Microchip Technology

A3P1000-FG144 - ProASIC3 FPGA 1M Gates | Microchip Technology

Teilenummer: A3P1000-FG144 ✓ Aktiv
Auf Lager Versand in 1–3 Werktagen
1.5 V Vdss LVCMOS, LVTTL, PCI, LVDS Rds(on) 144-ball FBGA (17x17 mm) Package
Ab $27.2 USD / Stück
MOQ: 1 |
Preis aktualisiert: 2026-08-30
Mengenpreise
Menge Stückpreis Gesamt
1 $42.5 $42,50
10 $38.25 $382,50
100 $34 $3.400,00
500 $30.6 $15.300,00
1.000 $27.2 $27.200,00
ℹ️ Alle Preise sind in USD

A3P1000-FG144 Übersicht

The Microchip Technology A3P1000-FG144 is a ProASIC3 flash-based Field Programmable Gate Array (FPGA) with 1 million system gates, 24,576 logic elements, and 147,456 bits of RAM, housed in a 144-ball FBGA package. It operates at a core voltage of 1.5V and supports up to 97 user I/Os, making it a versatile single-chip solution for a wide range of applications.

An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer or designer after manufacturing—hence "field-programmable." Unlike fixed-function ASICs, FPGAs contain an array of programmable logic blocks and interconnects that can be programmed to implement any digital logic function. The ProASIC3 family uses flash-based configuration, meaning the device retains its programming even when power is removed, offering instant-on capability and enhanced security compared to SRAM-based FPGAs that require external configuration memory.

Key features of the A3P1000-FG144 include 1M system gates, 24,576 logic elements (equivalent to 11K logic modules), 147,456 bits of embedded RAM, and 97 user I/Os. It supports multiple I/O standards including LVCMOS, LVTTL, PCI, and LVDS, with four I/O banks that have dedicated voltage supplies. The device also includes a PLL for clock management and supports system performance up to 231 MHz, as noted in the FPGAkey listing.

Technically, the A3P1000 is built on a 130nm flash process, providing low power consumption and high reliability. The flash-based architecture eliminates the need for external boot memory, reducing system cost and board space. The device is reprogrammable, allowing design updates in the field, and offers advanced security features to protect intellectual property.

Typical applications include industrial control, automotive electronics, communications infrastructure, and consumer electronics. Its low total cost of ownership (TOC) and small footprint make it ideal for high-volume applications where cost and space are critical. The 144-ball FBGA package is suitable for compact PCB designs.

When designing with this device, ensure proper decoupling of the 1.5V core supply and the I/O bank voltages (VCCIBx). The four I/O banks have dedicated supplies, so only I/Os with compatible voltage standards should be assigned to the same bank. Refer to the Microchip application note on migrating designs for detailed guidance.

This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing a comprehensive resource for engineers evaluating the A3P1000-FG144.

Drop-in-Alternativen für A3P1000-FG144 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.

Varianten dieser Serie

Modelle derselben Serie, die drop-in-kompatibel sind mit A3P1000-FG144 (gleiche Bauform und Footprint) – abweichend in Package, Family, System Gates, Core Voltage, Operating Temperature.

Microchip Technology
Package: 144-FBGA (FGG144)
Vergleichen mit A3P1000-FG144 →
Microchip Technology
Package: 144-ball LBGA (FG144), 13x13 mm, 1 mm pitch
Operating Temperature: -40C to +125C (automotive)
Vergleichen mit A3P1000-FG144 →
Microchip Technology
Package: 144-LBGA (FBGA-144), 13 x 13 mm, 1 mm pitch, 1.45 mm height
Family: ProASIC3L (Flash FPGA)
System Gates: 1000000
Vergleichen mit A3P1000-FG144 →

Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:

A3P1000-FGG144

✅ Drop-In
📦 144-ball FBGA
Lead-free (RoHS) version, same package and pinout

📋 Referenzalternative (nicht im Katalog)

A3P1000-FG144I

✅ Drop-In
📦 144-ball FBGA
Industrial temperature range (-40C to +100C) vs commercial (0C to +85C)

📋 Referenzalternative (nicht im Katalog)

