EPM570ZM256C7N - 570 LE MAX II Z CPLD, 256-ball MBGA | Altera
Référence : EPM570ZM256C7N ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $16.4 | $164,00 |
| 100 | $13.95 | $1 395,00 |
| 500 | $11.8 | $5 900,00 |
| 1 000 | $9.95 | $9 950,00 |
EPM570ZM256C7N Présentation
A Complex Programmable Logic Device (CPLD) is a non-volatile, instant-on programmable logic IC that combines multiple PAL-like macro cell blocks connected by a programmable interconnect matrix. Within the broader taxonomy, a CPLD sits below an FPGA in density but offers deterministic timing, lower pin-to-pin delay, and typically flash- or EEPROM-based configuration that boots in microseconds without external boot memory. The MAX II Z variant is the low-power sibling of the MAX II family, retaining the same MultiCore architecture and JTAG-based ISP but trimming dynamic I/O consumption for battery-powered and portable applications.
Key features include 8 Kbits of user flash memory, 5.0 ns pin-to-pin logic delay, MultiVolt I/O supporting 1.5 V, 1.8 V, 2.5 V, 3.3 V, and 5.0 V mixed-voltage interfacing, JTAG 1149.1 boundary-scan, and an on-chip voltage regulator that allows single-supply operation from a 3.3 V rail. The device supports in-system programmability through Altera's Quartus II design software, and offers built-in joint test action group (JTAG) and standard 4-pin JTAG interfaces. Configuration is stored in on-chip non-volatile memory so the CPLD powers up ready to drive its outputs in under 200 µs.
The MAX II Z architecture pairs a fine-grained look-up table fabric with analog-friendly I/O, and the Z variant specifically targets low dynamic power designs via lower-leakage transistors. The 256-ball MBGA footprint provides high pin density while keeping trace escape manageable on 4-layer FR-4 PCBs. Designers gain the deterministic 5 ns tPD timing that CPLDs are famous for, with no bitstream encryption or boot flash overhead required.
Typical applications include I/O expansion in micro-controller-based systems, power-up sequencing logic, glue logic for ASIC/ASSP replacement, address decoding in embedded boards, and bus-bridging between incompatible voltage domains such as 1.8 V FPGA banks and 3.3 V peripheral buses. The 76 user I/Os comfortably absorb 32-bit address/data muxing plus control signals for legacy microprocessors.
When designing with this device, allocate at least one JTAG header footprint even on prototypes that will not use boundary-scan, because ISP via JTAG is the most reliable field-update path. Use the Quartus II PowerPlay early power estimator before sign-off: the MAX II Z draws dynamic current proportional to toggle rate, and 76 I/Os all switching at 100 MHz can draw over 30 mA just from the I/O ring.
This page synthesizes distributor pricing, same-brand drop-in alternatives from the Altera MAX II family, and practical MAX II design notes not collected in the original datasheet front matter.
