EP1S10F780C7 - Stratix FPGA 10,570 LEs 780-FBGA | Intel / Altera
Артикул: EP1S10F780C7 ✗ Снят с производства| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $204.34 | $204,34 |
| 10 | $188.5 | $1.885,00 |
| 100 | $165.2 | $16.520,00 |
| 500 | $142.75 | $71.375,00 |
| 1.000 | $128.4 | $128.400,00 |
EP1S10F780C7 Обзор
An FPGA (Field Programmable Gate Array) is a reconfigurable integrated circuit that lets engineers implement arbitrary digital logic, memory, and high-speed transceiver functions after PCB fabrication, instead of committing to a fixed ASIC design. The Stratix family sits in the broader taxonomy: FPGA -> programmable logic -> logic IC -> integrated circuit. FPGAs are commonly deployed for DSP pipelines, custom protocol bridging, ASIC prototyping, and high-throughput parallel processing where fixed-function processors are too slow or inflexible.
Key features of the EP1S10F780C7 include 10570 logic elements, 426 maximum user I/O, and 920448 RAM bits distributed across TriMatrix memory blocks. The device also embeds DSP blocks for high-throughput arithmetic, supports LVDS I/O signalling, and offers a dedicated configuration interface (Passive Serial, Fast Passive Parallel, Passive Parallel Asynchronous, and JTAG). It is implemented on a 1.5 V core supply with separate VCCIO banks for mixed-voltage I/O.
Architecturally, Stratix devices combine a fine-grained logic element fabric, embedded SRAM, dedicated DSP blocks, and high-speed I/O elements with on-die termination. The 'S' in the prefix marks the device as the Stratix series (rather than Stratix GX / Stratix II). This architecture suits applications that demand deterministic latency, parallel datapath processing, and flexible I/O standard assignment across multiple banks.
Typical applications for the EP1S10F780C7 include high-performance DSP acceleration, ASIC prototyping, telecom baseband processing, industrial control and motor control, and test-and-measurement instrumentation. The large pin count and RAM density make it well suited to multi-channel data acquisition systems, video processing engines, and high-speed serial protocol bridging.
When designing with this FPGA, engineers must supply the configuration device or JTAG chain, define I/O bank voltages for each bank, and ensure the PCB land pattern matches the 780-ball FC-FBGA 29 × 29 mm 1.0 mm-pitch layout. Thermal management should be considered because the large BGA can dissipate several watts in sustained logic-switching workloads.
This page synthesizes Stratix family specifications, current distributor pricing, drop-in same-package alternatives from the Site MPN list, and practical design notes that are not collated in any single manufacturer document.
Аналоги без доработки для EP1S10F780C7 — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с EP1S10F780C7 (тот же форм-фактор и посадочное место) — отличается по Package, Operating Temperature, Process Technology, Speed Grade, DSP Blocks.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
EP1S10F780C6
✅ Прямая замена✓ В наличии
$118 / шт.
Открыть даташит →EP1S10F780C5
✅ Прямая замена✓ В наличии
$460 / шт.
Открыть даташит →EP1S10F780C6N
✅ Прямая замена✓ В наличии
$205 / шт.
Открыть даташит →EP1S10F780C5N
✅ Прямая замена✓ В наличии
$195 / шт.
Открыть даташит →EP1S10F780C7 Максимальные параметры и электрические характеристики
| Family | Stratix |
| Logic Elements | 10,570 |
| Total RAM Bits | 920,448 |
| User I/O Count | 426 |
| Core Voltage | 1.5 V |
| Process Technology | 130 nm CMOS |
| Корпус | 780-ball FC-FBGA (29 × 29 mm, 1.0 mm pitch) |
| Тип монтажа | Surface Mount (BGA) |
| Рабочая температура | 0 °C to 85 °C (Commercial) |
| Speed Grade | C7 |
| Maximum Internal Frequency | 420.17 MHz |
| Configuration Modes | Passive Serial, Fast Passive Parallel, Passive Parallel Asynchronous, JTAG |
| DSP Blocks | Yes (embedded) |
| I/O Standards Supported | LVTTL, LVCMOS, LVDS, SSTL, HSTL (per bank) |
| Статус RoHS | Non-compliant (per third-party distributor listing) |
| Logic Family | CMOS |
Руководство по цоколевке EP1S10F780C7 в корпусе 780-ball fc-fbga (29 × 29 mm, 1.0 mm pitch)
Цоколевка для EP1S10F780C7 (корпус 780-ball fc-fbga (29 × 29 mm, 1.0 mm pitch)). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.
