Microchip Technology

A3P600-FG144 - 600K Gate Flash FPGA | Microchip Technology

Артикул: A3P600-FG144 ✓ Активен
В наличии Отправка в течение 1–3 рабочих дней
1.5V Vdss 144-LBGA (FBGA-144), 1mm pitch Package 231 MHz Speed
От $15.6 USD / шт.
MOQ: 1 |
Цена обновлена: 2026-08-31
Оптовые цены
Кол-во Цена за ед. Итого
1 $25.5 $25,50
10 $23.2 $232,00
100 $20.1 $2.010,00
500 $17.8 $8.900,00
1.000 $15.6 $15.600,00
ℹ️ Все цены указаны в USD

A3P600-FG144 Обзор

The Microchip Technology A3P600-FG144 is a flash-based Field Programmable Gate Array (FPGA) from the ProASIC3 family, offering 600,000 system gates, 231 MHz maximum internal frequency, and 97 user I/Os in a 144-ball FBGA package. It operates from a 1.5V core supply and is built on a 130-nm, 7-layer metal (6 copper) flash-based CMOS process, providing instant-on, low-power, and secure non-volatile operation.

An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer after manufacturing to implement custom digital logic functions. FPGAs belong to the broader category of programmable logic devices (PLDs), which sit between fixed-function ASICs and general-purpose processors in the digital logic hierarchy. The ProASIC3 family specifically uses flash-based configuration cells, meaning the design is stored in non-volatile flash memory, eliminating the need for external configuration memory and enabling instant-on operation at power-up.

Key features of the A3P600-FG144 include 600K system gates, 110,592 bits of True Dual-Port SRAM, and up to 300 user I/Os across the family (97 on this package). It supports multiple I/O standards including LVCMOS, LVTTL, PCI, and LVDS, with four I/O banks that have dedicated supply voltages. The flash-based architecture provides inherent security against bitstream copying and supports In-System Programming (ISP) for field updates. The device also features clock conditioning circuits (CCC) and PLLs for robust clock management.

Technically, the A3P600 uses a 130-nm flash process with 7 metal layers, achieving a typical power consumption significantly lower than SRAM-based FPGAs due to the absence of configuration overhead. The device supports hot-swapping and has a single-chip solution with no boot PROM required. It offers 231 MHz system performance and 350 MHz maximum clock frequency in some variants, making it suitable for mid-range digital designs.

Typical applications include industrial control, automotive electronics, communications infrastructure, and consumer electronics where low power, instant-on, and security are critical. The 144-ball FBGA package with 1mm pitch is ideal for space-constrained designs requiring moderate I/O counts.

When designing with this device, ensure proper decoupling of the 1.5V core supply and each VCCIBx bank supply. The flash-based configuration retains the design even without power, but careful power sequencing is recommended to avoid I/O contention during power-up.

This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing a comprehensive resource for engineers evaluating the A3P600-FG144.

Аналоги без доработки для A3P600-FG144 — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.

Варианты в этой серии

Модели той же серии, совместимые без доработки с A3P600-FG144 (тот же форм-фактор и посадочное место) — отличается по Package, Operating Temperature, Process Technology, Family, RoHS Status.

Microchip Technology
Operating Temperature: 0°C to +85°C (TJ)
RoHS Status: RoHS non-compliant
Сравнить с A3P600-FG144 →
Microchip Technology
Package: 144-LBGA (13x13 mm, 0.8 mm pitch)
Сравнить с A3P600-FG144 →
Microchip Technology
Operating Temperature: 0°C ~ 85°C (TJ)
RoHS Status: RoHS non-compliant
Сравнить с A3P600-FG144 →
Microsemi
Package: 144-Ball FBGA (FGG144)
Process Technology: 130 nm CMOS
Сравнить с A3P600-FG144 →
Microchip Technology
Package: 144-LBGA / 144-FBGA (13x13 mm)
Operating Temperature: -40C to +100C (TJ)
Process Technology: 130 nm flash
Сравнить с A3P600-FG144 →
Microchip Technology
RoHS Status: Compliant
Сравнить с A3P600-FG144 →
Microchip Technology
Package: 144-FBGA / 144-LBGA (FGG144)
Family: ProASIC3 (Actel/Microchip)
Сравнить с A3P600-FG144 →
Microchip Technology
Package: 144-pin FBGA (FGG144)
Operating Temperature: -40C to +100C (industrial)
Process Technology: 130nm flash
Сравнить с A3P600-FG144 →
Microchip Technology
Package: 144-ball FBGA (FG144), 13 x 13 mm, 1.0 mm pitch, 1.45 mm height
Operating Temperature: 0C to +85C (commercial, -F grade)
Family: ProASIC3L (Flash FPGA)
Сравнить с A3P600-FG144 →

Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:

A3P600-FG144I

✅ Прямая замена
Microchip Technology
📦 144-LBGA (FBGA-144)
600000 · 13824 · 350 MHz · 97 · FBGA-144, 1 mm pitch · CMOS · 144 · -40°C to +100°C (industrial)

✓ В наличии

$15.6 / шт.

Открыть даташит →

A3P600-FGG144

✅ Прямая замена
Microchip Technology
📦 144-LBGA (FBGA-144)
600000 gates · 13824 CLBs · 97 · 110592 bits · CMOS flash-based FPGA, nonvolatile · ProASIC3 (Actel/Microchip) · 144-FBGA / 144-LBGA (FGG144) · 1.00 mm

✓ В наличии

$49.8 / шт.

Открыть даташит →

A3P600-FGG144I

✅ Прямая замена
Microchip Technology
📦 144-LBGA (FBGA-144)
ProASIC3 · 600000 · 13824 · 110592 · 97 · 1.5 V · 231 MHz · 144-pin FBGA (FGG144)

✓ В наличии

$27.2 / шт.

Открыть даташит →

A3P600-1FGG144I

✅ Прямая замена
Microchip Technology
📦 144-LBGA (FBGA-144)
ProASIC3 · 600000 · 13824 · 13824 · 110592 · 97 · 1 · 1.5 V

✓ В наличии

$45 / шт.

Открыть даташит →

A3P600-2FGG144

✅ Прямая замена
Microsemi
📦 144-LBGA (FBGA-144)
ProASIC3 · 600000 gates · 13824 CLBs · 97 I/O · 310 MHz · 130 nm CMOS · 1.5 V · Nonvolatile Flash

✓ В наличии

$30.4 / шт.

Открыть даташит →

A3P600-2FGG144I

✅ Прямая замена
Microchip Technology
📦 144-LBGA (FBGA-144)
ProASIC3 · 600000 · 110592 · 13824 · 97 · 310 MHz (speed grade -2) · 130 nm flash · 1.425 V to 1.575 V (1.5 V nominal)

✓ В наличии

$44.6 / шт.

Открыть даташит →

A3P600-FG144 Максимальные параметры и электрические характеристики

Family ProASIC3
System Gates 600000
Maximum Internal Frequency 231 MHz
User I/Os 97
SRAM Bits 110592
Core Supply Voltage 1.5V
Process Technology 130-nm, 7-Layer Metal (6 Copper), Flash-Based CMOS
Корпус 144-LBGA (FBGA-144), 1mm pitch
Рабочая температура 0 to 70 C
Logic Family CMOS
Number of CLBs 13824
I/O Banks 4
Configuration Flash-based, non-volatile
In-System Programming Supported
Статус RoHS Compliant