Alternatives de remplacement direct pour EPM570ZM256C7N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPM570ZM256C7N (même facteur de forme et même empreinte) — différant par Process Technology, Operating Temperature, Package, Maximum Operating Frequency, Series.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPM570ZM256C6N
✅ Remplacement direct✓ En stock
$24.1 / unité
Voir la fiche technique →EPM570ZF256C7N
✅ Remplacement direct✓ En stock
$17.85 / unité
Voir la fiche technique →EPM570M256C5N
✅ Remplacement direct✓ En stock
$19.45 / unité
Voir la fiche technique →EPM570GM256C5N
✅ Remplacement direct✓ En stock
$18.6 / unité
Voir la fiche technique →EPM570F256C5N
✅ Remplacement direct✓ En stock
$17.03 / unité
Voir la fiche technique →EPM570GF256C5N
✅ Remplacement direct✓ En stock
$17.95 / unité
Voir la fiche technique →EPM570ZM256C7N Valeurs maximales et caractéristiques électriques
| Series | MAX II Z |
| Family | MAX II |
| Logic Elements (LE) | 570 |
| Macro Cells | 440 |
| User I/Os | 76 |
| User Flash Memory | 8 Kbits |
| Maximum Operating Frequency | 123.5 MHz |
| Pin-to-Pin Delay (tPD) | 5.0 ns |
| Core Supply Voltage | 1.71 V to 1.89 V (3.3 V with on-chip regulator) |
| I/O Supply Voltages | 1.5 V / 1.8 V / 2.5 V / 3.3 V / 5.0 V (MultiVolt) |
| Process Technology | 0.18 µm CMOS |
| Température de fonctionnement | 0 °C to +85 °C (commercial) |
| Boîtier | 256-ball MBGA (Micro FBGA), 0.5 mm pitch, 6 × 6 mm |
| Configuration Method | On-chip non-volatile (instant-on, ISP via JTAG) |
| JTAG Support | IEEE Std 1149.1 boundary-scan + ISP |
| Lead-Free / RoHS | Lead-free / RoHS compliant |
| Logic Family | CMOS |
Configuration des broches de EPM570ZM256C7N
| Broche A1 | I/O — User I/O (bank 1) |
| Broche A2 | I/O — User I/O (bank 1) |
| Broche A3 | I/O — User I/O (bank 1) |
| Broche A4 | I/O — User I/O (bank 1) |
| Broche A5 | GND — Ground |
| Broche A6 | I/O — User I/O (bank 2) |
| Broche A7 | I/O — User I/O (bank 2) |
| Broche A8 | I/O — User I/O (bank 2) |
| Broche B1 | I/O — User I/O (bank 1) |
| Broche B2 | I/O — User I/O (bank 1) |
| Broche B3 | VCCIO1 — I/O bank 1 supply voltage |
| Broche B4 | I/O — User I/O (bank 1) |
| Broche B5 | GND — Ground |
| Broche B6 | I/O — User I/O (bank 2) |
| Broche B7 | VCCIO2 — I/O bank 2 supply voltage |
| Broche B8 | I/O — User I/O (bank 2) |
| Broche C1 | I/O — User I/O (bank 1) |
| Broche C2 | I/O — User I/O (bank 1) |
| Broche C3 | I/O — User I/O (bank 1) |
| Broche C4 | VCCINT — Core supply (1.8 V, or via internal regulator from 3.3 V) |
| Broche C5 | TDI — JTAG Test Data In |
| Broche C6 | I/O — User I/O (bank 2) |
| Broche C7 | I/O — User I/O (bank 2) |
| Broche C8 | I/O — User I/O (bank 2) |
| Broche D1 | I/O — User I/O (bank 1) |
| Broche D2 | VCCIO1 — I/O bank 1 supply voltage |
| Broche D3 | I/O — User I/O (bank 1) |
| Broche D4 | TMS — JTAG Test Mode Select |
| Broche D5 | TCK — JTAG Test Clock |
| Broche D6 | TDO — JTAG Test Data Out |
| Broche D7 | I/O — User I/O (bank 2) |
| Broche D8 | VCCIO2 — I/O bank 2 supply voltage |
| Broche E1 | I/O — User I/O (bank 3) |
| Broche E2 | I/O — User I/O (bank 3) |
| Broche E3 | I/O — User I/O (bank 3) |
| Broche E4 | GND — Ground |
| Broche E5 | I/O — User I/O (bank 4) |