Нет подробных данных о распиновке для EP1S10F780C7.
Обратитесь к даташиту для полной конфигурации выводов.
Типичное применение
EP1S10F780C7 подходит для 7 применениеs: ASIC Prototyping and Emulation, High-Performance DSP Acceleration, Telecom Baseband and Protocol Bridging, Industrial Motor Control and Drive, Test and Measurement Instrumentation, Video Processing and Image Pipeline, Aerospace Avionics Databus (Legacy / Up-cycle).
ASIC Prototyping and Emulation
The EP1S10F780C7 is well suited to ASIC prototyping because its 10,570 logic elements and 920,448 bits of embedded RAM provide enough capacity to map large RTL blocks onto a single device. With 426 user I/O the part exposes wide bus interfaces to bring out an emulated ASIC's external pins, while the 1.5 V Stratix core and dedicated TriMatrix memory support high-fidelity behavioural validation at speeds up to 420.17 MHz. Quartus design flows and JTAG configuration allow rapid iteration during bring-up.
Рекомендуется
High-Performance DSP Acceleration
With on-die DSP blocks and 920,448 RAM bits, the EP1S10F780C7 can implement multi-channel FIR, FFT, and correlator engines in parallel datapath topologies. The 426 I/O and banked LVDS support high-rate ADC and DAC interfaces, while 130 nm CMOS silicon at 1.5 V keeps deterministic latency under sustained compute load. Designers typically pin out LVDS pairs to A/D and D/A converters and use the RAM as coefficient and sample buffers.
Рекомендуется
Telecom Baseband and Protocol Bridging
The EP1S10F780C7's mix of logic, RAM, and 426 I/O makes it a practical choice for telecom baseband and custom protocol bridge designs. Stratix DSP blocks handle channelisation and FEC, while user I/O banks expose LVDS, LVTTL, and SSTL interfaces to backplane transceivers and optical modules. The 130 nm process gives predictable timing closure for multi-channel TDM and packet processing pipelines.
Рекомендуется
Industrial Motor Control and Drive
Industrial drive applications leverage the EP1S10F780C7's parallel PWM generation, encoder feedback counting, and deterministic I/O response. The 426 I/O pins carry multi-axis PWM, Hall/encoder feedback, and fieldbus interfaces (PROFIBUS, EtherCAT, CAN). With 10,570 logic elements, the design can host a soft CPU core plus the control loops in a single device, simplifying BOM and certification.
Рекомендуется
Test and Measurement Instrumentation
Test instruments require deep logic, large RAM for sample buffering, and many LVDS pairs to ADC front ends - exactly the EP1S10F780C7's strengths. The device can implement protocol-aware pattern generators, logic analyser capture, and digitiser signal-processing firmware in one device. The 780-ball FC-FBGA supports dense PCB routing for multi-GSPS data converters and timing-critical trigger logic.
Рекомендуется
Video Processing and Image Pipeline
Video pipelines benefit from the EP1S10F780C7's wide RAM, parallel datapath, and many LVDS pairs for camera and display interfaces. Designers commonly instantiate SDR/DDR controllers, colour-space converters, scaling engines, and overlay compositors in fabric while using TriMatrix blocks as line and frame buffers. 426 user I/O provide enough bandwidth to drive parallel RGB, BT.1120, or LVDS display links directly.
