EP1S25F1020C5 - Stratix 25K LE FPGA 1020-BGA | Altera / Intel
Артикул: EP1S25F1020C5 ✗ Снят с производства| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $871.2 | $871,20 |
| 10 | $820 | $8.200,00 |
| 100 | $760 | $76.000,00 |
| 500 | $705 | $352.500,00 |
| 1.000 | $650 | $650.000,00 |
EP1S25F1020C5 Обзор
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that sits within the semiconductor hierarchy between fixed-function ASICs and software-driven processors. It contains an array of configurable logic blocks (LABs), embedded memory blocks, DSP blocks, and programmable routing, all of which are customized by the user via a hardware description language (HDL) such as VHDL or Verilog. Stratix-class FPGAs are positioned above CPLDs and below ASICs in performance, density, and cost, and are commonly used as prototyping vehicles, mid-volume production logic, and signal-processing engines.
Key features of the EP1S25F1020C5 include 2,566 Logic Array Blocks (LABs), up to 500 MHz internal operation, dedicated DSP blocks for high-speed multiply-accumulate operations, embedded TriMatrix memory of 1.94 Mbits, and four phase-locked loops (PLLs) for clock management. The device supports high-speed external memory interfaces including DDR SDRAM, FCRAM, QDR SRAM, and RLDRAM through dedicated PHY circuitry.
Architecturally, the Stratix family integrates hard intellectual property (IP) blocks such as DSP blocks and high-speed transceivers (where applicable), reducing the need for soft logic implementation of common functions. The 130 nm process node balances density and power, while the FC-FBGA 1020-ball package provides the high pin count required for parallel digital buses and memory interfaces. The 'C5' speed grade indicates a specific timing closure tier; 'N' suffix versions add lead-free compliance.
Typical applications include high-performance digital signal processing, telecom baseband processing, video and image processing pipelines, ASIC prototyping, and high-bandwidth data acquisition. The combination of DSP blocks, embedded memory, and high I/O count also suits the device for industrial control and test equipment.
When designing with this part, ensure that PCB layout accommodates the 1020-ball FC-FBGA land pattern with controlled-impedance routing, decoupling capacitors placed within the package breakout region, and a robust multi-rail power distribution network. Quartus II development software is required for synthesis, place-and-route, and bitstream generation.
This page synthesizes distributor pricing, drop-in alternative candidates, and design guidance that complements the manufacturer datasheet for engineers evaluating the EP1S25F1020C5 against modern FPGA alternatives.
Аналоги без доработки для EP1S25F1020C5 — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с EP1S25F1020C5 (тот же форм-фактор и посадочное место) — отличается по Operating Temperature, DSP Blocks, Package, Mounting Type, Speed Grade.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
EP1S25F1020C6
✅ Прямая замена✓ В наличии
$425 / шт.
Открыть даташит →EP1S25F1020C7
✅ Прямая замена✓ В наличии
$820 / шт.
Открыть даташит →EP1S25F1020I7
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
EP1S25F1020C5N
✅ Прямая замена✓ В наличии
$640 / шт.
Открыть даташит →EP1S25F1020C6N
✅ Прямая замена✓ В наличии
$450 / шт.
Открыть даташит →EP1S25F1020C7N
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
EP1S25F1020I7N
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
EP1S25F1020C5 Максимальные параметры и электрические характеристики
| Family | Stratix |
| Logic Elements | 25,660 |
| Logic Array Blocks (LABs) | 2,566 |
| Embedded Memory | 1,944,576 bits (1.94 Mbits) |
| User I/Os | 706 |
| Process Technology | 130 nm CMOS |
| Core Voltage | 1.5 V |
| Maximum Internal Frequency | 500 MHz |
| Speed Grade | C5 |
| Temperature Grade | Commercial Extended |
| Корпус | 1020-ball FC-FBGA |
| Тип монтажа | Surface Mount (Flip-Chip BGA) |
| Number of PLLs | 4 |
| DSP Blocks | Yes (dedicated multiply-accumulate) |
| Memory Interfaces Supported | DDR SDRAM, FCRAM, QDR SRAM, RLDRAM |
Руководство по цоколевке EP1S25F1020C5 в корпусе 1020-ball fc-fbga
Цоколевка для EP1S25F1020C5 (корпус 1020-ball fc-fbga). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.
Нет подробных данных о распиновке для EP1S25F1020C5.
Обратитесь к даташиту для полной конфигурации выводов.
Типичное применение
EP1S25F1020C5 подходит для 6 применениеs: High-Performance Digital Signal Processing, Telecom Baseband Processing, ASIC Prototyping and Emulation, Video and Image Processing, High-Bandwidth Data Acquisition, Industrial Control Systems.
High-Performance Digital Signal Processing
The EP1S25F1020C5's dedicated DSP blocks and 500 MHz maximum internal frequency make it suitable for high-throughput DSP pipelines. Its 25,660 logic elements and 1.94 Mbits of embedded memory support parallel filter architectures, FFT engines, and channelizers. Designers typically place the device on a 6-layer PCB with controlled-impedance routing for LVDS pairs interfacing to high-speed ADCs. Unlike smaller FPGAs, the EP1S25F1020C5 sustains multi-channel DSP workloads without external logic. Quartus II MegaWizard Plug-In Manager provides parameterized DSP block instantiation for FIR, CIC, and NCO functions.
