Microchip Technology

A3P600-1FGG144I - ProASIC3 FPGA, 600K Gates | Microchip

Артикул: A3P600-1FGG144I ✓ Активен
В наличии Отправка в течение 1–3 рабочих дней
1.5 V Vdss 3.3V, 2.5V, 1.8V, 1.5V Rds(on) 144-LBGA (13x13 mm, 0.8 mm pitch) Package 350 MHz Speed
От $45 USD / шт.
MOQ: 1 |
Цена обновлена: 2026-08-31
Оптовые цены
Кол-во Цена за ед. Итого
1 $65.97 $65,97
10 $60.5 $605,00
100 $55 $5.500,00
500 $50 $25.000,00
1.000 $45 $45.000,00
ℹ️ Все цены указаны в USD

A3P600-1FGG144I Обзор

The Microchip Technology A3P600-1FGG144I is a ProASIC3 Field Programmable Gate Array (FPGA) with 600,000 system gates, 13,824 logic elements, and 97 user I/Os, housed in a 144-ball LBGA (FBGA) package. It operates from a 1.5V core supply and supports industrial temperature range (-40°C to +100°C). This flash-based FPGA offers non-volatile, single-chip, low-power operation with instant-on capability and reprogrammability.

An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer after manufacturing to implement any digital logic function. FPGAs belong to the programmable logic device (PLD) family, which sits between fixed-function ASICs and general-purpose processors. The ProASIC3 family is Microchip's flash-based FPGA line, offering a single-chip solution without external configuration memory, making it ideal for secure, low-power, and space-constrained applications.

Key features of the A3P600-1FGG144I include 600K system gates, 13,824 D-flip-flops, 110,592 bits of RAM, and 97 user I/Os. It supports up to 272 MHz system performance and 350 MHz internal clock frequency. The device includes 1 PLL, 1.5V core voltage, and 3.3V/2.5V/1.8V/1.5V I/O standards. The flash-based architecture provides inherent security against reverse engineering and supports live-at-power-up (LAPU) instant-on operation.

The ProASIC3 architecture uses a flash-based switch matrix that retains configuration even when power is removed, eliminating the need for external boot memory. This reduces system cost and board space while improving security. The device supports JTAG (IEEE 1149.1) boundary scan for programming and testing, and can be reprogrammed in-system. The 144-ball LBGA package measures 13x13 mm with 0.8 mm ball pitch, offering a compact footprint for high-density designs.

Typical applications include industrial control, automotive electronics, communications infrastructure, and consumer electronics. The A3P600-1FGG144I is well-suited for glue logic, bus interfacing, motor control, and sensor processing. Its low power consumption and instant-on capability make it ideal for battery-powered and power-sensitive designs.

When designing with this FPGA, ensure proper decoupling of the 1.5V core supply and all I/O banks. Use the on-chip PLL for clock generation and consider the thermal characteristics of the LBGA package. The device supports multiple configuration modes, including JTAG and SPI, for flexible programming.

This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing engineers with a comprehensive resource for evaluating the A3P600-1FGG144I.

Аналоги без доработки для A3P600-1FGG144I — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.

Варианты в этой серии

Модели той же серии, совместимые без доработки с A3P600-1FGG144I (тот же форм-фактор и посадочное место) — отличается по Package, Configuration, Operating Temperature, Process Technology, RoHS Status.

Microchip Technology
Operating Temperature: 0°C to +85°C (TJ)
RoHS Status: RoHS non-compliant
Сравнить с A3P600-1FGG144I →
Microchip Technology
RoHS Status: Compliant
Сравнить с A3P600-1FGG144I →
Microchip Technology
Package: 144-LBGA (FBGA)
Configuration: Flash-based (non-volatile)
Сравнить с A3P600-1FGG144I →
Microsemi
Package: 144-Ball FBGA (FGG144)
Configuration: Single-chip, Instant On, no external boot device
Process Technology: 130 nm CMOS
Сравнить с A3P600-1FGG144I →
Microchip Technology
Package: 144-LBGA / 144-FBGA (13x13 mm)
Operating Temperature: -40C to +100C (TJ)
Process Technology: 130 nm flash
Сравнить с A3P600-1FGG144I →
Microchip Technology
Package: 144-LBGA (FBGA-144), 1mm pitch
Configuration: Flash-based, non-volatile
Operating Temperature: 0 to 70 C
Сравнить с A3P600-1FGG144I →
Microchip Technology
Package: 144-FBGA / 144-LBGA (FGG144)
Configuration: Instant-On, single-chip, no external boot device
Сравнить с A3P600-1FGG144I →
Microchip Technology
Package: 144-pin FBGA (FGG144)
Operating Temperature: -40C to +100C (industrial)
Process Technology: 130nm flash
Сравнить с A3P600-1FGG144I →

Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:

A3P600-FGG144I

✅ Прямая замена
Microchip Technology
📦 144-LBGA
ProASIC3 · 600000 · 13824 · 110592 · 97 · 1.5 V · 231 MHz · 144-pin FBGA (FGG144)

✓ В наличии

$27.2 / шт.

Открыть даташит →

A3P600-2FGG144I

✅ Прямая замена
Microchip Technology
📦 144-LBGA
ProASIC3 · 600000 · 110592 · 13824 · 97 · 310 MHz (speed grade -2) · 130 nm flash · 1.425 V to 1.575 V (1.5 V nominal)

✓ В наличии

$44.6 / шт.

Открыть даташит →

A3P600-1FGG144

✅ Прямая замена
Microchip Technology
📦 144-LBGA
ProASIC3 · 600,000 · 13,824 · 97 · 110,592 bits · 1.5 V · 350 MHz · 144-LBGA (FBGA)

✓ В наличии

$42.88 / шт.

Открыть даташит →

A3P600-FGG144

✅ Прямая замена
Microchip Technology
📦 144-LBGA
600000 gates · 13824 CLBs · 97 · 110592 bits · CMOS flash-based FPGA, nonvolatile · ProASIC3 (Actel/Microchip) · 144-FBGA / 144-LBGA (FGG144) · 1.00 mm

✓ В наличии

$49.8 / шт.

Открыть даташит →

A3P600-2FGG144

✅ Прямая замена
Microsemi
📦 144-LBGA
ProASIC3 · 600000 gates · 13824 CLBs · 97 I/O · 310 MHz · 130 nm CMOS · 1.5 V · Nonvolatile Flash

✓ В наличии

$30.4 / шт.

Открыть даташит →

A3P600-1FGG144I Максимальные параметры и электрические характеристики

Family ProASIC3
System Gates 600000
Logic Elements (LEs) 13824
D-Flip-Flops 13824
RAM Bits 110592
User I/Os 97
Number of PLLs 1
Core Supply Voltage 1.5 V
I/O Standards Supported 3.3V, 2.5V, 1.8V, 1.5V
Maximum System Performance 272 MHz
Maximum Internal Clock Frequency 350 MHz
Корпус 144-LBGA (13x13 mm, 0.8 mm pitch)
Диапазон рабочих температур -40°C to +100°C (industrial)
Тип монтажа Surface Mount
Статус RoHS Compliant
Technology 130nm Flash