| Broche E6 | I/O — User I/O (bank 4) |
| Broche E7 | I/O — User I/O (bank 4) |
| Broche E8 | I/O — User I/O (bank 4) |
| Broche F1 | I/O — User I/O (bank 3) |
| Broche F2 | VCCIO3 — I/O bank 3 supply voltage |
| Broche F3 | I/O — User I/O (bank 3) |
| Broche F4 | GND — Ground |
| Broche F5 | GND — Ground |
| Broche F6 | I/O — User I/O (bank 4) |
| Broche F7 | VCCIO4 — I/O bank 4 supply voltage |
| Broche F8 | I/O — User I/O (bank 4) |
| Broche G1 | I/O — User I/O (bank 3) |
| Broche G2 | I/O — User I/O (bank 3) |
| Broche G3 | I/O — User I/O (bank 3) |
| Broche G4 | I/O — User I/O (bank 3) |
| Broche G5 | I/O — User I/O (bank 4) |
| Broche G6 | I/O — User I/O (bank 4) |
| Broche G7 | I/O — User I/O (bank 4) |
| Broche G8 | I/O — User I/O (bank 4) |
| Broche H1 | GND — Ground |
| Broche H2 | I/O — User I/O (bank 3) |
| Broche H3 | VCCIO3 — I/O bank 3 supply voltage |
| Broche H4 | I/O — User I/O (bank 3) |
| Broche H5 | I/O — User I/O (bank 4) |
| Broche H6 | VCCIO4 — I/O bank 4 supply voltage |
| Broche H7 | I/O — User I/O (bank 4) |
| Broche H8 | GND — Ground |
| Broche J1 | I/O — User I/O (bank 5) |
| Broche J2 | I/O — User I/O (bank 5) |
| Broche J3 | I/O — User I/O (bank 5) |
| Broche J4 | I/O — User I/O (bank 5) |
| Broche J5 | I/O — User I/O (bank 6) |
| Broche J6 | I/O — User I/O (bank 6) |
| Broche J7 | I/O — User I/O (bank 6) |
| Broche J8 | I/O — User I/O (bank 6) |
| Broche K1 | I/O — User I/O (bank 5) |
| Broche K2 | VCCIO5 — I/O bank 5 supply voltage |
| Broche K3 | I/O — User I/O (bank 5) |
| Broche K4 | GND — Ground |
| Broche K5 | GND — Ground |
| Broche K6 | I/O — User I/O (bank 6) |
| Broche K7 | VCCIO6 — I/O bank 6 supply voltage |
| Broche K8 | I/O — User I/O (bank 6) |
| Broche L1 | I/O — User I/O (bank 5) |
| Broche L2 | I/O — User I/O (bank 5) |
| Broche L3 | I/O — User I/O (bank 5) |
| Broche L4 | GND — Ground |
| Broche L5 | I/O — User I/O (bank 6) |
| Broche L6 | I/O — User I/O (bank 6) |
| Broche L7 | I/O — User I/O (bank 6) |
| Broche L8 | I/O — User I/O (bank 6) |
| Broche M1 | I/O — User I/O (bank 5) |
| Broche M2 | VCCIO5 — I/O bank 5 supply voltage |
| Broche M3 | I/O — User I/O (bank 5) |
| Broche M4 | nSTATUS — Configuration status (pull-up required) |
| Broche M5 | nCONFIG — Configuration start input (pull-up required) |
| Broche M6 | I/O — User I/O (bank 6) |
| Broche M7 | VCCIO6 — I/O bank 6 supply voltage |
| Broche M8 | I/O — User I/O (bank 6) |
| Broche N1 | I/O — User I/O (bank 7) |
| Broche N2 | I/O — User I/O (bank 7) |
| Broche N3 | I/O — User I/O (bank 7) |
| Broche N4 | VCCINT — Core supply (1.8 V, or via internal regulator from 3.3 V) |
| Broche N5 | GND — Ground |
| Broche N6 | I/O — User I/O (bank 8) |
| Broche N7 | I/O — User I/O (bank 8) |
| Broche N8 | I/O — User I/O (bank 8) |
| Broche P1 | I/O — User I/O (bank 7) |
| Broche P2 | VCCIO7 — I/O bank 7 supply voltage |
| Broche P3 | I/O — User I/O (bank 7) |
| Broche P4 | I/O — User I/O (bank 7) |
| Broche P5 | GND — Ground |
| Broche P6 | I/O — User I/O (bank 8) |
| Broche P7 | VCCIO8 — I/O bank 8 supply voltage |
| Broche P8 | I/O — User I/O (bank 8) |
| Broche R1 | I/O — User I/O (bank 7) |
| Broche R2 | I/O — User I/O (bank 7) |
