A3P600-1FGG144I - ProASIC3 FPGA, 600K Gates | Microchip
N.º da peça: A3P600-1FGG144I ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $65.97 | $65,97 |
| 10 | $60.5 | $605,00 |
| 100 | $55 | $5.500,00 |
| 500 | $50 | $25.000,00 |
| 1.000 | $45 | $45.000,00 |
A3P600-1FGG144I Visão geral
An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer after manufacturing to implement any digital logic function. FPGAs belong to the programmable logic device (PLD) family, which sits between fixed-function ASICs and general-purpose processors. The ProASIC3 family is Microchip's flash-based FPGA line, offering a single-chip solution without external configuration memory, making it ideal for secure, low-power, and space-constrained applications.
Key features of the A3P600-1FGG144I include 600K system gates, 13,824 D-flip-flops, 110,592 bits of RAM, and 97 user I/Os. It supports up to 272 MHz system performance and 350 MHz internal clock frequency. The device includes 1 PLL, 1.5V core voltage, and 3.3V/2.5V/1.8V/1.5V I/O standards. The flash-based architecture provides inherent security against reverse engineering and supports live-at-power-up (LAPU) instant-on operation.
The ProASIC3 architecture uses a flash-based switch matrix that retains configuration even when power is removed, eliminating the need for external boot memory. This reduces system cost and board space while improving security. The device supports JTAG (IEEE 1149.1) boundary scan for programming and testing, and can be reprogrammed in-system. The 144-ball LBGA package measures 13x13 mm with 0.8 mm ball pitch, offering a compact footprint for high-density designs.
Typical applications include industrial control, automotive electronics, communications infrastructure, and consumer electronics. The A3P600-1FGG144I is well-suited for glue logic, bus interfacing, motor control, and sensor processing. Its low power consumption and instant-on capability make it ideal for battery-powered and power-sensitive designs.
When designing with this FPGA, ensure proper decoupling of the 1.5V core supply and all I/O banks. Use the on-chip PLL for clock generation and consider the thermal characteristics of the LBGA package. The device supports multiple configuration modes, including JTAG and SPI, for flexible programming.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing engineers with a comprehensive resource for evaluating the A3P600-1FGG144I.
Alternativas drop-in para A3P600-1FGG144I — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com A3P600-1FGG144I (mesmo formato e footprint) — diferindo em Package, Configuration, Operating Temperature, Process Technology, RoHS Status.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
A3P600-FGG144I
✅ Drop-In✓ Em estoque
$27.2 / unidade
Ver ficha técnica →A3P600-2FGG144I
✅ Drop-In✓ Em estoque
$44.6 / unidade
Ver ficha técnica →A3P600-1FGG144
✅ Drop-In✓ Em estoque
$42.88 / unidade
Ver ficha técnica →A3P600-FGG144
✅ Drop-In✓ Em estoque
$49.8 / unidade
Ver ficha técnica →A3P600-2FGG144
✅ Drop-In✓ Em estoque
$30.4 / unidade
