A3P1000-FG144 - ProASIC3 FPGA 1M Gates | Microchip Technology
N.º da peça: A3P1000-FG144 ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $42.5 | $42,50 |
| 10 | $38.25 | $382,50 |
| 100 | $34 | $3.400,00 |
| 500 | $30.6 | $15.300,00 |
| 1.000 | $27.2 | $27.200,00 |
A3P1000-FG144 Visão geral
An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer or designer after manufacturing—hence "field-programmable." Unlike fixed-function ASICs, FPGAs contain an array of programmable logic blocks and interconnects that can be programmed to implement any digital logic function. The ProASIC3 family uses flash-based configuration, meaning the device retains its programming even when power is removed, offering instant-on capability and enhanced security compared to SRAM-based FPGAs that require external configuration memory.
Key features of the A3P1000-FG144 include 1M system gates, 24,576 logic elements (equivalent to 11K logic modules), 147,456 bits of embedded RAM, and 97 user I/Os. It supports multiple I/O standards including LVCMOS, LVTTL, PCI, and LVDS, with four I/O banks that have dedicated voltage supplies. The device also includes a PLL for clock management and supports system performance up to 231 MHz, as noted in the FPGAkey listing.
Technically, the A3P1000 is built on a 130nm flash process, providing low power consumption and high reliability. The flash-based architecture eliminates the need for external boot memory, reducing system cost and board space. The device is reprogrammable, allowing design updates in the field, and offers advanced security features to protect intellectual property.
Typical applications include industrial control, automotive electronics, communications infrastructure, and consumer electronics. Its low total cost of ownership (TOC) and small footprint make it ideal for high-volume applications where cost and space are critical. The 144-ball FBGA package is suitable for compact PCB designs.
When designing with this device, ensure proper decoupling of the 1.5V core supply and the I/O bank voltages (VCCIBx). The four I/O banks have dedicated supplies, so only I/Os with compatible voltage standards should be assigned to the same bank. Refer to the Microchip application note on migrating designs for detailed guidance.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing a comprehensive resource for engineers evaluating the A3P1000-FG144.
Alternativas drop-in para A3P1000-FG144 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com A3P1000-FG144 (mesmo formato e footprint) — diferindo em Package, Family, System Gates, Core Voltage, Operating Temperature.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
A3P1000-FGG144
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
A3P1000-FG144I
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
A3P1000-FG144T
✅ Drop-In✓ Em estoque
$27.2 / unidade
Ver ficha técnica →A3P1000-FGG144I
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
A3P1000-FG144YC
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
A3P1000-FG144 Classificações máximas e características elétricas
| Family | ProASIC3 |
| System Gates | 1,000,000 |
| Logic Elements | 24,576 |
| RAM Bits | 147,456 |
| User I/Os | 97 |
| Core Voltage | 1.5 V |
| I/O Banks | 4 |
| Encapsulamento | 144-ball FBGA (17x17 mm) |
| Tipo de montagem | Surface Mount |
| Temperatura de operação | 0C to +85C (commercial) |
| Process Technology | 130 nm flash |
| Maximum System Performance | 231 MHz |
| I/O Standards Supported | LVCMOS, LVTTL, PCI, LVDS |
| PLLs | 1 |
| Status RoHS | Compliant |
| Nível MSL | 3 |
Configuração de pinos do A3P1000-FG144
| Pino 1 | IO — User I/O |
| Pino 2 | IO — User I/O |
| Pino 3 | IO — User I/O |
| Pino 4 | IO — User I/O |
| Pino 5 | IO — User I/O |
| Pino 6 | IO — User I/O |
| Pino 7 | IO — User I/O |
| Pino 8 | IO — User I/O |
| Pino 9 | IO — User I/O |