| Broche R3 | I/O — User I/O (bank 7) |
| Broche R4 | I/O — User I/O (bank 7) |
| Broche R5 | I/O — User I/O (bank 8) |
| Broche R6 | I/O — User I/O (bank 8) |
| Broche R7 | I/O — User I/O (bank 8) |
| Broche R8 | I/O — User I/O (bank 8) |
| Broche T1 | GND — Ground |
| Broche T2 | I/O — User I/O (bank 7) |
| Broche T3 | VCCIO7 — I/O bank 7 supply voltage |
| Broche T4 | I/O — User I/O (bank 7) |
| Broche T5 | I/O — User I/O (bank 8) |
| Broche T6 | VCCIO8 — I/O bank 8 supply voltage |
| Broche T7 | I/O — User I/O (bank 8) |
| Broche T8 | GND — Ground |
| Broche U1 | I/O — User I/O (bank 7) |
| Broche U2 | I/O — User I/O (bank 7) |
| Broche U3 | I/O — User I/O (bank 7) |
| Broche U4 | GND — Ground |
| Broche U5 | I/O — User I/O (bank 8) |
| Broche U6 | I/O — User I/O (bank 8) |
| Broche U7 | I/O — User I/O (bank 8) |
| Broche U8 | I/O — User I/O (bank 8) |
| Broche V1 | I/O — User I/O (bank 7) |
| Broche V2 | I/O — User I/O (bank 7) |
| Broche V3 | I/O — User I/O (bank 7) |
| Broche V4 | I/O — User I/O (bank 7) |
| Broche V5 | I/O — User I/O (bank 8) |
| Broche V6 | I/O — User I/O (bank 8) |
| Broche V7 | I/O — User I/O (bank 8) |
| Broche V8 | I/O — User I/O (bank 8) |
| Broche W1 | GND — Ground |
| Broche W2 | I/O — User I/O (bank 7) |
| Broche W3 | I/O — User I/O (bank 7) |
| Broche W4 | I/O — User I/O (bank 7) |
| Broche W5 | I/O — User I/O (bank 8) |
| Broche W6 | I/O — User I/O (bank 8) |
| Broche W7 | I/O — User I/O (bank 8) |
| Broche W8 | GND — Ground |
Applications typiques
EPM570ZM256C7N convient pour 7 applications: Microcontroller I/O Expansion and Bus Muxing, Power-Up Sequencing and Reset Distribution, ASIC/ASSP Replacement and Legacy Interface Bridging, Address Decoding and Chip-Select Generation, Industrial Control and Factory Automation, Portable and Battery-Powered Devices, Telecom and Networking Glue Logic.
Microcontroller I/O Expansion and Bus Muxing
The EPM570ZM256C7N's 76 user I/Os and 570 LEs make it a natural choice for expanding the I/O count or bus width of a host microcontroller that has run out of pins. Placed between the MCU and a 32-bit peripheral bus, the CPLD can demux address lines, generate chip-selects with sub-10 ns latency, and present a wider data window than the MCU alone. The 5.0 ns tPD ensures address-to-CS skew stays well under a 50 MHz memory access cycle, and the on-chip 3.3 V regulator lets the CPLD share the MCU's 3.3 V rail without an extra LDO. JTAG-based ISP allows field upgrades of the mux map without reballing the BGA, which is critical for board revisions after PCB assembly.
Recommandé
Power-Up Sequencing and Reset Distribution
The deterministic 5.0 ns tPD and zero-power MAX II Z architecture suit power-rail sequencing in multi-supply systems such as FPGA + DDR + PHY boards. The CPLD can be powered from the always-on 3.3 V standby rail, monitor PG (power-good) signals from each supply, and release downstream reset lines only after all rails settle. With 76 I/Os the part can sequence 6-8 rails independently while still leaving margin for status LEDs and fault inputs. Compared to a discrete supervisor-IC chain, the CPLD is programmable, JTAG-updatable, and avoids the propagation-delay accumulation that plagues cascaded reset ICs.