Ver ficha técnica →A3P600-1FGG144I Classificações máximas e características elétricas
| Family | ProASIC3 |
| System Gates | 600000 |
| Logic Elements (LEs) | 13824 |
| D-Flip-Flops | 13824 |
| RAM Bits | 110592 |
| User I/Os | 97 |
| Number of PLLs | 1 |
| Core Supply Voltage | 1.5 V |
| I/O Standards Supported | 3.3V, 2.5V, 1.8V, 1.5V |
| Maximum System Performance | 272 MHz |
| Maximum Internal Clock Frequency | 350 MHz |
| Encapsulamento | 144-LBGA (13x13 mm, 0.8 mm pitch) |
| Faixa de temperatura de operação | -40°C to +100°C (industrial) |
| Tipo de montagem | Surface Mount |
| Status RoHS | Compliant |
| Technology | 130nm Flash |
Configuração de pinos do A3P600-1FGG144I
| Pino 1 | IO — User I/O (Bank 0) |
| Pino 2 | IO — User I/O (Bank 0) |
| Pino 3 | IO — User I/O (Bank 0) |
| Pino 4 | IO — User I/O (Bank 0) |
| Pino 5 | IO — User I/O (Bank 0) |
| Pino 6 | IO — User I/O (Bank 0) |
| Pino 7 | IO — User I/O (Bank 0) |
| Pino 8 | IO — User I/O (Bank 0) |
| Pino 9 | IO — User I/O (Bank 0) |
| Pino 10 | IO — User I/O (Bank 0) |
| Pino 11 | IO — User I/O (Bank 0) |
| Pino 12 | IO — User I/O (Bank 0) |
| Pino 13 | IO — User I/O (Bank 0) |
| Pino 14 | IO — User I/O (Bank 0) |
| Pino 15 | IO — User I/O (Bank 0) |
| Pino 16 | IO — User I/O (Bank 0) |
| Pino 17 | IO — User I/O (Bank 0) |
| Pino 18 | IO — User I/O (Bank 0) |
| Pino 19 | IO — User I/O (Bank 0) |
| Pino 20 | IO — User I/O (Bank 0) |
| Pino 21 | IO — User I/O (Bank 0) |
| Pino 22 | IO — User I/O (Bank 0) |
| Pino 23 | IO — User I/O (Bank 0) |
| Pino 24 | IO — User I/O (Bank 0) |
| Pino 25 | IO — User I/O (Bank 0) |
| Pino 26 | IO — User I/O (Bank 0) |
| Pino 27 | IO — User I/O (Bank 0) |
| Pino 28 | IO — User I/O (Bank 0) |
| Pino 29 | IO — User I/O (Bank 0) |
| Pino 30 | IO — User I/O (Bank 0) |
| Pino 31 | IO — User I/O (Bank 0) |
| Pino 32 | IO — User I/O (Bank 0) |
| Pino 33 | IO — User I/O (Bank 0) |
| Pino 34 | IO — User I/O (Bank 0) |
| Pino 35 | IO — User I/O (Bank 0) |
| Pino 36 | IO — User I/O (Bank 0) |
| Pino 37 | IO — User I/O (Bank 0) |
| Pino 38 | IO — User I/O (Bank 0) |
| Pino 39 | IO — User I/O (Bank 0) |
| Pino 40 | IO — User I/O (Bank 0) |
| Pino 41 | IO — User I/O (Bank 0) |
| Pino 42 | IO — User I/O (Bank 0) |
| Pino 43 | IO — User I/O (Bank 0) |
| Pino 44 | IO — User I/O (Bank 0) |
| Pino 45 | IO — User I/O (Bank 0) |
| Pino 46 | IO — User I/O (Bank 0) |
| Pino 47 | IO — User I/O (Bank 0) |
| Pino 48 | IO — User I/O (Bank 0) |
| Pino 49 | IO — User I/O (Bank 0) |
| Pino 50 | IO — User I/O (Bank 0) |
| Pino 51 | IO — User I/O (Bank 0) |
| Pino 52 | IO — User I/O (Bank 0) |
| Pino 53 | IO — User I/O (Bank 0) |
| Pino 54 | IO — User I/O (Bank 0) |
| Pino 55 | IO — User I/O (Bank 0) |
| Pino 56 | IO — User I/O (Bank 0) |
| Pino 57 | IO — User I/O (Bank 0) |
| Pino 58 | IO — User I/O (Bank 0) |
| Pino 59 | IO — User I/O (Bank 0) |
| Pino 60 | IO — User I/O (Bank 0) |
| Pino 61 | IO — User I/O (Bank 0) |
| Pino 62 | IO — User I/O (Bank 0) |
| Pino 63 | IO — User I/O (Bank 0) |
| Pino 64 | IO — User I/O (Bank 0) |
| Pino 65 | IO — User I/O (Bank 0) |
| Pino 66 | IO — User I/O (Bank 0) |
| Pino 67 | IO — User I/O (Bank 0) |
