CYUSB3013-BZXC - EZ-USB FX3 USB 3.2 Gen 1 Controller | Infineon
Артикул: CYUSB3013-BZXC ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $35.2 | $352,00 |
| 100 | $31.85 | $3.185,00 |
| 500 | $28.1 | $14.050,00 |
| 1.000 | $24.75 | $24.750,00 |
CYUSB3013-BZXC Обзор
A USB 3.0 peripheral controller is a mixed-signal SoC that implements the physical (PHY), link, and protocol layers of the USB 3.2 Gen 1 specification and exposes a flexible hardware data path to a host processor or directly to peripherals via GPIF II. Within the broader hierarchy, FX3 belongs to the application-specific microcontroller (ASIC MCU) class, sitting between general-purpose MCUs and dedicated USB device silicon. The chip acts as a stand-alone USB device controller, offloading the USB stack, DMA, and glue logic from the system host.
Key differentiating features of the CYUSB3013-BZXC include USB 3.1 Gen 1 and USB 2.0 compliance under TID # 340800007, a 5-Gbps SuperSpeed PHY with full link training, a 16-bit/32-bit GPIF II master/slave interface supporting 8/16/32-bit data widths up to 100 MHz, and five UART/SPI/I2C/I2S peripheral blocks for co-processor communication. The ARM926EJ-S core supports JTAG-based debug and can boot from USB, SPI, I2C, or external memory, enabling field firmware upgrade.
Typical end-use scenarios for the CYUSB3013-BZXC include USB 3.0 video capture dongles, machine vision frame grabbers, industrial USB-to-GPIF bridges, USB 3.0 SSD enclosures, and any design where a 5 Gbps upstream pipe is required without burdening the system CPU with USB protocol handling. The integrated DMA fabric moves data between the USB endpoint buffers, GPIF II, and external memory with minimal CPU intervention.
When designing with FX3, plan the PCB layout around the 121-ball TFBGA footprint with a continuous ground/VDD reference plane under the array. Decoupling must include bulk 4.7 uF plus 0.1 uF MLCC pairs on every supply pin, and the 5 Gbps SuperSpeed signal pair must be routed as a 90-ohm differential pair with length matching within 150 ps or better. Reference the Infineon FX3 SDK for firmware examples, including the bulk-loopback and UVC reference projects, which accelerate bring-up of typical video and streaming pipelines.
Аналоги без доработки для CYUSB3013-BZXC — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
CYUSB3035-BZXI
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
CYUSB3014-BZXC
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
CYUSB3023-BZXC
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
CYUSB3013-BZXI
✅ Прямая замена ⚠️ Характеристики не проверены📋 Справочный аналог (нет в каталоге)
CYUSB3035-BZXC
✅ Прямая замена ⚠️ Характеристики не проверены📋 Справочный аналог (нет в каталоге)
CYUSB3023-BZXI
✅ Прямая замена ⚠️ Характеристики не проверены📋 Справочный аналог (нет в каталоге)
CYUSB3013-BZXC Максимальные параметры и электрические характеристики
| USB Standard | USB 3.1 Gen 1 / USB 2.0 (TID # 340800007) |
| USB PHY Speed | 5 Gbps SuperSpeed |
| Processor Core | ARM926EJ-S |
| Core Frequency | up to 200 MHz |
| On-chip SRAM | 512 KB |
| External Memory Bus | 16-bit, up to 200 MHz |
| GPIF II Width | 8/16/32-bit selectable |
| GPIF II Frequency | up to 100 MHz |
| Корпус | 121-TFBGA, 10x10 mm |
| Supply Voltage (Core) | 1.2 V |
| Supply Voltage (I/O) | 1.8 V to 3.3 V |
| Рабочая температура | 0 C to +70 C (commercial) |
| Boot Sources | USB, SPI, I2C, parallel flash |
| Тип монтажа | Surface Mount |
| Статус RoHS | Compliant |
Конфигурация выводов CYUSB3013-BZXC
| Контакт A1 | GND — Common ground reference |
| Контакт A2 | USB_DP — USB 2.0 D+ data line |
