EP1S25F1020C5 - Stratix 25K LE FPGA 1020-BGA | Altera / Intel
MPN: EP1S25F1020C5 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $871.2 | $871.20 |
| 10 | $820 | $8,200.00 |
| 100 | $760 | $76,000.00 |
| 500 | $705 | $352,500.00 |
| 1,000 | $650 | $650,000.00 |
Drop-in alternatives for EP1S25F1020C5 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1S25F1020C6
✅ Drop-In✓ In Stock
$425 / Unit
View Datasheet →EP1S25F1020C7
✅ Drop-In✓ In Stock
$820 / Unit
View Datasheet →EP1S25F1020I7
✅ Drop-In📋 Reference alternative (not in catalog)
EP1S25F1020C5N
✅ Drop-In✓ In Stock
$640 / Unit
View Datasheet →EP1S25F1020C6N
✅ Drop-In✓ In Stock
$450 / Unit
View Datasheet →EP1S25F1020C7N
✅ Drop-In📋 Reference alternative (not in catalog)
EP1S25F1020I7N
✅ Drop-In📋 Reference alternative (not in catalog)
EP1S25F1020C5 Maximum Ratings & Electrical Characteristics
| Family | Stratix |
| Logic Elements | 25,660 |
| Logic Array Blocks (LABs) | 2,566 |
| Embedded Memory | 1,944,576 bits (1.94 Mbits) |
| User I/Os | 706 |
| Process Technology | 130 nm CMOS |
| Core Voltage | 1.5 V |
| Maximum Internal Frequency | 500 MHz |
| Speed Grade | C5 |
| Temperature Grade | Commercial Extended |
| Package | 1020-ball FC-FBGA |
| Mounting Type | Surface Mount (Flip-Chip BGA) |
| Number of PLLs | 4 |
| DSP Blocks | Yes (dedicated multiply-accumulate) |
| Memory Interfaces Supported | DDR SDRAM, FCRAM, QDR SRAM, RLDRAM |
EP1S25F1020C5 1020-ball fc-fbga Pin Configuration Guide
Complete pinout information for EP1S25F1020C5 (1020-ball fc-fbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1S25F1020C5.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1S25F1020C5 is suitable for 6 applications: High-Performance Digital Signal Processing, Telecom Baseband Processing, ASIC Prototyping and Emulation, Video and Image Processing, High-Bandwidth Data Acquisition, Industrial Control Systems.
High-Performance Digital Signal Processing
The EP1S25F1020C5's dedicated DSP blocks and 500 MHz maximum internal frequency make it suitable for high-throughput DSP pipelines. Its 25,660 logic elements and 1.94 Mbits of embedded memory support parallel filter architectures, FFT engines, and channelizers. Designers typically place the device on a 6-layer PCB with controlled-impedance routing for LVDS pairs interfacing to high-speed ADCs. Unlike smaller FPGAs, the EP1S25F1020C5 sustains multi-channel DSP workloads without external logic. Quartus II MegaWizard Plug-In Manager provides parameterized DSP block instantiation for FIR, CIC, and NCO functions.
Recommended
Telecom Baseband Processing
Telecommunications infrastructure requires FPGAs that can handle multi-gigabit serial links, baseband modulation, and forward error correction. The EP1S25F1020C5's 706 user I/Os accommodate parallel RapidIO or POS-PHY interfaces, while its PLLs generate low-jitter clocks for serializer/deserializer functions. The 130 nm process node offers a mature, well-characterized silicon foundation for long-lifecycle telecom deployments. Compared with discrete ASIC implementations, the Stratix family provides time-to-market advantages for evolving standards such as W-CDMA and LTE.
Recommended
ASIC Prototyping and Emulation
The 25,660 logic elements and 1.94 Mbits of embedded memory make the EP1S25F1020C5 a viable vehicle for ASIC prototyping, allowing multi-million-gate designs to be partitioned across multiple Stratix devices. Its 706 user I/Os support high-pin-count ASIC emulation boards, while Quartus II synthesis and place-and-route tools provide Verilog/VHDL compatibility. Compared to ASIC fabrication, FPGA prototyping cuts development cycles from months to weeks, with the trade-off of higher per-unit cost and lower raw performance. The Stratix I family's high logic density reduces the number of devices in multi-FPGA prototyping arrays.
