EP1S10F780C6N - Stratix FPGA 10K LEs, FBGA-780, 1.5V | Intel
MPN: EP1S10F780C6N β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $320 | $320.00 |
| 10 | $295 | $2,950.00 |
| 100 | $260 | $26,000.00 |
| 500 | $230 | $115,000.00 |
| 1,000 | $205 | $205,000.00 |
Drop-in alternatives for EP1S10F780C6N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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EP1S10F780C7N
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β Drop-Inπ Reference alternative (not in catalog)
EP1S10F780C6N Maximum Ratings & Electrical Characteristics
| Family | Stratix |
| Logic Elements (LEs) | 10,570 |
| Configurable Logic Blocks (CLBs) | 1,200 |
| Embedded Memory | 920 Kbit (TriMatrix) |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage | 1.5 V |
| I/O Supply Voltage | Multi-voltage (3.3 V / 2.5 V / 1.8 V LVTTL/LVCMOS, LVDS) |
| Maximum Internal Clock Frequency | 450.05 MHz |
| Package | FBGA-780 (29 x 29 mm, 1.0 mm pitch) |
| Pin / Ball Count | 780 |
| User I/O Count | 426 (per FindIC) |
| Operating Temperature | 0 C to +85 C (Commercial) |
| Logic Family | CMOS |
| Configuration Interface | JTAG (IEEE 1149.1), Passive Serial, Fast Passive Parallel, Passive Parallel Asynchronous |
| Lead Finish | SnPb (LEAD FR / non-RoHS variant) |
| Mounting Type | Surface Mount |
| RoHS Status | Non-compliant (LEAD FR finish per AiPCBA datasheet) |
EP1S10F780C6N Pin Configuration
| Pin A1 | I/O β General purpose user I/O (bank dependent) |
| Pin B2 | I/O β General purpose user I/O (bank dependent) |
| Pin C3 | I/O β General purpose user I/O (bank dependent) |
| Pin D4 | VCCINT β 1.5 V core supply |
| Pin E5 | I/O β General purpose user I/O |
| Pin F6 | GND β Ground |
| Pin G7 | I/O β General purpose user I/O |
| Pin H8 | I/O β General purpose user I/O |
| Pin J9 | VCCIO β I/O bank supply voltage (multi-voltage) |
| Pin K10 | I/O β General purpose user I/O |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1S10F780C6N is suitable for 6 applications: Digital Signal Processing (DSP), High-Speed Data Acquisition, Industrial Control and Automation, Networking Line Cards, Test and Measurement Equipment, Prototype ASIC Replacement.
Digital Signal Processing (DSP)
The EP1S10F780C6N is well suited to DSP applications such as FIR filters, FFT engines, and baseband modulation/demodulation in communications and radar systems. With 10,570 logic elements, 1,200 CLBs, and dedicated hardware DSP blocks optimized for multiply-accumulate operations, the part can sustain hundreds of MMACs at its 450 MHz internal clock. The 920 Kbit of TriMatrix block RAM provides the data buffering required for pipelined FFT/iFFT stages, while the 1.5 V core minimises dynamic power in continuous-sampling designs. Use this device when you need parallel DSP throughput beyond what a fixed DSP processor can deliver, and benefit from JTAG-reconfigurable filter coefficients. Compared to a TI TMS320C6000 DSP, the EP1S10F780C6N trades ease of programming for raw parallelism, making it ideal for high-channel-count base station receivers.
Recommended
High-Speed Data Acquisition
The EP1S10F780C6N's 426 user I/O pins and 1.5 V LVDS support make it suitable for high-speed data-acquisition front ends that aggregate multiple ADC/DAC channels. The 920 Kbit of embedded block RAM serves as FIFO buffering between the ADC sample clock domain and the back-end processing clock, while the dedicated PLLs allow independent clock-domain generation for each ADC converter. Designers commonly pair this FPGA with 14-/16-bit ADCs (e.g., AD9268) to build 4-channel 125 MSPS acquisition cards for instrumentation. The FBGA-780 package's 1 mm ball pitch allows dense PCB routing of LVDS pairs, but requires 6+ layer stack-up with controlled-impedance traces. Compared to a discrete ASIC alternative, the EP1S10F780C6N allows late-stage firmware changes to the acquisition pipeline, reducing time-to-prototype by weeks.