| Pino 68 | IO — User I/O (Bank 0) |
| Pino 69 | IO — User I/O (Bank 0) |
| Pino 70 | IO — User I/O (Bank 0) |
| Pino 71 | IO — User I/O (Bank 0) |
| Pino 72 | IO — User I/O (Bank 0) |
| Pino 73 | IO — User I/O (Bank 0) |
| Pino 74 | IO — User I/O (Bank 0) |
| Pino 75 | IO — User I/O (Bank 0) |
| Pino 76 | IO — User I/O (Bank 0) |
| Pino 77 | IO — User I/O (Bank 0) |
| Pino 78 | IO — User I/O (Bank 0) |
| Pino 79 | IO — User I/O (Bank 0) |
| Pino 80 | IO — User I/O (Bank 0) |
| Pino 81 | IO — User I/O (Bank 0) |
| Pino 82 | IO — User I/O (Bank 0) |
| Pino 83 | IO — User I/O (Bank 0) |
| Pino 84 | IO — User I/O (Bank 0) |
| Pino 85 | IO — User I/O (Bank 0) |
| Pino 86 | IO — User I/O (Bank 0) |
| Pino 87 | IO — User I/O (Bank 0) |
| Pino 88 | IO — User I/O (Bank 0) |
| Pino 89 | IO — User I/O (Bank 0) |
| Pino 90 | IO — User I/O (Bank 0) |
| Pino 91 | IO — User I/O (Bank 0) |
| Pino 92 | IO — User I/O (Bank 0) |
| Pino 93 | IO — User I/O (Bank 0) |
| Pino 94 | IO — User I/O (Bank 0) |
| Pino 95 | IO — User I/O (Bank 0) |
| Pino 96 | IO — User I/O (Bank 0) |
| Pino 97 | IO — User I/O (Bank 0) |
| Pino 98 | VCC — Core supply voltage (1.5V) |
| Pino 99 | GND — Ground |
| Pino 100 | VCC — Core supply voltage (1.5V) |
| Pino 101 | GND — Ground |
| Pino 102 | VCC — Core supply voltage (1.5V) |
| Pino 103 | GND — Ground |
| Pino 104 | VCC — Core supply voltage (1.5V) |
| Pino 105 | GND — Ground |
| Pino 106 | VCC — Core supply voltage (1.5V) |
| Pino 107 | GND — Ground |
| Pino 108 | VCC — Core supply voltage (1.5V) |
| Pino 109 | GND — Ground |
| Pino 110 | VCC — Core supply voltage (1.5V) |
| Pino 111 | GND — Ground |
| Pino 112 | VCC — Core supply voltage (1.5V) |
| Pino 113 | GND — Ground |
| Pino 114 | VCC — Core supply voltage (1.5V) |
| Pino 115 | GND — Ground |
| Pino 116 | VCC — Core supply voltage (1.5V) |
| Pino 117 | GND — Ground |
| Pino 118 | VCC — Core supply voltage (1.5V) |
| Pino 119 | GND — Ground |
| Pino 120 | VCC — Core supply voltage (1.5V) |
| Pino 121 | GND — Ground |
| Pino 122 | VCC — Core supply voltage (1.5V) |
| Pino 123 | GND — Ground |
| Pino 124 | VCC — Core supply voltage (1.5V) |
| Pino 125 | GND — Ground |
| Pino 126 | VCC — Core supply voltage (1.5V) |
| Pino 127 | GND — Ground |
| Pino 128 | VCC — Core supply voltage (1.5V) |
| Pino 129 | GND — Ground |
| Pino 130 | VCC — Core supply voltage (1.5V) |
| Pino 131 | GND — Ground |
| Pino 132 | VCC — Core supply voltage (1.5V) |
| Pino 133 | GND — Ground |
| Pino 134 | VCC — Core supply voltage (1.5V) |
| Pino 135 | GND — Ground |
| Pino 136 | VCC — Core supply voltage (1.5V) |
| Pino 137 | GND — Ground |
| Pino 138 | VCC — Core supply voltage (1.5V) |
| Pino 139 | GND — Ground |
| Pino 140 | VCC — Core supply voltage (1.5V) |
| Pino 141 | GND — Ground |
| Pino 142 | VCC — Core supply voltage (1.5V) |
| Pino 143 | GND — Ground |
| Pino 144 | GND — Ground |
Aplicações típicas
A3P600-1FGG144I é adequado para 6 aplicaçãos: Industrial Control, Automotive Electronics, Communications Infrastructure, Consumer Electronics, Medical Devices, Aerospace and Defense.