Конфигурация выводов A3P600-FG144

BGA-144 Package Pinout Diagram BGA-144 13x13mm, 12x12, P0.8mm, JEDEC MO-192. A1 BGA-144 12x12 grid
Контакт 1 IO_0 — User I/O bank 0
Контакт 2 IO_1 — User I/O bank 0
Контакт 3 VCCIB0 — I/O bank 0 supply voltage
Контакт 4 IO_2 — User I/O bank 0
Контакт 5 IO_3 — User I/O bank 0
Контакт 6 GND — Ground
Контакт 7 IO_4 — User I/O bank 0
Контакт 8 IO_5 — User I/O bank 0
Контакт 9 IO_6 — User I/O bank 0
Контакт 10 VCC — Core supply voltage 1.5V
Контакт 11 IO_7 — User I/O bank 0
Контакт 12 IO_8 — User I/O bank 0
Контакт 13 IO_9 — User I/O bank 0
Контакт 14 GND — Ground
Контакт 15 IO_10 — User I/O bank 0
Контакт 16 IO_11 — User I/O bank 0
Контакт 17 IO_12 — User I/O bank 0
Контакт 18 VCCIB0 — I/O bank 0 supply voltage
Контакт 19 IO_13 — User I/O bank 0
Контакт 20 IO_14 — User I/O bank 0
Контакт 21 IO_15 — User I/O bank 0
Контакт 22 GND — Ground
Контакт 23 IO_16 — User I/O bank 0
Контакт 24 IO_17 — User I/O bank 0
Контакт 25 IO_18 — User I/O bank 0
Контакт 26 VCC — Core supply voltage 1.5V
Контакт 27 IO_19 — User I/O bank 0
Контакт 28 IO_20 — User I/O bank 0
Контакт 29 IO_21 — User I/O bank 0
Контакт 30 GND — Ground
Контакт 31 IO_22 — User I/O bank 0
Контакт 32 IO_23 — User I/O bank 0
Контакт 33 IO_24 — User I/O bank 0
Контакт 34 VCCIB0 — I/O bank 0 supply voltage
Контакт 35 IO_25 — User I/O bank 0
Контакт 36 IO_26 — User I/O bank 0
Контакт 37 IO_27 — User I/O bank 0
Контакт 38 GND — Ground
Контакт 39 IO_28 — User I/O bank 0
Контакт 40 IO_29 — User I/O bank 0
Контакт 41 IO_30 — User I/O bank 0
Контакт 42 VCC — Core supply voltage 1.5V
Контакт 43 IO_31 — User I/O bank 0
Контакт 44 IO_32 — User I/O bank 0
Контакт 45 IO_33 — User I/O bank 0
Контакт 46 GND — Ground
Контакт 47 IO_34 — User I/O bank 0
Контакт 48 IO_35 — User I/O bank 0
Контакт 49 IO_36 — User I/O bank 0
Контакт 50 VCCIB0 — I/O bank 0 supply voltage
Контакт 51 IO_37 — User I/O bank 0
Контакт 52 IO_38 — User I/O bank 0
Контакт 53 IO_39 — User I/O bank 0
Контакт 54 GND — Ground
Контакт 55 IO_40 — User I/O bank 0
Контакт 56 IO_41 — User I/O bank 0
Контакт 57 IO_42 — User I/O bank 0
Контакт 58 VCC — Core supply voltage 1.5V
Контакт 59 IO_43 — User I/O bank 0
Контакт 60 IO_44 — User I/O bank 0
Контакт 61 IO_45 — User I/O bank 0
Контакт 62 GND — Ground
Контакт 63 IO_46 — User I/O bank 0
Контакт 64 IO_47 — User I/O bank 0
Контакт 65 IO_48 — User I/O bank 0
Контакт 66 VCCIB0 — I/O bank 0 supply voltage
Контакт 67 IO_49 — User I/O bank 0
Контакт 68 IO_50 — User I/O bank 0
Контакт 69 IO_51 — User I/O bank 0
Контакт 70 GND — Ground
Контакт 71 IO_52 — User I/O bank 0
Контакт 72 IO_53 — User I/O bank 0
Контакт 73 IO_54 — User I/O bank 0
Контакт 74 VCC — Core supply voltage 1.5V
Контакт 75 IO_55 — User I/O bank 0
Контакт 76 IO_56 — User I/O bank 0
Контакт 77 IO_57 — User I/O bank 0
Контакт 78 GND — Ground
Контакт 79 IO_58 — User I/O bank 0
Контакт 80 IO_59 — User I/O bank 0
Контакт 81 IO_60 — User I/O bank 0
Контакт 82 VCCIB0 — I/O bank 0 supply voltage
Контакт 83 IO_61 — User I/O bank 0
Контакт 84 IO_62 — User I/O bank 0
Контакт 85 IO_63 — User I/O bank 0
Контакт 86 GND — Ground
Контакт 87 IO_64 — User I/O bank 0
Контакт 88 IO_65 — User I/O bank 0
Контакт 89 IO_66 — User I/O bank 0
Контакт 90 VCC — Core supply voltage 1.5V
Контакт 91 IO_67 — User I/O bank 0
Контакт 92 IO_68 — User I/O bank 0
Контакт 93 IO_69 — User I/O bank 0
Контакт 94 GND — Ground
Контакт 95 IO_70 — User I/O bank 0
Контакт 96 IO_71 — User I/O bank 0
Контакт 97 IO_72 — User I/O bank 0
Контакт 98 VCCIB0 — I/O bank 0 supply voltage
Контакт 99 IO_73 — User I/O bank 0
Контакт 100 IO_74 — User I/O bank 0
Контакт 101 IO_75 — User I/O bank 0
Контакт 102 GND — Ground
Контакт 103 IO_76 — User I/O bank 0
Контакт 104 IO_77 — User I/O bank 0
Контакт 105 IO_78 — User I/O bank 0
Контакт 106 VCC — Core supply voltage 1.5V
Контакт 107 IO_79 — User I/O bank 0
Контакт 108 IO_80 — User I/O bank 0
Контакт 109 IO_81 — User I/O bank 0
Контакт 110 GND — Ground
Контакт 111 IO_82 — User I/O bank 0
Контакт 112 IO_83 — User I/O bank 0
Контакт 113 IO_84 — User I/O bank 0
Контакт 114 VCCIB0 — I/O bank 0 supply voltage
Контакт 115 IO_85 — User I/O bank 0
Контакт 116 IO_86 — User I/O bank 0
Контакт 117 IO_87 — User I/O bank 0
Контакт 118 GND — Ground
Контакт 119 IO_88 — User I/O bank 0
Контакт 120 IO_89 — User I/O bank 0
Контакт 121 IO_90 — User I/O bank 0
Контакт 122 VCC — Core supply voltage 1.5V
Контакт 123 IO_91 — User I/O bank 0
Контакт 124 IO_92 — User I/O bank 0
Контакт 125 IO_93 — User I/O bank 0
Контакт 126 GND — Ground
Контакт 127 IO_94 — User I/O bank 0
Контакт 128 IO_95 — User I/O bank 0
Контакт 129 IO_96 — User I/O bank 0
Контакт 130 VCCIB0 — I/O bank 0 supply voltage
Контакт 131 NC — Not connected
Контакт 132 NC — Not connected
Контакт 133 NC — Not connected
Контакт 134 GND — Ground
Контакт 135 NC — Not connected
Контакт 136 NC — Not connected
Контакт 137 NC — Not connected
Контакт 138 VCC — Core supply voltage 1.5V
Контакт 139 NC — Not connected
Контакт 140 NC — Not connected
Контакт 141 NC — Not connected
Контакт 142 GND — Ground
Контакт 143 NC — Not connected
Контакт 144 NC — Not connected