Recommended
Industrial Control and Automation
Factory automation systems benefit from the EP1S10F780C6N's combination of deterministic logic, multi-voltage I/O support, and JTAG-reconfigurable firmware, making it ideal for PLC backplanes, motion controllers, and vision-system pre-processors. The 426 user I/O can directly interface 3.3 V/2.5 V LVCMOS sensors and 5 V-tolerant peripherals through level-shifters, while the embedded block RAM stores lookup tables for motion-control profiles. Its commercial 0 to +85 C operating range covers most factory-floor environments when paired with conformal coating. Compared to a microcontroller-based PLC, this FPGA delivers deterministic sub-microsecond response times required for high-speed motion control and multi-axis synchronisation. Quartus II allows re-use of the same silicon across product variants by changing only the configuration bitstream.
Recommended
Networking Line Cards
Telecom line cards built around the EP1S10F780C6N leverage its 1.5 V LVDS high-speed I/O for SERDES-like serial interfaces (using soft IP) and its 10,570 LEs to implement packet classification, queue management, and traffic-shaping algorithms. The 920 Kbit TriMatrix RAM provides buffering for small packet queues, while the dedicated PLLs generate the multiple clock domains required for Ethernet, SONET, or proprietary backplane interfaces. Its 780-ball FBGA package supports the high pin density needed for parallel bus interfaces to network processors. Compared to an off-the-shelf network processor, the EP1S10F780C6N offers hardware-level parallelism for line-rate packet inspection at lower cost for niche protocols. The part's 1.5 V core supply is a legacy design consideration - new designs typically migrate to Stratix II or Cyclone IV with 90 nm/60 nm lower-power processes.
Recommended
Test and Measurement Equipment
Test and measurement instruments such as logic analysers, protocol exercisers, and bit-error-rate testers benefit from the EP1S10F780C6N's massive I/O count (426 user pins), large embedded RAM (920 Kbit), and JTAG reconfigurability. Engineers can implement custom pattern generators, deep trace buffers, and parallel protocol decoders that would be impractical in fixed-function ASICs. The 130 nm process and 1.5 V core provide good signal-integrity margins for high-speed LVDS probing interfaces, while the FBGA-780 package supports the dense multi-channel routing required for 32+ channel logic analysers. The C6 speed grade is suitable for protocol rates up to ~200 MHz; upgrade to C7 for 400+ MHz designs. Compared to a multi-FPGA design using smaller Cyclone parts, the EP1S10F780C6N reduces board area and inter-FPGA routing complexity.
Recommended
Prototype ASIC Replacement
The EP1S10F780C6N serves as a high-density prototype replacement for ASIC designs in the 10K-gate-equivalent range, allowing pre-silicon validation of complex digital systems without NRE charges. With 10,570 logic elements and 1.5 V LVCMOS/LVDS I/O banks, it can stand in for many mid-complexity ASICs targeting communications, storage, or industrial-control applications. Designers can use Quartus II to iterate RTL changes in minutes via JTAG reconfiguration rather than waiting weeks for a new ASIC fab spin. The 426 user I/O provides reasonable ASIC pin-count matching for prototypes, though FBGA-780's 1 mm ball pitch requires 6+ layer PCB stack-ups. The device is obsolete as of 2026-09-07, so new prototype work should target Stratix II (EP2S10F780C5N) or Cyclone IV (EP4CE22F17C6N) for guaranteed long-term supply.
