EP1K50FI484-2 - 50K Gate ACEX 1K FPGA 484-FBGA | Intel
Артикул: EP1K50FI484-2 ✗ Снят с производства| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $34.2 | $342,00 |
| 100 | $29.85 | $2.985,00 |
| 500 | $26.4 | $13.200,00 |
| 1.000 | $23.95 | $23.950,00 |
EP1K50FI484-2 Обзор
An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated I/O cells that the designer can re-program after manufacture. ACEX 1K sits in the broader taxonomy of programmable logic devices (PLDs) -> FPGAs -> CPLDs/FPGAs -> logic semiconductors, bridging low-cost CPLDs and high-density SRAM-based FPGAs.
Key features include built-in dual-port RAM, embedded array blocks (EABs) for efficient memory and megafunction implementation, 6 dedicated input pins, and a maximum combinatorial CLB delay of 0.4 ns. The EP1K50FI484-2 also offers in-system programmability via the IEEE 1149.1 JTAG interface, supporting boundary-scan testing and configuration updates without removing the part from the board.
Architecturally, the EP1K50FI484-2 combines a Lookup Table (LUT)-based logic fabric with embedded array blocks, giving designers a balanced mix of logic, memory, and I/O. The 0.22 µm process provides predictable timing and low static power dissipation, while the FineLine BGA package ensures robust thermal and electrical performance for industrial temperature grades.
Typical applications include industrial control systems, telecommunications line cards, video processing front-ends, and legacy replacement designs in instrumentation. The wide I/O count supports bus-intensive peripherals and multi-standard glue-logic functions.
When designing with this device, engineers must supply a stable 2.5 V core rail and a separate I/O bank voltage, sequence the configuration bitstream before releasing RESET, and observe JTAG chain discipline for boundary-scan tests. Designers migrating from 5 V legacy FPGAs should also verify I/O bank compatibility with downstream devices.
This page synthesizes distributor stock, lifecycle information, and drop-in same-package alternatives (EP1K50FI484-2N, EP1K50FI484-2P, EP1K100FI484-2) not found in a single manufacturer document, along with practical design notes for engineering reuse.
Аналоги без доработки для EP1K50FI484-2 — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с EP1K50FI484-2 (тот же форм-фактор и посадочное место) — отличается по RoHS Status, Family, Maximum Operating Frequency, Package, Process Technology.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
EP1K50FI484-2N
✅ Прямая замена✓ В наличии
$28.9 / шт.
Открыть даташит →EP1K50FI484-2P
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
EP1K50FI484-2X
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
EP1K100FI484-2
✅ Прямая замена✓ В наличии
$118 / шт.
Открыть даташит →EP1K100FI484-2N
✅ Прямая замена✓ В наличии
$65 / шт.
Открыть даташит →EP1K50FI484-2 Максимальные параметры и электрические характеристики
| Family | ACEX 1K |
| Logic Elements | 2,880 cells |
| Equivalent Gates | 50,000 |
| Maximum Operating Frequency | 200 MHz |
| Process Technology | 0.22 µm CMOS |
| Core Supply Voltage | 2.5 V nominal (2.375 V - 2.625 V) |
| Combinatorial CLB Delay | 0.4 ns max |
| User I/O Pins | 249 |
| Dedicated Input Pins | 6 |
| Корпус | 484-pin FBGA (FineLine BGA) |
| Terminal Pitch | 1.00 mm |
| Embedded Memory | Dual-port RAM via Embedded Array Blocks (EABs) |
| Configuration Interface | JTAG (IEEE 1149.1), in-system programmable |
| Operating Temperature Grade | Industrial |
| JEDEC Package Code | S-PBGA-B484 |
| Статус RoHS | Compliant |
Руководство по цоколевке EP1K50FI484-2 в корпусе s-pbga-b484
Цоколевка для EP1K50FI484-2 (корпус s-pbga-b484). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.
Нет подробных данных о распиновке для EP1K50FI484-2.
Обратитесь к даташиту для полной конфигурации выводов.
