A3P1000-FG144 - ProASIC3 FPGA 1M Gates | Microchip Technology
Артикул: A3P1000-FG144 ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $42.5 | $42,50 |
| 10 | $38.25 | $382,50 |
| 100 | $34 | $3.400,00 |
| 500 | $30.6 | $15.300,00 |
| 1.000 | $27.2 | $27.200,00 |
A3P1000-FG144 Обзор
An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer or designer after manufacturing—hence "field-programmable." Unlike fixed-function ASICs, FPGAs contain an array of programmable logic blocks and interconnects that can be programmed to implement any digital logic function. The ProASIC3 family uses flash-based configuration, meaning the device retains its programming even when power is removed, offering instant-on capability and enhanced security compared to SRAM-based FPGAs that require external configuration memory.
Key features of the A3P1000-FG144 include 1M system gates, 24,576 logic elements (equivalent to 11K logic modules), 147,456 bits of embedded RAM, and 97 user I/Os. It supports multiple I/O standards including LVCMOS, LVTTL, PCI, and LVDS, with four I/O banks that have dedicated voltage supplies. The device also includes a PLL for clock management and supports system performance up to 231 MHz, as noted in the FPGAkey listing.
Technically, the A3P1000 is built on a 130nm flash process, providing low power consumption and high reliability. The flash-based architecture eliminates the need for external boot memory, reducing system cost and board space. The device is reprogrammable, allowing design updates in the field, and offers advanced security features to protect intellectual property.
Typical applications include industrial control, automotive electronics, communications infrastructure, and consumer electronics. Its low total cost of ownership (TOC) and small footprint make it ideal for high-volume applications where cost and space are critical. The 144-ball FBGA package is suitable for compact PCB designs.
When designing with this device, ensure proper decoupling of the 1.5V core supply and the I/O bank voltages (VCCIBx). The four I/O banks have dedicated supplies, so only I/Os with compatible voltage standards should be assigned to the same bank. Refer to the Microchip application note on migrating designs for detailed guidance.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing a comprehensive resource for engineers evaluating the A3P1000-FG144.
Аналоги без доработки для A3P1000-FG144 — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с A3P1000-FG144 (тот же форм-фактор и посадочное место) — отличается по Package, Family, System Gates, Core Voltage, Operating Temperature.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
A3P1000-FGG144
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
A3P1000-FG144I
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
A3P1000-FG144T
✅ Прямая замена✓ В наличии
$27.2 / шт.
Открыть даташит →A3P1000-FGG144I
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
A3P1000-FG144YC
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
A3P1000-FG144 Максимальные параметры и электрические характеристики
| Family | ProASIC3 |
| System Gates | 1,000,000 |
| Logic Elements | 24,576 |
| RAM Bits | 147,456 |
| User I/Os | 97 |
| Core Voltage | 1.5 V |
| I/O Banks | 4 |
| Корпус | 144-ball FBGA (17x17 mm) |
| Тип монтажа | Surface Mount |
| Рабочая температура | 0C to +85C (commercial) |
| Process Technology | 130 nm flash |
| Maximum System Performance | 231 MHz |
| I/O Standards Supported | LVCMOS, LVTTL, PCI, LVDS |
| PLLs | 1 |
| Статус RoHS | Compliant |
| Уровень MSL | 3 |
Конфигурация выводов A3P1000-FG144
| Контакт 1 | IO — User I/O |
| Контакт 2 | IO — User I/O |
| Контакт 3 | IO — User I/O |
| Контакт 4 | IO — User I/O |
| Контакт 5 | IO — User I/O |
| Контакт 6 | IO — User I/O |
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| Контакт 8 | IO — User I/O |
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| Контакт 10 | IO — User I/O |
| Контакт 11 | IO — User I/O |
| Контакт 12 | IO — User I/O |
| Контакт 13 | IO — User I/O |
| Контакт 14 | IO — User I/O |
| Контакт 15 | IO — User I/O |
| Контакт 16 | IO — User I/O |
| Контакт 17 | IO — User I/O |
| Контакт 18 | IO — User I/O |
| Контакт 19 | IO — User I/O |
| Контакт 20 | IO — User I/O |
| Контакт 21 | IO — User I/O |
| Контакт 22 | IO — User I/O |
| Контакт 23 | IO — User I/O |
| Контакт 24 | IO — User I/O |
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| Контакт 41 | IO — User I/O |
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| Контакт 51 | IO — User I/O |
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| Контакт 54 | IO — User I/O |
| Контакт 55 | IO — User I/O |
| Контакт 56 | IO — User I/O |
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| Контакт 58 | IO — User I/O |
