EP1S10F780C5N - Stratix 10570 Cells FPGA, 780-FBGA | Intel (Altera)
MPN: EP1S10F780C5N ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $262.5 | $2,625.00 |
| 100 | $238 | $23,800.00 |
| 500 | $215.5 | $107,750.00 |
| 1,000 | $195 | $195,000.00 |
Drop-in alternatives for EP1S10F780C5N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1S10F780C5
✅ Drop-In✓ In Stock
$460 / Unit
View Datasheet →EP1S10F780C7N
✅ Drop-In✓ In Stock
$96.2 / Unit
View Datasheet →EP1S20F780C5N
✅ Drop-In✓ In Stock
$92 / Unit
View Datasheet →EP1S25F780C5N
✅ Drop-In✓ In Stock
$595 / Unit
View Datasheet →EP1S30F780C5N
✅ Drop-In📋 Reference alternative (not in catalog)
EP1S10F780C6N
✅ Drop-In✓ In Stock
$205 / Unit
View Datasheet →EP1S10F780C5N Maximum Ratings & Electrical Characteristics
| Family | Stratix |
| Logic Elements | 10570 |
| Total RAM Bits | 920448 |
| User I/O Count | 426 |
| Core Voltage | 1.5 V |
| Operating Temperature | 0C to +85C (Commercial) |
| Package | 780-ball FBGA (29 x 29 mm, 1 mm pitch) |
| Process Technology | 130 nm CMOS |
| Internal Operating Frequency (max) | 500 MHz |
| DSP Blocks | 12 (per family datasheet) |
| Configuration Modes | Passive Serial, Active Serial, JTAG |
| I/O Standards Supported | LVTTL, LVCMOS, PCI, SSTL, LVDS (per family datasheet) |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant (N suffix) |
| Lead-Free | Yes |
| Speed Grade | C5 |
EP1S10F780C5N 780-ball fbga (29 x 29 mm, 1 mm pitch) Pin Configuration Guide
Complete pinout information for EP1S10F780C5N (780-ball fbga (29 x 29 mm, 1 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1S10F780C5N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1S10F780C5N is suitable for 6 applications: Telecommunications Line Card Processing, DSP Pre-Processing and Filtering, Industrial Machine Vision Pre-Processor, Network Aggregation Switch Fabric, Test and Measurement Instrumentation, Military/Aerospace Signal Processing Prototypes.
Telecommunications Line Card Processing
The EP1S10F780C5N's 10,570 logic elements, 920 Kbits of embedded TriMatrix RAM, and 12 dedicated DSP blocks make it well suited to telecom line-card datapath processing where parallel channel aggregation and ingress buffering must coexist on a single fabric. Its 426 user I/Os accommodate multiple SFI/SPI ribbon connections plus external PHY interfaces without an external bridge ASIC. The 500 MHz internal operating frequency supports serialization/deserialization glue logic between framers and network processors, while the 780-FBGA package provides the I/O density required for 8-16 channel line cards. Pin-compatible Stratix siblings (EP1S20, EP1S25) let the same PCB host higher-density variants when channel count scales, preserving board design investment across product tiers.
Recommended
DSP Pre-Processing and Filtering
With 12 dedicated hardware DSP blocks running at up to 500 MHz internal frequency, the EP1S10F780C5N delivers sustained multiply-accumulate throughput suitable for FIR filtering, FFT pre-processing, and adaptive equalization in baseband signal chains. The TriMatrix memory blocks (M512, M4K, M-RAM) provide low-latency coefficient storage directly adjacent to the DSP blocks, eliminating external memory round-trips and reducing pipeline stalls. Compared with a software DSP, this fabric offers deterministic latency critical for control loops in motor drives, radar signal conditioning, and software-defined radio front-ends. Quartus II IP cores for FFT, FIR, and NCO accelerate the design entry path.
Recommended
Industrial Machine Vision Pre-Processor
The EP1S10F780C5N combines 426 user I/Os with 920 Kbits of embedded RAM to handle multi-camera LVDS ingest plus on-fabric buffering in industrial machine-vision pre-processors. The 780-FBGA package supports the high pin count required for parallel Camera Link, LVDS, or MIPI-CSI2 aggregation; LVDS I/O standards are natively supported per the Stratix family datasheet. Embedded memory eliminates the latency of off-chip DDR access for line-buffer operations, while the DSP blocks accelerate convolution kernels for edge detection and thresholding at line rate. Commercial 0C-85C operation is suitable for factory-floor enclosures with controlled airflow.
Recommended
Network Aggregation Switch Fabric
In network aggregation switches, the EP1S10F780C5N serves as a custom queuing/classification engine alongside merchant switch ASICs. The 426 user I/Os accommodate multiple SGMII, SPI-3, or POS-PHY ribbon interfaces, while the embedded TriMatrix blocks implement deep packet queues without external SRAM. The 500 MHz core supports line-rate table lookups for ACL and QoS classification. The pin-compatible EP1S20/25/30 variants in the same 780-FBGA enable aggregation-tier scaling on a single PCB, preserving layout investment when port count grows. Quartus II MegaWizard IP accelerates queue manager and TCAM-like lookup implementation.