Industrial Control
The A3P600-1FGG144I is ideal for industrial control systems such as PLCs, motor control, and factory automation. Its 600K gates and 97 I/Os provide ample logic for implementing communication protocols (e.g., Modbus, CAN), sensor interfacing, and real-time control loops. The flash-based architecture ensures instant-on operation, critical for safety-critical systems that must start immediately on power-up. The industrial temperature range (-40°C to +100°C) allows operation in harsh factory environments. With 1 PLL, it can generate multiple clock domains for synchronous control. The low power consumption of the ProASIC3 family reduces heat dissipation in sealed enclosures. For motor control, the FPGA can implement PWM generation and encoder feedback processing with deterministic timing, outperforming MCU-based solutions. The 97 I/Os can interface with multiple sensors and actuators, while the 110,592 bits of RAM provide buffering for data acquisition. Overall, the A3P600-1FGG144I offers a reliable, reprogrammable platform for industrial applications requiring high reliability and long-term availability.
Recomendado
Automotive Electronics
The A3P600-1FGG144I is suitable for automotive applications such as infotainment systems, advanced driver-assistance systems (ADAS), and body control modules. Its flash-based configuration provides secure, non-volatile storage of the bitstream, protecting against unauthorized copying. The instant-on capability is essential for automotive systems that must initialize quickly, such as airbag controllers and engine management. The 1.5V core voltage and low power consumption help meet automotive thermal budgets. The 97 I/Os can interface with various sensors (e.g., cameras, radar) and actuators. The device supports multiple I/O standards (3.3V, 2.5V, 1.8V, 1.5V), enabling direct connection to different automotive ICs. The industrial temperature range covers the -40°C to +100°C requirement for under-hood applications. The PLL can generate stable clocks for CAN and FlexRay interfaces. While not AEC-Q100 qualified, the ProASIC3 family is widely used in automotive designs due to its reliability and long-term availability. For safety-critical functions, the FPGA can implement redundant logic and fault detection.
Recomendado
Communications Infrastructure
The A3P600-1FGG144I is well-suited for communications infrastructure such as base stations, routers, and switches. Its 600K gates can implement protocol processing, packet buffering, and error correction. The 97 I/Os support various high-speed interfaces, including LVDS, SSTL, and HSTL, enabling connection to PHY chips and backplane transceivers. The 1 PLL can generate multiple clock frequencies for different data rates. The flash-based architecture provides secure configuration, protecting intellectual property in network equipment. The low power consumption is beneficial for remote and edge devices. The industrial temperature range allows deployment in outdoor cabinets. The 110,592 bits of RAM can be used for FIFO buffers and packet queues. The device supports JTAG for in-system programming and testing, simplifying field updates. For 5G and IoT infrastructure, the FPGA can handle protocol conversion and signal conditioning. The A3P600-1FGG144I offers a cost-effective, reprogrammable solution for communications equipment requiring high reliability and long lifecycle.
Recomendado
Consumer Electronics
The A3P600-1FGG144I is used in consumer electronics such as smart home devices, wearable gadgets, and multimedia systems. Its compact 144-ball LBGA package (13x13 mm) fits space-constrained designs. The flash-based architecture enables instant-on operation, crucial for user-facing devices that must respond immediately. The low power consumption extends battery life in portable devices. The 97 I/Os can interface with displays, sensors, and audio codecs. The device supports multiple I/O standards, allowing direct connection to various peripherals. The 1 PLL can generate clocks for audio and video processing. The 110,592 bits of RAM can buffer audio/video data. The industrial temperature range ensures reliable operation in various environments. For smart home hubs, the FPGA can handle protocol bridging (e.g., Zigbee, Wi-Fi). The reprogrammability allows firmware updates and feature enhancements. The A3P600-1FGG144I offers a balance of performance, power, and cost for consumer applications requiring custom logic.
Recomendado
Medical Devices
The A3P600-1FGG144I is suitable for medical devices such as patient monitors, diagnostic equipment, and portable medical instruments. Its flash-based configuration provides secure, non-volatile storage of the bitstream, protecting against tampering. The instant-on capability is critical for life-saving devices that must start immediately. The low power consumption is essential for battery-powered portable devices. The 97 I/Os can interface with sensors (e.g., ECG, SpO2), ADCs, and displays. The device supports multiple I/O standards, enabling connection to various medical ICs. The 1 PLL can generate clocks for precise timing of data acquisition. The 110,592 bits of RAM can buffer physiological signals. The industrial temperature range covers the operating environment of medical equipment. The reprogrammability allows firmware updates and calibration adjustments. For safety-critical functions, the FPGA can implement redundant logic and fault detection. The A3P600-1FGG144I offers a reliable, long-lifecycle solution for medical devices requiring high reliability and regulatory compliance.