Recommended
Video and Image Processing
The EP1S25F1020C5 supports real-time video processing pipelines, including SD/HD video format conversion, scaling, de-interlacing, and color space conversion. The embedded memory bandwidth supports intermediate frame buffering without external SDRAM, while the DSP blocks accelerate motion estimation and video codec preprocessing. Its 706 user I/Os accept multiple parallel video data streams and BT.656/BT.1120 interfaces. Designers typically pair this FPGA with external DDR SDRAM for full-HD frame buffers, leveraging the device's dedicated DDR PHY.
Recommended
High-Bandwidth Data Acquisition
The EP1S25F1020C5 suits multi-channel data acquisition systems where 14-16 bit ADCs stream parallel LVDS data into the FPGA at hundreds of MSPS. The 706 user I/Os and high LVDS count accommodate 8+ channel systems, while the 1.94 Mbits of embedded memory hold acquisition windows before DMA transfer to host memory. The dedicated PLLs reduce jitter on ADC clock generation, and the DSP blocks perform real-time channel calibration. Compared with smaller FPGAs, the EP1S25F1020C5 supports larger on-chip FFT pre-processing, reducing host CPU loading.
Recommended
Industrial Control Systems
The EP1S25F1020C5's deterministic latency and parallel I/O capability suit industrial motion controllers, programmable logic controllers (PLCs), and machine vision systems. Its 4 PLLs generate precise multi-axis timing signals, and the dedicated DSP blocks execute real-time control loops at sub-microsecond intervals. The 1020-ball FC-FBGA package supports multi-axis encoder feedback, while embedded memory holds motion profiles and lookup tables. Compared with microcontroller-based solutions, the FPGA architecture achieves deterministic cycle times for high-speed deterministic control.
Recommended
Recommended Products Summary
Engineering reference data for EP1S25F1020C5 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1S25F1020C6 | EP1S25F1020C7 | EP1S25F1020I7 | EP1S25F1020C5N |
|---|---|---|---|---|---|
| Package | 1020-ball FC-FBGA | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same |
| Brand | Altera (Intel) | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same |
| Speed Grade | C5 | C6 (slower) | C7 (slowest) | I7 (industrial temp) | C5 (same speed) |
| Logic Elements | 25,660 | 25,660 - same | 25,660 - same | 25,660 - same | 25,660 - same |
| User I/Os | 706 | 706 - same | 706 - same | 706 - same | 706 - same |
| Embedded Memory | 1,944,576 bits | 1,944,576 bits - same | 1,944,576 bits - same | 1,944,576 bits - same | 1,944,576 bits - same |
| Temperature Grade | Commercial Extended | Commercial Extended | Commercial Extended | Industrial | Commercial Extended |
| RoHS/Lead-Free | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | Yes (N suffix denotes lead-free) |
Key Differentiators
- Same silicon, slower speed grade (vs EP1S25F1020C6)
- RoHS compliance variant (vs EP1S25F1020C5N)
- Industrial temperature option (vs EP1S25F1020I7)
Design Notes
The 1020-ball FC-FBGA package requires a PCB with microvia (laser-drilled) technology or via-in-pad construction to fan out signals. Use 0.4 mm or 0.5 mm pitch BGA land patterns per IPC-7351. Power decoupling requires 0.1 uF X7R ceramics within 2 mm of each power/ground ball pair, plus 10 uF bulk capacitors on each supply rail. Controlled-impedance routing (50 ohm single-ended, 100 ohm differential) must be verified with a 3D field solver for LVDS pairs above 500 Mbps.
Estimated: at full utilization (25,660 LEs switching at 100 MHz with 50% toggle rate), the EP1S25F1020C5 dissipates approximately 5-8 W. The FC-FBGA package has a theta_JA of approximately 8-12 C/W with 4 thermal balls and proper PCB thermal via array. A minimum 6-layer PCB with 2 oz copper on inner power/ground planes and a thermal via farm beneath the package is required for reliable operation. Without these measures, junction temperature can exceed 100 C in commercial extended grade.
Do not confuse the EP1S25F1020C5 with the EP1S25F780C5 (780-ball FBGA, fewer I/Os) - they share the same silicon die but different package pinouts and are NOT pin-compatible. Configuration mode (PS, AS, JTAG) must be selected via MSEL pins before power-up. JTAG chain ordering matters when multiple Altera devices share a single TCK/TMS line - keep chain length under 10 devices for signal integrity.
Compliance Information
Compliance data not present in the verified web data. EP1S25F1020C5N suffix variants are explicitly lead-free per standard Altera naming convention; the standard EP1S25F1020C5 may be either leaded or lead-free depending on assembly date - confirm with the distributor's Certificate of Conformance before placing in RoHS-restricted designs.