Конфигурация выводов A3P600-1FGG144I

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Контакт 1 IO — User I/O (Bank 0)
Контакт 2 IO — User I/O (Bank 0)
Контакт 3 IO — User I/O (Bank 0)
Контакт 4 IO — User I/O (Bank 0)
Контакт 5 IO — User I/O (Bank 0)
Контакт 6 IO — User I/O (Bank 0)
Контакт 7 IO — User I/O (Bank 0)
Контакт 8 IO — User I/O (Bank 0)
Контакт 9 IO — User I/O (Bank 0)
Контакт 10 IO — User I/O (Bank 0)
Контакт 11 IO — User I/O (Bank 0)
Контакт 12 IO — User I/O (Bank 0)
Контакт 13 IO — User I/O (Bank 0)
Контакт 14 IO — User I/O (Bank 0)
Контакт 15 IO — User I/O (Bank 0)
Контакт 16 IO — User I/O (Bank 0)
Контакт 17 IO — User I/O (Bank 0)
Контакт 18 IO — User I/O (Bank 0)
Контакт 19 IO — User I/O (Bank 0)
Контакт 20 IO — User I/O (Bank 0)
Контакт 21 IO — User I/O (Bank 0)
Контакт 22 IO — User I/O (Bank 0)
Контакт 23 IO — User I/O (Bank 0)
Контакт 24 IO — User I/O (Bank 0)
Контакт 25 IO — User I/O (Bank 0)
Контакт 26 IO — User I/O (Bank 0)
Контакт 27 IO — User I/O (Bank 0)
Контакт 28 IO — User I/O (Bank 0)
Контакт 29 IO — User I/O (Bank 0)
Контакт 30 IO — User I/O (Bank 0)
Контакт 31 IO — User I/O (Bank 0)
Контакт 32 IO — User I/O (Bank 0)
Контакт 33 IO — User I/O (Bank 0)
Контакт 34 IO — User I/O (Bank 0)
Контакт 35 IO — User I/O (Bank 0)
Контакт 36 IO — User I/O (Bank 0)
Контакт 37 IO — User I/O (Bank 0)
Контакт 38 IO — User I/O (Bank 0)
Контакт 39 IO — User I/O (Bank 0)
Контакт 40 IO — User I/O (Bank 0)
Контакт 41 IO — User I/O (Bank 0)
Контакт 42 IO — User I/O (Bank 0)
Контакт 43 IO — User I/O (Bank 0)
Контакт 44 IO — User I/O (Bank 0)
Контакт 45 IO — User I/O (Bank 0)
Контакт 46 IO — User I/O (Bank 0)
Контакт 47 IO — User I/O (Bank 0)
Контакт 48 IO — User I/O (Bank 0)
Контакт 49 IO — User I/O (Bank 0)
Контакт 50 IO — User I/O (Bank 0)
Контакт 51 IO — User I/O (Bank 0)
Контакт 52 IO — User I/O (Bank 0)
Контакт 53 IO — User I/O (Bank 0)
Контакт 54 IO — User I/O (Bank 0)
Контакт 55 IO — User I/O (Bank 0)
Контакт 56 IO — User I/O (Bank 0)
Контакт 57 IO — User I/O (Bank 0)
Контакт 58 IO — User I/O (Bank 0)
Контакт 59 IO — User I/O (Bank 0)
Контакт 60 IO — User I/O (Bank 0)
Контакт 61 IO — User I/O (Bank 0)
Контакт 62 IO — User I/O (Bank 0)
Контакт 63 IO — User I/O (Bank 0)
Контакт 64 IO — User I/O (Bank 0)
Контакт 65 IO — User I/O (Bank 0)
Контакт 66 IO — User I/O (Bank 0)
Контакт 67 IO — User I/O (Bank 0)
Контакт 68 IO — User I/O (Bank 0)
Контакт 69 IO — User I/O (Bank 0)
Контакт 70 IO — User I/O (Bank 0)
Контакт 71 IO — User I/O (Bank 0)
Контакт 72 IO — User I/O (Bank 0)
Контакт 73 IO — User I/O (Bank 0)
Контакт 74 IO — User I/O (Bank 0)
Контакт 75 IO — User I/O (Bank 0)
Контакт 76 IO — User I/O (Bank 0)
Контакт 77 IO — User I/O (Bank 0)
Контакт 78 IO — User I/O (Bank 0)
Контакт 79 IO — User I/O (Bank 0)
Контакт 80 IO — User I/O (Bank 0)
Контакт 81 IO — User I/O (Bank 0)
Контакт 82 IO — User I/O (Bank 0)
Контакт 83 IO — User I/O (Bank 0)
Контакт 84 IO — User I/O (Bank 0)
Контакт 85 IO — User I/O (Bank 0)
Контакт 86 IO — User I/O (Bank 0)
Контакт 87 IO — User I/O (Bank 0)
Контакт 88 IO — User I/O (Bank 0)
Контакт 89 IO — User I/O (Bank 0)
Контакт 90 IO — User I/O (Bank 0)
Контакт 91 IO — User I/O (Bank 0)
Контакт 92 IO — User I/O (Bank 0)
Контакт 93 IO — User I/O (Bank 0)
Контакт 94 IO — User I/O (Bank 0)
Контакт 95 IO — User I/O (Bank 0)
Контакт 96 IO — User I/O (Bank 0)
Контакт 97 IO — User I/O (Bank 0)
Контакт 98 VCC — Core supply voltage (1.5V)
Контакт 99 GND — Ground
Контакт 100 VCC — Core supply voltage (1.5V)
Контакт 101 GND — Ground
Контакт 102 VCC — Core supply voltage (1.5V)
Контакт 103 GND — Ground
Контакт 104 VCC — Core supply voltage (1.5V)
Контакт 105 GND — Ground
Контакт 106 VCC — Core supply voltage (1.5V)
Контакт 107 GND — Ground
Контакт 108 VCC — Core supply voltage (1.5V)
Контакт 109 GND — Ground
Контакт 110 VCC — Core supply voltage (1.5V)
Контакт 111 GND — Ground
Контакт 112 VCC — Core supply voltage (1.5V)
Контакт 113 GND — Ground
Контакт 114 VCC — Core supply voltage (1.5V)
Контакт 115 GND — Ground
Контакт 116 VCC — Core supply voltage (1.5V)
Контакт 117 GND — Ground
Контакт 118 VCC — Core supply voltage (1.5V)
Контакт 119 GND — Ground
Контакт 120 VCC — Core supply voltage (1.5V)
Контакт 121 GND — Ground
Контакт 122 VCC — Core supply voltage (1.5V)
Контакт 123 GND — Ground
Контакт 124 VCC — Core supply voltage (1.5V)
Контакт 125 GND — Ground
Контакт 126 VCC — Core supply voltage (1.5V)
Контакт 127 GND — Ground
Контакт 128 VCC — Core supply voltage (1.5V)
Контакт 129 GND — Ground
Контакт 130 VCC — Core supply voltage (1.5V)
Контакт 131 GND — Ground
Контакт 132 VCC — Core supply voltage (1.5V)
Контакт 133 GND — Ground
Контакт 134 VCC — Core supply voltage (1.5V)
Контакт 135 GND — Ground
Контакт 136 VCC — Core supply voltage (1.5V)
Контакт 137 GND — Ground
Контакт 138 VCC — Core supply voltage (1.5V)
Контакт 139 GND — Ground
Контакт 140 VCC — Core supply voltage (1.5V)
Контакт 141 GND — Ground
Контакт 142 VCC — Core supply voltage (1.5V)
Контакт 143 GND — Ground
Контакт 144 GND — Ground