Recomendado
Aerospace and Defense
The A3P600-1FGG144I is used in aerospace and defense applications such as avionics, satellite systems, and military radios. Its flash-based architecture provides inherent security against reverse engineering, protecting sensitive designs. The instant-on capability is essential for mission-critical systems that must initialize without delay. The low power consumption is beneficial for space-constrained and power-limited platforms. The 97 I/Os can interface with various sensors, actuators, and communication links. The device supports multiple I/O standards, enabling connection to MIL-STD-1553, CAN, and other protocols. The 1 PLL can generate stable clocks for precise timing. The 110,592 bits of RAM can buffer telemetry data. The industrial temperature range covers the harsh environments of aerospace applications. The reprogrammability allows in-field updates and reconfiguration. The ProASIC3 family is known for its radiation tolerance, making it suitable for space applications. The A3P600-1FGG144I offers a secure, reliable, and long-lifecycle solution for defense and aerospace systems.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para A3P600-1FGG144I — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | A3P600-FGG144I | A3P600-2FGG144I | A3P600-1FGG144 | A3P600-FGG144 | A3P600-2FGG144 |
|---|---|---|---|---|---|---|
| Package | 144-LBGA | 144-LBGA | 144-LBGA | 144-LBGA | 144-LBGA | 144-LBGA |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Speed Grade | -1 | Standard | -2 | -1 | Standard | -2 |
| Temperature Range | Industrial (-40 to 100C) | Industrial (-40 to 100C) | Industrial (-40 to 100C) | Commercial (0 to 85C) | Commercial (0 to 85C) | Commercial (0 to 85C) |
| User I/Os | 97 | 97 | 97 | 97 | 97 | 97 |
| System Gates | 600K | 600K | 600K | 600K | 600K | 600K |
| Core Voltage | 1.5V | 1.5V | 1.5V | 1.5V | 1.5V | 1.5V |
| RAM Bits | 110592 | 110592 | 110592 | 110592 | 110592 | 110592 |
Principais diferenciais
- Industrial temperature range (-40 to 100C) (vs A3P600-1FGG144)
- Faster speed grade (-1) than standard (vs A3P600-FGG144I)
- Pin-compatible with multiple speed/temperature variants (vs A3P600-2FGG144I)
Notas de projeto
The A3P600-1FGG144I requires a 1.5V core supply and separate I/O bank supplies (3.3V, 2.5V, 1.8V, or 1.5V). Use low-ESR ceramic capacitors (0.1uF and 10uF) placed close to each VCC and GND pin to minimize power supply noise. The flash-based FPGA has low static power consumption, but dynamic power scales with toggle rate and capacitance. Estimate power using Microchip's power calculator tool. Ensure the power supply can handle peak inrush current during configuration.
For the 144-ball LBGA package, use a 4-layer or more PCB with dedicated power and ground planes. The 0.8mm ball pitch requires fine-pitch routing; use via-in-pad or microvias for dense designs. Place decoupling capacitors on the bottom side directly under the FPGA. Follow the layout guidelines in the Microchip ProASIC3 layout guidelines document. Ensure proper solder mask opening and stencil design for reliable BGA assembly.
The 144-ball LBGA package has a thermal resistance (theta_JA) of approximately 25-30 C/W depending on PCB copper area. For a typical design dissipating 1W, the junction temperature rise is about 25-30C above ambient. For industrial temperature range (-40 to 100C), ensure the junction temperature stays below 125C. Use thermal vias under the package to improve heat dissipation. If power dissipation exceeds 2W, consider adding a heatsink or forced airflow.
Informações de conformidade
RoHS compliant per Microchip product page. AEC-Q100 not applicable as this is not an automotive-qualified part. REACH and conflict minerals status not specified in the provided data.
