EP1S10F780C6 - Stratix 10570-Cell FPGA, 780-BGA | Altera
MPN: EP1S10F780C6 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $185 | $185.00 |
| 10 | $165 | $1,650.00 |
| 100 | $145 | $14,500.00 |
| 500 | $130 | $65,000.00 |
| 1,000 | $118 | $118,000.00 |
Drop-in alternatives for EP1S10F780C6 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1S10F780C7
✅ Drop-In✓ In Stock
$128.4 / Unit
View Datasheet →EP1S10F780C5
✅ Drop-In✓ In Stock
$460 / Unit
View Datasheet →EP1S10F780C5N
✅ Drop-In✓ In Stock
$195 / Unit
View Datasheet →EP1S10F780C7N
✅ Drop-In✓ In Stock
$96.2 / Unit
View Datasheet →EP1S10F780C8
✅ Drop-In📋 Reference alternative (not in catalog)
EP1S10F780C6 Maximum Ratings & Electrical Characteristics
| Series | Stratix (EP1S) |
| Family | Stratix I |
| Logic Elements / Cells | 10,570 |
| LABs / CLBs | 1,057 |
| Total RAM Bits | 920,448 |
| Number of I/O | 426 |
| Package Type | 780-BBGA (FC-FBGA, 29x29 mm, 1.0 mm pitch) |
| Core Supply Voltage | 1.5 V |
| Process Technology | 130 nm CMOS |
| Operating Temperature | 0C to +85C (commercial 'C') |
| Speed Grade | C6 |
| Max User I/O | 426 |
| Mounting Type | Surface Mount (SMT/SMD) |
| Logic Family / Base Technology | CMOS, SRAM-based configuration |
| Configuration Mode | JTAG / passive serial / external flash |
EP1S10F780C6 780-bbga (fc-fbga, 29x29 mm, 1.0 mm pitch) Pin Configuration Guide
Complete pinout information for EP1S10F780C6 (780-bbga (fc-fbga, 29x29 mm, 1.0 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1S10F780C6.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1S10F780C6 is suitable for 7 applications: Telecom Baseband Signal Processing, Custom Serial Protocol Bridging / Glue Logic, Industrial Test and Measurement Backplanes, Video and Image Processing Pipelines, Aerospace and Defense Prototyping, ASIC Replacement / Education Platforms, High-Speed Custom DSP and FIR Filter Banks.
Telecom Baseband Signal Processing
The EP1S10F780C6 fits telecom baseband and channel-card DSP applications because its 10,570 logic elements and embedded DSP blocks deliver the parallel multiply-accumulate throughput needed for baseband modulation, channel filtering, and FEC decoding. The 920,448 bits of TriMatrix RAM absorb packet buffers and symbol-rate look-up tables without external memory contention, while 426 user I/O pins route wide parallel data buses to DSP co-processors and backplane connectors. The 130 nm 1.5 V core gives predictable timing closure at telecom clock rates, and Quartus II DSP Builder blocks accelerate FFT/FIR IP development. Trade-off: the Stratix I process node draws more power per MAC than later Stratix II/III families, so thermal design must account for ~5-10 W under sustained DSP load.
Recommended
Custom Serial Protocol Bridging / Glue Logic
Use the EP1S10F780C6 as a flexible protocol-bridging engine between proprietary or mixed-standard interfaces such as LVDS, LVPECL, HSTL, and SSTL. The 426 user I/O pins, organized across multiple VCCIO banks, allow the part to interface simultaneously to legacy 3.3 V peripheral logic and modern 1.8 V PHYs without external level shifters. TriMatrix RAM provides FIFO buffers for clock-domain crossing, and 1,057 LABs accommodate custom state machines for protocol conversion. Its SRAM-based configuration also enables field-updatable firmware via JTAG, simplifying production and field service. Compared with newer Stratix devices, this part remains cost-effective when a moderate logic density suffices and a 130 nm 1.5 V core is acceptable.