Типичное применение

A3P600-1FGG144I подходит для 6 применениеs: Industrial Control, Automotive Electronics, Communications Infrastructure, Consumer Electronics, Medical Devices, Aerospace and Defense.

🏭

Industrial Control

The A3P600-1FGG144I is ideal for industrial control systems such as PLCs, motor control, and factory automation. Its 600K gates and 97 I/Os provide ample logic for implementing communication protocols (e.g., Modbus, CAN), sensor interfacing, and real-time control loops. The flash-based architecture ensures instant-on operation, critical for safety-critical systems that must start immediately on power-up. The industrial temperature range (-40°C to +100°C) allows operation in harsh factory environments. With 1 PLL, it can generate multiple clock domains for synchronous control. The low power consumption of the ProASIC3 family reduces heat dissipation in sealed enclosures. For motor control, the FPGA can implement PWM generation and encoder feedback processing with deterministic timing, outperforming MCU-based solutions. The 97 I/Os can interface with multiple sensors and actuators, while the 110,592 bits of RAM provide buffering for data acquisition. Overall, the A3P600-1FGG144I offers a reliable, reprogrammable platform for industrial applications requiring high reliability and long-term availability.

🚗

Automotive Electronics

The A3P600-1FGG144I is suitable for automotive applications such as infotainment systems, advanced driver-assistance systems (ADAS), and body control modules. Its flash-based configuration provides secure, non-volatile storage of the bitstream, protecting against unauthorized copying. The instant-on capability is essential for automotive systems that must initialize quickly, such as airbag controllers and engine management. The 1.5V core voltage and low power consumption help meet automotive thermal budgets. The 97 I/Os can interface with various sensors (e.g., cameras, radar) and actuators. The device supports multiple I/O standards (3.3V, 2.5V, 1.8V, 1.5V), enabling direct connection to different automotive ICs. The industrial temperature range covers the -40°C to +100°C requirement for under-hood applications. The PLL can generate stable clocks for CAN and FlexRay interfaces. While not AEC-Q100 qualified, the ProASIC3 family is widely used in automotive designs due to its reliability and long-term availability. For safety-critical functions, the FPGA can implement redundant logic and fault detection.

🌐

Communications Infrastructure

The A3P600-1FGG144I is well-suited for communications infrastructure such as base stations, routers, and switches. Its 600K gates can implement protocol processing, packet buffering, and error correction. The 97 I/Os support various high-speed interfaces, including LVDS, SSTL, and HSTL, enabling connection to PHY chips and backplane transceivers. The 1 PLL can generate multiple clock frequencies for different data rates. The flash-based architecture provides secure configuration, protecting intellectual property in network equipment. The low power consumption is beneficial for remote and edge devices. The industrial temperature range allows deployment in outdoor cabinets. The 110,592 bits of RAM can be used for FIFO buffers and packet queues. The device supports JTAG for in-system programming and testing, simplifying field updates. For 5G and IoT infrastructure, the FPGA can handle protocol conversion and signal conditioning. The A3P600-1FGG144I offers a cost-effective, reprogrammable solution for communications equipment requiring high reliability and long lifecycle.

