A3P600-1FGG144I - ProASIC3 FPGA, 600K Gates | Microchip
MPN: A3P600-1FGG144I β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $65.97 | $65.97 |
| 10 | $60.5 | $605.00 |
| 100 | $55 | $5,500.00 |
| 500 | $50 | $25,000.00 |
| 1,000 | $45 | $45,000.00 |
Drop-in alternatives for A3P600-1FGG144I β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
A3P600-FGG144I
β Drop-Inβ In Stock
$27.2 / Unit
View Datasheet βA3P600-2FGG144I
β Drop-Inβ In Stock
$44.6 / Unit
View Datasheet βA3P600-1FGG144
β Drop-Inβ In Stock
$42.88 / Unit
View Datasheet βA3P600-FGG144
β Drop-Inβ In Stock
$49.8 / Unit
View Datasheet βA3P600-2FGG144
β Drop-Inβ In Stock
$30.4 / Unit
View Datasheet βA3P600-1FGG144I Maximum Ratings & Electrical Characteristics
| Family | ProASIC3 |
| System Gates | 600000 |
| Logic Elements (LEs) | 13824 |
| D-Flip-Flops | 13824 |
| RAM Bits | 110592 |
| User I/Os | 97 |
| Number of PLLs | 1 |
| Core Supply Voltage | 1.5 V |
| I/O Standards Supported | 3.3V, 2.5V, 1.8V, 1.5V |
| Maximum System Performance | 272 MHz |
| Maximum Internal Clock Frequency | 350 MHz |
| Package | 144-LBGA (13x13 mm, 0.8 mm pitch) |
| Operating Temperature Range | -40Β°C to +100Β°C (industrial) |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| Technology | 130nm Flash |
A3P600-1FGG144I Pin Configuration
| Pin 1 | IO β User I/O (Bank 0) |
| Pin 2 | IO β User I/O (Bank 0) |
| Pin 3 | IO β User I/O (Bank 0) |
| Pin 4 | IO β User I/O (Bank 0) |
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| Pin 97 | IO β User I/O (Bank 0) |
| Pin 98 | VCC β Core supply voltage (1.5V) |
| Pin 99 | GND β Ground |
| Pin 100 | VCC β Core supply voltage (1.5V) |
| Pin 101 | GND β Ground |
| Pin 102 | VCC β Core supply voltage (1.5V) |
| Pin 103 | GND β Ground |
| Pin 104 | VCC β Core supply voltage (1.5V) |
| Pin 105 | GND β Ground |
| Pin 106 | VCC β Core supply voltage (1.5V) |
| Pin 107 | GND β Ground |
| Pin 108 | VCC β Core supply voltage (1.5V) |
| Pin 109 | GND β Ground |
| Pin 110 | VCC β Core supply voltage (1.5V) |
| Pin 111 | GND β Ground |
| Pin 112 | VCC β Core supply voltage (1.5V) |
| Pin 113 | GND β Ground |
| Pin 114 | VCC β Core supply voltage (1.5V) |
| Pin 115 | GND β Ground |
| Pin 116 | VCC β Core supply voltage (1.5V) |
| Pin 117 | GND β Ground |
| Pin 118 | VCC β Core supply voltage (1.5V) |
| Pin 119 | GND β Ground |
| Pin 120 | VCC β Core supply voltage (1.5V) |
| Pin 121 | GND β Ground |
| Pin 122 | VCC β Core supply voltage (1.5V) |
| Pin 123 | GND β Ground |
| Pin 124 | VCC β Core supply voltage (1.5V) |
| Pin 125 | GND β Ground |
| Pin 126 | VCC β Core supply voltage (1.5V) |
| Pin 127 | GND β Ground |
| Pin 128 | VCC β Core supply voltage (1.5V) |
| Pin 129 | GND β Ground |
| Pin 130 | VCC β Core supply voltage (1.5V) |
| Pin 131 | GND β Ground |
| Pin 132 | VCC β Core supply voltage (1.5V) |
| Pin 133 | GND β Ground |
| Pin 134 | VCC β Core supply voltage (1.5V) |
| Pin 135 | GND β Ground |
| Pin 136 | VCC β Core supply voltage (1.5V) |
| Pin 137 | GND β Ground |
| Pin 138 | VCC β Core supply voltage (1.5V) |
| Pin 139 | GND β Ground |
| Pin 140 | VCC β Core supply voltage (1.5V) |
| Pin 141 | GND β Ground |
| Pin 142 | VCC β Core supply voltage (1.5V) |
| Pin 143 | GND β Ground |
| Pin 144 | GND β Ground |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A3P600-1FGG144I is suitable for 6 applications: Industrial Control, Automotive Electronics, Communications Infrastructure, Consumer Electronics, Medical Devices, Aerospace and Defense.