Recommended
Test and Measurement Instrumentation
The EP1S10F780C5N fits bench-top and ATE-style instrumentation where parallel DSP, deep pattern memory, and flexible I/O are required to generate and analyze wide parallel buses. The 500 MHz internal clock with PLL-driven phase shifting supports precise timing generation across 426 I/Os, while 920 Kbits of embedded RAM implements deep pattern storage for protocol-aware test sequences. The 780-FBGA exposes enough I/O for 32-bit or 64-bit parallel stimulus paths plus trigger and clocking rails. LVDS support enables direct connection to high-speed A/D and D/A converters without external buffering.
Recommended
Military/Aerospace Signal Processing Prototypes
While the EP1S10F780C5N itself is only commercial-grade (0C-85C), it is widely used as a low-cost prototype vehicle for military/aerospace DSP algorithm development that will eventually migrate to radiation-hardened or industrial-temperature variants. The 12 DSP blocks at 500 MHz are sufficient to validate radar pulse-compression, EW receiver channelization, and SIGINT pre-processing algorithms before committing to qualified parts. The 780-FBGA package mirrors that of higher-density Stratix siblings, easing migration to EP1S25/EP1S30 in production. Existing IP cores from previous programs can be reused without re-architecting around a different fabric.
Recommended
Recommended Products Summary
Engineering reference data for EP1S10F780C5N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1S10F780C5 | EP1S10F780C7N | EP1S20F780C5N | EP1S25F780C5N | EP1S30F780C5N | EP1S10F780C6N |
|---|---|---|---|---|---|---|---|
| Package | 780-FBGA (29x29 mm) | 780-FBGA (29x29 mm) - same | 780-FBGA (29x29 mm) - same | 780-FBGA (29x29 mm) - same | 780-FBGA (29x29 mm) - same | 780-FBGA (29x29 mm) - same | 780-FBGA (29x29 mm) - same |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Logic Elements | 10570 | 10570 | 10570 | 18460 | 25660 | 32470 | 10570 |
| Total RAM Bits | 920448 | 920448 | 920448 | 1669248 | 1944576 | 3317344 | 920448 |
| User I/O Count | 426 | 426 | 426 | 426 | 426 | 426 | 426 |
| Speed Grade | C5 | C5 | C7 (faster) | C5 | C5 | C5 | C6 (slower) |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Lead-Free / RoHS | Yes (N suffix) | No (no N suffix) | Yes | Yes | Yes | Yes | Yes |
| Lifecycle Status | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy |
Key Differentiators
- Lowest-cost entry into the Stratix I 780-FBGA family (vs EP1S20F780C5N / EP1S25F780C5N / EP1S30F780C5N)
- Mid-speed C5 grade balances timing margin and cost (vs EP1S10F780C7N)
- Pin-compatible scaling path to higher densities on same PCB (vs Smaller-package Stratix variants like EP1S10F484)
Design Notes
Estimated: At sustained high toggle rates (e.g. 80% of 426 I/Os at 100 MHz, 3.3V LVTTL), the EP1S10F780C5N can dissipate 4-6W. The 780-FBGA package exposes a thermal pad but no integrated heatsink; design the PCB with at least 4 thermal vias under the central die flag and a top-side copper pour of 4 sq.cm or larger. Commercial 0C-85C rating requires derating from 85C ambient at typical theta_JA values of 12-15 C/W (with proper thermal via array), so 4W dissipation yields a junction temperature rise of roughly 48-60C. Add 200 LFM airflow if your application runs the fabric at high utilization continuously.
The 780-FBGA's 1 mm ball pitch demands 4-6 layer PCB stackup with 0.5 oz copper on outer layers and 1 oz on inner planes, using 8 mil microvias and laser-drilled capture pads per IPC-6012 Class 3. Route all 426 user I/Os on the top layer when possible, fanning out into inner stripline layers for cross-FPGA connections. Maintain 100 ohm differential impedance for LVDS pairs (length-matched within 25 mil) and 50 ohm single-ended for clock outputs. Decouple each VCCINT/VCCIO bank pair with one 0.1 uF X7R plus one 10 uF tantalum placed within 100 mil of the package edge.
Do NOT attempt to use EP1S10F780C5N in new designs in 2026 because the part is in Last Time Buy status. Quartus II 13.0 is the last official release supporting Stratix I, and Quartus Prime (the modern toolchain) does not support this family - meaning your team is locked to legacy EDA software. Migration paths to Cyclone IV/V, MAX V, or Stratix II require PCB redesign and full Quartus recompilation but yield 50-70% power reduction and active lifecycle support. Also note that the 'N' suffix denotes lead-free terminal finish per RoHS; the non-N variant EP1S10F780C5 uses SnPb balls and may be restricted in RoHS-jurisdiction products.
Stratix I PLL placement is constrained - consult the Quartus II pin planner before locking board pinout because not every general-purpose I/O can serve as a PLL clock input. Differential I/O pairs must use the dedicated CLK or LVDS-capable pin pairs; randomly pairing single-ended I/Os will fail timing closure. The 780-FBGA has dedicated JTAG pins (TCK, TMS, TDI, TDO, TRST) that should be brought out to a header for in-system programming - even production designs benefit from JTAG access for boundary-scan and field upgrades.
Compliance Information
RoHS compliance inferred from 'N' suffix in MPN per Altera/Intel part numbering convention. Halogen-free status not explicitly stated in available web data. AEC-Q100 not applicable - this is a commercial-grade FPGA. Conflict minerals compliance per Intel Programmable Solutions Group policy.
