H5ANAG6NCR-XNC - 16Gb DDR4 SDRAM FBGA-96 | SK Hynix
Артикул: H5ANAG6NCR-XNC ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $85.23 | $85,23 |
| 10 | $80.97 | $809,70 |
| 100 | $76.71 | $7.671,00 |
| 500 | $72.45 | $36.225,00 |
| 1.000 | $68.18 | $68.180,00 |
H5ANAG6NCR-XNC Обзор
DDR4 SDRAM (Double Data Rate 4 Synchronous Dynamic Random Access Memory) is the fourth generation of DDR memory, defined around a low-voltage 1.2V signaling environment, internal bank grouping, and higher data rates than DDR3. In the memory hierarchy it sits as a volatile main-memory device below CPU caches and above storage (NAND/EEPROM), and it is a core power-management-relevant load in any processor-based system.
Key features verified for the H5ANAG6NCJR sibling (shared family datasheet) include auto self-refresh, auto precharge function, asynchronous reset function, data mask function, dynamic on-chip termination (ODT), ZQ calibration, CRC function, and write leveling. These features improve signal integrity on high-speed point-to-point DDR4 buses and simplify controller bring-up.
Architecturally, DDR4 devices use internal bank groups with independent activation, burst length 8 (BL8) access, and on-die termination networks calibrated against a precision external ZQ resistor. The x16 organization provides a 16-bit wide data interface with data mask (DM) pins for partial writes, suiting designs that need narrower buses or higher per-device bandwidth granularity than x8 or x4 parts.
Typical applications include embedded computing modules, industrial controllers, network appliances, test and measurement instrumentation, and replacement sourcing for DDR4-based main-memory sockets where 16Gb x16 devices are specified in the BOM.
Design consideration: DDR4 routing demands length-matched, impedance-controlled traces with proper fly-by or point-to-point topology, and VREF/ODT settings must be tuned per the controller memory training results; supply decoupling of the 1.2V rail with low-ESR ceramics is mandatory.
This page synthesizes distributor pricing, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet, with pricing as of 2026-09-05.
Аналоги без доработки для H5ANAG6NCR-XNC — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с H5ANAG6NCR-XNC (тот же форм-фактор и посадочное место) — отличается по Package, Interface, Memory Type, Memory Size, Organization.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
H5ANAG6NCJR-XNC
✅ Прямая замена✓ В наличии
$84.97 / шт.
Открыть даташит →H5ANAG6NCMR-XNC
✅ Прямая замена✓ В наличии
$31.4 / шт.
Открыть даташит →H5ANAG6NCR-VKC
✅ Прямая замена✓ В наличии
Уточнить цену
Открыть даташит →H5ANAG6NCR-UHC
✅ Прямая замена✓ В наличии
$9.2 / шт.
Открыть даташит →H5ANAG6NCR-RDC
✅ Прямая замена✓ В наличии
$72.1 / шт.
Открыть даташит →H5ANAG6NCR-PBC
✅ Прямая замена✓ В наличии
$70.2 / шт.
Открыть даташит →H5ANAG6NCR-XNC Максимальные параметры и электрические характеристики
| Manufacturer | SK hynix |
| Тип памяти | DDR4 SDRAM |
| Размер памяти | 16 Gbit |
| Организация памяти | 1G x 16 |
| Supply Voltage Range | 1.14 V to 1.26 V (1.2 V nominal) |
| Корпус | FBGA-96 |
| Тип монтажа | Surface Mount |
| Auto Self-Refresh | Yes |
| Auto Precharge Function | Yes |
| Asynchronous Reset Function | Yes |
| Data Mask Function | Yes |
| Dynamic On-Chip Termination (ODT) | Yes |
| ZQ Calibration Function | Yes |
| CRC Function | Yes |
| Write Leveling Function | Yes |
| Статус RoHS | Compliant (per JLCPCB listing) |
Руководство по цоколевке H5ANAG6NCR-XNC в корпусе fbga-96
Цоколевка для H5ANAG6NCR-XNC (корпус fbga-96). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.
Нет подробных данных о распиновке для H5ANAG6NCR-XNC.