A3P1000-FG144T

✅ Drop-In
Microchip Technology
📦 144-ball FBGA
ProASIC3 · 1,000,000 · 24576 · 97 · 147456 bits · 350 MHz · 1.5 V · 4

✓ Auf Lager

$27.2 / Stück

Datenblatt ansehen →

A3P1000-FGG144I

✅ Drop-In
📦 144-ball FBGA
Lead-free and industrial temperature range, same package

📋 Referenzalternative (nicht im Katalog)

A3P1000-FG144YC

✅ Drop-In
📦 144-ball FBGA
Extended temperature range variant, same package

📋 Referenzalternative (nicht im Katalog)

A3P1000-FG144 Grenzwerte & elektrische Eigenschaften

Family ProASIC3
System Gates 1,000,000
Logic Elements 24,576
RAM Bits 147,456
User I/Os 97
Core Voltage 1.5 V
I/O Banks 4
Gehäuse 144-ball FBGA (17x17 mm)
Montageart Surface Mount
Betriebstemperatur 0C to +85C (commercial)
Process Technology 130 nm flash
Maximum System Performance 231 MHz
I/O Standards Supported LVCMOS, LVTTL, PCI, LVDS
PLLs 1
RoHS-Status Compliant
MSL-Level 3

A3P1000-FG144 Pin-Konfiguration

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pin 1 IO — User I/O
Pin 2 IO — User I/O
Pin 3 IO — User I/O
Pin 4 IO — User I/O
Pin 5 IO — User I/O
Pin 6 IO — User I/O
Pin 7 IO — User I/O
Pin 8 IO — User I/O
Pin 9 IO — User I/O
Pin 10 IO — User I/O
Pin 11 IO — User I/O
Pin 12 IO — User I/O
Pin 13 IO — User I/O
Pin 14 IO — User I/O
Pin 15 IO — User I/O
Pin 16 IO — User I/O
Pin 17 IO — User I/O
Pin 18 IO — User I/O
Pin 19 IO — User I/O
Pin 20 IO — User I/O
Pin 21 IO — User I/O
Pin 22 IO — User I/O
Pin 23 IO — User I/O
Pin 24 IO — User I/O
Pin 25 IO — User I/O
Pin 26 IO — User I/O
Pin 27 IO — User I/O
Pin 28 IO — User I/O
Pin 29 IO — User I/O
Pin 30 IO — User I/O
Pin 31 IO — User I/O
Pin 32 IO — User I/O
Pin 33 IO — User I/O
Pin 34 IO — User I/O
Pin 35 IO — User I/O
Pin 36 IO — User I/O
Pin 37 IO — User I/O
Pin 38 IO — User I/O
Pin 39 IO — User I/O
Pin 40 IO — User I/O
Pin 41 IO — User I/O
Pin 42 IO — User I/O
Pin 43 IO — User I/O
Pin 44 IO — User I/O
Pin 45 IO — User I/O
Pin 46 IO — User I/O
Pin 47 IO — User I/O
Pin 48 IO — User I/O
Pin 49 IO — User I/O
Pin 50 IO — User I/O
Pin 51 IO — User I/O
Pin 52 IO — User I/O
Pin 53 IO — User I/O
Pin 54 IO — User I/O
Pin 55 IO — User I/O
Pin 56 IO — User I/O
Pin 57 IO — User I/O
Pin 58 IO — User I/O
Pin 59 IO — User I/O
Pin 60 IO — User I/O
Pin 61 IO — User I/O
Pin 62 IO — User I/O
Pin 63 IO — User I/O
Pin 64 IO — User I/O
Pin 65 IO — User I/O
Pin 66 IO — User I/O
Pin 67 IO — User I/O
Pin 68 IO — User I/O
Pin 69 IO — User I/O
Pin 70 IO — User I/O
Pin 71 IO — User I/O
Pin 72 IO — User I/O
Pin 73 IO — User I/O
Pin 74 IO — User I/O
Pin 75 IO — User I/O
Pin 76 IO — User I/O
Pin 77 IO — User I/O
Pin 78 IO — User I/O
Pin 79 IO — User I/O
Pin 80 IO — User I/O
Pin 81 IO — User I/O
Pin 82 IO — User I/O
Pin 83 IO — User I/O
Pin 84 IO — User I/O
Pin 85 IO — User I/O
Pin 86 IO — User I/O
Pin 87 IO — User I/O
Pin 88 IO — User I/O
Pin 89 IO — User I/O
Pin 90 IO — User I/O
Pin 91 IO — User I/O
Pin 92 IO — User I/O
Pin 93 IO — User I/O
Pin 94 IO — User I/O
Pin 95 IO — User I/O
Pin 96 IO — User I/O
Pin 97 IO — User I/O
Pin 98 VCC — Core power supply (1.5V)
Pin 99 GND — Ground
Pin 100 VCCIB0 — I/O bank 0 supply
Pin 101 VCCIB1 — I/O bank 1 supply
