5CEFA9F23I7N - Cyclone V E FPGA 301K LE 484-BGA | Altera
MPN: 5CEFA9F23I7N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $268.5 | $2,685.00 |
| 100 | $246.75 | $24,675.00 |
| 500 | $222 | $111,000.00 |
| 1,000 | $198 | $198,000.00 |
5CEFA9F23I7N Overview
A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs) connected by a programmable interconnect. Modern FPGAs such as the Cyclone V E also integrate hard IP blocks including transceivers, DSP blocks, block RAM, and memory controllers, blending the flexibility of programmable logic with the deterministic performance of ASIC-class peripherals. Cyclone V E belongs to Altera's (now Intel FPGA) low-power, low-cost family positioned between ASICs and high-end FPGAs.
Key features of the 5CEFA9F23I7N include 3.125 Gbps transceivers, a hard memory controller for DDR3, PCIe Gen2 x4 support, and fractional PLL synthesis. The part supports industrial temperature operation (-40C to +100C for the I7 speed grade) and is built on TSMC's 28 nm low-power process, giving a favorable performance-per-watt ratio for cost-sensitive applications.
The Cyclone V E architecture pairs a fabric of adaptive logic modules (ALMs) with 8-input fracturable look-up tables, dedicated 18x18 multipliers for DSP, and M20K block RAM tiles of 20 Kb each. Configuration is via SRAM cells, requiring a boot flash such as EPCQ on the board; the device supports passive serial, fast passive parallel, and JTAG configuration chains.
Typical applications include industrial machine vision, motor control, video processing and display pipelines, software-defined radio front ends, low-cost wireline aggregation, and PCIe endpoint cards in test instrumentation. The 484-FBGA package supports both consumer and industrial boards with abundant GPIO for parallel sensor or display interfaces.
When designing with this FPGA, plan the power tree carefully: VCCINT, VCCA, VCCD_PLL, VCCIO per bank, and transceiver rails each require their own decoupling strategy. Provide a configuration flash and a robust JTAG header for boundary-scan debug and in-system programming.
Drop-in alternatives for 5CEFA9F23I7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with 5CEFA9F23I7N (same form factor and footprint) — differing in Package, Embedded Memory, Speed Grade, Transceivers, Process Technology.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
5CEFA9F31I7N
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5CEFA9F23C8N
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5CEFA9F23I7
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5CEFA7F23I7N
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5CEFA2F23I7N
✅ Drop-In✓ In Stock
$42.85 / Unit
View Datasheet →5CEFA9F23I7N Maximum Ratings & Electrical Characteristics
| Family | Cyclone V E |
| Logic Elements | 301,000 |
| Embedded Memory | 14,251,008 bits |
| DSP Blocks (18x18 Multipliers) | 224 |
| Transceivers | Up to 3.125 Gbps |
| PCIe Hard IP | Gen2 x4 |
| Memory Controller Hard IP | DDR3 (hard controller) |
| PLLs | Fractional PLLs (per bank) |
| Process Technology | TSMC 28 nm low-power |
| Package | 484-ball FineLine BGA |
| Operating Temperature | -40C to +100C (industrial) |
| Speed Grade | I7 (fastest industrial) |
| Configuration Method | SRAM, via EPCQ flash / JTAG / Fast Passive Parallel |
| Supply Voltage Core | 1.1 V (VCCINT, typical) |
| RoHS Status | Compliant |
5CEFA9F23I7N 484-ball fineline bga Pin Configuration Guide
Pin configuration for 5CEFA9F23I7N (484-ball fineline bga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5CEFA9F23I7N.
Refer to the datasheet for full pin configuration.
Typical Applications
5CEFA9F23I7N is suitable for 6 applications: Industrial Machine Vision, Video Processing & Display Pipelines, Motor Control & Industrial Drives, Software-Defined Radio Front End, PCIe Endpoint Card for Test & Measurement, Low-Cost Wireline Aggregation.
Industrial Machine Vision
The 5CEFA9F23I7N suits industrial machine vision: its 301,000 logic elements and 224 18x18 multipliers deliver real-time Bayer demosaicing, Sobel edge detection, and small CNN inference at 1080p60 within the -40C to +100C industrial I7 envelope. Hard PCIe Gen2 x4 eases host-side image transfer; the DDR3 controller streams frame buffers at gigabytes per second.
Recommended
Video Processing & Display Pipelines
For video processing, the 5CEFA9F23I7N offers enough fabric and DSP for dual-channel 1080p60 pipelines, color-space conversion, scaling, and overlay composition. The DDR3 hard controller feeds frame buffers at full bandwidth, while PCIe Gen2 transports encoded streams to host processors. The FBGA484 package routes high-speed video interfaces on inner layers with matched impedance.
Recommended
Motor Control & Industrial Drives
In motor control, the 5CEFA9F23I7N runs field-oriented control (FOC), space-vector PWM, and encoder decoding for multi-axis servo drives. The fractional PLLs synthesize high-resolution PWM carriers, while the 224 multipliers handle Park/Clarke transforms and observer loops. Industrial temperature grade and 28 nm low-power process ensure reliable operation in cabinet environments.
