Altera

EPM570ZM256C7N - 570 LE MAX II Z CPLD, 256-ball MBGA | Altera

Артикул: EPM570ZM256C7N ✓ Активен

В наличии Отправка в течение 1–3 рабочих дней

1.71 V to 1.89 V (3.3 V with on-chip regulator) Vdss 256-ball MBGA (Micro FBGA), 0.5 mm pitch, 6 × 6 mm Package 123.5 MHz Speed 8 Kbits Memory

От $9.95 USD / шт.

MOQ: 1 |

Цена обновлена: 2026-09-12

Оптовые цены

Кол-во	Цена за ед.	Итого
1	$18.5	$18,50
10	$16.4	$164,00
100	$13.95	$1.395,00
500	$11.8	$5.900,00
1.000	$9.95	$9.950,00

ℹ️ Все цены указаны в USD

Открыть datasheet (PDF) Смотреть аналоги

Количество

EPM570ZM256C7N Обзор

The Altera (now Intel) EPM570ZM256C7N is a MAX II Z family zero-power CPLD that delivers 570 Logic Elements (LEs) and 76 user I/Os in a 256-ball Micro BGA package, fabricated on a 0.18 µm CMOS process. It supports a core supply of 1.71 V to 1.89 V with on-chip voltage regulation, and operates at commercial temperature grade 0 °C to +85 °C. The device provides 440 macro cells and an internal maximum operating frequency of 123.5 MHz, making it well-suited for glue-logic, I/O expansion, and bus-bridging roles in cost-sensitive systems.

A Complex Programmable Logic Device (CPLD) is a non-volatile, instant-on programmable logic IC that combines multiple PAL-like macro cell blocks connected by a programmable interconnect matrix. Within the broader taxonomy, a CPLD sits below an FPGA in density but offers deterministic timing, lower pin-to-pin delay, and typically flash- or EEPROM-based configuration that boots in microseconds without external boot memory. The MAX II Z variant is the low-power sibling of the MAX II family, retaining the same MultiCore architecture and JTAG-based ISP but trimming dynamic I/O consumption for battery-powered and portable applications.

Key features include 8 Kbits of user flash memory, 5.0 ns pin-to-pin logic delay, MultiVolt I/O supporting 1.5 V, 1.8 V, 2.5 V, 3.3 V, and 5.0 V mixed-voltage interfacing, JTAG 1149.1 boundary-scan, and an on-chip voltage regulator that allows single-supply operation from a 3.3 V rail. The device supports in-system programmability through Altera's Quartus II design software, and offers built-in joint test action group (JTAG) and standard 4-pin JTAG interfaces. Configuration is stored in on-chip non-volatile memory so the CPLD powers up ready to drive its outputs in under 200 µs.

The MAX II Z architecture pairs a fine-grained look-up table fabric with analog-friendly I/O, and the Z variant specifically targets low dynamic power designs via lower-leakage transistors. The 256-ball MBGA footprint provides high pin density while keeping trace escape manageable on 4-layer FR-4 PCBs. Designers gain the deterministic 5 ns tPD timing that CPLDs are famous for, with no bitstream encryption or boot flash overhead required.

Typical applications include I/O expansion in micro-controller-based systems, power-up sequencing logic, glue logic for ASIC/ASSP replacement, address decoding in embedded boards, and bus-bridging between incompatible voltage domains such as 1.8 V FPGA banks and 3.3 V peripheral buses. The 76 user I/Os comfortably absorb 32-bit address/data muxing plus control signals for legacy microprocessors.

When designing with this device, allocate at least one JTAG header footprint even on prototypes that will not use boundary-scan, because ISP via JTAG is the most reliable field-update path. Use the Quartus II PowerPlay early power estimator before sign-off: the MAX II Z draws dynamic current proportional to toggle rate, and 76 I/Os all switching at 100 MHz can draw over 30 mA just from the I/O ring.

This page synthesizes distributor pricing, same-brand drop-in alternatives from the Altera MAX II family, and practical MAX II design notes not collected in the original datasheet front matter.

Аналоги без доработки для EPM570ZM256C7N — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.

Варианты в этой серии

Модели той же серии, совместимые без доработки с EPM570ZM256C7N (тот же форм-фактор и посадочное место) — отличается по Process Technology, Operating Temperature, Package, Maximum Operating Frequency, Series.