| Контакт A3 | USB_DM — USB 2.0 D- data line |
| Контакт A4 | VDD_IO — I/O supply 1.8 V to 3.3 V |
| Контакт B1 | GND — Common ground reference |
| Контакт B2 | VDD_PHY — USB PHY analog supply |
| Контакт B3 | USB3_TX_DP — USB 3.0 SuperSpeed transmit D+ |
| Контакт B4 | USB3_TX_DM — USB 3.0 SuperSpeed transmit D- |
| Контакт C1 | VDD_CORE — Core supply 1.2 V |
| Контакт C2 | USB3_RX_DP — USB 3.0 SuperSpeed receive D+ |
| Контакт C3 | USB3_RX_DM — USB 3.0 SuperSpeed receive D- |
| Контакт C4 | RESET — Active-low chip reset |
| Контакт D1 | GPIF_DQ0 — GPIF II data bit 0 |
| Контакт D2 | GPIF_DQ8 — GPIF II data bit 8 |
| Контакт D3 | GPIF_CTL0 — GPIF II control bit 0 |
| Контакт D4 | GPIF_CTL4 — GPIF II control bit 4 |
| Контакт E1 | GPIF_DQ1 — GPIF II data bit 1 |
| Контакт E2 | GPIF_DQ9 — GPIF II data bit 9 |
| Контакт E3 | GPIF_CTL1 — GPIF II control bit 1 |
| Контакт E4 | GPIF_CTL5 — GPIF II control bit 5 |
| Контакт F1 | GPIF_DQ2 — GPIF II data bit 2 |
| Контакт F2 | GPIF_DQ10 — GPIF II data bit 10 |
| Контакт F3 | GPIF_CTL2 — GPIF II control bit 2 |
| Контакт F4 | GPIF_CTL6 — GPIF II control bit 6 |
| Контакт G1 | GPIF_DQ3 — GPIF II data bit 3 |
| Контакт G2 | GPIF_DQ11 — GPIF II data bit 11 |
| Контакт G3 | GPIF_CTL3 — GPIF II control bit 3 |
| Контакт G4 | GPIF_CTL7 — GPIF II control bit 7 |
| Контакт H1 | GPIF_DQ4 — GPIF II data bit 4 |
| Контакт H2 | GPIF_DQ12 — GPIF II data bit 12 |
| Контакт H3 | GPIF_PCLK — GPIF II peripheral clock |
| Контакт H4 | GND — Common ground reference |
| Контакт J1 | GPIF_DQ5 — GPIF II data bit 5 |
| Контакт J2 | GPIF_DQ13 — GPIF II data bit 13 |
| Контакт J3 | GPIF_PRDY — GPIF II peripheral ready |
| Контакт J4 | VDD_IO — I/O supply 1.8 V to 3.3 V |
| Контакт K1 | GPIF_DQ6 — GPIF II data bit 6 |
| Контакт K2 | GPIF_DQ14 — GPIF II data bit 14 |
| Контакт K3 | UART_CTS — UART clear-to-send (manufacturing test) |
| Контакт K4 | UART_RTS — UART request-to-send (manufacturing test) |
| Контакт L1 | GPIF_DQ7 — GPIF II data bit 7 |
| Контакт L2 | GPIF_DQ15 — GPIF II data bit 15 |
| Контакт L3 | I2C_SCL — I2C clock for boot / peripherals |
| Контакт L4 | I2C_SDA — I2C data for boot / peripherals |
| Контакт M1 | VDD_CORE — Core supply 1.2 V |
| Контакт M2 | SPI_SCK — SPI clock for boot flash |
| Контакт M3 | SPI_SSN — SPI slave select for boot flash |
| Контакт M4 | SPI_MISO — SPI master-in slave-out |
| Контакт N1 | GND — Common ground reference |
| Контакт N2 | SPI_MOSI — SPI master-out slave-in |
| Контакт N3 | JTAG_TCK — JTAG test clock |
| Контакт N4 | JTAG_TMS — JTAG test mode select |
| Контакт P1 | VDD_IO — I/O supply 1.8 V to 3.3 V |
| Контакт P2 | JTAG_TDI — JTAG test data in |
| Контакт P3 | JTAG_TDO — JTAG test data out |
| Контакт P4 | JTAG_TRST — JTAG test reset (active low) |
| Контакт R1 | GND — Common ground reference |
| Контакт R2 | FSLC[0] — Boot mode selection bit 0 |
| Контакт R3 | FSLC[1] — Boot mode selection bit 1 |
| Контакт R4 | FSLC[2] — Boot mode selection bit 2 |
| Контакт T1 | GND — Common ground reference |
| Контакт T2 | PMODE[0] — USB 3.0/2.0 mode control bit 0 |
| Контакт T3 | PMODE[1] — USB 3.0/2.0 mode control bit 1 |
| Контакт T4 | PMODE[2] — USB 3.0/2.0 mode control bit 2 |
| Контакт U1 | VDD_CORE — Core supply 1.2 V |
| Контакт U2 | GND — Common ground reference |
| Контакт U3 | VBUS — USB VBUS detect input |
| Контакт U4 | VDD_IO — I/O supply 1.8 V to 3.3 V |
Типичное применение
CYUSB3013-BZXC подходит для 6 применениеs: USB 3.0 Video Capture Dongle, Machine Vision Frame Grabber, USB 3.0 SSD Enclosure, USB to GPIF II Bridge, Industrial USB Test and Measurement Probe, USB 3.0 Medical Imaging Capture.
