EP3C5E144C7 - Cyclone III FPGA, 5K LEs, 144-LQFP | Intel
Référence : EP3C5E144C7 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $32.49 | $32,49 |
| 10 | $28.75 | $287,50 |
| 100 | $24.1 | $2 410,00 |
| 500 | $21.26 | $10 630,00 |
| 1 000 | $19.85 | $19 850,00 |
EP3C5E144C7 Présentation
A Cyclone III FPGA is a SRAM-based programmable logic device that combines lookup tables (LEs), embedded memory blocks (M9K), embedded multipliers (18x18), and PLL-based clock management in a single die. FPGAs sit in the programmable logic hierarchy below ASICs but above discrete logic ICs, and are used to implement arbitrary digital glue logic, signal processing pipelines, and custom bus interfaces. Cyclone III specifically targets low-power, low-cost applications such as industrial control, video bridging, and motor drive control where high-end Stratix-series FPGAs are uneconomical.
Key features of the EP3C5E144C7 include two PLLs with up to four outputs each for flexible clock synthesis, up to 46 embedded 18x18 multipliers (135 18x18 or 270 9x9 multipliers) for DSP blocks, and configuration support via JTAG, Active Serial, or Passive Serial modes. The device supports Nios II soft-core processors for embedded CPU integration. Embedded memory is organized as 9-Kbit blocks (M9K), totaling 46 blocks.
The Cyclone III architecture separates I/O banks into four groups supporting multiple I/O standards including LVTTL, LVCMOS, SSTL, HSTL, PCI, and LVDS on selected pins. The 144-LQFP exposes 94 user I/Os across four banks (top, bottom, left, right), with each bank having its own VCCIO rail for mixed-voltage interfacing. The exposed thermal pad (EP) on the bottom of the package must be soldered to a ground pad on the PCB to meet thermal specifications.
Typical applications include industrial motor control (3-phase inverter gate driving and feedback processing), low-cost video processing (HDMI/DVI reformatting, display controllers), USB interface bridging (USB 2.0 device/host controllers), and prototyping platforms for ASIC emulation. Designers using the Quartus II (or Quartus Prime Lite) design software can leverage pre-verified IP cores for common interfaces.
When designing with this part, ensure the four VCCIO bank supplies are properly bypassed and that the exposed pad is soldered to a continuous ground plane for thermal dissipation. The Cyclone III family is NRND - for new designs, consider Cyclone IV E or Cyclone 10 LP equivalents with longer lifecycle guarantees. Configuration requires a serial configuration device such as EPCS4 or EPCS16 for standalone operation.
This page synthesizes distributor pricing across 20+ sources, drop-in Cyclone III family alternatives, and practical design notes not consolidated in the manufacturer datasheet.
Alternatives de remplacement direct pour EP3C5E144C7 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP3C5E144C7 (même facteur de forme et même empreinte) — différant par Process Technology, Package, Speed Grade, Operating Temperature, Embedded 18x18 Multipliers.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP3C5E144A7N
✅ Remplacement direct✓ En stock
$22.8 / unité
Voir la fiche technique →EP3C5E144I7N
✅ Remplacement direct✓ En stock
$21.4 / unité
Voir la fiche technique →EP3C10E144C8N
✅ Remplacement direct✓ En stock
$15.2 / unité
Voir la fiche technique →EP3C16E144I7N
✅ Remplacement direct✓ En stock
$34.95 / unité
Voir la fiche technique →EP3C25E144I7N
✅ Remplacement direct✓ En stock
$66.99 / unité
Voir la fiche technique →EP3C5E144C7 Valeurs maximales et caractéristiques électriques
| Family | Cyclone III |
| Logic Elements (LEs) | 5,136 |
| Total Memory Bits | 423,936 |
| Embedded Memory Blocks (M9K) | 46 |
| Embedded 18x18 Multipliers | 46 (max) |
| User I/O Pins | 94 |
| PLLs | 2 (up to 4 outputs each) |
| Global Clock Networks | 10 |
| Core Voltage (VCCINT) | 1.2 V |
| Process Technology | 65 nm TSMC low-power |
| Maximum Internal Frequency | 437.5 MHz |
| Speed Grade | C7 (commercial, 7th speed grade) |
| Température de fonctionnement | 0C to +85C (commercial) |
| Boîtier | 144-LQFP Exposed Pad (EQFP-EP), 22x22 mm |
| Configuration Modes | JTAG, Active Serial, Passive Serial |
| Statut RoHS | Compliant |
| Type de montage | Surface Mount |
Configuration des broches de EP3C5E144C7
| Broche 1 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Broche 2 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Broche 3 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Broche 4 | VCCIO1 — I/O Bank 1 supply voltage |