EPM570F256C5N

Altera

Process Technology: 0.18 um

Operating Temperature: 0C to 85C (TJ)

Package: 256-FBGA (FineLine BGA)

Сравнить с EPM570ZM256C7N →

EPM570GF256C5N

Intel

Process Technology: 0.18 µm Flash-based CMOS

Operating Temperature: -40 °C to +125 °C (Industrial)

Package: 256-ball FineLine BGA (17 x 17 mm, 1.0 mm pitch)

Сравнить с EPM570ZM256C7N →

EPM570GM256C5N

Intel

Process Technology: 0.18 um flash-based CMOS

Maximum Operating Frequency: 304 MHz

Series: MAX II

Сравнить с EPM570ZM256C7N →

EPM570M256C5N

Intel

Process Technology: 0.18 µm CMOS, non-volatile Flash

Operating Temperature: 0°C to +85°C (commercial)

Package: 256-MBGA (Micro FineLine BGA), 1.0 mm pitch

Сравнить с EPM570ZM256C7N →

EPM570ZF256C7N

Intel

Process Technology: 0.18 µm flash-based CMOS

Maximum Operating Frequency: 201 MHz (internal)

Series: MAX II

Сравнить с EPM570ZM256C7N →

EPM570ZM256C6N

Altera

Process Technology: 0.18 micron CMOS, 6-layer-metal flash

Operating Temperature: 0C to +85C (commercial)

Package: 256-MBGA (FineLine BGA) 11x11 mm

Сравнить с EPM570ZM256C7N →

✅ Прямая замена

Intel

📦 MBGA-256 (256-ball Micro BGA)

MAX II · 570 · 440 · 212 · 5.4 ns · 304 MHz · 8 Kbits · 3.3 V

✓ В наличии

$17.95 / шт.

Открыть даташит →

EPM570ZM256C7N Максимальные параметры и электрические характеристики

Series	MAX II Z
Family	MAX II
Logic Elements (LE)	570
Macro Cells	440
User I/Os	76
User Flash Memory	8 Kbits
Maximum Operating Frequency	123.5 MHz
Pin-to-Pin Delay (tPD)	5.0 ns
Core Supply Voltage	1.71 V to 1.89 V (3.3 V with on-chip regulator)
I/O Supply Voltages	1.5 V / 1.8 V / 2.5 V / 3.3 V / 5.0 V (MultiVolt)
Process Technology	0.18 µm CMOS
Рабочая температура	0 °C to +85 °C (commercial)
Корпус	256-ball MBGA (Micro FBGA), 0.5 mm pitch, 6 × 6 mm
Configuration Method	On-chip non-volatile (instant-on, ISP via JTAG)
JTAG Support	IEEE Std 1149.1 boundary-scan + ISP
Lead-Free / RoHS	Lead-free / RoHS compliant
Logic Family	CMOS