Recommended
Industrial Test and Measurement Backplanes
The EP1S10F780C6 is well suited to custom test and measurement backplanes that aggregate multiple sensor channels, apply real-time DSP, and forward processed data to a host controller. With 426 user I/O pins it can capture dozens of analog-front-end channels simultaneously, while embedded multipliers perform per-channel calibration and FIR filtering. The commercial 0C to +85C temperature range covers most factory-floor environments, and the 780-FBGA package provides robust thermal performance when paired with a PCB thermal-via array. Designers value the mature Quartus II tool flow for repeatable timing closure across design revisions. For higher channel counts, the EP1S20 or EP1S25 Stratix variants share the same tool flow and many IP cores.
Recommended
Video and Image Processing Pipelines
Deploy the EP1S10F780C6 in real-time video and image processing pipelines where its 10,570 LEs and TriMatrix memory deliver enough bandwidth for line buffers, 2D convolution kernels, and motion estimation. The 426 I/O pins can ingest parallel camera-interface data (e.g., LVDS-based Channel Link) and drive DVI/HDMI bridges or display controllers without external bus-switching glue. Embedded multipliers accelerate DCT/IDCT and color-space conversion, while 1.5 V core operation keeps dynamic power manageable for 60 fps operation. Note that for 4K or HDR pipelines you should migrate to Stratix IV/V devices, which integrate transceivers and more DSP blocks; the EP1S10 is best for 1080p and below designs.
Recommended
Aerospace and Defense Prototyping
The EP1S10F780C6 has historically been specified into aerospace and defense prototyping applications where Altera's mature IP ecosystem and long-standing qualification records give program managers confidence in supply continuity. The part supports MIL-STD-1553, ARINC 429, and other legacy avionic bus standards via third-party IP, and the 1.5 V core with multiple VCCIO banks interfaces to 5 V and 3.3 V avionics without external level translation. Commercial temperature grade is acceptable for cabin/ground systems; for flight-critical applications use the industrial 'I' grade variants (EP1S10F780I6/7) when available. The mature 130 nm silicon and Stratix I process node have an extensive reliability and SEU-mitigation track record in defense literature.
Recommended
ASIC Replacement / Education Platforms
Use the EP1S10F780C6 as an ASIC replacement in low-volume production runs where NRE costs of a custom ASIC cannot be justified. With 10,570 LEs, 920 Kbits of block RAM, and 426 I/O pins, it has enough logic density to absorb most mid-complexity ASIC designs while staying in stock at major distributors. It is also widely adopted in university courses teaching VLSI/FPGA design because of the well-documented Stratix I architecture, abundant textbook examples, and freely available Quartus II Web Edition. The 780-FBGA package requires a multi-layer PCB with controlled-impedance routing and a thermal-via array, so budget accordingly when using this part in coursework or hobby projects.
Recommended
High-Speed Custom DSP and FIR Filter Banks
The EP1S10F780C6 is a strong fit for custom DSP applications that require parallel multiply-accumulate operations, such as radar pulse compression, software-defined-radio channelizers, and adaptive FIR filter banks. Its embedded DSP blocks and on-chip multipliers allow per-cycle MAC operations, while the 920 Kbit TriMatrix memory provides coefficient storage and data buffer windows without external memory contention. The 1,057 LABs and abundant routing deliver tight timing closure at telecom sample rates. Compared with newer Stratix families, this part lacks hard transceivers, so designs needing multi-gigabit SERDES should migrate to Stratix II GX or later. For pure DSP workloads at moderate clock rates, EP1S10F780C6 remains a cost-effective choice.