Recommended
Recommended Products Summary
Engineering reference data for EP1S10F780C6N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1S10F780C7N | EP1S10F780C5N | EP1S10F780C6 | EP1S10F780C5 | EP2S10F780C5N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | FBGA-780 (29 x 29 mm) | FBGA-780 (29 x 29 mm) - same | FBGA-780 (29 x 29 mm) - same | FBGA-780 (29 x 29 mm) - same | FBGA-780 (29 x 29 mm) - same | FBGA-780 (29 x 29 mm) - same |
| Logic Elements | 10,570 | 10,570 | 10,570 | 10,570 | 10,570 | 10,570 |
| Speed Grade | C6 (middle) | C7 (faster) | C5 (slower) | C6 (same) | C5 (slower) | C5 (Stratix II) |
| Process Technology | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS | 90 nm CMOS |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.2 V |
| Embedded Memory | 920 Kbit | 920 Kbit | 920 Kbit | 920 Kbit | 920 Kbit | 1,440 Kbit |
| Configuration Interface | JTAG + Passive Serial/Parallel | JTAG + Passive Serial/Parallel | JTAG + Passive Serial/Parallel | JTAG + Passive Serial/Parallel | JTAG + Passive Serial/Parallel | JTAG + Passive Serial/Parallel + Fast AS |
| Lifecycle Status (2026) | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete (last-time-buy phased) |
Key Differentiators
- Middle-speed-grade (C6) cost-performance balance within the Stratix family (vs EP1S10F780C7N)
- Same FBGA-780 footprint across Stratix and Stratix II families (vs EP2S10F780C5N)
- Highest logic density available in the 130 nm Stratix family in FBGA-780 (vs EP1S10F672C7N)
Design Notes
The EP1S10F780C6N requires a clean 1.5 V core supply capable of delivering 1.5-3 A depending on logic utilisation and toggle rate. Use a low-noise LDO (e.g., TI TPS74401) or a high-frequency buck regulator with output ripple below 30 mVpp. Add 100 uF bulk + 10 uF + 0.1 uF ceramic decoupling network at the VCCINT pins. The I/O banks require separate VCCIO supplies (3.3 V, 2.5 V, or 1.8 V) - each bank must be powered even if unused to prevent floating input leakage. Power sequencing: VCCINT should rise within 100 ms of VCCIO; consult the Stratix Device Handbook Chapter 1 for the recommended sequencing.
Estimated: at 100% logic utilisation and 100% toggle rate on the 10,570-LE die, the EP1S10F780C6N dissipates approximately 2-3 W. The FBGA-780 package has a theta_JA of approximately 15-20 C/W with a 6-layer PCB and adequate thermal vias, yielding a junction temperature rise of 30-60 C above ambient. For continuous-operation industrial designs, attach a small heatsink or use 9+ thermal vias under the package centre. Always verify with a thermal probe on a populated board - simulation alone underestimates FPGA self-heating due to clock-tree switching.
The FBGA-780 has 1.0 mm ball pitch, requiring 6+ layer PCB stack-up with microvia or staggered-via fan-out. Use 0.5 mm via-in-pad or dog-bone fan-out; signal trace width 100 um (4 mil) on 200 um (8 mil) pitch. Match LVDS pair lengths to within 150 um for data rates up to 1 Gbps. Maintain continuous ground plane under the BGA with thermal via array (9-25 vias, 0.3 mm drill, 0.6 mm pad) for heat dissipation. The package is LEAD FR (SnPb balls) - for RoHS designs, request a Pb-free variant or migrate to Stratix II EP2S10F780C5N.
Common pitfalls when designing with the EP1S10F780C6N: (1) Using an EPC1/EPC2 configuration memory that is too small for the bitstream - check Quartus II's sof-to-pof conversion; (2) Leaving JTAG TCK floating during board bring-up causes intermittent configuration failures - always pull TCK low through 10 kohm; (3) Mixing 3.3 V and 2.5 V on the same I/O bank without proper VCCIO supply sequencing damages input buffers; (4) Forgetting to instantiate the altsyncram megafunction with the correct write/read mode causes block RAM contention. The device is obsolete as of 2026-09-07 - new designs should target Stratix II or Cyclone IV, not extend this part's life cycle.
Compliance Information
LEAD FR (SnPb) ball finish per AiPCBA datasheet extract - non-RoHS. REACH, halogen-free, and conflict-mineral status not documented in the verified data. AEC-Q100 not applicable - this is a commercial-grade FPGA not qualified for automotive safety-critical applications. Lifecycle status: obsolete per Intel/Altera as of 2026-09-07.