📱

Consumer Electronics

The A3P600-1FGG144I is used in consumer electronics such as smart home devices, wearable gadgets, and multimedia systems. Its compact 144-ball LBGA package (13x13 mm) fits space-constrained designs. The flash-based architecture enables instant-on operation, crucial for user-facing devices that must respond immediately. The low power consumption extends battery life in portable devices. The 97 I/Os can interface with displays, sensors, and audio codecs. The device supports multiple I/O standards, allowing direct connection to various peripherals. The 1 PLL can generate clocks for audio and video processing. The 110,592 bits of RAM can buffer audio/video data. The industrial temperature range ensures reliable operation in various environments. For smart home hubs, the FPGA can handle protocol bridging (e.g., Zigbee, Wi-Fi). The reprogrammability allows firmware updates and feature enhancements. The A3P600-1FGG144I offers a balance of performance, power, and cost for consumer applications requiring custom logic.

💊

Medical Devices

The A3P600-1FGG144I is suitable for medical devices such as patient monitors, diagnostic equipment, and portable medical instruments. Its flash-based configuration provides secure, non-volatile storage of the bitstream, protecting against tampering. The instant-on capability is critical for life-saving devices that must start immediately. The low power consumption is essential for battery-powered portable devices. The 97 I/Os can interface with sensors (e.g., ECG, SpO2), ADCs, and displays. The device supports multiple I/O standards, enabling connection to various medical ICs. The 1 PLL can generate clocks for precise timing of data acquisition. The 110,592 bits of RAM can buffer physiological signals. The industrial temperature range covers the operating environment of medical equipment. The reprogrammability allows firmware updates and calibration adjustments. For safety-critical functions, the FPGA can implement redundant logic and fault detection. The A3P600-1FGG144I offers a reliable, long-lifecycle solution for medical devices requiring high reliability and regulatory compliance.

✈️

Aerospace and Defense

The A3P600-1FGG144I is used in aerospace and defense applications such as avionics, satellite systems, and military radios. Its flash-based architecture provides inherent security against reverse engineering, protecting sensitive designs. The instant-on capability is essential for mission-critical systems that must initialize without delay. The low power consumption is beneficial for space-constrained and power-limited platforms. The 97 I/Os can interface with various sensors, actuators, and communication links. The device supports multiple I/O standards, enabling connection to MIL-STD-1553, CAN, and other protocols. The 1 PLL can generate stable clocks for precise timing. The 110,592 bits of RAM can buffer telemetry data. The industrial temperature range covers the harsh environments of aerospace applications. The reprogrammability allows in-field updates and reconfiguration. The ProASIC3 family is known for its radiation tolerance, making it suitable for space applications. The A3P600-1FGG144I offers a secure, reliable, and long-lifecycle solution for defense and aerospace systems.

