EP3C5E144C7 - Cyclone III FPGA, 5K LEs, 144-LQFP | Intel
N.º da peça: EP3C5E144C7 ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $32.49 | $32,49 |
| 10 | $28.75 | $287,50 |
| 100 | $24.1 | $2.410,00 |
| 500 | $21.26 | $10.630,00 |
| 1.000 | $19.85 | $19.850,00 |
EP3C5E144C7 Visão geral
A Cyclone III FPGA is a SRAM-based programmable logic device that combines lookup tables (LEs), embedded memory blocks (M9K), embedded multipliers (18x18), and PLL-based clock management in a single die. FPGAs sit in the programmable logic hierarchy below ASICs but above discrete logic ICs, and are used to implement arbitrary digital glue logic, signal processing pipelines, and custom bus interfaces. Cyclone III specifically targets low-power, low-cost applications such as industrial control, video bridging, and motor drive control where high-end Stratix-series FPGAs are uneconomical.
Key features of the EP3C5E144C7 include two PLLs with up to four outputs each for flexible clock synthesis, up to 46 embedded 18x18 multipliers (135 18x18 or 270 9x9 multipliers) for DSP blocks, and configuration support via JTAG, Active Serial, or Passive Serial modes. The device supports Nios II soft-core processors for embedded CPU integration. Embedded memory is organized as 9-Kbit blocks (M9K), totaling 46 blocks.
The Cyclone III architecture separates I/O banks into four groups supporting multiple I/O standards including LVTTL, LVCMOS, SSTL, HSTL, PCI, and LVDS on selected pins. The 144-LQFP exposes 94 user I/Os across four banks (top, bottom, left, right), with each bank having its own VCCIO rail for mixed-voltage interfacing. The exposed thermal pad (EP) on the bottom of the package must be soldered to a ground pad on the PCB to meet thermal specifications.
Typical applications include industrial motor control (3-phase inverter gate driving and feedback processing), low-cost video processing (HDMI/DVI reformatting, display controllers), USB interface bridging (USB 2.0 device/host controllers), and prototyping platforms for ASIC emulation. Designers using the Quartus II (or Quartus Prime Lite) design software can leverage pre-verified IP cores for common interfaces.
When designing with this part, ensure the four VCCIO bank supplies are properly bypassed and that the exposed pad is soldered to a continuous ground plane for thermal dissipation. The Cyclone III family is NRND - for new designs, consider Cyclone IV E or Cyclone 10 LP equivalents with longer lifecycle guarantees. Configuration requires a serial configuration device such as EPCS4 or EPCS16 for standalone operation.
This page synthesizes distributor pricing across 20+ sources, drop-in Cyclone III family alternatives, and practical design notes not consolidated in the manufacturer datasheet.
Alternativas drop-in para EP3C5E144C7 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP3C5E144C7 (mesmo formato e footprint) — diferindo em Process Technology, Package, Speed Grade, Operating Temperature, Embedded 18x18 Multipliers.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP3C5E144A7N
✅ Drop-In✓ Em estoque
$22.8 / unidade
Ver ficha técnica →EP3C5E144I7N
✅ Drop-In✓ Em estoque
$21.4 / unidade
Ver ficha técnica →EP3C10E144C8N
✅ Drop-In✓ Em estoque
$15.2 / unidade
Ver ficha técnica →EP3C16E144I7N
✅ Drop-In✓ Em estoque
$34.95 / unidade
Ver ficha técnica →EP3C25E144I7N
✅ Drop-In✓ Em estoque
$66.99 / unidade
Ver ficha técnica →EP3C5E144C7 Classificações máximas e características elétricas
| Family | Cyclone III |
| Logic Elements (LEs) | 5,136 |
| Total Memory Bits | 423,936 |
| Embedded Memory Blocks (M9K) | 46 |
| Embedded 18x18 Multipliers | 46 (max) |
| User I/O Pins | 94 |
| PLLs | 2 (up to 4 outputs each) |
| Global Clock Networks | 10 |
| Core Voltage (VCCINT) | 1.2 V |
| Process Technology | 65 nm TSMC low-power |
| Maximum Internal Frequency | 437.5 MHz |
| Speed Grade | C7 (commercial, 7th speed grade) |
| Temperatura de operação | 0C to +85C (commercial) |
| Encapsulamento | 144-LQFP Exposed Pad (EQFP-EP), 22x22 mm |
| Configuration Modes | JTAG, Active Serial, Passive Serial |
| Status RoHS | Compliant |
| Tipo de montagem | Surface Mount |
Configuração de pinos do EP3C5E144C7
| Pino 1 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Pino 2 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Pino 3 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Pino 4 | VCCIO1 — I/O Bank 1 supply voltage |
