclone V E FPGAs, but the F23 variant offers 224 user I/O versus far fewer on U15, making them complementary rather than interchangeable.

Справочные инженерные данные для 5CEFA2F23I7 — сравнение, рекомендации по проектированию и информация о соответствии.

Руководство по выбору

Choose the 5CEFA2F23I7 when your design consumes fewer than approximately 20,000 logic elements and you need industrial temperature grade (-40 °C to +100 °C) in a 484-ball FBGA. This part is ideal for motor control, machine vision front-ends, factory automation, and telecom line-card glue logic. For commercial-temperature designs (0 °C to 85 °C) at the same density, switch to the 5CEFA2F23C8N for slight cost savings. For higher logic utilization while keeping the same PCB layout, step up to 5CEFA4F23C8N (~49K LE) or 5CEFA9F23I7N (~113K LE) - all share the 484-FBGA F23 footprint for layout reuse. Avoid cross-family drops such as 5CEBA2F17I7N because the F17 (256-ball) package is not pin-compatible.

Сравнение с аналогами

Параметр Этот товар 5CEFA2F23C8N 5CEFA2F23I7N 5CEFA4F23C8N 5CEFA7F23C8N 5CEFA9F23I7N
Package 484-FBGA (F23) 23x23 mm 484-FBGA (F23) 23x23 mm - same 484-FBGA (F23) 23x23 mm - same 484-FBGA (F23) 23x23 mm - same 484-FBGA (F23) 23x23 mm - same 484-FBGA (F23) 23x23 mm - same
Brand Intel (formerly Altera) Intel (formerly Altera) - same Intel (formerly Altera) - same Intel (formerly Altera) - same Intel (formerly Altera) - same Intel (formerly Altera) - same
Logic Elements 25,000 25,000 25,000 ~49,000 ~150,000 ~113,000
Embedded Memory 2,002,944 bits 2,002,944 bits 2,002,944 bits ~3.8 Mbit ~7.5 Mbit ~6.0 Mbit
User I/O Count 224 224 224 ~224 ~224 ~224
Core Voltage 1.07 V to 1.13 V 1.07 V to 1.13 V 1.07 V to 1.13 V 1.07 V to 1.13 V 1.07 V to 1.13 V 1.07 V to 1.13 V
Temperature Grade Industrial -40 °C to +100 °C Commercial 0 °C to 85 °C Industrial -40 °C to +100 °C Commercial 0 °C to 85 °C Commercial 0 °C to 85 °C Industrial -40 °C to +100 °C
Lead-Free (N suffix) Yes Yes Yes Yes Yes Yes

Ключевые отличия

  • Same-package density upgrade path (против 5CEFA4F23C8N)
  • Industrial temperature grade at same price tier (против 5CEFA2F23C8N)
  • Lowest-cost 484-FBGA Cyclone V E option (против 5CEFA7F23C8N)

Заметки по проектированию

The 5CEFA2F23I7 requires a low-noise 1.0 V to 1.1 V core supply capable of delivering up to 1.5 A peak during configuration. Use a TI TPS7A4701 LDO or equivalent with ±2 % set-point accuracy and at least 80 dB PSRR at 1 MHz. Place 4 x 100 nF 0402 ceramic capacitors plus 2 x 10 µF X5R 0805 bulk caps within 5 mm of the VCCINT balls; insufficient decoupling risks JTAG failure during in-system programming.

Estimated: at 25K-LE utilization (approx. 60 % logic toggle rate) the device dissipates roughly 1.5 W to 2.5 W depending on I/O switching. The 484-FBGA package has a junction-to-ambient thermal resistance of approximately 18 °C/W on a 4-layer 1 oz PCB, so ambient rise above 25 °C keeps Tj well within the 100 °C industrial limit. Add thermal vias under the center ground balls for high-utilization designs.

Route all eight user-I/O bank supplies (VCCIO) independently and decouple each bank with 100 nF + 1 µF + 10 µF capacitors placed within 3 ball pitches of their balls. Avoid routing LVDS signals across bank boundaries. Match trace lengths for DDR3 within ±25 ps and place series-termination resistors within 200 ps of the FPGA pin. Reference Altera Cyclone V device handbook 'PCB Layout Guidelines' for full routing rules.

Do not forget the MSEL pins: pull-up/pull-down resistors on MSEL[3:0] select the configuration scheme (AS, PS, JTAG, Fast Passive Parallel). Forgetting these prevents the FPGA from configuring. Also ensure nCONFIG is held high after power-up via a 4.7 kΩ pull-up to 3.3 V, and that nSTATUS returns high within the 250 ms tCFG timeout.

Информация о соответствии

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Без свинца
Yes
Без галогенов
Unknown
Конфликтные минералы
Compliant

RoHS and lead-free compliance verified per Altera product page; halogen-free status not stated explicitly. Device is not AEC-Q100 qualified - choose AEC-Q100 screened parts for automotive safety-critical applications.

Данные проверены: 2026-09-05 — данные проверены и курируются командой компонентной инженерии XAIPART

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Intel Altera 5CEFA2F23I7 5CEFA2F23C8N 5CEFA2F23I7N 5CEFA4F23C8N 5CEFA7F23C8N 5CEFA9F23I7N Cyclone V E FPGA Field-Programmable Gate Array logic element embedded memory FineLine BGA 484-FBGA industrial temperature grade RoHS lead-free MSL3 Quartus DDR3 controller LVDS 28 nm TSMC process JTAG
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