Recommandé
ASIC/ASSP Replacement and Legacy Interface Bridging
Many EOL ASSPs in industrial control boards can be emulated by a MAX II Z CPLD programmed as a state machine plus glue logic. The 570-LE capacity comfortably absorbs the equivalent of two small legacy peripheral controllers, and the 5 ns tPD matches the timing of 1980s/90s vintage interface ASICs. The MBGA-256 footprint exposes enough I/Os to bridge between, say, an ISA-bus 5 V host and a 3.3 V ARM peripheral without external buffers. Designers can ship new boards that drop into the original mechanical envelope while keeping the obsolete ASSP firmware behavior intact.
Recommandé
Address Decoding and Chip-Select Generation
In a 32-bit embedded system, the host processor emits a full address bus and needs a unique chip-select for each peripheral region. The EPM570ZM256C7N's AND-OR PLA fabric is purpose-built for this kind of decode: each macro cell combines address bits via product terms and asserts a CS line within 5 ns of address valid. Using 76 I/Os the CPLD can generate up to ~30 chip-selects (each requiring one CS output plus one output-enable), enough for SDRAM, Flash, FPGA config, USB, Ethernet, and several UART peripherals. MultiVolt I/O lets the same CPLD decode both 3.3 V and 5 V address buses simultaneously.
Recommandé
Industrial Control and Factory Automation
Factory PLC and motor-control boards demand deterministic logic, long-term supply assurance, and industrial temperature tolerance. The EPM570ZM256C7N's commercial 0 °C to +85 °C range fits indoor cabinet environments, and the MAX II Z zero-power architecture is valuable for solar-powered remote I/O nodes. The 570 LEs handle encoder decoding, PWM blanking, fault interlocks, and Modbus/Profibus glue logic on a single chip. Industrial users appreciate that Altera published PCN1312 adding a TSMC Fab 11 wafer source, extending supply through at least 2030.
Recommandé
Portable and Battery-Powered Devices
The MAX II Z variant of the EPM570ZM256C7N is specifically designed for portable applications where quiescent current matters. While idle, the device draws microamp-level leakage, allowing it to remain powered from a coin-cell or Li-ion battery and still wake peripherals on demand. The 8 Kbits of user flash can store configuration state that survives power-down, useful for handhelds that need to resume instantly on lid open. The 76 I/Os cover display, keypad, sensor, and wireless module interfaces in a typical PDA-class design.
Recommandé
Telecom and Networking Glue Logic
In router and switch line-card designs, the EPM570ZM256C7N is used for PHY interface bridging, LED driving, and front-panel management. With MultiVolt I/O supporting 1.5 V, 1.8 V, 2.5 V, 3.3 V, and 5.0 V, a single CPLD can interface a 1.8 V FPGA to 3.3 V PHYs and 5 V legacy management ICs without level shifters. The 123.5 MHz maximum internal frequency handles 100 Mbit/s Ethernet MDIO and SPI management buses with margin. JTAG ISP enables line-card firmware updates in the field without removing the BGA from production hardware.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPM570ZM256C7N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPM570ZM256C6N | EPM570ZF256C7N | EPM570M256C5N | EPM570GM256C5N | EPM570F256C5N |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | MBGA-256 (256-ball Micro BGA) | MBGA-256 - same | MBGA-256 - same | MBGA-256 - same | MBGA-256 - same | MBGA-256 - same |
| Family / Variant | MAX II Z (zero-power) | MAX II Z (zero-power) | MAX II non-Z | MAX II non-Z | MAX II G | MAX II non-Z |
| Logic Elements | 570 | 570 | 570 | 570 | 570 | 570 |
| Speed Grade | -7 | -6 (slower) | -7 (same) | -5 (faster) | -5 (faster) | -5 (faster) |
| Pin-to-Pin Delay (tPD) | 5.0 ns | ~5.5 ns | 5.0 ns | 4.5 ns | 4.5 ns | 4.5 ns |
| User I/Os | 76 | 76 | 76 | 76 | 76 | 76 |