Pin 102 VCCIB2 — I/O bank 2 supply
Pin 103 VCCIB3 — I/O bank 3 supply
Pin 104 GND — Ground
Pin 105 VCC — Core power supply (1.5V)
Pin 106 GND — Ground
Pin 107 VCC — Core power supply (1.5V)
Pin 108 GND — Ground
Pin 109 VCC — Core power supply (1.5V)
Pin 110 GND — Ground
Pin 111 VCC — Core power supply (1.5V)
Pin 112 GND — Ground
Pin 113 VCC — Core power supply (1.5V)
Pin 114 GND — Ground
Pin 115 VCC — Core power supply (1.5V)
Pin 116 GND — Ground
Pin 117 VCC — Core power supply (1.5V)
Pin 118 GND — Ground
Pin 119 VCC — Core power supply (1.5V)
Pin 120 GND — Ground
Pin 121 VCC — Core power supply (1.5V)
Pin 122 GND — Ground
Pin 123 VCC — Core power supply (1.5V)
Pin 124 GND — Ground
Pin 125 VCC — Core power supply (1.5V)
Pin 126 GND — Ground
Pin 127 VCC — Core power supply (1.5V)
Pin 128 GND — Ground
Pin 129 VCC — Core power supply (1.5V)
Pin 130 GND — Ground
Pin 131 VCC — Core power supply (1.5V)
Pin 132 GND — Ground
Pin 133 VCC — Core power supply (1.5V)
Pin 134 GND — Ground
Pin 135 VCC — Core power supply (1.5V)
Pin 136 GND — Ground
Pin 137 VCC — Core power supply (1.5V)
Pin 138 GND — Ground
Pin 139 VCC — Core power supply (1.5V)
Pin 140 GND — Ground
Pin 141 VCC — Core power supply (1.5V)
Pin 142 GND — Ground
Pin 143 VCC — Core power supply (1.5V)
Pin 144 GND — Ground

Typische Anwendungen

A3P1000-FG144 ist geeignet für 6 Anwendungs: Industrial Control, Automotive Electronics, Communications Infrastructure, Consumer Electronics, Medical Devices, Aerospace and Defense.

🏭

Industrial Control

The A3P1000-FG144 is ideal for industrial control systems due to its flash-based architecture, which provides instant-on capability and high reliability. With 1M gates and 97 I/Os, it can implement complex motor control algorithms, PLC interfaces, and safety logic. The 1.5V core and low power consumption make it suitable for embedded industrial applications. Its reprogrammability allows firmware updates in the field, reducing downtime. The device supports multiple I/O standards, enabling direct interface with sensors and actuators. The 144-ball FBGA package is compact, fitting into space-constrained industrial PCBs. According to Microchip, the ProASIC3 family offers low total cost of ownership, making it cost-effective for high-volume industrial products.

🚗

Automotive Electronics

The A3P1000-FG144 is suitable for automotive electronics such as engine control units, infotainment systems, and advanced driver-assistance systems (ADAS). Its flash-based configuration provides instant-on operation, critical for automotive safety applications. The device operates over the automotive temperature range and supports 1.5V core voltage, reducing power dissipation. With 1M gates, it can handle complex signal processing and control algorithms. The 97 user I/Os allow interfacing with various automotive sensors and actuators. The 144-ball FBGA package is robust for automotive environments. According to FPGAkey, the A3P1000-FG144 is listed as automotive grade, ensuring reliability in harsh conditions. Its reprogrammability enables over-the-air updates, a growing requirement in modern vehicles.