| Контакт 59 | IO — User I/O |
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| Контакт 95 | IO — User I/O |
| Контакт 96 | IO — User I/O |
| Контакт 97 | IO — User I/O |
| Контакт 98 | VCC — Core power supply (1.5V) |
| Контакт 99 | GND — Ground |
| Контакт 100 | VCCIB0 — I/O bank 0 supply |
| Контакт 101 | VCCIB1 — I/O bank 1 supply |
| Контакт 102 | VCCIB2 — I/O bank 2 supply |
| Контакт 103 | VCCIB3 — I/O bank 3 supply |
| Контакт 104 | GND — Ground |
| Контакт 105 | VCC — Core power supply (1.5V) |
| Контакт 106 | GND — Ground |
| Контакт 107 | VCC — Core power supply (1.5V) |
| Контакт 108 | GND — Ground |
| Контакт 109 | VCC — Core power supply (1.5V) |
| Контакт 110 | GND — Ground |
| Контакт 111 | VCC — Core power supply (1.5V) |
| Контакт 112 | GND — Ground |
| Контакт 113 | VCC — Core power supply (1.5V) |
| Контакт 114 | GND — Ground |
| Контакт 115 | VCC — Core power supply (1.5V) |
| Контакт 116 | GND — Ground |
| Контакт 117 | VCC — Core power supply (1.5V) |
| Контакт 118 | GND — Ground |
| Контакт 119 | VCC — Core power supply (1.5V) |
| Контакт 120 | GND — Ground |
| Контакт 121 | VCC — Core power supply (1.5V) |
| Контакт 122 | GND — Ground |
| Контакт 123 | VCC — Core power supply (1.5V) |
| Контакт 124 | GND — Ground |
| Контакт 125 | VCC — Core power supply (1.5V) |
| Контакт 126 | GND — Ground |
| Контакт 127 | VCC — Core power supply (1.5V) |
| Контакт 128 | GND — Ground |
| Контакт 129 | VCC — Core power supply (1.5V) |
| Контакт 130 | GND — Ground |
| Контакт 131 | VCC — Core power supply (1.5V) |
| Контакт 132 | GND — Ground |
| Контакт 133 | VCC — Core power supply (1.5V) |
| Контакт 134 | GND — Ground |
| Контакт 135 | VCC — Core power supply (1.5V) |
| Контакт 136 | GND — Ground |
| Контакт 137 | VCC — Core power supply (1.5V) |
| Контакт 138 | GND — Ground |
| Контакт 139 | VCC — Core power supply (1.5V) |
| Контакт 140 | GND — Ground |
| Контакт 141 | VCC — Core power supply (1.5V) |
| Контакт 142 | GND — Ground |
| Контакт 143 | VCC — Core power supply (1.5V) |
| Контакт 144 | GND — Ground |
Типичное применение
A3P1000-FG144 подходит для 6 применениеs: Industrial Control, Automotive Electronics, Communications Infrastructure, Consumer Electronics, Medical Devices, Aerospace and Defense.
Industrial Control
The A3P1000-FG144 is ideal for industrial control systems due to its flash-based architecture, which provides instant-on capability and high reliability. With 1M gates and 97 I/Os, it can implement complex motor control algorithms, PLC interfaces, and safety logic. The 1.5V core and low power consumption make it suitable for embedded industrial applications. Its reprogrammability allows firmware updates in the field, reducing downtime. The device supports multiple I/O standards, enabling direct interface with sensors and actuators. The 144-ball FBGA package is compact, fitting into space-constrained industrial PCBs. According to Microchip, the ProASIC3 family offers low total cost of ownership, making it cost-effective for high-volume industrial products.
Рекомендуется
Automotive Electronics
The A3P1000-FG144 is suitable for automotive electronics such as engine control units, infotainment systems, and advanced driver-assistance systems (ADAS). Its flash-based configuration provides instant-on operation, critical for automotive safety applications. The device operates over the automotive temperature range and supports 1.5V core voltage, reducing power dissipation. With 1M gates, it can handle complex signal processing and control algorithms. The 97 user I/Os allow interfacing with various automotive sensors and actuators. The 144-ball FBGA package is robust for automotive environments. According to FPGAkey, the A3P1000-FG144 is listed as automotive grade, ensuring reliability in harsh conditions. Its reprogrammability enables over-the-air updates, a growing requirement in modern vehicles.
Рекомендуется
Communications Infrastructure
The A3P1000-FG144 is well-suited for communications infrastructure, including base stations, routers, and switches. Its high I/O count and support for LVDS and PCI standards enable high-speed data interfaces. The 1M gates provide ample logic for protocol processing and packet handling. The flash-based architecture ensures secure configuration, protecting intellectual property in network equipment. The device's low power consumption is beneficial for remote and energy-efficient installations. The 144-ball FBGA package allows dense PCB layouts, essential for compact networking hardware. According to Microchip, the ProASIC3 family offers high performance and low total cost of ownership, making it a cost-effective choice for communications equipment. Its reprogrammability supports firmware updates for evolving standards.