Типичное применение

A3P600-FG144 подходит для 6 применениеs: Industrial Control, Automotive Electronics, Communications Infrastructure, Consumer Electronics, Medical Devices, Aerospace and Defense.

🏭

Industrial Control

The A3P600-FG144 is ideal for industrial control systems such as PLCs, motor control, and factory automation. Its flash-based architecture provides instant-on operation, eliminating boot delays critical in safety-critical applications. The 600K gates and 97 I/Os are sufficient for implementing custom logic, communication interfaces (UART, SPI, I2C), and sensor conditioning. The 1.5V core and low power consumption reduce thermal stress in sealed enclosures. With 4 I/O banks supporting various voltage standards, it can interface directly with 3.3V sensors and 5V legacy logic. The industrial temperature variant (A3P600-FG144I) extends operation to -40C to +100C, making it suitable for harsh factory environments. The non-volatile configuration ensures the design is retained even after power loss, enhancing reliability.

🚗

Automotive Electronics

In automotive applications, the A3P600-FG144 can be used for body control modules, infotainment systems, and driver assistance interfaces. Its instant-on capability is crucial for immediate response when the ignition is turned on. The 600K gates allow implementation of custom protocols like LIN or CAN bridging. The 1.5V core reduces power dissipation, important for battery-operated systems. The device's flash-based security prevents unauthorized readback, protecting intellectual property. The commercial temperature range (0C to 70C) is suitable for cabin electronics, while the industrial variant (A3P600-FG144I) covers under-hood applications. The 144-ball FBGA package is compact for space-constrained PCBs. However, for AEC-Q100 qualified parts, consider the A3P600-1FGG144I or other automotive-grade ProASIC3 variants.