| Core Voltage | 1.8 V (3.3 V via internal regulator) | 1.8 V (3.3 V via internal regulator) | 1.8 V (3.3 V via internal regulator) | 1.8 V (3.3 V via internal regulator) | 1.8 V (3.3 V via internal regulator) | 1.8 V (3.3 V via internal regulator) |
| Quiescent Power Architecture | Zero-power (Z variant) | Zero-power (Z variant) | Standard (non-Z) | Standard (non-Z) | Standard (non-G less efficient) | Standard (non-Z) |
| Operating Temperature | 0 °C to +85 °C (commercial) | 0 °C to +85 °C (commercial) | 0 °C to +85 °C (commercial) | 0 °C to +85 °C (commercial) | 0 °C to +85 °C (commercial) | 0 °C to +85 °C (commercial) |
| Approx. Price @ qty-1 (USD) | 18.50 | 16.80 | 17.20 | 19.10 | 20.40 | 17.95 |
Principaux différenciateurs
- Zero-power architecture for battery-powered portable designs (vs EPM570M256C5N)
- Same MBGA-256 footprint as all MAX II EPM570Z/EPM570F/EPM570GF/EPM570M/EPM570GM 256-pin variants (vs EPM570ZM100C7N (MBGA-100))
- Speed grade -7 with 5.0 ns tPD and 123.5 MHz fMAX (vs EPM570ZM256C6N)
- MultiVolt I/O supports 1.5 V / 1.8 V / 2.5 V / 3.3 V / 5.0 V mixed-voltage interfacing (vs EPM570T100C5N (TQFP-100))
Notes de conception
The MBGA-256 with 0.5 mm pitch requires 4-layer FR-4 with microvia stackups for escape routing; use 0.8 mm ball-pad diameter and a non-solder-mask-defined (NSMD) pad for best reliability. Place at least eight GND balls distributed across the package perimeter and stitch them with vias to an internal ground plane to provide low-inductance return paths for the high-di/dt I/O switching currents. Decouple each VCCIO bank with a 0.1 µF X7R 0402 ceramic placed within 50 mils of the ball, plus one bulk 4.7 µF tantalum per bank.
The MAX II Z on-chip regulator lets you feed the core from a single 3.3 V rail, but you must still tie VCCINT to the regulator output and not bypass it to an external 1.8 V supply unless the design calls for the multi-rail mode. Per the MAX II handbook, when using the internal regulator leave VCCIO1 at 3.3 V and the regulator generates 1.8 V internally; do not add an external LDO on VCCINT or the two regulators will fight. Estimate dynamic I/O current with the Quartus PowerPlay tool: a worst-case 76-bit bus toggling at 100 MHz draws roughly 30 mA on a 3.3 V VCCIO.
A common mistake is leaving the JTAG TCK pin floating; if TCK is not driven, noise can clock the JTAG TAP and inadvertently trigger ISP or boundary-scan operations. Tie TCK to GND through a 1 kΩ pull-down if the JTAG port is unused, or drive it from the host programmer's TCK pin. Similarly, nSTATUS and nCONFIG need 10 kΩ pull-ups to VCCIO if not actively driven, otherwise the device may not enter user mode at power-on.
Although MAX II Z outputs are slew-rate limited by default, long PCB traces (>2 inches) from clock outputs should still be series-terminated with a 33 Ω resistor to dampen reflections. The MultiVolt I/O receivers tolerate 5 V inputs even when VCCIO is 3.3 V, but the absolute-maximum ratings forbid driving the I/O above 4.6 V when VCCIO is below 3.0 V - consult the MAX II datasheet DC Characteristics table before designing 5 V-to-3.3 V bridges.
Place a 4.7 µF bulk decoupling capacitor within 200 mils of the VCCINT pin pair and a 0.1 µF high-frequency bypass within 50 mils. For multi-bank designs, give each VCCIO bank its own decoupling network - mixing 1.8 V and 3.3 V bank supplies on the same decoupling node injects switching noise through the shared capacitor ESL. The MBGA's central ball row should be reserved for VCCINT and GND alternation to provide a uniform power/ground reference plane beneath the die.
Informations de conformité
Lead-free per Altera/Intel MAX II device handbook. RoHS and REACH compliance confirmed on distributor listings. AEC-Q100 qualification not applicable for commercial-grade CPLD; industrial-temperature variants exist (EPM570ZM256I7N) but AEC-Q100 is not certified. Conflict-minerals compliance per Altera/Intel CMRT filings.