Recommended
Software-Defined Radio Front End
For SDR front ends, the 5CEFA9F23I7N performs digital down-conversion, FIR filtering, and FFT-based spectral analysis on intermediate-frequency streams. The 3.125 Gbps transceivers accept ADC data directly, while the 224 18x18 multipliers handle quadrature mixing and polyphase filter banks. DDR3 buffers captured bursts before host transfer over PCIe.
Recommended
PCIe Endpoint Card for Test & Measurement
For T&M instrumentation, the 5CEFA9F23I7N provides a single-chip PCIe Gen2 x4 endpoint that streams high-speed ADC data to the host. The fabric implements custom trigger logic and on-card DSP, while the hard PCIe engine and DMA controller free the host CPU for analysis. The FBGA484 outline supports low-profile PCIe cards with compact heatsinks.
Recommended
Low-Cost Wireline Aggregation
In wireline aggregation equipment, the 5CEFA9F23I7N multiplexes multiple SFP+ links through its 3.125 Gbps transceivers, performs packet classification in fabric, and feeds aggregated streams to a backplane uplink. The DDR3 hard controller queues bursts at line rate; the I7 speed grade ensures deterministic latency across industrial temperature ranges.
Recommended
Recommended Products Summary
Engineering reference data for 5CEFA9F23I7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5CEFA9F31I7N | 5CEFA9F23C8N | 5CEFA9F23I7 | 5CEFA7F23I7N | 5CEFA2F23I7N |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 484-BGA (FBGA484) | 484-BGA (FBGA484) - same | 484-BGA (FBGA484) - same | 484-BGA (FBGA484) - same | 484-BGA (FBGA484) - same | 484-BGA (FBGA484) - same |
| Embedded Memory | 14,251,008 bits | 14,251,008 bits | 14,251,008 bits | 7,024,640 bits | 1,538,400 bits | |
| DSP Blocks (18x18 Multipliers) | 224 | 224 | 224 | 156 | 66 | |
| Speed Grade | I7 (industrial, fastest) | I7 | C8 (commercial, slower) | I7 | I7 | I7 |
| Operating Temperature | -40C to +100C (industrial) | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +100C (commercial) | -40C to +100C (industrial) | -40C to +100C (industrial) |
| Transceivers | Up to 3.125 Gbps | Up to 3.125 Gbps | Up to 3.125 Gbps | Up to 3.125 Gbps | Up to 3.125 Gbps | |
| PCIe Hard IP | Gen2 x4 | Gen2 x4 | Gen2 x4 | Gen2 x4 | Gen2 x4 | |
| DDR3 Hard Controller | Yes | Yes | Yes | Yes | Yes |
Key Differentiators
- Highest logic density in Cyclone V E FBGA484 package (vs 5CEFA7F23I7N)
- Industrial temperature grade at I7 fastest speed (vs 5CEFA9F23C8N)
- Order-of-magnitude more DSP than low-density tier (vs 5CEFA2F23I7N)
Design Notes
The Cyclone V E 5CEFA9F23I7N requires multiple supply rails: VCCINT (1.1 V core), VCCD_PLL (1.1 V PLL digital), VCCA (2.5 V PLL analog), VCCIO (1.2/1.5/1.8/2.5/3.3 V per bank), VCCPD (2.5/3.3 V pre-driver), and VCCCHIP_L/H (1.1/1.2 V transceiver rails). Place 0.1 uF X7R ceramic decoupling within 100 mil of each VCC pin, and add bulk 22-47 uF X5R capacitors per rail. Estimated: a fully utilized 5CEFA9F23I7N with active transceivers and 75% logic utilization may consume 3-5 W; design the regulator to deliver 1.5x this headroom.
The 484-ball FBGA uses 1.0 mm pitch and typically requires microvia (laser-drilled) PCB stack-up. Matched-length impedance control (100 ohm differential for transceivers, 50 ohm SE for GPIO) is mandatory. Route high-speed transceiver lanes on inner stripline layers with continuous reference planes. Keep DDR3 traces matched within 25 mil and length-matched across byte lanes per the Cyclone V E external memory interface guidelines.
Do not confuse 5CEFA9F23I7N (9-series, 301K LE, FBGA484) with 5CEFA7F23I7N (7-series, 149.5K LE) or 5CEFA2F23I7N (2-series, 25.9K LE) - all share the FBGA484 footprint but differ wildly in capacity. Verify JTAG IDCODE and silicon revision in software before programming. Always include an external configuration flash (EPCQ64 or larger) since SRAM-based FPGAs lose configuration on power-down. Pull MSEL pins correctly per datasheet to select the configuration mode.
Compliance Information
RoHS and REACH compliance per Intel FPGA (formerly Altera) product declarations; the I7 industrial temperature grade is not AEC-Q100 qualified (FPGAs are not typically AEC-Q100, instead design houses implement in-vehicle qualification through their own validation cycles).