EPM570ZM100I8N - 440-Macrocell MAX II CPLD, 100-BGA | Intel / Altera
Артикул: EPM570ZM100I8N ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $26.42 | $26,42 |
| 10 | $23.78 | $237,80 |
| 100 | $21.13 | $2.113,00 |
| 500 | $18.49 | $9.245,00 |
| 1.000 | $16.5 | $16.500,00 |
EPM570ZM100I8N Обзор
What is a CPLD? A Complex Programmable Logic Device (CPLD) is a non-volatile, low-density programmable logic device that sits architecturally between discrete logic gates (74HC, 74LV) and FPGAs. CPLDs typically contain a few hundred to a few thousand macrocells organized into Logic Array Blocks (LABs) with a deterministic, non-volatile interconnect fabric. Compared to FPGAs, CPLDs have lower logic density, lower power consumption, instant-on configuration (< 1 ms), and a more predictable timing model that simplifies timing closure for glue-logic and bus-interface designs.
Key features of the EPM570ZM100I8N include 570 Logic Elements, 57 LABs, 440 macrocells, 76 user I/Os, JTAG-compliant IEEE 1149.1 boundary-scan support, in-system programmability (ISP) via JTAG, a chip-wide DEV_OE output-enable pin, and on-chip flash user flash memory for user data storage. The MAX II family is built on a 0.18 μm flash process and is specified for the industrial -40 °C to +85 °C temperature range.
Typical applications include bus-interface bridging (for example, address-latch or chip-select decoding in legacy microprocessor systems), power-sequencer logic, I/O expansion for microcontrollers, LED-display drivers, and configurable glue logic in industrial-control boards where the non-volatile, instant-on behavior of a CPLD is more attractive than an FPGA's configuration delay.
When designing with this device, ensure PCB layout accommodates the 0.8 mm pitch FineLine BGA and that JTAG pins (TCK, TMS, TDI, TDO) are brought out to a test header. The EPM570Z's 1.8 V core must be supplied independently from the 3.3 V or 2.5 V I/O bank supply used by surrounding logic. Always reference the Altera MAX II Device Handbook for timing-model parameters.
Аналоги без доработки для EPM570ZM100I8N — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с EPM570ZM100I8N (тот же форм-фактор и посадочное место) — отличается по Series, Operating Temperature, Package, Process Technology, Logic Elements.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
EPM570ZM100C7N
✅ Прямая замена✓ В наличии
$12.55 / шт.
Открыть даташит →EPM570ZM100C6N
✅ Прямая замена✓ В наличии
$14.98 / шт.
Открыть даташит →EPM570M100I5N
✅ Прямая замена✓ В наличии
$8.75 / шт.
Открыть даташит →EPM570M100C5N
✅ Прямая замена✓ В наличии
$11.85 / шт.
Открыть даташит →EPM570GM100I5N
✅ Прямая замена✓ В наличии
$8.55 / шт.
Открыть даташит →EPM570ZM100I8N Максимальные параметры и электрические характеристики
| Device Family | MAX II |
| Series | EPM570Z |
| Logic Elements | 570 |
| Number of Macrocells | 440 |
| Number of Logic Array Blocks (LABs) | 57 |
| User I/Os | 76 |
| Maximum Operating Frequency | 152 MHz |
| Propagation Delay (tPD) | 9 ns |
| Operating Supply Voltage (Core) | 1.8 V |
| Programming Technology | Flash, non-volatile |
| In-System Programmability (ISP) | Yes (JTAG) |
| Boundary Scan | IEEE 1149.1 (JTAG) |
| Диапазон рабочих температур | -40 C to +85 C (Industrial) |
| Способ монтажа | SMD/SMT |
| Корпус / Типоразмер | 100-ball FineLine BGA (MBGA, 0.8 mm pitch) |
| Packaging | Tray |
Конфигурация выводов EPM570ZM100I8N
| Контакт A1 | I/O — User I/O pin (bank 1) |
| Контакт A2 | I/O — User I/O pin (bank 1) |
| Контакт A3 | I/O — User I/O pin (bank 1) |
| Контакт A4 | VCCIO1 — I/O bank 1 supply voltage |
| Контакт A5 | I/O — User I/O pin (bank 1) |
| Контакт A6 | I/O — User I/O pin (bank 1) |