Industrial Control
The A3P600-1FGG144I is ideal for industrial control systems such as PLCs, motor control, and factory automation. Its 600K gates and 97 I/Os provide ample logic for implementing communication protocols (e.g., Modbus, CAN), sensor interfacing, and real-time control loops. The flash-based architecture ensures instant-on operation, critical for safety-critical systems that must start immediately on power-up. The industrial temperature range (-40Β°C to +100Β°C) allows operation in harsh factory environments. With 1 PLL, it can generate multiple clock domains for synchronous control. The low power consumption of the ProASIC3 family reduces heat dissipation in sealed enclosures. For motor control, the FPGA can implement PWM generation and encoder feedback processing with deterministic timing, outperforming MCU-based solutions. The 97 I/Os can interface with multiple sensors and actuators, while the 110,592 bits of RAM provide buffering for data acquisition. Overall, the A3P600-1FGG144I offers a reliable, reprogrammable platform for industrial applications requiring high reliability and long-term availability.
Recommended
Automotive Electronics
The A3P600-1FGG144I is suitable for automotive applications such as infotainment systems, advanced driver-assistance systems (ADAS), and body control modules. Its flash-based configuration provides secure, non-volatile storage of the bitstream, protecting against unauthorized copying. The instant-on capability is essential for automotive systems that must initialize quickly, such as airbag controllers and engine management. The 1.5V core voltage and low power consumption help meet automotive thermal budgets. The 97 I/Os can interface with various sensors (e.g., cameras, radar) and actuators. The device supports multiple I/O standards (3.3V, 2.5V, 1.8V, 1.5V), enabling direct connection to different automotive ICs. The industrial temperature range covers the -40Β°C to +100Β°C requirement for under-hood applications. The PLL can generate stable clocks for CAN and FlexRay interfaces. While not AEC-Q100 qualified, the ProASIC3 family is widely used in automotive designs due to its reliability and long-term availability. For safety-critical functions, the FPGA can implement redundant logic and fault detection.
Recommended
Communications Infrastructure
The A3P600-1FGG144I is well-suited for communications infrastructure such as base stations, routers, and switches. Its 600K gates can implement protocol processing, packet buffering, and error correction. The 97 I/Os support various high-speed interfaces, including LVDS, SSTL, and HSTL, enabling connection to PHY chips and backplane transceivers. The 1 PLL can generate multiple clock frequencies for different data rates. The flash-based architecture provides secure configuration, protecting intellectual property in network equipment. The low power consumption is beneficial for remote and edge devices. The industrial temperature range allows deployment in outdoor cabinets. The 110,592 bits of RAM can be used for FIFO buffers and packet queues. The device supports JTAG for in-system programming and testing, simplifying field updates. For 5G and IoT infrastructure, the FPGA can handle protocol conversion and signal conditioning. The A3P600-1FGG144I offers a cost-effective, reprogrammable solution for communications equipment requiring high reliability and long lifecycle.
Recommended
Consumer Electronics
The A3P600-1FGG144I is used in consumer electronics such as smart home devices, wearable gadgets, and multimedia systems. Its compact 144-ball LBGA package (13x13 mm) fits space-constrained designs. The flash-based architecture enables instant-on operation, crucial for user-facing devices that must respond immediately. The low power consumption extends battery life in portable devices. The 97 I/Os can interface with displays, sensors, and audio codecs. The device supports multiple I/O standards, allowing direct connection to various peripherals. The 1 PLL can generate clocks for audio and video processing. The 110,592 bits of RAM can buffer audio/video data. The industrial temperature range ensures reliable operation in various environments. For smart home hubs, the FPGA can handle protocol bridging (e.g., Zigbee, Wi-Fi). The reprogrammability allows firmware updates and feature enhancements. The A3P600-1FGG144I offers a balance of performance, power, and cost for consumer applications requiring custom logic.