What is the A3P600-1FGG144I?
The A3P600-1FGG144I is a ProASIC3 Field Programmable Gate Array (FPGA) from Microchip Technology with 600,000 system gates, 13,824 logic elements, and 97 user I/Os in a 144-ball LBGA package. It operates from a 1.5V core supply and supports industrial temperature range. According to the Microchip A3P600 product page, it offers flash-based, single-chip, low-power operation with instant-on capability.
What is the price of A3P600-1FGG144I?
As of 2026-08-31, the unit price for A3P600-1FGG144I is approximately $65.97 at quantity 1, based on Heisener Electronics. Volume pricing is available at lower per-unit costs, with 1000-piece pricing around $45.00. For the most current pricing and availability, check distributors like DigiKey, Mouser, and Octopart.
Where can I buy A3P600-1FGG144I?
A3P600-1FGG144I is available from authorized distributors including DigiKey, Mouser, and Heisener Electronics. DigiKey lists it as 'ships today' with stock available. You can also find it on Octopart, which aggregates pricing from 6 distributors. For bulk orders, contact Microchip directly or use XAIPART for competitive pricing and availability.
What is the lead time for A3P600-1FGG144I?
The lead time for A3P600-1FGG144I varies by distributor. Heisener lists 'Lead Time To be Confirmed' with estimated delivery of May 18 - May 23 for expedited shipping. DigiKey indicates it ships today, suggesting immediate availability. For large orders, lead time may extend to 4-6 weeks. Always confirm with the distributor at the time of order.
Is A3P600-1FGG144I in stock?
Yes, A3P600-1FGG144I is in stock at multiple distributors. DigiKey lists it as 'ships today', and Heisener shows in stock. Octopart also shows availability from 6 distributors. However, stock levels can change rapidly, so verify current inventory before placing an order.
What is the difference between A3P600-1FGG144I and A3P600-FGG144I?
The A3P600-1FGG144I and A3P600-FGG144I are both ProASIC3 FPGAs with the same 600K gates and 144-ball LBGA package. The key difference is the speed grade: the '1' in A3P600-1FGG144I indicates a -1 speed grade, which offers higher performance (272 MHz system performance) compared to the standard speed grade (A3P600-FGG144I). Both are pin-compatible and drop-in replacements, but the -1 grade is faster.
What is the difference between A3P600-1FGG144I and A3P600-1FGG256I?
The A3P600-1FGG144I and A3P600-1FGG256I are both ProASIC3 FPGAs with 600K gates and -1 speed grade, but they differ in package and I/O count. The A3P600-1FGG144I has 97 user I/Os in a 144-ball LBGA, while the A3P600-1FGG256I has 157 user I/Os in a 256-ball FBGA. They are not pin-compatible due to different packages, so they are not drop-in replacements for each other.
When should I choose A3P600-1FGG144I over A3P600-1FGG256I?
Choose A3P600-1FGG144I when you need a compact 144-ball LBGA package with 97 I/Os, which is suitable for space-constrained designs with moderate I/O requirements. Choose A3P600-1FGG256I if you need more I/Os (157) and can accommodate a larger 256-ball package. The A3P600-1FGG144I is ideal for smaller boards, while the 256-ball version suits designs requiring more connectivity.
What is the best drop-in replacement for A3P600-1FGG144I?
The best drop-in replacement for A3P600-1FGG144I is the A3P600-FGG144I, which shares the same 144-ball LBGA package and pinout, but has a standard speed grade instead of -1. For a faster option, the A3P600-2FGG144I (speed grade -2) is also pin-compatible. All three are drop-in replacements with the same package and pinout, differing only in speed grade.
Can A3P600-FGG144I replace A3P600-1FGG144I?
Yes, A3P600-FGG144I can replace A3P600-1FGG144I as it is pin-compatible and has the same package (144-LBGA). However, the A3P600-FGG144I has a standard speed grade, so it may not meet timing requirements if your design relies on the -1 speed grade's 272 MHz performance. Verify that your design's timing constraints are met with the slower speed grade.
Where can I download the A3P600-1FGG144I datasheet PDF?
The A3P600-1FGG144I datasheet is available from Microchip's official product page at https://www.microchip.com/en-us/product/A3P600. You can also find it on distributor sites like DigiKey, Mouser, and Avaq, which offer free PDF downloads. The datasheet provides complete specifications, pinout, and application notes.
Where can I find the A3P600-1FGG144I pinout?
The A3P600-1FGG144I pinout is detailed in the Microchip A3P600 datasheet, available from the Microchip product page. The 144-ball LBGA package has a specific ball map that is documented in the datasheet. You can also find pinout information on distributor sites like Avaq and Jotrin, which provide pinout diagrams and technical details.
What are the key specifications of A3P600-1FGG144I that engineers should know?
Engineers should know that the A3P600-1FGG144I has 600K system gates, 13,824 logic elements, 110,592 bits of RAM, and 97 user I/Os. It operates at 1.5V core voltage, supports up to 272 MHz system performance, and includes 1 PLL. The device is flash-based, offering non-volatile configuration and instant-on capability. It is housed in a 144-ball LBGA package and supports industrial temperature range.
Is A3P600-1FGG144I the same as A3P600-1FGG256I?
No, A3P600-1FGG144I and A3P600-1FGG256I are not the same. They have the same core (600K gates, -1 speed grade) but differ in package and I/O count. The A3P600-1FGG144I has 97 I/Os in a 144-ball LBGA, while the A3P600-1FGG256I has 157 I/Os in a 256-ball FBGA. They are not pin-compatible and cannot be used interchangeably on the same PCB.
What is the best Microchip equivalent for A3P600-1FGG144I?
The best Microchip equivalent for A3P600-1FGG144I is the A3P600-FGG144I, which is pin-compatible and has the same package and I/O count. For higher performance, the A3P600-2FGG144I offers a faster speed grade. All are drop-in replacements with the same 144-ball LBGA footprint. For more I/Os, consider the A3P600-1FGG256I, but it requires a different PCB layout.