| Контакт A7 | I/O — User I/O pin (bank 1) |
| Контакт A8 | I/O — User I/O pin (bank 1) |
| Контакт A9 | GND — Ground |
| Контакт A10 | I/O — User I/O pin (bank 1) |
| Контакт B1 | I/O — User I/O pin (bank 1) |
| Контакт B2 | GND — Ground |
| Контакт B3 | I/O — User I/O pin (bank 1) |
| Контакт B4 | I/O — User I/O pin (bank 1) |
| Контакт B5 | I/O — User I/O pin (bank 1) |
| Контакт B6 | I/O — User I/O pin (bank 1) |
| Контакт B7 | I/O — User I/O pin (bank 1) |
| Контакт B8 | I/O — User I/O pin (bank 1) |
| Контакт B9 | I/O — User I/O pin (bank 1) |
| Контакт B10 | I/O — User I/O pin (bank 1) |
| Контакт C1 | TDI — JTAG Test Data In |
| Контакт C2 | I/O — User I/O pin (bank 1) |
| Контакт C3 | VCCINT — Core supply voltage (1.8 V) |
| Контакт C4 | I/O — User I/O pin (bank 1) |
| Контакт C5 | GND — Ground |
| Контакт C6 | I/O — User I/O pin (bank 1) |
| Контакт C7 | I/O — User I/O pin (bank 1) |
| Контакт C8 | I/O — User I/O pin (bank 1) |
| Контакт C9 | VCCIO1 — I/O bank 1 supply voltage |
| Контакт C10 | TCK — JTAG Test Clock |
| Контакт D1 | I/O — User I/O pin (bank 1) |
| Контакт D2 | TMS — JTAG Test Mode Select |
| Контакт D3 | I/O — User I/O pin (bank 1) |
| Контакт D4 | I/O — User I/O pin (bank 1) |
| Контакт D5 | I/O — User I/O pin (bank 1) |
| Контакт D6 | I/O — User I/O pin (bank 1) |
| Контакт D7 | I/O — User I/O pin (bank 1) |
| Контакт D8 | I/O — User I/O pin (bank 1) |
| Контакт D9 | I/O — User I/O pin (bank 1) |
| Контакт D10 | TDO — JTAG Test Data Out |
| Контакт E1 | I/O — User I/O pin (bank 2) |
| Контакт E2 | I/O — User I/O pin (bank 2) |
| Контакт E3 | I/O — User I/O pin (bank 2) |
| Контакт E4 | VCCIO2 — I/O bank 2 supply voltage |
| Контакт E5 | GND — Ground |
| Контакт E6 | VCCINT — Core supply voltage (1.8 V) |
| Контакт E7 | I/O — User I/O pin (bank 2) |
| Контакт E8 | I/O — User I/O pin (bank 2) |
| Контакт E9 | I/O — User I/O pin (bank 2) |
| Контакт E10 | I/O — User I/O pin (bank 2) |
| Контакт F1 | I/O — User I/O pin (bank 2) |
| Контакт F2 | I/O — User I/O pin (bank 2) |
| Контакт F3 | I/O — User I/O pin (bank 2) |
| Контакт F4 | I/O — User I/O pin (bank 2) |
| Контакт F5 | I/O — User I/O pin (bank 2) |
| Контакт F6 | I/O — User I/O pin (bank 2) |
| Контакт F7 | I/O — User I/O pin (bank 2) |
| Контакт F8 | I/O — User I/O pin (bank 2) |
| Контакт F9 | I/O — User I/O pin (bank 2) |
| Контакт F10 | I/O — User I/O pin (bank 2) |
| Контакт G1 | I/O — User I/O pin (bank 3) |
| Контакт G2 | I/O — User I/O pin (bank 3) |
| Контакт G3 | I/O — User I/O pin (bank 3) |
| Контакт G4 | I/O — User I/O pin (bank 3) |
| Контакт G5 | GND — Ground |
| Контакт G6 | I/O — User I/O pin (bank 3) |
| Контакт G7 | I/O — User I/O pin (bank 3) |
| Контакт G8 | I/O — User I/O pin (bank 3) |
| Контакт G9 | I/O — User I/O pin (bank 3) |
| Контакт G10 | I/O — User I/O pin (bank 3) |
| Контакт H1 | DEV_OE — Chip-wide output enable |
| Контакт H2 | I/O — User I/O pin (bank 3) |
| Контакт H3 | I/O — User I/O pin (bank 3) |
| Контакт H4 | VCCIO3 — I/O bank 3 supply voltage |
| Контакт H5 | I/O — User I/O pin (bank 3) |
| Контакт H6 | I/O — User I/O pin (bank 3) |
| Контакт H7 | VCCIO4 — I/O bank 4 supply voltage |
| Контакт H8 | I/O — User I/O pin (bank 4) |
| Контакт H9 | I/O — User I/O pin (bank 4) |
| Контакт H10 | nCONFIG — Configuration start input |
| Контакт J1 | I/O — User I/O pin (bank 4) |
| Контакт J2 | I/O — User I/O pin (bank 4) |
| Контакт J3 | I/O — User I/O pin (bank 4) |
| Контакт J4 | I/O — User I/O pin (bank 4) |
| Контакт J5 | GND — Ground |
| Контакт J6 | I/O — User I/O pin (bank 4) |
| Контакт J7 | I/O — User I/O pin (bank 4) |
| Контакт J8 | I/O — User I/O pin (bank 4) |