Рекомендуется
Telecom Baseband Processing
Telecommunications infrastructure requires FPGAs that can handle multi-gigabit serial links, baseband modulation, and forward error correction. The EP1S25F1020C5's 706 user I/Os accommodate parallel RapidIO or POS-PHY interfaces, while its PLLs generate low-jitter clocks for serializer/deserializer functions. The 130 nm process node offers a mature, well-characterized silicon foundation for long-lifecycle telecom deployments. Compared with discrete ASIC implementations, the Stratix family provides time-to-market advantages for evolving standards such as W-CDMA and LTE.
Рекомендуется
ASIC Prototyping and Emulation
The 25,660 logic elements and 1.94 Mbits of embedded memory make the EP1S25F1020C5 a viable vehicle for ASIC prototyping, allowing multi-million-gate designs to be partitioned across multiple Stratix devices. Its 706 user I/Os support high-pin-count ASIC emulation boards, while Quartus II synthesis and place-and-route tools provide Verilog/VHDL compatibility. Compared to ASIC fabrication, FPGA prototyping cuts development cycles from months to weeks, with the trade-off of higher per-unit cost and lower raw performance. The Stratix I family's high logic density reduces the number of devices in multi-FPGA prototyping arrays.
Рекомендуется
Video and Image Processing
The EP1S25F1020C5 supports real-time video processing pipelines, including SD/HD video format conversion, scaling, de-interlacing, and color space conversion. The embedded memory bandwidth supports intermediate frame buffering without external SDRAM, while the DSP blocks accelerate motion estimation and video codec preprocessing. Its 706 user I/Os accept multiple parallel video data streams and BT.656/BT.1120 interfaces. Designers typically pair this FPGA with external DDR SDRAM for full-HD frame buffers, leveraging the device's dedicated DDR PHY.
Рекомендуется
High-Bandwidth Data Acquisition
The EP1S25F1020C5 suits multi-channel data acquisition systems where 14-16 bit ADCs stream parallel LVDS data into the FPGA at hundreds of MSPS. The 706 user I/Os and high LVDS count accommodate 8+ channel systems, while the 1.94 Mbits of embedded memory hold acquisition windows before DMA transfer to host memory. The dedicated PLLs reduce jitter on ADC clock generation, and the DSP blocks perform real-time channel calibration. Compared with smaller FPGAs, the EP1S25F1020C5 supports larger on-chip FFT pre-processing, reducing host CPU loading.
Рекомендуется
Industrial Control Systems
The EP1S25F1020C5's deterministic latency and parallel I/O capability suit industrial motion controllers, programmable logic controllers (PLCs), and machine vision systems. Its 4 PLLs generate precise multi-axis timing signals, and the dedicated DSP blocks execute real-time control loops at sub-microsecond intervals. The 1020-ball FC-FBGA package supports multi-axis encoder feedback, while embedded memory holds motion profiles and lookup tables. Compared with microcontroller-based solutions, the FPGA architecture achieves deterministic cycle times for high-speed deterministic control.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для EP1S25F1020C5 — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | EP1S25F1020C6 | EP1S25F1020C7 | EP1S25F1020I7 | EP1S25F1020C5N |
|---|---|---|---|---|---|
| Package | 1020-ball FC-FBGA | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same |
| Brand | Altera (Intel) | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same |
| Speed Grade | C5 | C6 (slower) | C7 (slowest) | I7 (industrial temp) | C5 (same speed) |
| Logic Elements | 25,660 | 25,660 - same | 25,660 - same | 25,660 - same | 25,660 - same |
| User I/Os | 706 | 706 - same | 706 - same | 706 - same | 706 - same |
| Embedded Memory | 1,944,576 bits | 1,944,576 bits - same | 1,944,576 bits - same | 1,944,576 bits - same | 1,944,576 bits - same |
| Temperature Grade | Commercial Extended | Commercial Extended | Commercial Extended | Industrial | Commercial Extended |
Ключевые отличия
- Same silicon, slower speed grade (против EP1S25F1020C6)
- RoHS compliance variant (против EP1S25F1020C5N)
- Industrial temperature option (против EP1S25F1020I7)
Заметки по проектированию
The 1020-ball FC-FBGA package requires a PCB with microvia (laser-drilled) technology or via-in-pad construction to fan out signals. Use 0.4 mm or 0.5 mm pitch BGA land patterns per IPC-7351. Power decoupling requires 0.1 uF X7R ceramics within 2 mm of each power/ground ball pair, plus 10 uF bulk capacitors on each supply rail. Controlled-impedance routing (50 ohm single-ended, 100 ohm differential) must be verified with a 3D field solver for LVDS pairs above 500 Mbps.
Estimated: at full utilization (25,660 LEs switching at 100 MHz with 50% toggle rate), the EP1S25F1020C5 dissipates approximately 5-8 W. The FC-FBGA package has a theta_JA of approximately 8-12 C/W with 4 thermal balls and proper PCB thermal via array. A minimum 6-layer PCB with 2 oz copper on inner power/ground planes and a thermal via farm beneath the package is required for reliable operation. Without these measures, junction temperature can exceed 100 C in commercial extended grade.
Do not confuse the EP1S25F1020C5 with the EP1S25F780C5 (780-ball FBGA, fewer I/Os) - they share the same silicon die but different package pinouts and are NOT pin-compatible. Configuration mode (PS, AS, JTAG) must be selected via MSEL pins before power-up. JTAG chain ordering matters when multiple Altera devices share a single TCK/TMS line - keep chain length under 10 devices for signal integrity.
Информация о соответствии
Compliance data not present in the verified web data. EP1S25F1020C5N suffix variants are explicitly lead-free per standard Altera naming convention; the standard EP1S25F1020C5 may be either leaded or lead-free depending on assembly date - confirm with the distributor's Certificate of Conformance before placing in RoHS-restricted designs.