| Pino 5 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Pino 6 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Pino 7 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Pino 8 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Pino 9 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Pino 10 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Pino 11 | GND — Ground |
| Pino 12 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Pino 13 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Pino 14 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Pino 15 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Pino 16 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Pino 17 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Pino 18 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Pino 19 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Pino 20 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Pino 21 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Pino 22 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Pino 23 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Pino 24 | GND — Ground |
| Pino 25 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Pino 26 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Pino 27 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Pino 28 | VCCIO2 — I/O Bank 2 supply voltage |
| Pino 29 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Pino 30 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Pino 31 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Pino 32 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Pino 33 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Pino 34 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Pino 35 | GND — Ground |
| Pino 36 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Pino 37 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Pino 38 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Pino 39 | VCCINT — Core supply voltage (1.2V) |
| Pino 40 | I/O Bank 3 — User I/O pin (Bank 3, bottom) |
| Pino 41 | I/O Bank 3 — User I/O pin (Bank 3, bottom) |
| Pino 42 | I/O Bank 3 — User I/O pin (Bank 3, bottom) |
| Pino 43 | I/O Bank 3 — User I/O pin (Bank 3, bottom) |
| Pino 44 | VCCIO3 — I/O Bank 3 supply voltage |
| Pino 45 | I/O Bank 3 — User I/O pin (Bank 3, bottom) |
| Pino 46 | I/O Bank 3 — User I/O pin (Bank 3, bottom) |
| Pino 47 | I/O Bank 3 — User I/O pin (Bank 3, bottom) |
| Pino 48 | I/O Bank 3 — User I/O pin (Bank 3, bottom) |
| Pino 49 | I/O Bank 3 — User I/O pin (Bank 3, bottom) |
| Pino 50 | I/O Bank 3 — User I/O pin (Bank 3, bottom) |
| Pino 51 | GND — Ground |
| Pino 52 | I/O Bank 3 — User I/O pin (Bank 3, bottom) |
| Pino 53 | I/O Bank 3 — User I/O pin (Bank 3, bottom) |
| Pino 54 | I/O Bank 3 — User I/O pin (Bank 3, bottom) |
| Pino 55 | I/O Bank 3 — User I/O pin (Bank 3, bottom) |
| Pino 56 | I/O Bank 3 — User I/O pin (Bank 3, bottom) |
| Pino 57 | I/O Bank 3 — User I/O pin (Bank 3, bottom) |
| Pino 58 | VCCIO3 — I/O Bank 3 supply voltage |
| Pino 59 | I/O Bank 3 — User I/O pin (Bank 3, bottom) |
| Pino 60 | I/O Bank 3 — User I/O pin (Bank 3, bottom) |
| Pino 61 | I/O Bank 3 — User I/O pin (Bank 3, bottom) |
| Pino 62 | I/O Bank 3 — User I/O pin (Bank 3, bottom) |
| Pino 63 | GND — Ground |
| Pino 64 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Pino 65 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Pino 66 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Pino 67 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Pino 68 | VCCIO4 — I/O Bank 4 supply voltage |
| Pino 69 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Pino 70 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Pino 71 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Pino 72 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Pino 73 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Pino 74 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Pino 75 | GND — Ground |
| Pino 76 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Pino 77 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Pino 78 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Pino 79 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Pino 80 | VCCIO4 — I/O Bank 4 supply voltage |