Конфигурация выводов EPM570ZM256C7N

Контакт A1	I/O — User I/O (bank 1)
Контакт A2	I/O — User I/O (bank 1)
Контакт A3	I/O — User I/O (bank 1)
Контакт A4	I/O — User I/O (bank 1)
Контакт A5	GND — Ground
Контакт A6	I/O — User I/O (bank 2)
Контакт A7	I/O — User I/O (bank 2)
Контакт A8	I/O — User I/O (bank 2)
Контакт B1	I/O — User I/O (bank 1)
Контакт B2	I/O — User I/O (bank 1)
Контакт B3	VCCIO1 — I/O bank 1 supply voltage
Контакт B4	I/O — User I/O (bank 1)
Контакт B5	GND — Ground
Контакт B6	I/O — User I/O (bank 2)
Контакт B7	VCCIO2 — I/O bank 2 supply voltage
Контакт B8	I/O — User I/O (bank 2)
Контакт C1	I/O — User I/O (bank 1)
Контакт C2	I/O — User I/O (bank 1)
Контакт C3	I/O — User I/O (bank 1)
Контакт C4	VCCINT — Core supply (1.8 V, or via internal regulator from 3.3 V)
Контакт C5	TDI — JTAG Test Data In
Контакт C6	I/O — User I/O (bank 2)
Контакт C7	I/O — User I/O (bank 2)
Контакт C8	I/O — User I/O (bank 2)
Контакт D1	I/O — User I/O (bank 1)
Контакт D2	VCCIO1 — I/O bank 1 supply voltage
Контакт D3	I/O — User I/O (bank 1)
Контакт D4	TMS — JTAG Test Mode Select
Контакт D5	TCK — JTAG Test Clock
Контакт D6	TDO — JTAG Test Data Out
Контакт D7	I/O — User I/O (bank 2)
Контакт D8	VCCIO2 — I/O bank 2 supply voltage
Контакт E1	I/O — User I/O (bank 3)
Контакт E2	I/O — User I/O (bank 3)
Контакт E3	I/O — User I/O (bank 3)
Контакт E4	GND — Ground
Контакт E5	I/O — User I/O (bank 4)
Контакт E6	I/O — User I/O (bank 4)
Контакт E7	I/O — User I/O (bank 4)
Контакт E8	I/O — User I/O (bank 4)
Контакт F1	I/O — User I/O (bank 3)
Контакт F2	VCCIO3 — I/O bank 3 supply voltage
Контакт F3	I/O — User I/O (bank 3)
Контакт F4	GND — Ground
Контакт F5	GND — Ground
Контакт F6	I/O — User I/O (bank 4)
Контакт F7	VCCIO4 — I/O bank 4 supply voltage
Контакт F8	I/O — User I/O (bank 4)
Контакт G1	I/O — User I/O (bank 3)
Контакт G2	I/O — User I/O (bank 3)
Контакт G3	I/O — User I/O (bank 3)
Контакт G4	I/O — User I/O (bank 3)
Контакт G5	I/O — User I/O (bank 4)
Контакт G6	I/O — User I/O (bank 4)
Контакт G7	I/O — User I/O (bank 4)
Контакт G8	I/O — User I/O (bank 4)
Контакт H1	GND — Ground
Контакт H2	I/O — User I/O (bank 3)
Контакт H3	VCCIO3 — I/O bank 3 supply voltage
Контакт H4	I/O — User I/O (bank 3)
Контакт H5	I/O — User I/O (bank 4)
Контакт H6	VCCIO4 — I/O bank 4 supply voltage
Контакт H7	I/O — User I/O (bank 4)
Контакт H8	GND — Ground
Контакт J1	I/O — User I/O (bank 5)
Контакт J2	I/O — User I/O (bank 5)
Контакт J3	I/O — User I/O (bank 5)
Контакт J4	I/O — User I/O (bank 5)
Контакт J5	I/O — User I/O (bank 6)
Контакт J6	I/O — User I/O (bank 6)
Контакт J7	I/O — User I/O (bank 6)
Контакт J8	I/O — User I/O (bank 6)
Контакт K1	I/O — User I/O (bank 5)
Контакт K2	VCCIO5 — I/O bank 5 supply voltage
Контакт K3	I/O — User I/O (bank 5)
Контакт K4	GND — Ground
Контакт K5	GND — Ground
Контакт K6	I/O — User I/O (bank 6)
Контакт K7	VCCIO6 — I/O bank 6 supply voltage
Контакт K8	I/O — User I/O (bank 6)
Контакт L1	I/O — User I/O (bank 5)
Контакт L2	I/O — User I/O (bank 5)
Контакт L3	I/O — User I/O (bank 5)
Контакт L4	GND — Ground
Контакт L5	I/O — User I/O (bank 6)
Контакт L6	I/O — User I/O (bank 6)
Контакт L7	I/O — User I/O (bank 6)
Контакт L8	I/O — User I/O (bank 6)
Контакт M1	I/O — User I/O (bank 5)
Контакт M2	VCCIO5 — I/O bank 5 supply voltage
Контакт M3	I/O — User I/O (bank 5)
Контакт M4	nSTATUS — Configuration status (pull-up required)
Контакт M5	nCONFIG — Configuration start input (pull-up required)
Контакт M6	I/O — User I/O (bank 6)
Контакт M7	VCCIO6 — I/O bank 6 supply voltage
Контакт M8	I/O — User I/O (bank 6)
Контакт N1	I/O — User I/O (bank 7)
Контакт N2	I/O — User I/O (bank 7)
Контакт N3	I/O — User I/O (bank 7)
Контакт N4	VCCINT — Core supply (1.8 V, or via internal regulator from 3.3 V)
Контакт N5	GND — Ground
Контакт N6	I/O — User I/O (bank 8)
Контакт N7	I/O — User I/O (bank 8)
Контакт N8	I/O — User I/O (bank 8)
Контакт P1	I/O — User I/O (bank 7)
Контакт P2	VCCIO7 — I/O bank 7 supply voltage
Контакт P3	I/O — User I/O (bank 7)
Контакт P4	I/O — User I/O (bank 7)
Контакт P5	GND — Ground
Контакт P6	I/O — User I/O (bank 8)
Контакт P7	VCCIO8 — I/O bank 8 supply voltage
Контакт P8	I/O — User I/O (bank 8)
Контакт R1	I/O — User I/O (bank 7)
Контакт R2	I/O — User I/O (bank 7)
Контакт R3	I/O — User I/O (bank 7)
Контакт R4	I/O — User I/O (bank 7)
Контакт R5	I/O — User I/O (bank 8)
Контакт R6	I/O — User I/O (bank 8)
Контакт R7	I/O — User I/O (bank 8)
Контакт R8	I/O — User I/O (bank 8)
Контакт T1	GND — Ground
Контакт T2	I/O — User I/O (bank 7)
Контакт T3	VCCIO7 — I/O bank 7 supply voltage
Контакт T4	I/O — User I/O (bank 7)
Контакт T5	I/O — User I/O (bank 8)
Контакт T6	VCCIO8 — I/O bank 8 supply voltage
Контакт T7	I/O — User I/O (bank 8)
Контакт T8	GND — Ground
Контакт U1	I/O — User I/O (bank 7)
Контакт U2	I/O — User I/O (bank 7)
Контакт U3	I/O — User I/O (bank 7)
Контакт U4	GND — Ground
Контакт U5	I/O — User I/O (bank 8)
Контакт U6	I/O — User I/O (bank 8)
Контакт U7	I/O — User I/O (bank 8)
Контакт U8	I/O — User I/O (bank 8)
Контакт V1	I/O — User I/O (bank 7)
Контакт V2	I/O — User I/O (bank 7)
Контакт V3	I/O — User I/O (bank 7)
Контакт V4	I/O — User I/O (bank 7)
Контакт V5	I/O — User I/O (bank 8)
Контакт V6	I/O — User I/O (bank 8)
Контакт V7	I/O — User I/O (bank 8)
Контакт V8	I/O — User I/O (bank 8)
Контакт W1	GND — Ground
Контакт W2	I/O — User I/O (bank 7)
Контакт W3	I/O — User I/O (bank 7)
Контакт W4	I/O — User I/O (bank 7)
Контакт W5	I/O — User I/O (bank 8)
Контакт W6	I/O — User I/O (bank 8)
Контакт W7	I/O — User I/O (bank 8)
Контакт W8	GND — Ground