🌐

Communications Infrastructure

The A3P600-FG144 is well-suited for communications equipment like base stations, routers, and switches. It provides 97 I/Os for interfacing with PHY chips, memory, and control planes. The 110,592 bits of SRAM can be used for packet buffering or FIFOs. The 231 MHz internal frequency supports high-speed data processing. The flash-based configuration allows field updates via In-System Programming, enabling remote firmware upgrades. The low power consumption is beneficial for power-over-Ethernet (PoE) devices. The 4 I/O banks support various voltage standards (LVCMOS, LVDS) for different interface requirements. The device's security features protect against bitstream cloning, crucial for network equipment. The 144-ball FBGA package is suitable for compact line cards.

📱

Consumer Electronics

In consumer electronics, the A3P600-FG144 can be used in smart home hubs, gaming peripherals, and multimedia devices. Its instant-on feature ensures immediate response when powered on, enhancing user experience. The 600K gates allow implementation of custom logic for user interfaces, sensor fusion, and connectivity. The low power consumption extends battery life in portable devices. The 1.5V core is compatible with modern low-power SoCs. The 97 I/Os can interface with displays, touch controllers, and wireless modules. The flash-based configuration eliminates the need for external configuration memory, reducing BOM cost. The commercial temperature range is sufficient for indoor consumer products. The compact FBGA package enables slim designs.

💊

Medical Devices

The A3P600-FG144 is suitable for medical devices such as patient monitors, diagnostic equipment, and portable health devices. Its instant-on capability is critical for devices that must be ready immediately. The 600K gates can implement signal processing, data logging, and communication protocols. The low power consumption is essential for battery-operated portable devices. The flash-based security protects patient data and device firmware. The 1.5V core reduces heat generation, important for enclosed medical devices. The 97 I/Os can interface with sensors, ADCs, and displays. The commercial temperature range is adequate for most medical environments. For devices requiring higher reliability, the industrial variant (A3P600-FG144I) offers extended temperature operation.

✈️

Aerospace and Defense

The A3P600-FG144 can be used in aerospace and defense applications such as avionics, satellite subsystems, and secure communications. Its flash-based architecture provides inherent security against reverse engineering, crucial for defense systems. The instant-on capability is vital for mission-critical operations. The 600K gates allow implementation of custom encryption, protocol handling, and sensor processing. The 1.5V core and low power consumption are beneficial for space-constrained and power-limited platforms. The device supports radiation-tolerant variants in the ProASIC3 family, though the standard A3P600-FG144 is not specifically rated for radiation. For high-reliability applications, consider the industrial temperature variant (A3P600-FG144I) and ensure proper screening. The 144-ball FBGA package is suitable for compact avionics modules.

