EP1S10F780C5 - Stratix FPGA 10K LE 780-FBGA | Intel
MPN: EP1S10F780C5 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $619.78 | $619.78 |
| 10 | $580 | $5,800.00 |
| 100 | $540 | $54,000.00 |
| 500 | $495 | $247,500.00 |
| 1,000 | $460 | $460,000.00 |
Drop-in alternatives for EP1S10F780C5 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1S10F780C7N
✅ Drop-In✓ In Stock
$96.2 / Unit
View Datasheet →EP1S10F780C5N
✅ Drop-In✓ In Stock
$195 / Unit
View Datasheet →EP1S10F780C6
✅ Drop-In✓ In Stock
$118 / Unit
View Datasheet →EP1S10F780C7
✅ Drop-In✓ In Stock
$128.4 / Unit
View Datasheet →EP1S20F780C5
✅ Drop-In✓ In Stock
$645 / Unit
View Datasheet →EP1S10F780C5 Maximum Ratings & Electrical Characteristics
| Family | Stratix |
| Logic Elements (LEs) | 10,570 |
| Total RAM Bits | 920,448 |
| DSP Blocks | Up to 28 |
| Embedded Multipliers | Up to 224 (9-bit x 9-bit) |
| User I/Os | 426 |
| Process Technology | 0.13 micrometer, all-layer copper CMOS, SRAM |
| Core Supply Voltage | 1.5 V |
| Internal Operating Frequency | Up to 500 MHz |
| Package | 780-ball FineLine BGA (FC-FBGA) |
| LABs (Logic Array Blocks) | 1057 |
| Configuration | SRAM-based, volatile |
| Operating Temperature Grade | Commercial (C5 speed grade) |
| Speed Grade | C5 |
EP1S10F780C5 780-ball fineline bga (fc-fbga) Pin Configuration Guide
Complete pinout information for EP1S10F780C5 (780-ball fineline bga (fc-fbga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1S10F780C5.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1S10F780C5 is suitable for 6 applications: Software-Defined Radio (SDR) Baseband, High-Speed Image and Video Processing, Telecommunications Baseband Processing, ASIC Prototyping and Emulation, Industrial Motor Control and Drive, Medical Imaging and Diagnostic Equipment.
Software-Defined Radio (SDR) Baseband
The EP1S10F780C5's combination of 224 (9-bit x 9-bit) embedded multipliers and 920 Kbits of TriMatrix memory makes it well-suited for SDR baseband processing. Its 500 MHz internal fabric supports FIR filters, FFTs, and channelization at sample rates beyond 100 MSPS. The 426 user I/Os route digital IF to external ADC/DAC companion parts such as the AD9230 or AD9747. Designers can implement multi-channel DDC/DUC chains and benefit from deterministic latency through dedicated DSP blocks rather than soft multipliers.
Recommended
High-Speed Image and Video Processing
With 426 user I/Os and 1,057 LABs, the EP1S10F780C5 can ingest parallel video streams from external image sensors and perform real-time processing such as Bayer demosaicing, color space conversion, and edge detection. The M4K and M-RAM blocks serve as line buffers and frame stores, while the DSP blocks accelerate 2D convolution kernels. Designers pair the FPGA with DDR SDRAM controllers implemented in soft logic, and use LVDS I/O standards to receive pixel data at hundreds of MHz.
Recommended
Telecommunications Baseband Processing
The EP1S10F780C5 supports Turbo decoding, Viterbi decoding, and channel estimation for 3G/4G base-station baseband implementations. Its DSP blocks run 9-bit x 9-bit multipliers at high speed, enabling soft-decision decoding of convolutional and Turbo codes with low bit-error rates. The TriMatrix memory stores soft-bit metrics and interleaved data blocks. Its LVDS and HSTL I/O standards connect seamlessly to analog front-end ICs and backplane SERDES devices.
Recommended
ASIC Prototyping and Emulation
The EP1S10F780C5 is frequently used as a building block in multi-FPGA ASIC prototyping platforms. Each device can emulate 5 to 10 million gates of an ASIC design depending on memory and DSP usage. The 426 I/Os implement chip-to-chip time-domain-multiplexed traces, while the SRAM-based configuration allows rapid RTL re-spin for iterative bring-up. Designers use Quartus II to partition and place the ASIC netlist across an array of EP1S10 devices on a prototyping board.
Recommended
Industrial Motor Control and Drive
The EP1S10F780C5 implements field-oriented control (FOC) algorithms for three-phase AC induction and PMSM motors. Its DSP blocks execute Park/Clarke transforms and PI controllers at the PWM switching frequency (typically 10 to 20 kHz), while the LABs handle state machines and protection logic. The 426 I/Os interface with gate drivers, encoders, and isolated current sensors. Industrial designs may migrate to the EP1S10F780C7N for extended temperature operation.