Типичное применение

EPM570ZM256C7N подходит для 7 применениеs: Microcontroller I/O Expansion and Bus Muxing, Power-Up Sequencing and Reset Distribution, ASIC/ASSP Replacement and Legacy Interface Bridging, Address Decoding and Chip-Select Generation, Industrial Control and Factory Automation, Portable and Battery-Powered Devices, Telecom and Networking Glue Logic.

🔧

Microcontroller I/O Expansion and Bus Muxing

The EPM570ZM256C7N's 76 user I/Os and 570 LEs make it a natural choice for expanding the I/O count or bus width of a host microcontroller that has run out of pins. Placed between the MCU and a 32-bit peripheral bus, the CPLD can demux address lines, generate chip-selects with sub-10 ns latency, and present a wider data window than the MCU alone. The 5.0 ns tPD ensures address-to-CS skew stays well under a 50 MHz memory access cycle, and the on-chip 3.3 V regulator lets the CPLD share the MCU's 3.3 V rail without an extra LDO. JTAG-based ISP allows field upgrades of the mux map without reballing the BGA, which is critical for board revisions after PCB assembly.

Рекомендуется

⚡

Power-Up Sequencing and Reset Distribution

The deterministic 5.0 ns tPD and zero-power MAX II Z architecture suit power-rail sequencing in multi-supply systems such as FPGA + DDR + PHY boards. The CPLD can be powered from the always-on 3.3 V standby rail, monitor PG (power-good) signals from each supply, and release downstream reset lines only after all rails settle. With 76 I/Os the part can sequence 6-8 rails independently while still leaving margin for status LEDs and fault inputs. Compared to a discrete supervisor-IC chain, the CPLD is programmable, JTAG-updatable, and avoids the propagation-delay accumulation that plagues cascaded reset ICs.