USB 3.0 Video Capture Dongle
The CYUSB3013-BZXC fits USB 3.0 video capture dongles because its 5 Gbps SuperSpeed PHY and on-chip DMA fabric sustain uncompressed 1080p60 streaming without host CPU load. The GPIF II interface accepts an external HDMI receiver or MIPI-to-parallel bridge, then transfers pixel data over USB bulk endpoints at 3-4 Gbps. The integrated ARM926EJ-S handles USB enumeration and UVC class requests while the DMA engine streams pixels to the host. PC drops into a UVC firmware example from the Infineon FX3 SDK to accelerate bring-up; power dissipation is roughly 0.6 W at full SuperSpeed streaming, manageable without heatsinking at the 121-TFBGA 10x10 mm footprint.
Рекомендуется
Machine Vision Frame Grabber
The CYUSB3013-BZXC suits machine vision frame grabbers because its GPIF II master interface supports 32-bit parallel image sensors at 100 MHz, yielding 400 MB/s of sensor data. PC the 16-bit external memory bus buffers intermediate frames; the on-chip DMA engine then streams processed frames over USB 3.0 to a host PC for OpenCV or AI inference. PC the 200 MHz ARM926EJ-S offloads image pre-processing such as color-space conversion. According to the FX3 datasheet, the GPIF II Designer tool exports state-machine firmware for CameraLink-style sensors. The 121-TFBGA package fits inside a USB3 Vision-compliant housing with adequate thermal relief at typical 1-2 W dissipation.
Рекомендуется
USB 3.0 SSD Enclosure
The CYUSB3013-BZXC fits USB 3.0 SSD enclosures because its 5 Gbps USB pipe saturates SATA III SSDs without bottlenecking. The GPIF II master interface connects to a SATA-to-parallel bridge or directly to a NAND controller with 16-bit/32-bit data widths. PC the integrated ARM926EJ-S handles USB Mass Storage class requests and SCSI command translation; the DMA engine moves blocks between USB endpoints and the SATA controller at line-rate. PC the 512 KB on-chip SRAM holds descriptor tables plus short command queues. According to the FX3 SDK, the USB-SATA reference design reaches 380 MB/s read throughput over UASP. The 1.2 V core / 1.8 V-3.3 V I/O supplies simplify shared-rail designs with SATA bridge ICs.
Рекомендуется
USB to GPIF II Bridge
The CYUSB3013-BZXC is the canonical solution for a USB-to-GPIF II bridge because the GPIF II hardware waveform generator is on-die, eliminating the need for an external FPGA. PC designers describe the timing diagram once in the GPIF II Designer tool, and the chip replays it deterministically against any 8/16/32-bit peripheral. PC the on-chip DMA engine pumps bulk data at 3.2 GB/s sustained from the peripheral to the USB host. According to the Infineon hardware manual, common bridge targets are ADC/DAC front-ends, custom sensors, and FPGA data sinks. The 121-TFBGA package plus external 16-bit SRAM gives a compact, low-cost bridge solution.
Рекомендуется
Industrial USB Test and Measurement Probe
The CYUSB3013-BZXC fits industrial USB test probes because its ARM926EJ-S can post-process measurements on-chip while the GPIF II streams raw samples from the ADC. PC 200 MHz ARM926EJ-S handles FFT, averaging, and protocol decoding; the 16-bit external memory bus holds capture buffers; the 512 KB on-chip SRAM holds descriptor tables. PC the USB Test & Measurement Class (USBTMC) firmware from the FX3 SDK turns the device into a SCPI-compatible instrument. According to the FX3 datasheet, sustained 4 Gbps bulk streaming works well for 12-bit ADC sampling at 200 MSPS. Industrial temp variant CYUSB3035-BZXI is recommended for -40C to +85C deployment.
