EP1S25F1020C5 - Stratix 25K LE FPGA 1020-BGA | Altera / Intel
부품 번호: EP1S25F1020C5 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $871.2 | $871.20 |
| 10 | $820 | $8,200.00 |
| 100 | $760 | $76,000.00 |
| 500 | $705 | $352,500.00 |
| 1,000 | $650 | $650,000.00 |
EP1S25F1020C5 개요
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that sits within the semiconductor hierarchy between fixed-function ASICs and software-driven processors. It contains an array of configurable logic blocks (LABs), embedded memory blocks, DSP blocks, and programmable routing, all of which are customized by the user via a hardware description language (HDL) such as VHDL or Verilog. Stratix-class FPGAs are positioned above CPLDs and below ASICs in performance, density, and cost, and are commonly used as prototyping vehicles, mid-volume production logic, and signal-processing engines.
Key features of the EP1S25F1020C5 include 2,566 Logic Array Blocks (LABs), up to 500 MHz internal operation, dedicated DSP blocks for high-speed multiply-accumulate operations, embedded TriMatrix memory of 1.94 Mbits, and four phase-locked loops (PLLs) for clock management. The device supports high-speed external memory interfaces including DDR SDRAM, FCRAM, QDR SRAM, and RLDRAM through dedicated PHY circuitry.
Architecturally, the Stratix family integrates hard intellectual property (IP) blocks such as DSP blocks and high-speed transceivers (where applicable), reducing the need for soft logic implementation of common functions. The 130 nm process node balances density and power, while the FC-FBGA 1020-ball package provides the high pin count required for parallel digital buses and memory interfaces. The 'C5' speed grade indicates a specific timing closure tier; 'N' suffix versions add lead-free compliance.
Typical applications include high-performance digital signal processing, telecom baseband processing, video and image processing pipelines, ASIC prototyping, and high-bandwidth data acquisition. The combination of DSP blocks, embedded memory, and high I/O count also suits the device for industrial control and test equipment.
When designing with this part, ensure that PCB layout accommodates the 1020-ball FC-FBGA land pattern with controlled-impedance routing, decoupling capacitors placed within the package breakout region, and a robust multi-rail power distribution network. Quartus II development software is required for synthesis, place-and-route, and bitstream generation.
This page synthesizes distributor pricing, drop-in alternative candidates, and design guidance that complements the manufacturer datasheet for engineers evaluating the EP1S25F1020C5 against modern FPGA alternatives.
드롭인 대체품: EP1S25F1020C5 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP1S25F1020C5 (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, DSP Blocks, Package, Mounting Type, Speed Grade.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP1S25F1020C6
✅ 드롭인✓ 재고 있음
$425 / 개
데이터시트 보기 →EP1S25F1020C7
✅ 드롭인✓ 재고 있음
$820 / 개
데이터시트 보기 →EP1S25F1020I7
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP1S25F1020C5N
✅ 드롭인✓ 재고 있음
$640 / 개
데이터시트 보기 →EP1S25F1020C6N
✅ 드롭인✓ 재고 있음
$450 / 개
데이터시트 보기 →EP1S25F1020C7N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP1S25F1020I7N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP1S25F1020C5 최대 정격 & 전기적 특성
| Family | Stratix |
| Logic Elements | 25,660 |
| Logic Array Blocks (LABs) | 2,566 |
| Embedded Memory | 1,944,576 bits (1.94 Mbits) |
| User I/Os | 706 |
| Process Technology | 130 nm CMOS |
| Core Voltage | 1.5 V |
| Maximum Internal Frequency | 500 MHz |
| Speed Grade | C5 |
| Temperature Grade | Commercial Extended |
| 패키지 | 1020-ball FC-FBGA |
| 실장 유형 | Surface Mount (Flip-Chip BGA) |
| Number of PLLs | 4 |
| DSP Blocks | Yes (dedicated multiply-accumulate) |
| Memory Interfaces Supported | DDR SDRAM, FCRAM, QDR SRAM, RLDRAM |
EP1S25F1020C5 1020-ball fc-fbga 핀 구성 가이드
EP1S25F1020C5(1020-ball fc-fbga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP1S25F1020C5.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP1S25F1020C5 적합 용도: 6 애플리케이션s: High-Performance Digital Signal Processing, Telecom Baseband Processing, ASIC Prototyping and Emulation, Video and Image Processing, High-Bandwidth Data Acquisition, Industrial Control Systems.
High-Performance Digital Signal Processing
The EP1S25F1020C5's dedicated DSP blocks and 500 MHz maximum internal frequency make it suitable for high-throughput DSP pipelines. Its 25,660 logic elements and 1.94 Mbits of embedded memory support parallel filter architectures, FFT engines, and channelizers. Designers typically place the device on a 6-layer PCB with controlled-impedance routing for LVDS pairs interfacing to high-speed ADCs. Unlike smaller FPGAs, the EP1S25F1020C5 sustains multi-channel DSP workloads without external logic. Quartus II MegaWizard Plug-In Manager provides parameterized DSP block instantiation for FIR, CIC, and NCO functions.
추천
Telecom Baseband Processing
Telecommunications infrastructure requires FPGAs that can handle multi-gigabit serial links, baseband modulation, and forward error correction. The EP1S25F1020C5's 706 user I/Os accommodate parallel RapidIO or POS-PHY interfaces, while its PLLs generate low-jitter clocks for serializer/deserializer functions. The 130 nm process node offers a mature, well-characterized silicon foundation for long-lifecycle telecom deployments. Compared with discrete ASIC implementations, the Stratix family provides time-to-market advantages for evolving standards such as W-CDMA and LTE.