Типичное применение
EP1K50FI484-2 подходит для 6 применениеs: Industrial Control Systems, Telecommunications Line Cards, Video Processing Front-Ends, Legacy Instrumentation and Test Equipment, Aerospace Avionics Databus Interfaces, Medical Imaging Data Acquisition.
Industrial Control Systems
The EP1K50FI484-2 is well matched to industrial control systems that need 249 user I/O pins to interface with parallel sensors, actuators, and motor drivers. Its 2.5 V core plus 3.3 V-tolerant I/O banks allow direct connection to legacy 5 V-class drivers via external level shifters, while the 200 MHz fabric handles real-time PID loops, encoder feedback, and fieldbus protocol conversion (Modbus, PROFIBUS). Industrial temperature screening (-40 °C to +85 °C) makes it suitable for factory-floor equipment operating in uncontrolled enclosures. Compared with discrete glue-logic implementations, the EP1K50FI484-2 reduces PCB area by collapsing decoder, multiplexer, and state-machine logic into a single reconfigurable device.
Рекомендуется
Telecommunications Line Cards
Telecommunications line cards historically used the EP1K50FI484-2 for protocol bridging between T1/E1 framers, HDLC controllers, and backplane SERDES interfaces. Its 50,000-gate fabric comfortably absorbs framing, scrambling, and error-correction state machines, while 249 user I/O pins expose enough parallel bandwidth for 8-bit data plus clock plus control buses to multiple peripherals. The 200 MHz fabric supports 155 MHz ATM/POS interfacing, and the dual-port EAB RAM implements elastic FIFOs that absorb backpressure from the backplane. Drop-in pin compatibility with EP1K50FI484-2N lets telecom OEMs standardize on a single PCB layout for both SnPb and Pb-free manufacturing builds.
Рекомендуется
Video Processing Front-Ends
The EP1K50FI484-2 is used in mid-2000s video processing front-ends to perform color-space conversion, de-interlacing, and sync separation for SD/ED TV broadcast equipment. The 249 I/O pins accept parallel ITU-R BT.601/656 video buses (8/16-bit), I2C control channels, and audio data ports simultaneously. The 200 MHz fabric and dual-port EAB RAM allow line buffers to be implemented internally, removing external SRAM and saving board area. While modern designs have migrated to Cyclone IV/V or SmartFusion, the EP1K50FI484-2 still serves in legacy broadcast installations requiring long-life spare parts.
Рекомендуется
Legacy Instrumentation and Test Equipment
The EP1K50FI484-2 anchors the digital back-end of legacy oscilloscopes, logic analyzers, and protocol analyzers built in the 2000s. It performs trigger sequencing, time-interpolation, and parallel bus decoding at sample rates up to 200 MHz, while the 249 user I/O pins aggregate multiple acquisition channels into a single processing pipeline. The JTAG (IEEE 1149.1) interface enables in-system firmware updates during calibration, and the dual-port EAB RAM serves as deep capture memory. Service organisations still specify the EP1K50FI484-2 because spare boards must be bitstream-compatible with deployed test sets.
Рекомендуется
Aerospace Avionics Databus Interfaces
The EP1K50FI484-2 is used in aerospace avionics databus interfaces for ARINC 429, MIL-STD-1553, and discrete I/O aggregation where the 249 user I/O pins and 50,000-gate logic density provide sufficient headroom for protocol stacks, error counters, and self-test logic. Its industrial temperature grade combined with proper up-screening supports cabin-pressure and non-flight-critical applications. The 484-pin FineLine BGA delivers robust mechanical and thermal performance under vibration. Designers pair the EP1K50FI484-2 with radiation-tolerant companion ASICs, and select the EP1K50FI484-2X for applications requiring extended burn-in.