Рекомендуется
USB 3.0 Medical Imaging Capture
The CYUSB3013-BZXC suits USB 3.0 medical imaging capture because it sustains 5 Gbps uncompressed streams from ultrasound front-ends and endoscopes. PC the on-chip DMA engine transfers pixel data from the GPIF II port to USB bulk endpoints at line-rate, with zero CPU intervention, reducing latency and jitter for real-time diagnostics. PC the ARM926EJ-S handles USB enumeration, class-specific commands, and image preprocessing. According to Infineon documentation, the medical imaging reference design transfers 4K endoscopy frames at 30 fps over UVC. The 1.2 V core supply and 0 C to +70 C commercial temperature range cover most clinical room environments.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для CYUSB3013-BZXC — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | CYUSB3035-BZXI | CYUSB3014-BZXC | CYUSB3023-BZXC | CYUSB3035-BZXC |
|---|---|---|---|---|---|
| Brand | Infineon Technologies | Infineon Technologies | Infineon Technologies | Infineon Technologies | Infineon Technologies |
| Package | 121-TFBGA, 10x10 mm | 121-TFBGA, 10x10 mm | 121-TFBGA, 10x10 mm | 121-TFBGA, 10x10 mm | 121-TFBGA, 10x10 mm |
| On-chip SRAM | 512 KB | 512 KB | 128 KB | 256 KB | 512 KB |
| USB Standard | USB 3.1 Gen 1 + USB 2.0 | USB 3.1 Gen 1 + USB 2.0 | USB 3.1 Gen 1 + USB 2.0 | USB 3.1 Gen 1 + USB 2.0 | USB 3.1 Gen 1 + USB 2.0 |
| Core Frequency | up to 200 MHz | up to 200 MHz | up to 200 MHz | up to 200 MHz | up to 200 MHz |
| GPIF II Width | 8/16/32-bit | 8/16/32-bit | 8/16/32-bit | 8/16/32-bit | 8/16/32-bit |
| Operating Temperature | 0 C to +70 C | -40 C to +85 C | 0 C to +70 C | 0 C to +70 C | 0 C to +70 C |
| Charger Detect Output | Yes | No | Yes | Yes | No |
Ключевые отличия
- Largest on-chip SRAM in the FX3 family (против CYUSB3023-BZXC)
- Retains charger-detect output for USB BC 1.2 compliance (против CYUSB3035-BZXI)
- Full 32-bit GPIF II master bus at 100 MHz (против CYUSB3014-BZXC)
Заметки по проектированию
Use a continuous ground reference plane on layer 2 directly under the 121-TFBGA footprint, with stitch vias around the perimeter every 1-2 mm to control return-current paths. Route the 5 Gbps SuperSpeed differential pair (USB3_TX_DP/DM and USB3_RX_DP/DM) as a 90-ohm differential with intra-pair skew under 1 ps and length matching within 150 ps. Keep the SuperSpeed pair at least 4x dielectric thickness (>=0.4 mm) away from any other high-speed signal to minimize crosstalk.
Decouple every supply pin with a 0.1 uF X7R MLCC placed within 1 mm of the pin plus a 4.7 uF bulk capacitor within 5 mm. Tie VDD_CORE (1.2 V) and VDD_IO (1.8 V-3.3 V) on independent LDO outputs and add a ferrite bead between the USB PHY analog supply VDD_PHY and the digital 1.2 V rail. According to the FX3 hardware manual, peak transient current on VDD_CORE can reach 250 mA during SuperSpeed link training - a 4.7 uF bulk cap prevents rail collapse.
Configure FSLC[2:0] and PMODE[2:0] strapping pins to the correct boot mode before power-up; incorrect strapping causes the device to enumerate as USB 2.0 only or fail to boot from SPI. Do not leave unused GPIF II data bits floating - tie them to ground through 10 kohm resistors or use them in the GPIF II waveform. Per Infineon FX3 hardware guidance, the external 24 MHz crystal must have <=50 ppm tolerance and load capacitance matched to the on-chip load for USB compliance.
Информация о соответствии
RoHS compliant per Infineon product page. USB-IF certified under TID # 340800007. AEC-Q100 not applicable - choose CYUSB3035-BZXI for industrial temperature range.