| Контакт J9 | I/O — User I/O pin (bank 4) |
| Контакт J10 | I/O — User I/O pin (bank 4) |
| Контакт K1 | I/O — User I/O pin (bank 4) |
| Контакт K2 | I/O — User I/O pin (bank 4) |
| Контакт K3 | I/O — User I/O pin (bank 4) |
| Контакт K4 | GND — Ground |
| Контакт K5 | I/O — User I/O pin (bank 4) |
| Контакт K6 | VCCINT — Core supply voltage (1.8 V) |
| Контакт K7 | I/O — User I/O pin (bank 4) |
| Контакт K8 | I/O — User I/O pin (bank 4) |
| Контакт K9 | I/O — User I/O pin (bank 4) |
| Контакт K10 | I/O — User I/O pin (bank 4) |
| Контакт L1 | I/O — User I/O pin (bank 4) |
| Контакт L2 | I/O — User I/O pin (bank 4) |
| Контакт L3 | I/O — User I/O pin (bank 4) |
| Контакт L4 | I/O — User I/O pin (bank 4) |
| Контакт L5 | I/O — User I/O pin (bank 4) |
| Контакт L6 | I/O — User I/O pin (bank 4) |
| Контакт L7 | I/O — User I/O pin (bank 4) |
| Контакт L8 | I/O — User I/O pin (bank 4) |
| Контакт L9 | GND — Ground |
| Контакт L10 | I/O — User I/O pin (bank 4) |
Типичное применение
EPM570ZM100I8N подходит для 6 применениеs: Microcontroller I/O Expansion & Glue Logic, Power-Sequencer Logic for Multi-Rail Systems, Bus-Bridge and Protocol-Converter Glue, LED Display Driver & Multiplex Controller, Industrial Sensor Signal Conditioning Front-End, Legacy Board Replacement & Long-Life Cycle Designs.
Microcontroller I/O Expansion & Glue Logic
The EPM570ZM100I8N's 440 macrocells and 76 user I/Os make it ideal for expanding the GPIO count of microcontrollers in industrial-control boards. With a 152 MHz internal frequency and 9 ns propagation delay, the device decodes chip-select lines, generates timing waveforms, and latches address/data buses in real time without burdening the MCU. Its flash-based non-volatile configuration boots in under 1 ms, eliminating the need for an external PROM and reducing BOM cost. Quartus II Place-and-Route produces deterministic, timing-closed logic across the 57 LABs, simplifying glue-logic implementation.
Рекомендуется
Power-Sequencer Logic for Multi-Rail Systems
The EPM570ZM100I8N's 440 macrocells and chip-wide DEV_OE output-enable pin enable robust power-sequencer logic in servers, base stations, and FPGA-based platforms where multiple rails must be enabled in a deterministic order. With 76 user I/Os the CPLD drives dozens of load-switch enable lines and reads PG (power-good) feedback from DC-DC converters. The non-volatile flash configuration eliminates boot-time race conditions common to SRAM-based logic devices, making the EPM570ZM100I8N a reliable, instant-on sequencer for safety-critical rails.
Рекомендуется
Bus-Bridge and Protocol-Converter Glue
Where legacy microprocessors or DSPs must communicate with modern peripherals, the EPM570ZM100I8N's 152 MHz frequency and 9 ns tPD handle bus-protocol translation (for example, address-latch, wait-state insertion, chip-select decoding) in real time. The 76 user I/Os map directly to address, data, and control signals of 8/16/32-bit buses. JTAG in-system programmability allows field updates without removing the part, and the -40 °C to +85 °C industrial temperature range supports factory-floor deployment.
Рекомендуется
LED Display Driver & Multiplex Controller
The EPM570ZM100I8N's 440 macrocells easily drive large multiplexed LED arrays and seven-segment displays in industrial HMIs and signage panels. With 76 user I/Os, the CPLD controls row/column multiplexing, brightness modulation via PWM, and refresh timing without external drivers. The 152 MHz internal clock supports high refresh rates that eliminate visible flicker, while the 9 ns propagation delay ensures glitch-free column switching. Non-volatile storage retains display patterns at power-on.