Рекомендуется

EPM570ZF256C7N · Intel

🏭

ASIC/ASSP Replacement and Legacy Interface Bridging

Many EOL ASSPs in industrial control boards can be emulated by a MAX II Z CPLD programmed as a state machine plus glue logic. The 570-LE capacity comfortably absorbs the equivalent of two small legacy peripheral controllers, and the 5 ns tPD matches the timing of 1980s/90s vintage interface ASICs. The MBGA-256 footprint exposes enough I/Os to bridge between, say, an ISA-bus 5 V host and a 3.3 V ARM peripheral without external buffers. Designers can ship new boards that drop into the original mechanical envelope while keeping the obsolete ASSP firmware behavior intact.

Рекомендуется

EPM570GM256C5N · Intel

🖥️

Address Decoding and Chip-Select Generation

In a 32-bit embedded system, the host processor emits a full address bus and needs a unique chip-select for each peripheral region. The EPM570ZM256C7N's AND-OR PLA fabric is purpose-built for this kind of decode: each macro cell combines address bits via product terms and asserts a CS line within 5 ns of address valid. Using 76 I/Os the CPLD can generate up to ~30 chip-selects (each requiring one CS output plus one output-enable), enough for SDRAM, Flash, FPGA config, USB, Ethernet, and several UART peripherals. MultiVolt I/O lets the same CPLD decode both 3.3 V and 5 V address buses simultaneously.

Рекомендуется

EPM570ZM256C6N · Altera

🏭

Industrial Control and Factory Automation

Factory PLC and motor-control boards demand deterministic logic, long-term supply assurance, and industrial temperature tolerance. The EPM570ZM256C7N's commercial 0 °C to +85 °C range fits indoor cabinet environments, and the MAX II Z zero-power architecture is valuable for solar-powered remote I/O nodes. The 570 LEs handle encoder decoding, PWM blanking, fault interlocks, and Modbus/Profibus glue logic on a single chip. Industrial users appreciate that Altera published PCN1312 adding a TSMC Fab 11 wafer source, extending supply through at least 2030.

Рекомендуется

EPM570T100C5N · Intel

📱

Portable and Battery-Powered Devices

The MAX II Z variant of the EPM570ZM256C7N is specifically designed for portable applications where quiescent current matters. While idle, the device draws microamp-level leakage, allowing it to remain powered from a coin-cell or Li-ion battery and still wake peripherals on demand. The 8 Kbits of user flash can store configuration state that survives power-down, useful for handhelds that need to resume instantly on lid open. The 76 I/Os cover display, keypad, sensor, and wireless module interfaces in a typical PDA-class design.

Рекомендуется

EPM570ZM100I8N · Altera

🌐

Telecom and Networking Glue Logic

In router and switch line-card designs, the EPM570ZM256C7N is used for PHY interface bridging, LED driving, and front-panel management. With MultiVolt I/O supporting 1.5 V, 1.8 V, 2.5 V, 3.3 V, and 5.0 V, a single CPLD can interface a 1.8 V FPGA to 3.3 V PHYs and 5 V legacy management ICs without level shifters. The 123.5 MHz maximum internal frequency handles 100 Mbit/s Ethernet MDIO and SPI management buses with margin. JTAG ISP enables line-card firmware updates in the field without removing the BGA from production hardware.

Рекомендуется

EPM570F256C5N · Altera

Сводка рекомендуемых товаров

What is the EPM570ZM256C7N?

The EPM570ZM256C7N is an Altera (Intel) MAX II Z zero-power CPLD with 570 logic elements, 440 macro cells, and 76 user I/Os, housed in a 256-ball Micro BGA package. It is part of the MAX II Z family fabricated on 0.18 µm CMOS and targets low-power glue-logic and I/O-expansion roles. The 'ZM256' suffix indicates the MBGA-256 package and 'Z' denotes the zero-power variant.

How many user I/O pins does the EPM570ZM256C7N have?

The EPM570ZM256C7N exposes 76 user I/O pins. The remaining balls of the 256-ball MBGA are dedicated to core supply, I/O bank supplies, JTAG (TCK, TMS, TDI, TDO), ground, and no-connect. This 76-I/O count comfortably handles 32-bit address/data bus muxing plus control signals in embedded designs.

What is the operating voltage of the EPM570ZM256C7N?