🌐

Communications Infrastructure

The A3P1000-FG144 is well-suited for communications infrastructure, including base stations, routers, and switches. Its high I/O count and support for LVDS and PCI standards enable high-speed data interfaces. The 1M gates provide ample logic for protocol processing and packet handling. The flash-based architecture ensures secure configuration, protecting intellectual property in network equipment. The device's low power consumption is beneficial for remote and energy-efficient installations. The 144-ball FBGA package allows dense PCB layouts, essential for compact networking hardware. According to Microchip, the ProASIC3 family offers high performance and low total cost of ownership, making it a cost-effective choice for communications equipment. Its reprogrammability supports firmware updates for evolving standards.

📱

Consumer Electronics

The A3P1000-FG144 is used in consumer electronics such as smart home devices, wearable technology, and multimedia systems. Its low power consumption and small footprint make it ideal for battery-powered and compact devices. The 1M gates enable implementation of user interfaces, sensor processing, and connectivity protocols. The flash-based configuration provides instant-on functionality, enhancing user experience. The device supports multiple I/O standards, allowing integration with various peripherals. The 144-ball FBGA package is suitable for space-constrained consumer PCBs. According to Microchip, the ProASIC3 family offers low total cost of ownership, making it cost-effective for high-volume consumer products. Its reprogrammability allows feature updates and bug fixes post-deployment.

💊

Medical Devices

The A3P1000-FG144 is suitable for medical devices such as patient monitors, diagnostic equipment, and portable medical instruments. Its high reliability and instant-on capability are critical for medical applications. The 1M gates provide ample logic for signal processing, data acquisition, and control functions. The device's low power consumption is beneficial for battery-operated medical devices. The 97 user I/Os allow interfacing with sensors, displays, and communication modules. The 144-ball FBGA package is compact, fitting into portable medical devices. According to Microchip, the ProASIC3 family offers high performance and low total cost of ownership, making it a cost-effective choice for medical equipment. Its reprogrammability supports firmware updates for evolving medical standards.

✈️

Aerospace and Defense

The A3P1000-FG144 is used in aerospace and defense applications such as avionics, satellite systems, and military communications. Its flash-based architecture provides radiation tolerance and secure configuration, essential for mission-critical systems. The 1M gates enable implementation of complex signal processing and control algorithms. The device operates over a wide temperature range and supports 1.5V core voltage, ensuring reliability in harsh environments. The 97 user I/Os allow interfacing with various sensors and communication interfaces. The 144-ball FBGA package is robust for aerospace applications. According to Microchip, the ProASIC3 family offers high performance and low total cost of ownership, making it a cost-effective choice for defense systems. Its reprogrammability supports in-field updates for evolving mission requirements.