Recommended
Recommended Products Summary
Engineering reference data for EP1S10F780C6 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1S10F780C7 | EP1S10F780C5 | EP1S10F780C5N | EP1S10F780C7N | EP1S10F780C8 |
|---|---|---|---|---|---|---|
| Package | 780-FBGA (29x29 mm, 1.0 mm pitch) | 780-FBGA (29x29 mm) - same | 780-FBGA (29x29 mm) - same | 780-FBGA (29x29 mm) - same | 780-FBGA (29x29 mm) - same | 780-FBGA (29x29 mm) - same |
| Brand | Altera (Intel FPGA) | Altera | Altera | Altera | Altera | Altera |
| Family | Stratix I (EP1S) | Stratix I | Stratix I | Stratix I | Stratix I | Stratix I |
| Logic Elements | 10,570 | 10,570 | 10,570 | 10,570 | 10,570 | 10,570 |
| RAM Bits | 920,448 | 920,448 | 920,448 | 920,448 | 920,448 | 920,448 |
| User I/O Pins | 426 | 426 | 426 | 426 | 426 | 426 |
| Speed Grade | C6 (mid) | C7 (faster) | C5 (slower) | C5 (slower) + lead-free | C7 (faster) + lead-free | C8 (fastest) |
| Temperature Grade | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C, lead-free | Commercial 0C to +85C, lead-free | Commercial 0C to +85C |
Key Differentiators
- Most widely stocked mid-grade speed option in the EP1S10F780 family (vs EP1S10F780C5 / EP1S10F780C7)
- Mid-density 10K LE class within the Stratix I family (vs EP1S25F672 / EP1S20F672)
- Commercial temperature grade offers wider distributor stock than industrial (vs EP1S10F780I6 / EP1S10F780I7 (industrial))
Design Notes
Estimated: The EP1S10F780C6 draws 1.5 V core current in the range of 1-3 A depending on logic utilization and toggle rate, plus VCCIO current per bank. Provide a low-impedance 1.5 V plane with at least 4-6 bulk 220 uF polymer capacitors and per-pin 0.1 uF + 1 nF decoupling. VCCIO banks must be grouped by voltage (1.5 V/1.8 V/2.5 V/3.3 V) and each bank requires its own decoupling network; mixing VCCIO voltages on adjacent banks without proper isolation causes logic errors. Refer to the Stratix Device Handbook Section I power-supply guidelines for recommended ferrite-bead separation between analog PLL supplies and digital rails.
Estimated: At full DSP utilization the part can dissipate 5-10 W; combined with the 29x29 mm FC-FBGA package, this demands a thermal-via array under the package die region (typical Stratix recommendation: 9x9 or 11x11 via grid, 0.3 mm drill, 0.5 mm pitch). Without thermal vias, junction temperature can exceed 100C under load, causing timing degradation or thermal shutdown. Always run Quartus PowerPlay early in the design to estimate worst-case power and verify thermal envelope at the system level.
The 1.0 mm pitch BGA requires a high-density PCB stack-up: minimum 6 layers with microvia-in-pad or 1.0 mm laser-drilled vias. Route all I/O signals on the breakout layer using escape routing (via-in-pad or dog-bone fan-out). Use length-matched differential pairs for LVDS and HSTL class I/II signals, and add 100 ohm differential termination at the receiver end. Place configuration flash (EPCS1/EPCS4) within 50 mm of the FPGA to keep JTAG/AS configuration traces short. Refer to the Stratix Hardware Reference for I/O bank restrictions before final pin assignment.
Common mistakes on this part include: (1) tying unused I/O pins incorrectly - all unused I/O must be set to 'inputs tri-stated with weak pull-up' via Quartus pin assignments to avoid floating-input leakage; (2) using 5 V signals on a bank configured for 3.3 V VCCIO - this destroys the I/O; (3) failing to provide a clean CONFIG_DONE pull-up and proper nCONFIG/nSTATUS sequencing, which can prevent boot; (4) treating 'C5' and 'C6' speed grades as interchangeable in timing-closure - timing must be re-run if grade changes. Confirm with Quartus II timing analyzer output before tape-out.
Place the configuration flash and configuration mode jumpers (MSEL pins) within 50 mm of the FPGA. Use a 4-layer minimum PCB with continuous reference (ground) planes under all BGA fan-out traces to control impedance. JTAG chain pinout (TCK/TMS/TDO/TDI) must be brought to a standard 0.1 inch header or USB-Blaster pinout connector for programming access. Avoid routing clock signals across split planes or over the FBGA break-out region - both degrade jitter performance on the dedicated PLL inputs.
Compliance Information
Stratix I devices were launched before RoHS was widely adopted. The 'N' suffix variants (e.g., EP1S10F780C5N) typically indicate lead-free reflow-compatible packaging. Verify compliance directly with Altera/Intel or your distributor's product declaration.