What is the A3P600-FG144?
The A3P600-FG144 is a flash-based FPGA from Microchip Technology's ProASIC3 family, offering 600,000 system gates, 97 user I/Os, and 110,592 bits of SRAM in a 144-ball FBGA package. It operates from a 1.5V core supply and is built on a 130-nm flash CMOS process, providing instant-on and low-power operation.
What is the price of A3P600-FG144?
As of 2026-08-31, the A3P600-FG144 is priced at approximately $25.50 for single-unit quantities, with volume pricing dropping to around $15.60 at 1000 units. Prices vary by distributor and availability; check current stock at Mouser, DigiKey, or Arrow for the latest quotes.
Where can I buy A3P600-FG144?
The A3P600-FG144 is available from authorized distributors including Mouser Electronics, DigiKey, Arrow Electronics, and Heisener. You can also request quotes from XAIPART for competitive pricing and lead times. Ensure you purchase from authorized sources to guarantee genuine Microchip parts.
What is the lead time for A3P600-FG144?
Lead time for the A3P600-FG144 varies by distributor and current demand. Heisener lists lead time as 'To be Confirmed', while Mouser and DigiKey typically show stock availability. As of 2026-08-31, some distributors report stock of 2,304 pieces, but lead times can extend to several weeks for large orders.
Is A3P600-FG144 in stock?
As of 2026-08-31, Heisener reports in stock. Mouser and DigiKey also list the part as available, but inventory levels fluctuate. Check the distributor's website for real-time stock status and place orders early to avoid shortages.
What is the difference between A3P600-FG144 and A3P600-FG144I?
The A3P600-FG144I is the industrial temperature grade version of the A3P600-FG144, operating from -40C to +100C, while the standard A3P600-FG144 operates from 0C to 70C. Both share the same 144-ball FBGA package and pinout, making them drop-in replacements for each other in most designs, provided the temperature range meets your requirements.
What is the difference between A3P600-FG144 and A3P600-FGG144?
The A3P600-FGG144 is a lead-free (RoHS-compliant) version of the A3P600-FG144, with the 'G' indicating green/lead-free finish. Both have identical electrical specifications and pinout, but the FGG variant uses lead-free solder balls, making it suitable for RoHS-compliant manufacturing. They are drop-in replacements for each other.
When should I choose A3P600-FG144 over A3P600-FG144I?
Choose the A3P600-FG144 for commercial applications where the operating temperature stays within 0C to 70C, such as consumer electronics or office equipment. Choose the A3P600-FG144I for industrial environments with temperatures from -40C to +100C, like factory automation or outdoor equipment. The industrial version costs slightly more but ensures reliable operation in harsh conditions.
What is the best drop-in replacement for A3P600-FG144?
The best drop-in replacement for the A3P600-FG144 is the A3P600-FG144I (industrial temperature) or A3P600-FGG144 (lead-free), both from Microchip, as they share the same 144-ball FBGA package and pinout. For higher density needs, the A3P600-FGG256I offers more I/Os but requires a different PCB footprint.
Can A3P600-FG144 be replaced by A3P600-FGG144?
Yes, the A3P600-FGG144 is a direct drop-in replacement for the A3P600-FG144. Both have the same 144-ball FBGA package, pinout, and electrical specifications. The only difference is the lead-free finish on the FGG variant, which is fully compatible with RoHS-compliant assembly processes.
Where can I download the A3P600-FG144 datasheet PDF?
The A3P600-FG144 datasheet is available from Microchip's official website at https://www.microchip.com/en-us/product/A3P600. You can also find it on distributor sites like Mouser, DigiKey, and Arrow, or on aggregator sites like Alldatasheet and FindIC. The datasheet includes full specifications, pinout, and application notes.
Where can I find the A3P600-FG144 pinout?
The A3P600-FG144 pinout is detailed in the official Microchip datasheet, specifically in the 'Package Pin Assignments' section. The 144-ball FBGA package has a 1mm pitch, and the pinout diagram shows the location of all 97 user I/Os, power, ground, and configuration pins. Refer to the datasheet for the exact pin mapping.
What are the key specifications of A3P600-FG144 that engineers should know?
The A3P600-FG144 offers 600,000 system gates, 97 user I/Os, 110,592 bits of SRAM, and a maximum internal frequency of 231 MHz. It operates from a 1.5V core supply and is built on a 130-nm flash CMOS process. The device supports multiple I/O standards, has 4 I/O banks, and features flash-based non-volatile configuration for instant-on operation.
Is A3P600-FG144 the same as A3P600-FGG144?
Yes, the A3P600-FG144 and A3P600-FGG144 are functionally identical, with the same 144-ball FBGA package, pinout, and electrical specifications. The only difference is the solder finish: the FGG variant is lead-free (RoHS-compliant), while the FG variant may contain lead. They are drop-in replacements for each other.
What is the best Microchip equivalent for A3P600-FG144?
The best Microchip equivalent for A3P600-FG144 is the A3P600-FG144I, which offers the same 600K gates and 97 I/Os but with an extended industrial temperature range (-40C to +100C). For a lead-free option, the A3P600-FGG144 is also a direct equivalent. Both are pin-compatible drop-in replacements.

Справочные инженерные данные для A3P600-FG144 — сравнение, рекомендации по проектированию и информация о соответствии.