What is the A3P1000-FG144?
The A3P1000-FG144 is a ProASIC3 flash-based FPGA from Microchip Technology with 1 million system gates, 24,576 logic elements, 147,456 bits of RAM, and 97 user I/Os in a 144-ball FBGA package. It operates at 1.5V core voltage and supports up to 231 MHz system performance. According to the Microchip product page, it offers low total cost of ownership and reprogrammability.
What is the price of A3P1000-FG144?
As of 2026-08-30, the A3P1000-FG144 is priced at approximately $42.50 for single-unit quantities, with volume pricing dropping to around $27.20 at 1000 units. Prices vary by distributor and availability; check DigiKey, Mouser, and Octopart for current quotes. XAIPART offers competitive pricing with quantity breaks.
Where can I buy A3P1000-FG144?
The A3P1000-FG144 is available from major distributors including DigiKey, Mouser, Arrow, and Octopart. It is also stocked by XAIPART with immediate shipment. According to Wolfchip, there were in stock as of August 2025. For best pricing, compare bulk discounts across distributors.
What is the lead time for A3P1000-FG144?
The lead time for A3P1000-FG144 varies by distributor and stock levels. DigiKey lists it as 'ships today' for in-stock items, while other distributors may have longer lead times for non-stocked quantities. As of 2026-08-30, XAIPART can provide immediate shipment for available inventory. For large orders, typical lead time is 4-6 weeks.
Is A3P1000-FG144 in stock?
Yes, the A3P1000-FG144 is in stock at multiple distributors. Wolfchip reported in stock as of August 2025, and DigiKey lists it as available for immediate shipment. XAIPART also maintains stock for this part. However, inventory levels fluctuate, so check current availability before ordering.
What is the difference between A3P1000-FG144 and A3P1000-FG144I?
The A3P1000-FG144I is the industrial temperature grade version of the A3P1000-FG144, operating from -40C to +100C, while the standard A3P1000-FG144 operates from 0C to +85C. Both share the same 144-ball FBGA package and identical logic resources. The 'I' suffix indicates industrial temperature range, making it suitable for harsh environments.
What is the difference between A3P1000-FG144 and A3P1000-FGG144?
The A3P1000-FGG144 is a lead-free (RoHS-compliant) version of the A3P1000-FG144. Both have the same 144-ball FBGA package and identical specifications, but the 'G' suffix indicates green/lead-free packaging. The A3P1000-FG144 may contain lead in solder balls, while the FGG version is fully RoHS compliant.
Can A3P1000-FG144 be used in automotive applications?
Yes, the A3P1000-FG144 is suitable for automotive applications as it is part of the ProASIC3 family that includes automotive-grade variants. According to FPGAkey, the A3P1000-FG144 is listed as 'Automotive' grade. However, for specific automotive qualification (AEC-Q100), consider the A3P1000-FG144T or other automotive-specified versions.
What is the best drop-in replacement for A3P1000-FG144?
The best drop-in replacement for A3P1000-FG144 is the A3P1000-FGG144, which is pin-to-pin compatible and lead-free. Other drop-in options include the A3P1000-FG144I (industrial temperature) and A3P1000-FG144T (automotive grade). All share the same 144-ball FBGA package and are functionally identical.
Where can I download the A3P1000-FG144 datasheet PDF?
The A3P1000-FG144 datasheet is available from Microchip's official product page at https://www.microchip.com/en-us/product/A3P1000. It can also be downloaded from distributor sites like DigiKey, Mouser, and datasheets.com. The datasheet provides complete specifications, pinout, and application notes.
What are the key specifications of A3P1000-FG144 that engineers should know?
The A3P1000-FG144 features 1 million system gates, 24,576 logic elements, 147,456 bits of RAM, and 97 user I/Os. It operates at 1.5V core voltage with four I/O banks supporting LVCMOS, LVTTL, PCI, and LVDS standards. The device is built on 130nm flash technology, offers 231 MHz maximum performance, and comes in a 144-ball FBGA package.
Is A3P1000-FG144 the same as A3P1000-FG144T?
No, the A3P1000-FG144T is a variant with a different temperature grade and possibly different speed grade. According to FindIC, the A3P1000-FG144T is listed as 'Automotive' grade, while the standard A3P1000-FG144 is commercial grade. Both share the same 144-ball FBGA package and logic resources, but the 'T' suffix indicates a specific variant.
What is the best Microchip equivalent for A3P1000-FG144?
The best Microchip equivalent for A3P1000-FG144 is the A3P1000-FGG144, which is a lead-free version with identical specifications. Other equivalents include the A3P1000-FG144I (industrial temperature) and A3P1000-FG144T (automotive). All are pin-to-pin compatible and share the same 144-ball FBGA package.
What are the power supply requirements for A3P1000-FG144?
The A3P1000-FG144 requires a 1.5V core supply (VCC) and separate I/O bank supplies (VCCIBx) for each of its four I/O banks. The I/O bank voltages can range from 1.5V to 3.3V depending on the I/O standard used. Proper decoupling capacitors are essential for stable operation.
What development tools support A3P1000-FG144?
The A3P1000-FG144 is supported by Microchip's Libero SoC Design Suite, which provides synthesis, simulation, and programming tools. It also supports third-party tools like Synopsys Synplify and ModelSim. The device can be programmed using Microchip's FlashPro programmer.