Обратитесь к даташиту для полной конфигурации выводов.
Типичное применение
H5ANAG6NCR-XNC подходит для 6 применениеs: Industrial Controllers and PLCs, Embedded Computing Modules, Network Appliances and Routers, Test and Measurement Instrumentation, Automotive-Adjacent Telematics and Logging, Replacement Sourcing and BOM Continuity.
Industrial Controllers and PLCs
Industrial controllers, PLCs, and edge automation gateways require deterministic, high-bandwidth main memory buffered between the processor and slower flash storage. The H5ANAG6NCR-XNC's 16Gb (1G x 16) density fits a single device per 16-bit channel, minimizing board space and BOM count in compact DIN-rail controllers. Its auto self-refresh preserves memory content during processor-initiated low-power windows, while the asynchronous reset function allows the controller to recover the DRAM after brown-out events common on factory floors. Data mask (DM) supports partial-word writes for real-time logging. Dynamic on-chip termination and ZQ calibration maintain signal integrity across long backplane-style traces. Supply decoupling of the 1.14V-1.26V rail with low-ESR ceramics is essential near motor-drive noise sources.
Рекомендуется
Embedded Computing Modules
Computer-on-modules and SBCs populate DDR4 SODIMM-equivalent footprints with soldered-down FBGA DRAM for vibration immunity. The H5ANAG6NCR-XNC provides 2GB of main memory per device at x16 width, letting a single 16-bit channel reach 2GB without stacking x8 parts. DDR4's 1.2V signaling reduces module power versus DDR3, improving thermals in fanless enclosures. The CRC function helps detect bus errors on long carrier-board traces, and write leveling plus ZQ calibration are exercised by standard x86/ARM memory training flows at boot. Layout requires length-matched address/command fly-by routing and per-byte data-group matching. Choose this x16 device when the module schematic defines a 16-bit channel; select the x8 family sibling for 64-bit multi-device channels.
Рекомендуется
Network Appliances and Routers
Enterprise routers, switches, and firewalls use DDR4 as packet-buffer and control-plane memory. The 16Gb H5ANAG6NCR-XNC supplies deep buffering per device, and its x16 organization matches 16-bit-wide buffer interfaces common in network processors. Burst length 8 accesses sustain the sequential bandwidth needed for queue management, while dynamic OT terminates impedance adaptively as bus loading changes during read/write turnaround. The asynchronous reset input allows the management controller to reinitialize the buffer memory independently during link flap recovery. Thermal design matters: sustained traffic keeps the device in active currents near the top of the IDD range, so airflow or copper pours under the FBGA-96 body are recommended in 1U chassis with restricted convection.
Рекомендуется
Test and Measurement Instrumentation
Oscilloscopes, logic analyzers, and signal generators need large acquisition buffers that stream digitizer samples at high sustained rates. The H5ANAG6NCR-XNC's 16Gb capacity provides deep record length per device, and DDR4-3200-class sequential bandwidth sustains streaming from front-end ADCs into memory. Auto precharge reduces controller overhead during purely sequential capture writes, maximizing effective bandwidth. The x16 data mask enables efficient compaction of filtered sample streams. Instruments benefit from the 1.14V-1.26V supply's low rail noise sensitivity when paired with a point-of-load regulator and heavy local decoupling. Per Micron's own DRAM cross-reference positioning, 16Gb DDR4 devices of this class are standard buffer memory across the T&M industry, aiding second-source planning.
Рекомендуется
Automotive-Adjacent Telematics and Logging
Telematics units, event data recorders, and in-vehicle infotainment head units use DDR4 for runtime memory and circular event logging. The H5ANAG6NCR-XNC's auto self-refresh retains buffers during ignition-off micro-power states, and the CRC function detects errors induced by the electrically noisy 12V automotive environment, complementing software ECC in the host SoC. Wide temperature variants in the same family (VKC suffix class) support extended ambient requirements. The 16Gb density holds multi-hour sensor logs before offload to NAND. Note that the standard (non-Q1) suffix is not AEC-Q100 qualified; for instrument-cluster or powertrain sockets, select SK hynix automotive-qualified DDR4 variants and verify component qualification level with the manufacturer before design-in.