Recommended
Medical Imaging and Diagnostic Equipment
Ultrasound beamforming, CT reconstruction kernels, and patient-monitoring DSP are common EP1S10F780C5 deployments. The 224 embedded multipliers support real-time beam steering and apodization at 64-channel probe densities, while the abundant I/Os interface with high-speed ADCs such as the AD9271. Designers meet medical safety standards (IEC 60601) by pairing the FPGA with reinforced-isolated power and signal chains. Obsolescence has driven many designs to migrate to Cyclone V or Stratix V.
Recommended
Recommended Products Summary
Engineering reference data for EP1S10F780C5 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1S10F780C7N | EP1S10F780C5N | EP1S10F780C6 | EP1S10F780C7 | EP1S20F780C5 |
|---|---|---|---|---|---|---|
| Package | 780-ball FC-FBGA | 780-ball FC-FBGA (same) | 780-ball FC-FBGA (same) | 780-ball FC-FBGA (same) | 780-ball FC-FBGA (same) | 780-ball FC-FBGA (same) |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Logic Elements | 10,570 LEs | 10,570 LEs (same die) | 10,570 LEs (same die) | 10,570 LEs (same die) | 10,570 LEs (same die) | 18,460 LEs (+74%) |
| Embedded RAM | 920,448 bits | 920,448 bits (same die) | 920,448 bits (same die) | 920,448 bits (same die) | 920,448 bits (same die) | 1,669,344 bits (+81%) |
| User I/Os | 426 | 426 (same) | 426 (same) | 426 (same) | 426 (same) | 426 (same) |
| DSP Blocks | Up to 28 | Up to 28 (same die) | Up to 28 (same die) | Up to 28 (same die) | Up to 28 (same die) | Up to 52 (+86%) |
| Speed Grade | C5 | C7 (slower) | C5 (same) | C6 (between) | C7 (slower) | C5 (same) |
| Temperature Grade | Commercial | Industrial | Commercial (same) | Commercial (same) | Commercial (same) | Commercial (same) |
| Lead-Free (RoHS) | [DATA_NEEDED] | Yes (Pb-free N suffix) | Yes (Pb-free N suffix) | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Highest speed grade in EP1S10 780-FBGA family (vs EP1S10F780C7 / EP1S10F780C7N)
- Pin-compatible density upgrade path within Stratix family (vs EP1S20F780C5)
- Integrated DSP blocks for parallel arithmetic (vs EP1S20F780C5)
Design Notes
Estimated: at 500 MHz internal clock with 80% logic utilization, the EP1S10 core draws approximately 1.2 to 1.8 A from the 1.5 V rail (1.8 to 2.7 W), and the I/O banks draw up to 0.5 A per bank from VCCIO supplies. Use a low-noise 1.5 V LDO such as the TPS7A4701 for the core rail and a TPS7A3301 for any negative bias. Place 100 nF X7R decoupling capacitors within 5 mm of every power pin and 10 uF bulk caps per power plane region.
The 780-ball FC-FBGA package uses a 1.0 mm ball pitch; route signals on inner layers with microvia stackups. Match trace lengths within +/- 50 mil for LVDS pairs and within +/- 100 mil for source-synchronous DDR interfaces. Maintain a continuous ground plane on layer 2 and a continuous 1.5 V plane on layer 3 directly under the BGA to minimize power inductance. Use 8 or more PCB layers for signal integrity at 500 MHz.
Estimated: at full DSP utilization (all 28 DSP blocks toggling), the device may dissipate 3 to 5 W. The FC-FBGA package has a theta-JA of approximately 12 C/W with a 4-layer JEDEC test board, leading to a junction-temperature rise of 36 to 60 C above ambient. Provide forced-air cooling (200 LFM minimum) for industrial-temperature operation, or migrate to the EP1S10F780C7N variant and limit to commercial junction temperatures.
Do not apply power before MSEL configuration-mode pins are properly tied - floating MSEL pins can put the device into JTAG-only mode and cause configuration failures. Use a series resistor on TCK for JTAG chain integrity. The EP1S10F780C5's SRAM configuration is volatile; pair it with an EPCQ64 or similar AS-mode configuration memory so the bitstream reloads after power-up. Do not exceed the 1.6 V absolute-maximum VCCINT limit.
Compliance Information
The original Stratix family predates widespread RoHS enforcement; lead-free variants are identified by the 'N' suffix (EP1S10F780C5N, EP1S10F780C7N). Specific RoHS/REACH/AEC-Q100 compliance data was not present in the verified web data - consult the manufacturer's declaration or the lot-specific certificate of conformance.