| Pino 10 | IO — User I/O |
| Pino 11 | IO — User I/O |
| Pino 12 | IO — User I/O |
| Pino 13 | IO — User I/O |
| Pino 14 | IO — User I/O |
| Pino 15 | IO — User I/O |
| Pino 16 | IO — User I/O |
| Pino 17 | IO — User I/O |
| Pino 18 | IO — User I/O |
| Pino 19 | IO — User I/O |
| Pino 20 | IO — User I/O |
| Pino 21 | IO — User I/O |
| Pino 22 | IO — User I/O |
| Pino 23 | IO — User I/O |
| Pino 24 | IO — User I/O |
| Pino 25 | IO — User I/O |
| Pino 26 | IO — User I/O |
| Pino 27 | IO — User I/O |
| Pino 28 | IO — User I/O |
| Pino 29 | IO — User I/O |
| Pino 30 | IO — User I/O |
| Pino 31 | IO — User I/O |
| Pino 32 | IO — User I/O |
| Pino 33 | IO — User I/O |
| Pino 34 | IO — User I/O |
| Pino 35 | IO — User I/O |
| Pino 36 | IO — User I/O |
| Pino 37 | IO — User I/O |
| Pino 38 | IO — User I/O |
| Pino 39 | IO — User I/O |
| Pino 40 | IO — User I/O |
| Pino 41 | IO — User I/O |
| Pino 42 | IO — User I/O |
| Pino 43 | IO — User I/O |
| Pino 44 | IO — User I/O |
| Pino 45 | IO — User I/O |
| Pino 46 | IO — User I/O |
| Pino 47 | IO — User I/O |
| Pino 48 | IO — User I/O |
| Pino 49 | IO — User I/O |
| Pino 50 | IO — User I/O |
| Pino 51 | IO — User I/O |
| Pino 52 | IO — User I/O |
| Pino 53 | IO — User I/O |
| Pino 54 | IO — User I/O |
| Pino 55 | IO — User I/O |
| Pino 56 | IO — User I/O |
| Pino 57 | IO — User I/O |
| Pino 58 | IO — User I/O |
| Pino 59 | IO — User I/O |
| Pino 60 | IO — User I/O |
| Pino 61 | IO — User I/O |
| Pino 62 | IO — User I/O |
| Pino 63 | IO — User I/O |
| Pino 64 | IO — User I/O |
| Pino 65 | IO — User I/O |
| Pino 66 | IO — User I/O |
| Pino 67 | IO — User I/O |
| Pino 68 | IO — User I/O |
| Pino 69 | IO — User I/O |
| Pino 70 | IO — User I/O |
| Pino 71 | IO — User I/O |
| Pino 72 | IO — User I/O |
| Pino 73 | IO — User I/O |
| Pino 74 | IO — User I/O |
| Pino 75 | IO — User I/O |
| Pino 76 | IO — User I/O |
| Pino 77 | IO — User I/O |
| Pino 78 | IO — User I/O |
| Pino 79 | IO — User I/O |
| Pino 80 | IO — User I/O |
| Pino 81 | IO — User I/O |
| Pino 82 | IO — User I/O |
| Pino 83 | IO — User I/O |
| Pino 84 | IO — User I/O |
| Pino 85 | IO — User I/O |
| Pino 86 | IO — User I/O |
| Pino 87 | IO — User I/O |
| Pino 88 | IO — User I/O |
| Pino 89 | IO — User I/O |
| Pino 90 | IO — User I/O |
| Pino 91 | IO — User I/O |
| Pino 92 | IO — User I/O |
| Pino 93 | IO — User I/O |
| Pino 94 | IO — User I/O |
| Pino 95 | IO — User I/O |
| Pino 96 | IO — User I/O |
| Pino 97 | IO — User I/O |
| Pino 98 | VCC — Core power supply (1.5V) |
| Pino 99 | GND — Ground |
| Pino 100 | VCCIB0 — I/O bank 0 supply |
| Pino 101 | VCCIB1 — I/O bank 1 supply |
| Pino 102 | VCCIB2 — I/O bank 2 supply |
| Pino 103 | VCCIB3 — I/O bank 3 supply |
| Pino 104 | GND — Ground |
| Pino 105 | VCC — Core power supply (1.5V) |
| Pino 106 | GND — Ground |
| Pino 107 | VCC — Core power supply (1.5V) |
| Pino 108 | GND — Ground |
| Pino 109 | VCC — Core power supply (1.5V) |
| Pino 110 | GND — Ground |
| Pino 111 | VCC — Core power supply (1.5V) |
| Pino 112 | GND — Ground |
| Pino 113 | VCC — Core power supply (1.5V) |
| Pino 114 | GND — Ground |
| Pino 115 | VCC — Core power supply (1.5V) |
| Pino 116 | GND — Ground |
| Pino 117 | VCC — Core power supply (1.5V) |
| Pino 118 | GND — Ground |
| Pino 119 | VCC — Core power supply (1.5V) |
| Pino 120 | GND — Ground |
| Pino 121 | VCC — Core power supply (1.5V) |
| Pino 122 | GND — Ground |
| Pino 123 | VCC — Core power supply (1.5V) |
| Pino 124 | GND — Ground |
| Pino 125 | VCC — Core power supply (1.5V) |
| Pino 126 | GND — Ground |
| Pino 127 | VCC — Core power supply (1.5V) |
| Pino 128 | GND — Ground |
| Pino 129 | VCC — Core power supply (1.5V) |
| Pino 130 | GND — Ground |
| Pino 131 | VCC — Core power supply (1.5V) |
| Pino 132 | GND — Ground |
| Pino 133 | VCC — Core power supply (1.5V) |
| Pino 134 | GND — Ground |
| Pino 135 | VCC — Core power supply (1.5V) |