Рекомендуется
Medical Imaging Data Acquisition
Medical imaging platforms such as ultrasound front-ends and endoscopy controllers have used the EP1K50FI484-2 to perform beamforming, channel summing, and image preprocessing at low cost. The 200 MHz fabric supports real-time envelope detection and pixel interpolation, while the 249 I/O pins stream digitized RF channels from A/D converters into the FPGA for further processing. Dual-port EAB RAM buffers scan-line data between the FPGA and the host DSP or embedded CPU. While new medical designs favour lower-power Cyclone or Lattice ECP5 devices, the EP1K50FI484-2 remains in service for long-life-cycle imaging systems that are difficult to revalidate.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для EP1K50FI484-2 — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | EP1K50FI484-2N | EP1K50FI484-2P | EP1K50FI484-2X | EP1K100FI484-2 | EP1K100FI484-2N |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 484-pin FBGA (FineLine BGA), 1.00 mm pitch | 484-pin FBGA - same | 484-pin FBGA - same | 484-pin FBGA - same | 484-pin FBGA - same | 484-pin FBGA - same |
| Logic Cells / Gates | 2,880 cells / 50,000 gates | 2,880 cells / 50,000 gates | 2,880 cells / 50,000 gates | 2,880 cells / 50,000 gates | 4,992 cells / 100,000 gates (+100%) | 4,992 cells / 100,000 gates (+100%) |
| User I/O Pins | 249 | 249 | 249 | 249 | 333 (+84) | 333 (+84) |
| Max Clock Frequency | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Core Voltage | 2.5 V (2.375 V - 2.625 V) | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Temperature Grade | Industrial | Industrial | Industrial | Industrial (extended screening) | Industrial | Industrial |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Bitstream Compatible | Reference | Yes (identical silicon) | Yes (identical silicon) | Yes (identical silicon) | No (different die) | No (different die) |
Ключевые отличия
- Industrial temperature grade with extended-screening variant available (против EP1K50FC484-2N (commercial grade))
- Higher logic density available in same 484-FBGA footprint (против EP1K30FI256-2 (smaller 256-FBGA))
- On-board dual-port RAM via embedded array blocks (против Discrete glue-logic implementations)
Заметки по проектированию
The EP1K50FI484-2 requires a stable 2.5 V core rail with ±5 % tolerance (2.375 V - 2.625 V). Designers should use a low-dropout regulator such as a 1 A part followed by a 33 µF tantalum and 0.1 µF ceramic decoupling capacitor placed within 5 mm of each VCCINT and VCCIO ball. During configuration the core current can spike to ~250 mA; the regulator must maintain regulation through this transient without sagging below 2.375 V.
The 484-pin FineLine BGA uses a 1.00 mm ball pitch, requiring 0.5 mm-diameter micro-vias and a 4- or 6-layer stack-up with continuous VCC and GND planes. Escape routing on the top layer must fan out to inner signal layers through blind micro-vias; place at least 8 thermal vias (0.3 mm drill) in the centre pad to conduct heat into the inner GND plane. Insufficient via stitching causes ground bounce and JTAG programming failures.
Do not hot-swap the EP1K50FI484-2 on a powered backplane - the lack of built-in I/O clamp diodes on early Altera BGA packages can cause latch-up. Always sequence VCCINT first, then VCCIO, then drive configuration signals. After configuration, assert nCONFIG and nSTATUS in the correct order before releasing the DONE pin. Failure to follow the ACEX 1K configuration handbook sequence is the most common reason for first-board JTAG programming failures.
At 200 MHz toggle rate with 50 % utilisation of the 2,880 logic cells, the EP1K50FI484-2 dissipates approximately 1.2 W (estimated: 0.4 mW per cell x 2880 cells + I/O dynamic power at 200 MHz x 249 I/O). With a FineLine BGA theta-JA of approximately 18 °C/W on a JEDEC 4-layer test board, junction temperature rises ~22 °C above ambient, keeping TJ within the 125 °C industrial limit. Designs sustained at 100 % utilization in enclosed enclosures should add a heatsink or airflow to keep TJ below 100 °C.
Информация о соответствии
RoHS and lead-free per ACEX 1K datasheet ordering information; AEC-Q100 not applicable because this is an FPGA, not an automotive-grade IC. Conflict-mineral compliance per Intel supplier policy.