Рекомендуется
Replacement Sourcing and BOM Continuity
Legacy DDR4-based platforms in industrial and networking deployments outlive original sourcing channels, driving replacement-demand purchases of exact-family DRAM. The H5ANAG6NCR-XNC and its verified siblings (NCJR, NCMR, VKC/UHC/RDC/PBC suffixes) share the FBGA-96 footprint and 1G x 16 organization, allowing procurement to pivot among suffixes when one bin is allocated, provided controller training tolerates the speed-grade delta. Distributor data as of 2026-09-05 shows the family in stock at LCSC (from $85.228) with Octopart reporting 17,475 pcs of the NCJR sibling, indicating viable continuity. Always verify the ordering-code decoder table in the SK hynix datasheet before substituting suffixes in certified or validated systems.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для H5ANAG6NCR-XNC — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | H5ANAG6NCJR-XNC | H5ANAG6NCMR-XNC | H5ANAG6NCR-VKC | H5ANAG6NCR-PBC |
|---|---|---|---|---|---|
| Brand | SK hynix | SK hynix | SK hynix | SK hynix | SK hynix |
| Package | FBGA-96 | FBGA-96 - same | FBGA-96 - same | FBGA-96 - same | FBGA-96 - same |
| Memory Size | 16 Gbit | 16 Gbit | 16 Gbit | 16 Gbit | 16 Gbit |
| Organization | 1G x 16 | 1G x 16 | 1G x 16 | 1G x 16 | 1G x 16 |
| Supply Voltage | 1.14 V to 1.26 V | 1.14 V to 1.26 V | 1.14 V to 1.26 V | 1.14 V to 1.26 V | 1.14 V to 1.26 V |
| Key Features | Auto self-refresh, ODT, ZQ cal, CRC, write leveling | Same feature set (family) | Same feature set (family) | Same feature set (family) | Same feature set (family) |
Ключевые отличия
- x16 organization halves device count on 16-bit channels (против H5ANAG8NCR-XNC)
- DDR4-3200-class bandwidth available in same footprint (против H5ANAG6NCR-PBC)
- Rich signal-integrity feature set (CRC, ZQ cal, write leveling, dynamic ODT) (против Legacy DDR3 16Gb-class devices)
Заметки по проектированию
DDR4 routing requires controlled impedance (approximately 40 ohms for single-ended, 80 ohms differential clocks for x16 point-to-point or fly-by topologies per your stackup) and length matching: data groups within +/-25 mils to their DQS strobe, address/command within clock-based flight-time skew windows. Route VREF as a quiet plane reference and place the ZQ calibration resistor (240 ohm, 1%) within a short dedicated trace to the ZQ ball with no other signals nearby. Follow the SK hynix DDR4 package layout guidelines and your SoC vendor's memory design guide for topology specifics.
Power the 1.14V-1.26V rail from a DDR-specific point-of-load regulator with a dedicated VTT termination rail. Estimated: a 16Gb DDR4-3200 x16 device draws on the order of 1-2W active (using approximate family IDD figures), so budget the VRM for peak read/write burst currents with at least 10uF bulk plus 0.1uF/0.01uF ceramic decoupling at each supply ball. Sequence VDD before or with VPP per DDR4 requirements, and confirm IDD values in the SK hynix datasheet for your exact speed bin rather than using this estimate for final power budgets.
Do not substitute DDR4 suffixes (XNC, NCJR, VKC, UHC, RDC, PBC) blindly: speed grade and temperature coding differ and controller memory training must be re-validated per suffix. Verify the ordering-code decoder table in the official SK hynix datasheet - the -XNC suffix speed bin is not decodable from the MPN alone. Cross-brand DDR4 swaps (e.g., to Micron MT40A1G16-class parts) require footprint review because ball maps differ subtly between vendors, plus full retraining and signal-integrity simulation.
Информация о соответствии
RoHS compliance stated on JLCPCB listing for H5ANAG6NCJR-XNC family member. AEC-Q100 status set not_qualified pending automotive-qualified variant confirmation; REACH/lead-free/halogen-free not stated in verified data.