추천
ASIC Prototyping and Emulation
The 25,660 logic elements and 1.94 Mbits of embedded memory make the EP1S25F1020C5 a viable vehicle for ASIC prototyping, allowing multi-million-gate designs to be partitioned across multiple Stratix devices. Its 706 user I/Os support high-pin-count ASIC emulation boards, while Quartus II synthesis and place-and-route tools provide Verilog/VHDL compatibility. Compared to ASIC fabrication, FPGA prototyping cuts development cycles from months to weeks, with the trade-off of higher per-unit cost and lower raw performance. The Stratix I family's high logic density reduces the number of devices in multi-FPGA prototyping arrays.
추천
Video and Image Processing
The EP1S25F1020C5 supports real-time video processing pipelines, including SD/HD video format conversion, scaling, de-interlacing, and color space conversion. The embedded memory bandwidth supports intermediate frame buffering without external SDRAM, while the DSP blocks accelerate motion estimation and video codec preprocessing. Its 706 user I/Os accept multiple parallel video data streams and BT.656/BT.1120 interfaces. Designers typically pair this FPGA with external DDR SDRAM for full-HD frame buffers, leveraging the device's dedicated DDR PHY.
추천
High-Bandwidth Data Acquisition
The EP1S25F1020C5 suits multi-channel data acquisition systems where 14-16 bit ADCs stream parallel LVDS data into the FPGA at hundreds of MSPS. The 706 user I/Os and high LVDS count accommodate 8+ channel systems, while the 1.94 Mbits of embedded memory hold acquisition windows before DMA transfer to host memory. The dedicated PLLs reduce jitter on ADC clock generation, and the DSP blocks perform real-time channel calibration. Compared with smaller FPGAs, the EP1S25F1020C5 supports larger on-chip FFT pre-processing, reducing host CPU loading.
추천
Industrial Control Systems
The EP1S25F1020C5's deterministic latency and parallel I/O capability suit industrial motion controllers, programmable logic controllers (PLCs), and machine vision systems. Its 4 PLLs generate precise multi-axis timing signals, and the dedicated DSP blocks execute real-time control loops at sub-microsecond intervals. The 1020-ball FC-FBGA package supports multi-axis encoder feedback, while embedded memory holds motion profiles and lookup tables. Compared with microcontroller-based solutions, the FPGA architecture achieves deterministic cycle times for high-speed deterministic control.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP1S25F1020C5 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP1S25F1020C6 | EP1S25F1020C7 | EP1S25F1020I7 | EP1S25F1020C5N |
|---|---|---|---|---|---|
| Package | 1020-ball FC-FBGA | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same |
| Brand | Altera (Intel) | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same |
| Speed Grade | C5 | C6 (slower) | C7 (slowest) | I7 (industrial temp) | C5 (same speed) |
| Logic Elements | 25,660 | 25,660 - same | 25,660 - same | 25,660 - same | 25,660 - same |
| User I/Os | 706 | 706 - same | 706 - same | 706 - same | 706 - same |
| Embedded Memory | 1,944,576 bits | 1,944,576 bits - same | 1,944,576 bits - same | 1,944,576 bits - same | 1,944,576 bits - same |
| Temperature Grade | Commercial Extended | Commercial Extended | Commercial Extended | Industrial | Commercial Extended |
주요 차별점
- Same silicon, slower speed grade (vs EP1S25F1020C6)
- RoHS compliance variant (vs EP1S25F1020C5N)
- Industrial temperature option (vs EP1S25F1020I7)
설계 노트
The 1020-ball FC-FBGA package requires a PCB with microvia (laser-drilled) technology or via-in-pad construction to fan out signals. Use 0.4 mm or 0.5 mm pitch BGA land patterns per IPC-7351. Power decoupling requires 0.1 uF X7R ceramics within 2 mm of each power/ground ball pair, plus 10 uF bulk capacitors on each supply rail. Controlled-impedance routing (50 ohm single-ended, 100 ohm differential) must be verified with a 3D field solver for LVDS pairs above 500 Mbps.
Estimated: at full utilization (25,660 LEs switching at 100 MHz with 50% toggle rate), the EP1S25F1020C5 dissipates approximately 5-8 W. The FC-FBGA package has a theta_JA of approximately 8-12 C/W with 4 thermal balls and proper PCB thermal via array. A minimum 6-layer PCB with 2 oz copper on inner power/ground planes and a thermal via farm beneath the package is required for reliable operation. Without these measures, junction temperature can exceed 100 C in commercial extended grade.
Do not confuse the EP1S25F1020C5 with the EP1S25F780C5 (780-ball FBGA, fewer I/Os) - they share the same silicon die but different package pinouts and are NOT pin-compatible. Configuration mode (PS, AS, JTAG) must be selected via MSEL pins before power-up. JTAG chain ordering matters when multiple Altera devices share a single TCK/TMS line - keep chain length under 10 devices for signal integrity.
규정 준수 정보
Compliance data not present in the verified web data. EP1S25F1020C5N suffix variants are explicitly lead-free per standard Altera naming convention; the standard EP1S25F1020C5 may be either leaded or lead-free depending on assembly date - confirm with the distributor's Certificate of Conformance before placing in RoHS-restricted designs.