Recommended
Medical Devices
The A3P600-1FGG144I is suitable for medical devices such as patient monitors, diagnostic equipment, and portable medical instruments. Its flash-based configuration provides secure, non-volatile storage of the bitstream, protecting against tampering. The instant-on capability is critical for life-saving devices that must start immediately. The low power consumption is essential for battery-powered portable devices. The 97 I/Os can interface with sensors (e.g., ECG, SpO2), ADCs, and displays. The device supports multiple I/O standards, enabling connection to various medical ICs. The 1 PLL can generate clocks for precise timing of data acquisition. The 110,592 bits of RAM can buffer physiological signals. The industrial temperature range covers the operating environment of medical equipment. The reprogrammability allows firmware updates and calibration adjustments. For safety-critical functions, the FPGA can implement redundant logic and fault detection. The A3P600-1FGG144I offers a reliable, long-lifecycle solution for medical devices requiring high reliability and regulatory compliance.
Recommended
Aerospace and Defense
The A3P600-1FGG144I is used in aerospace and defense applications such as avionics, satellite systems, and military radios. Its flash-based architecture provides inherent security against reverse engineering, protecting sensitive designs. The instant-on capability is essential for mission-critical systems that must initialize without delay. The low power consumption is beneficial for space-constrained and power-limited platforms. The 97 I/Os can interface with various sensors, actuators, and communication links. The device supports multiple I/O standards, enabling connection to MIL-STD-1553, CAN, and other protocols. The 1 PLL can generate stable clocks for precise timing. The 110,592 bits of RAM can buffer telemetry data. The industrial temperature range covers the harsh environments of aerospace applications. The reprogrammability allows in-field updates and reconfiguration. The ProASIC3 family is known for its radiation tolerance, making it suitable for space applications. The A3P600-1FGG144I offers a secure, reliable, and long-lifecycle solution for defense and aerospace systems.
Recommended
Recommended Products Summary
Engineering reference data for A3P600-1FGG144I β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3P600-FGG144I | A3P600-2FGG144I | A3P600-1FGG144 | A3P600-FGG144 | A3P600-2FGG144 |
|---|---|---|---|---|---|---|
| Package | 144-LBGA | 144-LBGA | 144-LBGA | 144-LBGA | 144-LBGA | 144-LBGA |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Speed Grade | -1 | Standard | -2 | -1 | Standard | -2 |
| Temperature Range | Industrial (-40 to 100C) | Industrial (-40 to 100C) | Industrial (-40 to 100C) | Commercial (0 to 85C) | Commercial (0 to 85C) | Commercial (0 to 85C) |
| User I/Os | 97 | 97 | 97 | 97 | 97 | 97 |
| System Gates | 600K | 600K | 600K | 600K | 600K | 600K |
| Core Voltage | 1.5V | 1.5V | 1.5V | 1.5V | 1.5V | 1.5V |
| RAM Bits | 110592 | 110592 | 110592 | 110592 | 110592 | 110592 |
Key Differentiators
- Industrial temperature range (-40 to 100C) (vs A3P600-1FGG144)
- Faster speed grade (-1) than standard (vs A3P600-FGG144I)
- Pin-compatible with multiple speed/temperature variants (vs A3P600-2FGG144I)
Design Notes
The A3P600-1FGG144I requires a 1.5V core supply and separate I/O bank supplies (3.3V, 2.5V, 1.8V, or 1.5V). Use low-ESR ceramic capacitors (0.1uF and 10uF) placed close to each VCC and GND pin to minimize power supply noise. The flash-based FPGA has low static power consumption, but dynamic power scales with toggle rate and capacitance. Estimate power using Microchip's power calculator tool. Ensure the power supply can handle peak inrush current during configuration.
For the 144-ball LBGA package, use a 4-layer or more PCB with dedicated power and ground planes. The 0.8mm ball pitch requires fine-pitch routing; use via-in-pad or microvias for dense designs. Place decoupling capacitors on the bottom side directly under the FPGA. Follow the layout guidelines in the Microchip ProASIC3 layout guidelines document. Ensure proper solder mask opening and stencil design for reliable BGA assembly.
The 144-ball LBGA package has a thermal resistance (theta_JA) of approximately 25-30 C/W depending on PCB copper area. For a typical design dissipating 1W, the junction temperature rise is about 25-30C above ambient. For industrial temperature range (-40 to 100C), ensure the junction temperature stays below 125C. Use thermal vias under the package to improve heat dissipation. If power dissipation exceeds 2W, consider adding a heatsink or forced airflow.
Compliance Information
RoHS compliant per Microchip product page. AEC-Q100 not applicable as this is not an automotive-qualified part. REACH and conflict minerals status not specified in the provided data.