Рекомендуется
Industrial Sensor Signal Conditioning Front-End
In factory-automation and process-control applications, the EPM570ZM100I8N conditions and routes signals from encoders, optocouplers, and proximity sensors before they reach the MCU or FPGA. The 57 LABs implement Schmitt-trigger cleanup, debounce, quadrature decoding, and frequency multiplication with deterministic timing. The 76 user I/Os accept TTL/CMOS inputs across the -40 °C to +85 °C industrial range, and the non-volatile flash eliminates boot-time glitches on noisy factory power rails.
Рекомендуется
Legacy Board Replacement & Long-Life Cycle Designs
The MAX II CPLD family, including the EPM570ZM100I8N, is widely used in long-lifecycle industrial, medical, and aerospace platforms where design stability over decades matters. The non-volatile flash configuration and Altera / Intel long-term supply commitment make it a dependable replacement for legacy discrete-logic and PAL/GAL boards. Its 100-ball BGA and JTAG ISP support modern PCB manufacturing while preserving backward compatibility with earlier MAX II designs, and the 76 user I/Os cover most glue-logic retargeting tasks.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для EPM570ZM100I8N — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | EPM570ZM100C7N | EPM570ZM100C6N | EPM570M100I5N | EPM570M100C5N | EPM570GM100I5N |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 100-ball FineLine BGA (MBGA, 0.8 mm) | 100-ball FineLine BGA - same | 100-ball FineLine BGA - same | 100-ball FineLine BGA - same | 100-ball FineLine BGA - same | 100-ball FineLine BGA - same |
| Macrocells | 440 | 440 | 440 | 440 | 440 | 440 |
| Logic Array Blocks (LABs) | 57 | 57 | 57 | 57 | 57 | 57 |
| User I/Os | 76 | 76 | 76 | 76 | 76 | 76 |
| Sub-Family | EPM570Z (zero-power, 1.8 V core) | EPM570Z | EPM570Z | EPM570 | EPM570 | EPM570G |
| Operating Temperature | -40 C to +85 C (Industrial) | 0 C to +85 C (Commercial) | 0 C to +85 C (Commercial) | -40 C to +85 C (Industrial) | 0 C to +85 C (Commercial) | -40 C to +85 C (Industrial) |
Ключевые отличия
- Largest macrocell count in the MAX II family with 100-ball BGA low pincount (против EPM570F256C5N)
- Zero-power sub-family with 1.8 V core and flash non-volatile configuration (против EPM570M100I5N)
- Industrial temperature grade for harsh-environment deployment (против EPM570ZM100C7N)
Заметки по проектированию
The EPM570ZM100I8N requires two supplies per pin-to-bus interface: VCCINT (1.8 V) for the core and VCCIOx (1.5 V / 1.8 V / 2.5 V / 3.3 V) per I/O bank. Decouple each VCCINT and VCCIOx pin with a 0.1 µF X7R ceramic capacitor placed within 3 mm of the ball; add a 10 µF bulk capacitor on each supply rail. Power-rail sequencing is not strictly required because MAX II devices include power-on-reset circuitry, but simultaneous ramp is recommended.
The 100-ball FineLine BGA uses 0.8 mm pitch with a 10x10 array. PCB design requires laser-drilled or micro-via stacked-via fan-out for inner balls; use 0.4 mm via-pad with 0.2 mm finished hole and 4-mil trace/space rules. Match the BGA land pattern to the JEDEC MO-195 FineLine BGA standard. Add a 5 mm keep-out zone around the BGA for re-work and X-ray inspection.
Do not confuse the EPM570ZM100I8N (EPM570Z zero-power sub-family, 1.8 V core) with the EPM570M100I5N (EPM570 standard sub-family with higher VCCINT). Substituting one for the other without verifying the core supply voltage will cause configuration failure. Always confirm VCCINT = 1.8 V for the Z variant before PCB bring-up, and ensure the JTAG chain (TCK/TMS/TDI/TDO) is brought to a test header for in-system programming.
MAX II CPLDs do not include on-chip series termination. For outputs driving > 4 inch traces or > 25 MHz edges, add a 33 Ω series resistor close to the CPLD pin to dampen reflections. For clock-distribution networks, route clock traces on inner stripline layers with ground reference above and below, and keep clock-to-data trace spacing at least 3W (3x trace width).
Информация о соответствии
RoHS and REACH compliance confirmed by Altera / Intel product documentation; lead-free reflow profile per JEDEC J-STD-020. Halogen-free status not explicitly stated in the verified web data - set to 'unknown'.