| Broche 5 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Broche 6 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Broche 7 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Broche 8 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Broche 9 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Broche 10 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Broche 11 | GND — Ground |
| Broche 12 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Broche 13 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Broche 14 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Broche 15 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Broche 16 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Broche 17 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Broche 18 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Broche 19 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Broche 20 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Broche 21 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Broche 22 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Broche 23 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Broche 24 | GND — Ground |
| Broche 25 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Broche 26 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Broche 27 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Broche 28 | VCCIO2 — I/O Bank 2 supply voltage |
| Broche 29 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Broche 30 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Broche 31 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Broche 32 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Broche 33 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Broche 34 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Broche 35 | GND — Ground |
| Broche 36 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Broche 37 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Broche 38 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Broche 39 | VCCINT — Core supply voltage (1.2V) |
| Broche 40 | I/O Bank 3 — User I/O pin (Bank 3, bottom) |
| Broche 41 | I/O Bank 3 — User I/O pin (Bank 3, bottom) |
| Broche 42 | I/O Bank 3 — User I/O pin (Bank 3, bottom) |
| Broche 43 | I/O Bank 3 — User I/O pin (Bank 3, bottom) |
| Broche 44 | VCCIO3 — I/O Bank 3 supply voltage |
| Broche 45 | I/O Bank 3 — User I/O pin (Bank 3, bottom) |
| Broche 46 | I/O Bank 3 — User I/O pin (Bank 3, bottom) |
| Broche 47 | I/O Bank 3 — User I/O pin (Bank 3, bottom) |
| Broche 48 | I/O Bank 3 — User I/O pin (Bank 3, bottom) |
| Broche 49 | I/O Bank 3 — User I/O pin (Bank 3, bottom) |
| Broche 50 | I/O Bank 3 — User I/O pin (Bank 3, bottom) |
| Broche 51 | GND — Ground |
| Broche 52 | I/O Bank 3 — User I/O pin (Bank 3, bottom) |
| Broche 53 | I/O Bank 3 — User I/O pin (Bank 3, bottom) |
| Broche 54 | I/O Bank 3 — User I/O pin (Bank 3, bottom) |
| Broche 55 | I/O Bank 3 — User I/O pin (Bank 3, bottom) |
| Broche 56 | I/O Bank 3 — User I/O pin (Bank 3, bottom) |
| Broche 57 | I/O Bank 3 — User I/O pin (Bank 3, bottom) |
| Broche 58 | VCCIO3 — I/O Bank 3 supply voltage |
| Broche 59 | I/O Bank 3 — User I/O pin (Bank 3, bottom) |
| Broche 60 | I/O Bank 3 — User I/O pin (Bank 3, bottom) |
| Broche 61 | I/O Bank 3 — User I/O pin (Bank 3, bottom) |
| Broche 62 | I/O Bank 3 — User I/O pin (Bank 3, bottom) |
| Broche 63 | GND — Ground |
| Broche 64 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Broche 65 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Broche 66 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Broche 67 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Broche 68 | VCCIO4 — I/O Bank 4 supply voltage |
| Broche 69 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Broche 70 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Broche 71 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Broche 72 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Broche 73 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Broche 74 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Broche 75 | GND — Ground |
| Broche 76 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Broche 77 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Broche 78 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Broche 79 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Broche 80 | VCCIO4 — I/O Bank 4 supply voltage |