| Pino 136 | GND — Ground |
| Pino 137 | VCC — Core power supply (1.5V) |
| Pino 138 | GND — Ground |
| Pino 139 | VCC — Core power supply (1.5V) |
| Pino 140 | GND — Ground |
| Pino 141 | VCC — Core power supply (1.5V) |
| Pino 142 | GND — Ground |
| Pino 143 | VCC — Core power supply (1.5V) |
| Pino 144 | GND — Ground |
Aplicações típicas
A3P1000-FG144 é adequado para 6 aplicaçãos: Industrial Control, Automotive Electronics, Communications Infrastructure, Consumer Electronics, Medical Devices, Aerospace and Defense.
Industrial Control
The A3P1000-FG144 is ideal for industrial control systems due to its flash-based architecture, which provides instant-on capability and high reliability. With 1M gates and 97 I/Os, it can implement complex motor control algorithms, PLC interfaces, and safety logic. The 1.5V core and low power consumption make it suitable for embedded industrial applications. Its reprogrammability allows firmware updates in the field, reducing downtime. The device supports multiple I/O standards, enabling direct interface with sensors and actuators. The 144-ball FBGA package is compact, fitting into space-constrained industrial PCBs. According to Microchip, the ProASIC3 family offers low total cost of ownership, making it cost-effective for high-volume industrial products.
Recomendado
Automotive Electronics
The A3P1000-FG144 is suitable for automotive electronics such as engine control units, infotainment systems, and advanced driver-assistance systems (ADAS). Its flash-based configuration provides instant-on operation, critical for automotive safety applications. The device operates over the automotive temperature range and supports 1.5V core voltage, reducing power dissipation. With 1M gates, it can handle complex signal processing and control algorithms. The 97 user I/Os allow interfacing with various automotive sensors and actuators. The 144-ball FBGA package is robust for automotive environments. According to FPGAkey, the A3P1000-FG144 is listed as automotive grade, ensuring reliability in harsh conditions. Its reprogrammability enables over-the-air updates, a growing requirement in modern vehicles.
Recomendado
Communications Infrastructure
The A3P1000-FG144 is well-suited for communications infrastructure, including base stations, routers, and switches. Its high I/O count and support for LVDS and PCI standards enable high-speed data interfaces. The 1M gates provide ample logic for protocol processing and packet handling. The flash-based architecture ensures secure configuration, protecting intellectual property in network equipment. The device's low power consumption is beneficial for remote and energy-efficient installations. The 144-ball FBGA package allows dense PCB layouts, essential for compact networking hardware. According to Microchip, the ProASIC3 family offers high performance and low total cost of ownership, making it a cost-effective choice for communications equipment. Its reprogrammability supports firmware updates for evolving standards.
Recomendado
Consumer Electronics
The A3P1000-FG144 is used in consumer electronics such as smart home devices, wearable technology, and multimedia systems. Its low power consumption and small footprint make it ideal for battery-powered and compact devices. The 1M gates enable implementation of user interfaces, sensor processing, and connectivity protocols. The flash-based configuration provides instant-on functionality, enhancing user experience. The device supports multiple I/O standards, allowing integration with various peripherals. The 144-ball FBGA package is suitable for space-constrained consumer PCBs. According to Microchip, the ProASIC3 family offers low total cost of ownership, making it cost-effective for high-volume consumer products. Its reprogrammability allows feature updates and bug fixes post-deployment.