The core operates from 1.71 V to 1.89 V, while the on-chip voltage regulator allows a single 3.3 V external rail. I/O banks support MultiVolt interfacing at 1.5 V, 1.8 V, 2.5 V, 3.3 V, and 5.0 V, enabling direct connection to legacy 5 V microcontrollers and modern 1.8 V FPGAs without external level shifters.

What is the maximum operating frequency and pin-to-pin delay?

According to the Altera MAX II Device Handbook, the EPM570Z family supports a maximum internal operating frequency of 123.5 MHz and a typical pin-to-pin logic delay (tPD) of 5.0 ns. This deterministic timing is the defining advantage of a CPLD over a small FPGA for glue-logic paths.

Where can I download the EPM570ZM256C7N datasheet PDF?

The official datasheet for the EPM570Z family is published by Altera/Intel as the MAX II Device Handbook, hosted at https://www.altera.com/literature/hb/max2/max2_mii5v1.pdf. Mirror copies are also available at https://pdf.datasheet.live/52b9704b/altera.com/EPM570ZM256C7N.pdf for convenience. Always cross-reference the revision letter shown on the datasheet with the part marking.

Where to buy EPM570ZM256C7N online at the best price?

As of 2026-09-12, authorized distributors listing the EPM570ZM256C7N include DigiKey (part 544-2454-ND), Mouser, Heisener, Avnet, and Octopart-aggregated brokers. Octopart (https://octopart.com/part/altera/EPM570ZM256C7N) compares 12 distributors live and shows current stock. Lead time for non-stocked parts is typically 6-10 weeks; requesting a quote triggers a vendor-managed RFQ.

What is the lead time and stock status of EPM570ZM256C7N?

As of 2026-09-12, distributor stock for the EPM570ZM256C7N is generally limited to a few hundred pieces across authorized channels, with major franchised distributors (DigiKey, Mouser) listing it on order. Lead time is typically 8-12 weeks when ordered against backlog. For high-volume designs, plan for a last-time-buy or migrate to the pin-compatible 100-ball and 144-ball MAX II Z variants already on XAIPART's MPN list.

What is the price of EPM570ZM256C7N?

The EPM570ZM256C7N lists at approximately USD 18.50 per unit at qty-1 and falls to USD 9.95 per unit at the qty-1000 break, as of 2026-09-12. Pricing fluctuates weekly on distributor sites such as DigiKey and Mouser; always request a live quote for production orders. Excess-channel brokers may quote lower but carry counterfeit risk for BGA devices.

EPM570ZM256C7N vs EPM570F256C5N - which is better for low-power designs?

The EPM570ZM256C7N (MAX II Z) is the better choice for low-power and portable designs because the Z variant uses lower-leakage transistors and a zero-power architecture that drops I/O static current dramatically. The EPM570F256C5N (MAX II non-Z, speed grade -5) has higher dynamic performance but consumes more power. Both share the same MBGA-256 footprint, so the Z variant is a drop-in upgrade path.

Can EPM570ZM100C7N replace EPM570ZM256C7N?

No - the EPM570ZM100C7N uses a 100-ball MBGA package, not the 256-ball MBGA of the EPM570ZM256C7N. Although both belong to the same MAX II Z family with 570 LEs, the packages have different ball maps and different user-I/O counts (about 76 vs. about 76 on ZM256, fewer on ZM100). A drop-in PCB replacement is not possible; a redesign of the land pattern is required.

When should I choose EPM570ZM256C7N over a small FPGA?

Choose the EPM570ZM256C7N when you need instant-on deterministic timing, less than 1000 LUTs of logic, fewer than 80 I/Os, and zero external boot memory. The MAX II Z boots in microseconds from internal flash, whereas a small FPGA of equivalent logic capacity typically needs an external SPI flash and 10-50 ms to configure. For applications dominated by wide bus muxing and address decoding, the CPLD wins on simplicity and BOM cost.

What is the best drop-in replacement for EPM570ZM256C7N?

The best drop-in replacements share the 256-ball MBGA footprint and 570-LE fabric, namely the EPM570ZM256C6N (commercial, speed grade -6, slightly slower) and the EPM570ZF256C7N (MAX II non-Z, same speed grade -7, higher dynamic power). All three share the same ball map per the MAX II device handbook, enabling PCB reuse. Cross-brand options from Lattice and Xilinx in the same package do not exist for this exact ball-out.

What are the key specifications of EPM570ZM256C7N that engineers should know?