| Broche 81 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Broche 82 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Broche 83 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Broche 84 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Broche 85 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Broche 86 | GND — Ground |
| Broche 87 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Broche 88 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Broche 89 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Broche 90 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Broche 91 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Broche 92 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Broche 93 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Broche 94 | VCCIO1 — I/O Bank 1 supply voltage |
| Broche 95 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Broche 96 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Broche 97 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Broche 98 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Broche 99 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Broche 100 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Broche 101 | GND — Ground |
| Broche 102 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Broche 103 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Broche 104 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Broche 105 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Broche 106 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Broche 107 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Broche 108 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Broche 109 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Broche 110 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Broche 111 | VCCINT — Core supply voltage (1.2V) |
| Broche 112 | nCONFIG — Configuration start (active low) |
| Broche 113 | nSTATUS — Configuration status (active low) |
| Broche 114 | CONF_DONE — Configuration done indicator |
| Broche 115 | TCK — JTAG clock |
| Broche 116 | TMS — JTAG mode select |
| Broche 117 | TDI — JTAG data in |
| Broche 118 | TDO — JTAG data out |
| Broche 119 | MSEL0 — Configuration mode select 0 |
| Broche 120 | MSEL1 — Configuration mode select 1 |
| Broche 121 | MSEL2 — Configuration mode select 2 |
| Broche 122 | nCE — Chip enable (active low) |
| Broche 123 | CLK0 — Clock input 0 (PLL clock source) |
| Broche 124 | CLK1 — Clock input 1 (PLL clock source) |
| Broche 125 | CLK2 — Clock input 2 (PLL clock source) |
| Broche 126 | CLK3 — Clock input 3 (PLL clock source) |
| Broche 127 | DATA0 — Configuration data input (AS mode) |
| Broche 128 | DCLK — Configuration clock |
| Broche 129 | nCSO — Chip select to configuration device (active low) |
| Broche 130 | ASDO — Active serial data output |
| Broche 131 | VCCA_PLL1 — PLL1 analog supply (1.2V) |
| Broche 132 | GNDA_PLL1 — PLL1 analog ground |
| Broche 133 | VCCA_PLL2 — PLL2 analog supply (1.2V) |
| Broche 134 | GNDA_PLL2 — PLL2 analog ground |
| Broche 135 | GND — Ground |
| Broche 136 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Broche 137 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Broche 138 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Broche 139 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Broche 140 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Broche 141 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Broche 142 | VCCIO4 — I/O Bank 4 supply voltage |
| Broche 143 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Broche 144 | GND (EP) — Exposed thermal pad - solder to PCB ground |
Applications typiques
EP3C5E144C7 convient pour 6 applications: Industrial Motor Control, Low-Cost Video Bridge, USB Interface Bridging, ASIC Emulation and Prototyping, Industrial Sensor Aggregation Hub, Custom Display Controller.
Industrial Motor Control
The EP3C5E144C7 fits industrial motor control applications through its 5,136 logic elements capable of implementing Field-Oriented Control (FOC) algorithms and three-phase PWM generation, plus 46 embedded 18x18 multipliers for sensorless observer math. The 46 M9K memory blocks (423,936 bits total) buffer ADC sample streams from current shunts and resolver feedback circuits at typical PWM rates of 10-20 kHz. Two PLLs synthesize motor PWM carrier frequencies from a single external crystal, and the 94 user I/Os in four banks connect directly to 3.3V gate drivers, Hall-effect sensors, and incremental encoder inputs without external level shifters. Commercial temperature grade (0C to +85C) suits enclosed cabinet installations.