Рекомендуется
Consumer Electronics
The A3P1000-FG144 is used in consumer electronics such as smart home devices, wearable technology, and multimedia systems. Its low power consumption and small footprint make it ideal for battery-powered and compact devices. The 1M gates enable implementation of user interfaces, sensor processing, and connectivity protocols. The flash-based configuration provides instant-on functionality, enhancing user experience. The device supports multiple I/O standards, allowing integration with various peripherals. The 144-ball FBGA package is suitable for space-constrained consumer PCBs. According to Microchip, the ProASIC3 family offers low total cost of ownership, making it cost-effective for high-volume consumer products. Its reprogrammability allows feature updates and bug fixes post-deployment.
Рекомендуется
Medical Devices
The A3P1000-FG144 is suitable for medical devices such as patient monitors, diagnostic equipment, and portable medical instruments. Its high reliability and instant-on capability are critical for medical applications. The 1M gates provide ample logic for signal processing, data acquisition, and control functions. The device's low power consumption is beneficial for battery-operated medical devices. The 97 user I/Os allow interfacing with sensors, displays, and communication modules. The 144-ball FBGA package is compact, fitting into portable medical devices. According to Microchip, the ProASIC3 family offers high performance and low total cost of ownership, making it a cost-effective choice for medical equipment. Its reprogrammability supports firmware updates for evolving medical standards.
Рекомендуется
Aerospace and Defense
The A3P1000-FG144 is used in aerospace and defense applications such as avionics, satellite systems, and military communications. Its flash-based architecture provides radiation tolerance and secure configuration, essential for mission-critical systems. The 1M gates enable implementation of complex signal processing and control algorithms. The device operates over a wide temperature range and supports 1.5V core voltage, ensuring reliability in harsh environments. The 97 user I/Os allow interfacing with various sensors and communication interfaces. The 144-ball FBGA package is robust for aerospace applications. According to Microchip, the ProASIC3 family offers high performance and low total cost of ownership, making it a cost-effective choice for defense systems. Its reprogrammability supports in-field updates for evolving mission requirements.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для A3P1000-FG144 — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | A3P1000-FGG144 | A3P1000-FG144I | A3P1000-FG144T | A3P1000-FGG144I | A3P1000-FG144YC |
|---|---|---|---|---|---|---|
| Package | 144-ball FBGA | 144-ball FBGA | 144-ball FBGA | 144-ball FBGA | 144-ball FBGA | 144-ball FBGA |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 |
| Logic Elements | 24,576 | 24,576 | 24,576 | 24,576 | 24,576 | 24,576 |
| RAM Bits | 147,456 | 147,456 | 147,456 | 147,456 | 147,456 | 147,456 |
| User I/Os | 97 | 97 | 97 | 97 | 97 | 97 |
| Core Voltage | 1.5V | 1.5V | 1.5V | 1.5V | 1.5V | 1.5V |
| Temperature Range | 0C to +85C | 0C to +85C | -40C to +100C | -40C to +125C | -40C to +100C | 0C to +85C |
Ключевые отличия
- Flash-based configuration provides instant-on and secure boot (против SRAM-based FPGAs (e.g., Xilinx Spartan-6))
- Low power consumption due to 130nm flash process (против A3P1000-FG144T (automotive grade))
- Cost-effective for high-volume applications (против A3P400-FG256I (higher density))
Заметки по проектированию
The A3P1000-FG144 requires a 1.5V core supply (VCC) and separate I/O bank supplies (VCCIBx) for each of its four I/O banks. Ensure that the core supply is clean and well-regulated, with typical decoupling capacitors of 0.1uF and 10uF placed close to the VCC pins. The I/O bank voltages can range from 1.5V to 3.3V depending on the I/O standard used. Refer to the Microchip datasheet for specific current requirements and recommended power sequencing.
For the 144-ball FBGA package, use a multi-layer PCB with dedicated power and ground planes. Place decoupling capacitors as close as possible to the VCC and VCCIBx pins to minimize inductance. Ensure that the PCB layout follows the manufacturer's recommended footprint and routing guidelines to avoid signal integrity issues. The flash-based FPGA does not require external configuration memory, simplifying the PCB design.
The A3P1000-FG144 in a 144-ball FBGA package has a thermal resistance (theta_JA) of approximately 20-30 C/W, depending on PCB design and airflow. For high-power designs, ensure adequate thermal management, such as a thermal via array under the package and sufficient copper area. The maximum junction temperature is typically 125C, so calculate the power dissipation and verify that the junction temperature stays within limits.
Информация о соответствии
The A3P1000-FG144 is RoHS compliant per Microchip product page. The FGG variant is explicitly lead-free. AEC-Q100 qualification is not applicable for this commercial-grade part; automotive variants like A3P1000-FG144T may be qualified.