| Pino 81 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Pino 82 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Pino 83 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Pino 84 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Pino 85 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Pino 86 | GND — Ground |
| Pino 87 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Pino 88 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Pino 89 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Pino 90 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Pino 91 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Pino 92 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Pino 93 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Pino 94 | VCCIO1 — I/O Bank 1 supply voltage |
| Pino 95 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Pino 96 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Pino 97 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Pino 98 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Pino 99 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Pino 100 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Pino 101 | GND — Ground |
| Pino 102 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Pino 103 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Pino 104 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Pino 105 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Pino 106 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Pino 107 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Pino 108 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Pino 109 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Pino 110 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Pino 111 | VCCINT — Core supply voltage (1.2V) |
| Pino 112 | nCONFIG — Configuration start (active low) |
| Pino 113 | nSTATUS — Configuration status (active low) |
| Pino 114 | CONF_DONE — Configuration done indicator |
| Pino 115 | TCK — JTAG clock |
| Pino 116 | TMS — JTAG mode select |
| Pino 117 | TDI — JTAG data in |
| Pino 118 | TDO — JTAG data out |
| Pino 119 | MSEL0 — Configuration mode select 0 |
| Pino 120 | MSEL1 — Configuration mode select 1 |
| Pino 121 | MSEL2 — Configuration mode select 2 |
| Pino 122 | nCE — Chip enable (active low) |
| Pino 123 | CLK0 — Clock input 0 (PLL clock source) |
| Pino 124 | CLK1 — Clock input 1 (PLL clock source) |
| Pino 125 | CLK2 — Clock input 2 (PLL clock source) |
| Pino 126 | CLK3 — Clock input 3 (PLL clock source) |
| Pino 127 | DATA0 — Configuration data input (AS mode) |
| Pino 128 | DCLK — Configuration clock |
| Pino 129 | nCSO — Chip select to configuration device (active low) |
| Pino 130 | ASDO — Active serial data output |
| Pino 131 | VCCA_PLL1 — PLL1 analog supply (1.2V) |
| Pino 132 | GNDA_PLL1 — PLL1 analog ground |
| Pino 133 | VCCA_PLL2 — PLL2 analog supply (1.2V) |
| Pino 134 | GNDA_PLL2 — PLL2 analog ground |
| Pino 135 | GND — Ground |
| Pino 136 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Pino 137 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Pino 138 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Pino 139 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Pino 140 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Pino 141 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Pino 142 | VCCIO4 — I/O Bank 4 supply voltage |
| Pino 143 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Pino 144 | GND (EP) — Exposed thermal pad - solder to PCB ground |
Aplicações típicas
EP3C5E144C7 é adequado para 6 aplicaçãos: Industrial Motor Control, Low-Cost Video Bridge, USB Interface Bridging, ASIC Emulation and Prototyping, Industrial Sensor Aggregation Hub, Custom Display Controller.
Industrial Motor Control
The EP3C5E144C7 fits industrial motor control applications through its 5,136 logic elements capable of implementing Field-Oriented Control (FOC) algorithms and three-phase PWM generation, plus 46 embedded 18x18 multipliers for sensorless observer math. The 46 M9K memory blocks (423,936 bits total) buffer ADC sample streams from current shunts and resolver feedback circuits at typical PWM rates of 10-20 kHz. Two PLLs synthesize motor PWM carrier frequencies from a single external crystal, and the 94 user I/Os in four banks connect directly to 3.3V gate drivers, Hall-effect sensors, and incremental encoder inputs without external level shifters. Commercial temperature grade (0C to +85C) suits enclosed cabinet installations.