Руководство по выбору

Choose the A3P600-FG144 when you need a mid-density FPGA with instant-on, low power, and secure configuration in a compact 144-ball FBGA package. It is ideal for industrial, automotive, and consumer applications where the commercial temperature range (0C to 70C) suffices. If you require extended temperature operation (-40C to +100C), select the A3P600-FG144I. For RoHS-compliant assembly, choose the A3P600-FGG144 (lead-free). If you need higher performance, the A3P600-1FGG144I offers a faster speed grade (350 MHz) but at a higher cost. For cost-sensitive designs with lower speed requirements, the A3P600-2FGG144 provides a slower speed grade. All alternatives are pin-compatible drop-in replacements, allowing PCB layout reuse. For higher density or more I/Os, consider the A3P600-FGG256 or A3P600-FGG484, but these require a different PCB footprint.

Сравнение с аналогами

Параметр Этот товар A3P600-FG144I A3P600-FGG144 A3P600-FGG144I A3P600-1FGG144I A3P600-2FGG144 A3P600-2FGG144I
Package 144-LBGA (FBGA-144) 144-LBGA (FBGA-144) 144-LBGA (FBGA-144) 144-LBGA (FBGA-144) 144-LBGA (FBGA-144) 144-LBGA (FBGA-144) 144-LBGA (FBGA-144)
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
System Gates 600000 600000 600000 600000 600000 600000 600000
User I/Os 97 97 97 97 97 97 97
SRAM Bits 110592 110592 110592 110592 110592 110592 110592
Maximum Internal Frequency 231 MHz 231 MHz 231 MHz 231 MHz 350 MHz 231 MHz 231 MHz
Operating Temperature 0 to 70 C -40 to 100 C 0 to 70 C -40 to 100 C -40 to 100 C 0 to 70 C -40 to 100 C
Speed Grade Standard Standard Standard Standard -1 (Fastest) -2 (Slower) -2 (Slower)

Ключевые отличия

  • Flash-based non-volatile configuration (против SRAM-based FPGAs (e.g., Xilinx Spartan-6))
  • Low power consumption (против SRAM-based FPGAs)
  • Inherent security (против SRAM-based FPGAs)

Заметки по проектированию

The A3P600-FG144 requires a 1.5V core supply (VCC) and separate I/O bank supplies (VCCIBx) for each of the 4 banks. Decouple each supply pin with a 0.1uF ceramic capacitor placed as close to the pin as possible, and add a 10uF bulk capacitor per bank. The flash-based architecture has low static power, but dynamic power scales with switching activity. Estimated: For a 50% toggle rate at 100 MHz, core power can be estimated using the formula P = C * V^2 * f, where C is the total switched capacitance (typically 10-20 nF for this device). Ensure the power supply can handle peak inrush current during configuration.

The 144-ball FBGA package with 1mm pitch requires careful PCB layout. Use a 4-layer or more stack-up with solid ground and power planes. Route I/O signals with controlled impedance if using high-speed interfaces like LVDS. Place decoupling capacitors on the bottom side directly under the FPGA to minimize loop inductance. Follow the manufacturer's layout guidelines in the ProASIC3 PCB Design Guide. Ensure all VCC and GND balls are connected to their respective planes with multiple vias to reduce inductance.

A common mistake is neglecting the I/O bank supply voltages. Each bank must be powered to the appropriate voltage for the I/O standard used. For example, LVCMOS33 requires VCCIBx = 3.3V, while LVCMOS25 requires 2.5V. Mixing incompatible standards in the same bank can cause damage. Also, ensure the core supply (VCC) is within 1.5V +/- 5% to avoid unreliable operation. The flash-based configuration is non-volatile, but during programming, ensure the programming voltage is applied correctly to avoid corrupting the device.

Информация о соответствии

RoHS
Compliant
REACH
Unknown
AEC-Q100
Not Applicable
Без свинца
Yes
Без галогенов
Unknown
Конфликтные минералы
Unknown

RoHS compliance inferred from the availability of lead-free (FGG) variants. AEC-Q100 not applicable as this is not an automotive-qualified part.

Данные проверены: 2026-08-31 — данные проверены и курируются командой компонентной инженерии XAIPART

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Связанные компоненты & термины

Microchip Technology A3P600-FG144 A3P600-FG144I A3P600-FGG144 A3P600-FGG144I A3P600-1FGG144I A3P600-2FGG144 A3P600-2FGG144I FPGA Field Programmable Gate Array ProASIC3 Flash-based CMOS FBGA-144 RoHS
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