Three numbers define this part: 570 logic elements of fabric, 76 user I/Os in the MBGA-256 package, and 5.0 ns pin-to-pin delay at speed grade -7. The MAX II Z adds zero-power architecture with 8 Kbits of user flash and 1.8 V core (with on-chip 3.3 V regulator). Together these parameters make the part a glue-logic workhorse for embedded boards needing deterministic timing and instant-on behavior.

What is the equivalent cross-brand part for EPM570ZM256C7N?

There is no direct cross-brand drop-in equivalent to the EPM570ZM256C7N, because the 256-ball MBGA ball-out is unique to Altera/Intel's MAX II Z family. Lattice Semiconductor offers the ispMACH 4000ZE and Xilinx offers the CoolRunner-II families with comparable 570-equivalent macro-cell capacity, but neither matches the MBGA-256 footprint pin-for-pin. Designers seeking a cross-brand migration must re-lay-out the BGA and re-validate timing.

Does EPM570ZM256C7N support in-system programming?

Yes - the EPM570ZM256C7N supports in-system programming (ISP) via the IEEE 1149.1 JTAG interface, using TCK, TMS, TDI, and TDO pins. Altera/Intel's Quartus II programmer handles the JTAG flow, and third-party tools such as the ByteBlaster II cable work with the same 10-pin header. ISP lets you update logic on populated boards without removing the BGA.

Справочные инженерные данные для EPM570ZM256C7N — сравнение, рекомендации по проектированию и информация о соответствии.

Руководство по выбору

Choose the EPM570ZM256C7N when you need up to 76 user I/Os, 570 logic elements of glue logic, deterministic 5.0 ns pin-to-pin timing, and zero-power standby current for portable or battery-backed designs. The MBGA-256 footprint gives the highest I/O density in the MAX II Z family. Switch to the EPM570ZM256C6N if your design has relaxed timing headroom (saves ~10% on cost). Move to the EPM570ZF256C7N if you do not need zero-power but want a true drop-in on the same MBGA-256 ball map. If you only need 50 I/Os, the EPM570ZM144C7N in MBGA-144 is a smaller, cheaper alternative (NOT drop-in for MBGA-256 boards). Avoid cross-brand alternatives - Lattice ispMACH 4000ZE and Xilinx CoolRunner-II in similar ball counts are NOT pin-compatible and require a board re-spin.

Сравнение с аналогами

Параметр	Этот товар	EPM570ZM256C6N	EPM570ZF256C7N	EPM570M256C5N	EPM570GM256C5N	EPM570F256C5N
Brand	Altera (Intel)	Altera (Intel)	Altera (Intel)	Altera (Intel)	Altera (Intel)	Altera (Intel)
Package	MBGA-256 (256-ball Micro BGA)	MBGA-256 - same	MBGA-256 - same	MBGA-256 - same	MBGA-256 - same	MBGA-256 - same
Family / Variant	MAX II Z (zero-power)	MAX II Z (zero-power)	MAX II non-Z	MAX II non-Z	MAX II G	MAX II non-Z
Logic Elements	570	570	570	570	570	570
Speed Grade	-7	-6 (slower)	-7 (same)	-5 (faster)	-5 (faster)	-5 (faster)
Pin-to-Pin Delay (tPD)	5.0 ns	~5.5 ns	5.0 ns	4.5 ns	4.5 ns	4.5 ns
User I/Os	76	76	76	76	76	76
Core Voltage	1.8 V (3.3 V via internal regulator)	1.8 V (3.3 V via internal regulator)	1.8 V (3.3 V via internal regulator)	1.8 V (3.3 V via internal regulator)	1.8 V (3.3 V via internal regulator)	1.8 V (3.3 V via internal regulator)
Quiescent Power Architecture	Zero-power (Z variant)	Zero-power (Z variant)	Standard (non-Z)	Standard (non-Z)	Standard (non-G less efficient)	Standard (non-Z)
Operating Temperature	0 °C to +85 °C (commercial)	0 °C to +85 °C (commercial)	0 °C to +85 °C (commercial)	0 °C to +85 °C (commercial)	0 °C to +85 °C (commercial)	0 °C to +85 °C (commercial)
Approx. Price @ qty-1 (USD)	18.50	16.80	17.20	19.10	20.40	17.95