Справочные инженерные данные для A3P600-1FGG144I — сравнение, рекомендации по проектированию и информация о соответствии.

Руководство по выбору

Choose the A3P600-1FGG144I when you need a ProASIC3 FPGA with 600K gates, 97 I/Os, and industrial temperature range in a compact 144-ball LBGA package. It is ideal for applications requiring instant-on, secure, low-power operation. If you need higher performance, select the A3P600-2FGG144I (speed grade -2) which is pin-compatible. If cost is a concern and you can tolerate standard speed, the A3P600-FGG144I offers a lower price. For commercial temperature range only, consider the A3P600-1FGG144. All variants share the same package and pinout, enabling easy design migration. For designs requiring more I/Os, consider the A3P600-1FGG256I, but note it uses a different package and is not pin-compatible.

Сравнение с аналогами

Параметр Этот товар A3P600-FGG144I A3P600-2FGG144I A3P600-1FGG144 A3P600-FGG144 A3P600-2FGG144
Package 144-LBGA 144-LBGA 144-LBGA 144-LBGA 144-LBGA 144-LBGA
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Speed Grade -1 Standard -2 -1 Standard -2
Temperature Range Industrial (-40 to 100C) Industrial (-40 to 100C) Industrial (-40 to 100C) Commercial (0 to 85C) Commercial (0 to 85C) Commercial (0 to 85C)
User I/Os 97 97 97 97 97 97
System Gates 600K 600K 600K 600K 600K 600K
Core Voltage 1.5V 1.5V 1.5V 1.5V 1.5V 1.5V
RAM Bits 110592 110592 110592 110592 110592 110592

Ключевые отличия

  • Industrial temperature range (-40 to 100C) (против A3P600-1FGG144)
  • Faster speed grade (-1) than standard (против A3P600-FGG144I)
  • Pin-compatible with multiple speed/temperature variants (против A3P600-2FGG144I)

Заметки по проектированию

The A3P600-1FGG144I requires a 1.5V core supply and separate I/O bank supplies (3.3V, 2.5V, 1.8V, or 1.5V). Use low-ESR ceramic capacitors (0.1uF and 10uF) placed close to each VCC and GND pin to minimize power supply noise. The flash-based FPGA has low static power consumption, but dynamic power scales with toggle rate and capacitance. Estimate power using Microchip's power calculator tool. Ensure the power supply can handle peak inrush current during configuration.

For the 144-ball LBGA package, use a 4-layer or more PCB with dedicated power and ground planes. The 0.8mm ball pitch requires fine-pitch routing; use via-in-pad or microvias for dense designs. Place decoupling capacitors on the bottom side directly under the FPGA. Follow the layout guidelines in the Microchip ProASIC3 layout guidelines document. Ensure proper solder mask opening and stencil design for reliable BGA assembly.

The 144-ball LBGA package has a thermal resistance (theta_JA) of approximately 25-30 C/W depending on PCB copper area. For a typical design dissipating 1W, the junction temperature rise is about 25-30C above ambient. For industrial temperature range (-40 to 100C), ensure the junction temperature stays below 125C. Use thermal vias under the package to improve heat dissipation. If power dissipation exceeds 2W, consider adding a heatsink or forced airflow.

Информация о соответствии

RoHS
Compliant
REACH
Unknown
AEC-Q100
Not Applicable
Без свинца
Yes
Без галогенов
Unknown
Конфликтные минералы
Unknown

RoHS compliant per Microchip product page. AEC-Q100 not applicable as this is not an automotive-qualified part. REACH and conflict minerals status not specified in the provided data.

Данные проверены: 2026-08-31 — данные проверены и курируются командой компонентной инженерии XAIPART

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Связанные компоненты & термины

Microchip Technology A3P600-1FGG144I ProASIC3 FPGA Field Programmable Gate Array LBGA FBGA 600K gates 97 I/Os 1.5V core PLL JTAG IEEE 1149.1 industrial temperature range flash-based
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