Рекомендуется
Aerospace Avionics Databus (Legacy / Up-cycle)
Long-lifecycle aerospace platforms still maintain inventory of the EP1S10F780C7 for MIL-STD-1553, ARINC 429, and discrete avionic interface aggregation. Although the part is obsolete for new designs, existing LRUs continue to require drop-in replacements with the same FC-FBGA footprint. The 130 nm silicon's mature reliability database remains an asset in DO-254 verification flows.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для EP1S10F780C7 — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | EP1S10F780C6 | EP1S10F780C5 | EP1S10F780C6N | EP1S10F780C5N |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 780-ball FC-FBGA (29 x 29 mm, 1.0 mm pitch) | 780-ball FC-FBGA (29 x 29 mm, 1.0 mm pitch) - same | 780-ball FC-FBGA (29 x 29 mm, 1.0 mm pitch) - same | 780-ball FC-FBGA (29 x 29 mm, 1.0 mm pitch) - same | 780-ball FC-FBGA (29 x 29 mm, 1.0 mm pitch) - same |
| Logic Elements | 10,570 | 10,570 | 10,570 | 10,570 | 10,570 |
| Total RAM Bits | 920,448 | 920,448 | 920,448 | 920,448 | 920,448 |
| User I/O Count | 426 | 426 | 426 | 426 | 426 |
| Speed Grade | C7 (fastest) | C6 | C5 (slowest) | C6, lead-free | C5, lead-free |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Operating Temperature | 0 C to 85 C (Commercial) | 0 C to 85 C (Commercial) | 0 C to 85 C (Commercial) | 0 C to 85 C (Commercial) | 0 C to 85 C (Commercial) |
| RoHS Status | Non-compliant | Non-compliant | Non-compliant | Lead-free finish (per N suffix) | Lead-free finish (per N suffix) |
Ключевые отличия
- Fastest Stratix speed grade in the EP1S10 family (против EP1S10F780C6)
- Maximum speed grade preserved across all drop-in alternatives (против EP1S10F780C5)
- Lead-free surface finish option without changing the silicon (против EP1S10F780C6N)
Заметки по проектированию
Estimated: at 1.5 V core and a worst-case Stratix power-per-LE figure of order 5 uW/LE at full toggle, the EP1S10F780C7 can dissipate up to 5-8 W in sustained logic-switching workloads. The 780-ball FC-FBGA package exposes the die through the BGA balls; designers should provide a continuous ground plane, via-array under the package, and thermal vias to inner copper layers to keep junction temperature within the 0-85 C commercial envelope.
The 780-ball FC-FBGA has a 1.0 mm ball pitch on a 29 x 29 mm substrate. PCB fabrication must use laser-drilled microvias or staggered vias, and the land pattern must follow Altera's reference footprint exactly. Solder paste stencil aperture and reflow profile must be qualified for lead-free or SnPb depending on whether the chosen variant has the 'N' (lead-free) suffix or not.
Configuration failures are the most common Stratix bring-up issue. Always include a JTAG header (10-pin or 20-pin Altera-compatible) wired to the dedicated JTAG pins so the design can be programmed and observed even when the configuration device is missing. Double-check MSEL pin strapping to select the correct configuration mode (Passive Serial, FPP, PPA, or JTAG) for your boot source.
Each I/O bank must be powered from a single VCCIO supply; mixing voltages within a bank is not allowed. Decouple each VCCIO pin with a 0.1 uF + 10 uF pair placed as close to the BGA ball as the breakout allows. Keep LVDS pairs length-matched within 150 mil for the chosen data rate and route them over a continuous reference plane to control impedance and crosstalk.
Информация о соответствии
RoHS non-compliant per third-party distributor listing; the original Stratix family pre-dates the RoHS lead-free transition. The 'N' suffix variants (C6N, C5N) carry a lead-free finish on the same silicon. AEC-Q100 is not applicable - this is a commercial-grade FPGA, not an automotive-qualified IC.