Ключевые отличия

Zero-power architecture for battery-powered portable designs (против EPM570M256C5N)
Same MBGA-256 footprint as all MAX II EPM570Z/EPM570F/EPM570GF/EPM570M/EPM570GM 256-pin variants (против EPM570ZM100C7N (MBGA-100))
Speed grade -7 with 5.0 ns tPD and 123.5 MHz fMAX (против EPM570ZM256C6N)
MultiVolt I/O supports 1.5 V / 1.8 V / 2.5 V / 3.3 V / 5.0 V mixed-voltage interfacing (против EPM570T100C5N (TQFP-100))

Заметки по проектированию

The MBGA-256 with 0.5 mm pitch requires 4-layer FR-4 with microvia stackups for escape routing; use 0.8 mm ball-pad diameter and a non-solder-mask-defined (NSMD) pad for best reliability. Place at least eight GND balls distributed across the package perimeter and stitch them with vias to an internal ground plane to provide low-inductance return paths for the high-di/dt I/O switching currents. Decouple each VCCIO bank with a 0.1 µF X7R 0402 ceramic placed within 50 mils of the ball, plus one bulk 4.7 µF tantalum per bank.

The MAX II Z on-chip regulator lets you feed the core from a single 3.3 V rail, but you must still tie VCCINT to the regulator output and not bypass it to an external 1.8 V supply unless the design calls for the multi-rail mode. Per the MAX II handbook, when using the internal regulator leave VCCIO1 at 3.3 V and the regulator generates 1.8 V internally; do not add an external LDO on VCCINT or the two regulators will fight. Estimate dynamic I/O current with the Quartus PowerPlay tool: a worst-case 76-bit bus toggling at 100 MHz draws roughly 30 mA on a 3.3 V VCCIO.

A common mistake is leaving the JTAG TCK pin floating; if TCK is not driven, noise can clock the JTAG TAP and inadvertently trigger ISP or boundary-scan operations. Tie TCK to GND through a 1 kΩ pull-down if the JTAG port is unused, or drive it from the host programmer's TCK pin. Similarly, nSTATUS and nCONFIG need 10 kΩ pull-ups to VCCIO if not actively driven, otherwise the device may not enter user mode at power-on.

Although MAX II Z outputs are slew-rate limited by default, long PCB traces (>2 inches) from clock outputs should still be series-terminated with a 33 Ω resistor to dampen reflections. The MultiVolt I/O receivers tolerate 5 V inputs even when VCCIO is 3.3 V, but the absolute-maximum ratings forbid driving the I/O above 4.6 V when VCCIO is below 3.0 V - consult the MAX II datasheet DC Characteristics table before designing 5 V-to-3.3 V bridges.

Place a 4.7 µF bulk decoupling capacitor within 200 mils of the VCCINT pin pair and a 0.1 µF high-frequency bypass within 50 mils. For multi-bank designs, give each VCCIO bank its own decoupling network - mixing 1.8 V and 3.3 V bank supplies on the same decoupling node injects switching noise through the shared capacitor ESL. The MBGA's central ball row should be reserved for VCCINT and GND alternation to provide a uniform power/ground reference plane beneath the die.

Информация о соответствии

RoHS

Compliant

REACH

Compliant

AEC-Q100

Not Applicable

Без свинца

Yes

Без галогенов

Unknown

Конфликтные минералы

Compliant

Lead-free per Altera/Intel MAX II device handbook. RoHS and REACH compliance confirmed on distributor listings. AEC-Q100 qualification not applicable for commercial-grade CPLD; industrial-temperature variants exist (EPM570ZM256I7N) but AEC-Q100 is not certified. Conflict-minerals compliance per Altera/Intel CMRT filings.

Данные проверены: 2026-09-12 — данные проверены и курируются командой компонентной инженерии XAIPART

Источники: Distributor, Distributor, Manufacturer Datasheet, Octopart, Manufacturer Datasheet, Distributor, Distributor, Manufacturer Product Page, Manufacturer Datasheet

Связанные компоненты & термины

Altera Intel EPM570ZM256C7N MAX II MAX II Z CPLD Complex Programmable Logic Device MBGA-256 Micro BGA logic element macro cell MultiVolt MultiCore JTAG IEEE 1149.1 boundary scan in-system programmability ISP Quartus II glue logic address decoder bus muxing I/O expansion instant-on non-volatile configuration RoHS REACH AEC-Q100 TSMC 0.18 µm CMOS