Recommandé
Low-Cost Video Bridge
The EP3C5E144C7 supports low-cost video bridge designs such as DVI/HDMI reformatting, LCD timing controllers, and dual-channel camera aggregation pipelines. The 5,136 LEs handle 720p60 timing generation (pixel clock ~74.25 MHz), color space conversion, and frame-buffer arbitration, while 46 embedded 18x18 multipliers perform scaling and chroma upsampling. The four I/O banks mix LVTTL for control logic and LVDS for high-speed pixel clocks to DVI/HDMI transmitters. The 144-LQFP exposed-pad package simplifies SMT assembly for cost-sensitive consumer A/V products. Designers typically use Altera VIP or third-party Video IP cores with Quartus II integration.
Recommandé
USB Interface Bridging
The EP3C5E144C7 serves as a USB-to-UART, USB-to-SPI, or USB-to-parallel bridge in legacy equipment retrofits and industrial PCs. The 5,136 LEs host Altera's USB 2.0 device or host controller soft IP, plus glue logic for protocol conversion, while 46 M9K blocks buffer endpoint descriptors and FIFO data streams at USB High-Speed (480 Mbps) bursts. Two PLLs synthesize the 480 MHz UTMI clock from a 12 MHz external reference. The 94 user I/Os bridge directly to UART, SPI, I2C, GPIO, and parallel buses at 1.5-3.3V. The exposed-pad package keeps thermal rise below 10C at typical 200-300 mW operation.
Recommandé
ASIC Emulation and Prototyping
The EP3C5E144C7 is used as an ASIC emulation vehicle for low-density custom logic chips in product pre-silicon validation. Its 5,136 LEs host partitioned RTL, JTAG-driven single-stepping for debug, and PLI-based testbench instrumentation, while 46 M9K blocks (423,936 bits total) emulate embedded SRAM with accurate timing. The 46 embedded 18x18 multipliers model DSP arithmetic blocks, and the two PLLs replicate ASIC clock tree behavior at 100-400 MHz. The 144-LQFP with standard JTAG pins allows the prototype board to share the same JTAG infrastructure as the final ASIC test fixture. Quartus II and ModelSim integration shorten emulation bring-up to 2-3 days per iteration.
Recommandé
Industrial Sensor Aggregation Hub
The EP3C5E144C7 fits industrial sensor aggregation hubs that collect data from SPI, I2C, UART, and analog sensor arrays and forward it to Ethernet, RS-485, or wireless modules. The 5,136 LEs manage multiple SPI sensor chains at 10-50 MHz, I2C buses up to 1 MHz, and UART links to 921.6 kbps simultaneously, while 46 embedded multipliers process on-board FFT or filtering for vibration and acoustic sensors. Four I/O banks mix 3.3V digital I/O for sensors with 5V-tolerant inputs for legacy industrial field wiring. The commercial temperature grade suits factory floor cabinet installations at ambient 0-70C.
Recommandé
Custom Display Controller
The EP3C5E144C7 implements custom LCD, OLED, or e-ink display controllers for HMI panels where off-the-shelf display controllers cannot match the panel timing requirements. Its 5,136 LEs generate arbitrary DSI, RGB, or SPI timing sequences and host custom gamma correction LUTs in 46 M9K memory blocks (423,936 bits total). Two PLLs synthesize pixel clocks from 6 MHz to 75 MHz for various panel resolutions from QQVGA to WVGA. The four I/O banks support mixed voltage rails (1.8V, 2.5V, 3.3V) needed for modern OLED panel interfaces. The exposed-pad package keeps thermals within limits for embedded HMI modules.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP3C5E144C7 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP3C5E144A7N | EP3C5E144I7N | EP3C10E144C8N | EP3C16E144I7N | EP3C25E144I7N |
|---|---|---|---|---|---|---|