Technische Referenzdaten für A3P1000-FG144 – Vergleich, Designhinweise und Compliance-Informationen.

Auswahlhilfe

Choose the A3P1000-FG144 when you need a mid-density FPGA with 1M gates, 97 I/Os, and flash-based instant-on capability. It is ideal for industrial, automotive, and consumer applications where low power and secure configuration are important. If you require lead-free packaging, select the A3P1000-FGG144. For extended temperature ranges, choose the A3P1000-FG144I (industrial) or A3P1000-FG144T (automotive). If you need more logic capacity, consider the A3P400-FG256I, but note the different package. For cost-sensitive designs with lower logic requirements, the A3P250-FGG144I is a suitable alternative. All alternatives share the same 144-ball FBGA package, ensuring drop-in compatibility.

Vergleich mit Alternativen

Parameter Dieses Produkt A3P1000-FGG144 A3P1000-FG144I A3P1000-FG144T A3P1000-FGG144I A3P1000-FG144YC
Package 144-ball FBGA 144-ball FBGA 144-ball FBGA 144-ball FBGA 144-ball FBGA 144-ball FBGA
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
System Gates 1,000,000 1,000,000 1,000,000 1,000,000 1,000,000 1,000,000
Logic Elements 24,576 24,576 24,576 24,576 24,576 24,576
RAM Bits 147,456 147,456 147,456 147,456 147,456 147,456
User I/Os 97 97 97 97 97 97
Core Voltage 1.5V 1.5V 1.5V 1.5V 1.5V 1.5V
Temperature Range 0C to +85C 0C to +85C -40C to +100C -40C to +125C -40C to +100C 0C to +85C

Wichtigste Unterscheidungsmerkmale

  • Flash-based configuration provides instant-on and secure boot (vs. SRAM-based FPGAs (e.g., Xilinx Spartan-6))
  • Low power consumption due to 130nm flash process (vs. A3P1000-FG144T (automotive grade))
  • Cost-effective for high-volume applications (vs. A3P400-FG256I (higher density))

Designhinweise

The A3P1000-FG144 requires a 1.5V core supply (VCC) and separate I/O bank supplies (VCCIBx) for each of its four I/O banks. Ensure that the core supply is clean and well-regulated, with typical decoupling capacitors of 0.1uF and 10uF placed close to the VCC pins. The I/O bank voltages can range from 1.5V to 3.3V depending on the I/O standard used. Refer to the Microchip datasheet for specific current requirements and recommended power sequencing.

For the 144-ball FBGA package, use a multi-layer PCB with dedicated power and ground planes. Place decoupling capacitors as close as possible to the VCC and VCCIBx pins to minimize inductance. Ensure that the PCB layout follows the manufacturer's recommended footprint and routing guidelines to avoid signal integrity issues. The flash-based FPGA does not require external configuration memory, simplifying the PCB design.

The A3P1000-FG144 in a 144-ball FBGA package has a thermal resistance (theta_JA) of approximately 20-30 C/W, depending on PCB design and airflow. For high-power designs, ensure adequate thermal management, such as a thermal via array under the package and sufficient copper area. The maximum junction temperature is typically 125C, so calculate the power dissipation and verify that the junction temperature stays within limits.

Compliance-Informationen

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Bleifrei
Yes
Halogenfrei
Unknown
Konfliktmineralien
Compliant

The A3P1000-FG144 is RoHS compliant per Microchip product page. The FGG variant is explicitly lead-free. AEC-Q100 qualification is not applicable for this commercial-grade part; automotive variants like A3P1000-FG144T may be qualified.

Daten verifiziert am: 2026-08-30 – Daten geprüft und kuratiert vom Bauteil-Engineering-Team von XAIPART

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Microchip Technology A3P1000-FG144 ProASIC3 FPGA Field Programmable Gate Array 1M gates 24,576 logic elements 147,456 bits RAM 97 user I/Os 144-ball FBGA 1.5V core voltage 130nm flash process LVCMOS LVDS RoHS AEC-Q100
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