Recomendado
Low-Cost Video Bridge
The EP3C5E144C7 supports low-cost video bridge designs such as DVI/HDMI reformatting, LCD timing controllers, and dual-channel camera aggregation pipelines. The 5,136 LEs handle 720p60 timing generation (pixel clock ~74.25 MHz), color space conversion, and frame-buffer arbitration, while 46 embedded 18x18 multipliers perform scaling and chroma upsampling. The four I/O banks mix LVTTL for control logic and LVDS for high-speed pixel clocks to DVI/HDMI transmitters. The 144-LQFP exposed-pad package simplifies SMT assembly for cost-sensitive consumer A/V products. Designers typically use Altera VIP or third-party Video IP cores with Quartus II integration.
Recomendado
USB Interface Bridging
The EP3C5E144C7 serves as a USB-to-UART, USB-to-SPI, or USB-to-parallel bridge in legacy equipment retrofits and industrial PCs. The 5,136 LEs host Altera's USB 2.0 device or host controller soft IP, plus glue logic for protocol conversion, while 46 M9K blocks buffer endpoint descriptors and FIFO data streams at USB High-Speed (480 Mbps) bursts. Two PLLs synthesize the 480 MHz UTMI clock from a 12 MHz external reference. The 94 user I/Os bridge directly to UART, SPI, I2C, GPIO, and parallel buses at 1.5-3.3V. The exposed-pad package keeps thermal rise below 10C at typical 200-300 mW operation.
Recomendado
ASIC Emulation and Prototyping
The EP3C5E144C7 is used as an ASIC emulation vehicle for low-density custom logic chips in product pre-silicon validation. Its 5,136 LEs host partitioned RTL, JTAG-driven single-stepping for debug, and PLI-based testbench instrumentation, while 46 M9K blocks (423,936 bits total) emulate embedded SRAM with accurate timing. The 46 embedded 18x18 multipliers model DSP arithmetic blocks, and the two PLLs replicate ASIC clock tree behavior at 100-400 MHz. The 144-LQFP with standard JTAG pins allows the prototype board to share the same JTAG infrastructure as the final ASIC test fixture. Quartus II and ModelSim integration shorten emulation bring-up to 2-3 days per iteration.
Recomendado
Industrial Sensor Aggregation Hub
The EP3C5E144C7 fits industrial sensor aggregation hubs that collect data from SPI, I2C, UART, and analog sensor arrays and forward it to Ethernet, RS-485, or wireless modules. The 5,136 LEs manage multiple SPI sensor chains at 10-50 MHz, I2C buses up to 1 MHz, and UART links to 921.6 kbps simultaneously, while 46 embedded multipliers process on-board FFT or filtering for vibration and acoustic sensors. Four I/O banks mix 3.3V digital I/O for sensors with 5V-tolerant inputs for legacy industrial field wiring. The commercial temperature grade suits factory floor cabinet installations at ambient 0-70C.
Recomendado
Custom Display Controller
The EP3C5E144C7 implements custom LCD, OLED, or e-ink display controllers for HMI panels where off-the-shelf display controllers cannot match the panel timing requirements. Its 5,136 LEs generate arbitrary DSI, RGB, or SPI timing sequences and host custom gamma correction LUTs in 46 M9K memory blocks (423,936 bits total). Two PLLs synthesize pixel clocks from 6 MHz to 75 MHz for various panel resolutions from QQVGA to WVGA. The four I/O banks support mixed voltage rails (1.8V, 2.5V, 3.3V) needed for modern OLED panel interfaces. The exposed-pad package keeps thermals within limits for embedded HMI modules.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP3C5E144C7 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP3C5E144A7N | EP3C5E144I7N | EP3C10E144C8N | EP3C16E144I7N | EP3C25E144I7N |
|---|---|---|---|---|---|---|