| Package | 144-LQFP Exposed Pad (EQFP-EP) | 144-LQFP Exposed Pad (EQFP-EP) - same | 144-LQFP Exposed Pad (EQFP-EP) - same | 144-LQFP Exposed Pad (EQFP-EP) - same | 144-LQFP Exposed Pad (EQFP-EP) - same | 144-LQFP Exposed Pad (EQFP-EP) - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Family | Cyclone III | Cyclone III - same | Cyclone III - same | Cyclone III - same | Cyclone III - same | Cyclone III - same |
| Logic Elements | 5,136 | 5,136 (same) | 5,136 (same) | 10,320 (+101%) | 15,408 (+200%) | 24,624 (+380%) |
| Speed Grade | C7 (commercial) | A7 (slower commercial) | I7 (industrial temp) | C8 (slower) | I7 (industrial temp) | I7 (industrial temp) |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C | -40C to +100C (industrial) | 0C to +85C | -40C to +100C | -40C to +100C |
| User I/O Pins | 94 | 94 | 94 | 94 | 94 | 94 |
| Embedded Memory | 423,936 bits | 423,936 bits | 423,936 bits | 423,936 bits | 516,096 bits (+22%) | 608,256 bits (+44%) |
| Embedded 18x18 Multipliers | 46 | 46 | 46 | 46 | 56 (+22%) | 66 (+43%) |
| PLLs | 2 | 2 | 2 | 2 | 4 (+100%) | 4 (+100%) |
Principaux différenciateurs
- Cost-optimized Cyclone III density for sub-10K-LE designs (vs EP3C10E144C8N)
- Commercial temperature grade is sufficient for cabinet-mounted industrial control (vs EP3C5E144I7N)
- Faster C7 speed grade vs C8 in same die and package (vs EP3C10E144C8N)
- True drop-in footprint match to other Cyclone III 144-LQFP variants (vs EP3C5F144C7)
Notes de conception
The EP3C5E144C7 requires a 1.2V VCCINT core supply (typically 1.15-1.25V tolerance) and four separate VCCIO supplies (one per I/O bank) supporting 1.2V, 1.5V, 1.8V, 2.5V, or 3.3V per bank. Each VCCIO bank must be decoupled with 0.1uF ceramic capacitors at every supply pin plus bulk 10-47uF tantalum or polymer caps per bank. PLL analog supplies (VCCA_PLL1, VCCA_PLL2) require RC-filtered clean 1.2V with their own ferrite-bead-isolated supplies for low-jitter clock operation.
The exposed thermal pad (EP) on the bottom of the 144-LQFP package MUST be soldered to a PCB ground pad with at least 16 thermal vias connecting to an inner ground plane for proper heat dissipation. Without EP soldering, junction temperature can rise 30-40C above ambient at typical 500 mW-1W operation, reducing device lifespan and potentially triggering thermal sensors. Recommended PCB layout: 5x5 array of 0.3mm thermal vias filled with solder.
Use a 4-layer PCB stack-up with dedicated ground and 1.2V core power planes to minimize VCCINT noise. All four VCCIO bank supplies should be routed as wide traces (at least 0.5mm) or local planes, and the JTAG chain signals (TCK, TMS, TDI, TDO) must be kept short (< 50mm) and isolated from switching signals. Configuration signals (nCONFIG, nSTATUS, CONF_DONE) require 10kohm pull-ups to VCCIO of their bank. Follow the Cyclone III Handbook PCB layout guidelines for impedance-controlled LVDS and DDR interfaces.
Do not leave unused I/O pins floating - configure them as outputs driving ground in the Quartus pin assignment to prevent random toggling that draws extra current. Ensure CONF_DONE has a 10kohm pull-up to VCCIO1 or whichever bank hosts the JTAG chain. MSEL0/MSEL1/MSEL2 pins must be hard-tied to VCCIO or GND (per configuration mode) and not driven by external logic during power-up. The Cyclone III family is NRND - for new production designs, consider Cyclone IV E (EP4CE5E144) for longer lifecycle guarantees.
Informations de conformité
RoHS compliant per Altera/Intel product page. Not AEC-Q100 qualified - this is a commercial/industrial FPGA. Lead-free (Pb-free) package finish per MSL3 rating. Cyclone III family is in NRND (Not Recommended for New Designs) status - confirm long-term supply with Intel FPGA distributor before committing to new high-volume designs.