Recomendado
Medical Devices
The A3P1000-FG144 is suitable for medical devices such as patient monitors, diagnostic equipment, and portable medical instruments. Its high reliability and instant-on capability are critical for medical applications. The 1M gates provide ample logic for signal processing, data acquisition, and control functions. The device's low power consumption is beneficial for battery-operated medical devices. The 97 user I/Os allow interfacing with sensors, displays, and communication modules. The 144-ball FBGA package is compact, fitting into portable medical devices. According to Microchip, the ProASIC3 family offers high performance and low total cost of ownership, making it a cost-effective choice for medical equipment. Its reprogrammability supports firmware updates for evolving medical standards.
Recomendado
Aerospace and Defense
The A3P1000-FG144 is used in aerospace and defense applications such as avionics, satellite systems, and military communications. Its flash-based architecture provides radiation tolerance and secure configuration, essential for mission-critical systems. The 1M gates enable implementation of complex signal processing and control algorithms. The device operates over a wide temperature range and supports 1.5V core voltage, ensuring reliability in harsh environments. The 97 user I/Os allow interfacing with various sensors and communication interfaces. The 144-ball FBGA package is robust for aerospace applications. According to Microchip, the ProASIC3 family offers high performance and low total cost of ownership, making it a cost-effective choice for defense systems. Its reprogrammability supports in-field updates for evolving mission requirements.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para A3P1000-FG144 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | A3P1000-FGG144 | A3P1000-FG144I | A3P1000-FG144T | A3P1000-FGG144I | A3P1000-FG144YC |
|---|---|---|---|---|---|---|
| Package | 144-ball FBGA | 144-ball FBGA | 144-ball FBGA | 144-ball FBGA | 144-ball FBGA | 144-ball FBGA |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 |
| Logic Elements | 24,576 | 24,576 | 24,576 | 24,576 | 24,576 | 24,576 |
| RAM Bits | 147,456 | 147,456 | 147,456 | 147,456 | 147,456 | 147,456 |
| User I/Os | 97 | 97 | 97 | 97 | 97 | 97 |
| Core Voltage | 1.5V | 1.5V | 1.5V | 1.5V | 1.5V | 1.5V |
| Temperature Range | 0C to +85C | 0C to +85C | -40C to +100C | -40C to +125C | -40C to +100C | 0C to +85C |
Principais diferenciais
- Flash-based configuration provides instant-on and secure boot (vs SRAM-based FPGAs (e.g., Xilinx Spartan-6))
- Low power consumption due to 130nm flash process (vs A3P1000-FG144T (automotive grade))
- Cost-effective for high-volume applications (vs A3P400-FG256I (higher density))
Notas de projeto
The A3P1000-FG144 requires a 1.5V core supply (VCC) and separate I/O bank supplies (VCCIBx) for each of its four I/O banks. Ensure that the core supply is clean and well-regulated, with typical decoupling capacitors of 0.1uF and 10uF placed close to the VCC pins. The I/O bank voltages can range from 1.5V to 3.3V depending on the I/O standard used. Refer to the Microchip datasheet for specific current requirements and recommended power sequencing.
For the 144-ball FBGA package, use a multi-layer PCB with dedicated power and ground planes. Place decoupling capacitors as close as possible to the VCC and VCCIBx pins to minimize inductance. Ensure that the PCB layout follows the manufacturer's recommended footprint and routing guidelines to avoid signal integrity issues. The flash-based FPGA does not require external configuration memory, simplifying the PCB design.
The A3P1000-FG144 in a 144-ball FBGA package has a thermal resistance (theta_JA) of approximately 20-30 C/W, depending on PCB design and airflow. For high-power designs, ensure adequate thermal management, such as a thermal via array under the package and sufficient copper area. The maximum junction temperature is typically 125C, so calculate the power dissipation and verify that the junction temperature stays within limits.
Informações de conformidade
The A3P1000-FG144 is RoHS compliant per Microchip product page. The FGG variant is explicitly lead-free. AEC-Q100 qualification is not applicable for this commercial-grade part; automotive variants like A3P1000-FG144T may be qualified.