| Package | 144-LQFP Exposed Pad (EQFP-EP) | 144-LQFP Exposed Pad (EQFP-EP) - same | 144-LQFP Exposed Pad (EQFP-EP) - same | 144-LQFP Exposed Pad (EQFP-EP) - same | 144-LQFP Exposed Pad (EQFP-EP) - same | 144-LQFP Exposed Pad (EQFP-EP) - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Family | Cyclone III | Cyclone III - same | Cyclone III - same | Cyclone III - same | Cyclone III - same | Cyclone III - same |
| Logic Elements | 5,136 | 5,136 (same) | 5,136 (same) | 10,320 (+101%) | 15,408 (+200%) | 24,624 (+380%) |
| Speed Grade | C7 (commercial) | A7 (slower commercial) | I7 (industrial temp) | C8 (slower) | I7 (industrial temp) | I7 (industrial temp) |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C | -40C to +100C (industrial) | 0C to +85C | -40C to +100C | -40C to +100C |
| User I/O Pins | 94 | 94 | 94 | 94 | 94 | 94 |
| Embedded Memory | 423,936 bits | 423,936 bits | 423,936 bits | 423,936 bits | 516,096 bits (+22%) | 608,256 bits (+44%) |
| Embedded 18x18 Multipliers | 46 | 46 | 46 | 46 | 56 (+22%) | 66 (+43%) |
| PLLs | 2 | 2 | 2 | 2 | 4 (+100%) | 4 (+100%) |
Principais diferenciais
- Cost-optimized Cyclone III density for sub-10K-LE designs (vs EP3C10E144C8N)
- Commercial temperature grade is sufficient for cabinet-mounted industrial control (vs EP3C5E144I7N)
- Faster C7 speed grade vs C8 in same die and package (vs EP3C10E144C8N)
- True drop-in footprint match to other Cyclone III 144-LQFP variants (vs EP3C5F144C7)
Notas de projeto
The EP3C5E144C7 requires a 1.2V VCCINT core supply (typically 1.15-1.25V tolerance) and four separate VCCIO supplies (one per I/O bank) supporting 1.2V, 1.5V, 1.8V, 2.5V, or 3.3V per bank. Each VCCIO bank must be decoupled with 0.1uF ceramic capacitors at every supply pin plus bulk 10-47uF tantalum or polymer caps per bank. PLL analog supplies (VCCA_PLL1, VCCA_PLL2) require RC-filtered clean 1.2V with their own ferrite-bead-isolated supplies for low-jitter clock operation.
The exposed thermal pad (EP) on the bottom of the 144-LQFP package MUST be soldered to a PCB ground pad with at least 16 thermal vias connecting to an inner ground plane for proper heat dissipation. Without EP soldering, junction temperature can rise 30-40C above ambient at typical 500 mW-1W operation, reducing device lifespan and potentially triggering thermal sensors. Recommended PCB layout: 5x5 array of 0.3mm thermal vias filled with solder.
Use a 4-layer PCB stack-up with dedicated ground and 1.2V core power planes to minimize VCCINT noise. All four VCCIO bank supplies should be routed as wide traces (at least 0.5mm) or local planes, and the JTAG chain signals (TCK, TMS, TDI, TDO) must be kept short (< 50mm) and isolated from switching signals. Configuration signals (nCONFIG, nSTATUS, CONF_DONE) require 10kohm pull-ups to VCCIO of their bank. Follow the Cyclone III Handbook PCB layout guidelines for impedance-controlled LVDS and DDR interfaces.
Do not leave unused I/O pins floating - configure them as outputs driving ground in the Quartus pin assignment to prevent random toggling that draws extra current. Ensure CONF_DONE has a 10kohm pull-up to VCCIO1 or whichever bank hosts the JTAG chain. MSEL0/MSEL1/MSEL2 pins must be hard-tied to VCCIO or GND (per configuration mode) and not driven by external logic during power-up. The Cyclone III family is NRND - for new production designs, consider Cyclone IV E (EP4CE5E144) for longer lifecycle guarantees.
Informações de conformidade
RoHS compliant per Altera/Intel product page. Not AEC-Q100 qualified - this is a commercial/industrial FPGA. Lead-free (Pb-free) package finish per MSL3 rating. Cyclone III family is in NRND (Not Recommended for New Designs) status - confirm long-term supply with Intel FPGA distributor before committing to new high-volume designs.
