H5ANAG6NCR-XNC - 16Gb DDR4 SDRAM FBGA-96 | SK Hynix
MPN: H5ANAG6NCR-XNC ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $85.23 | $85.23 |
| 10 | $80.97 | $809.70 |
| 100 | $76.71 | $7,671.00 |
| 500 | $72.45 | $36,225.00 |
| 1,000 | $68.18 | $68,180.00 |
Drop-in alternatives for H5ANAG6NCR-XNC — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →H5ANAG6NCR-XNC Maximum Ratings & Electrical Characteristics
| Manufacturer | SK hynix |
| Memory Type | DDR4 SDRAM |
| Memory Size | 16 Gbit |
| Organization | 1G x 16 |
| Supply Voltage Range | 1.14 V to 1.26 V (1.2 V nominal) |
| Package | FBGA-96 |
| Mounting Type | Surface Mount |
| Auto Self-Refresh | Yes |
| Auto Precharge Function | Yes |
| Asynchronous Reset Function | Yes |
| Data Mask Function | Yes |
| Dynamic On-Chip Termination (ODT) | Yes |
| ZQ Calibration Function | Yes |
| CRC Function | Yes |
| Write Leveling Function | Yes |
| RoHS Status | Compliant (per JLCPCB listing) |
H5ANAG6NCR-XNC fbga-96 Pin Configuration Guide
Complete pinout information for H5ANAG6NCR-XNC (fbga-96 package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for H5ANAG6NCR-XNC.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
H5ANAG6NCR-XNC is suitable for 6 applications: Industrial Controllers and PLCs, Embedded Computing Modules, Network Appliances and Routers, Test and Measurement Instrumentation, Automotive-Adjacent Telematics and Logging, Replacement Sourcing and BOM Continuity.
Industrial Controllers and PLCs
Industrial controllers, PLCs, and edge automation gateways require deterministic, high-bandwidth main memory buffered between the processor and slower flash storage. The H5ANAG6NCR-XNC's 16Gb (1G x 16) density fits a single device per 16-bit channel, minimizing board space and BOM count in compact DIN-rail controllers. Its auto self-refresh preserves memory content during processor-initiated low-power windows, while the asynchronous reset function allows the controller to recover the DRAM after brown-out events common on factory floors. Data mask (DM) supports partial-word writes for real-time logging. Dynamic on-chip termination and ZQ calibration maintain signal integrity across long backplane-style traces. Supply decoupling of the 1.14V-1.26V rail with low-ESR ceramics is essential near motor-drive noise sources.
Recommended
Embedded Computing Modules
Computer-on-modules and SBCs populate DDR4 SODIMM-equivalent footprints with soldered-down FBGA DRAM for vibration immunity. The H5ANAG6NCR-XNC provides 2GB of main memory per device at x16 width, letting a single 16-bit channel reach 2GB without stacking x8 parts. DDR4's 1.2V signaling reduces module power versus DDR3, improving thermals in fanless enclosures. The CRC function helps detect bus errors on long carrier-board traces, and write leveling plus ZQ calibration are exercised by standard x86/ARM memory training flows at boot. Layout requires length-matched address/command fly-by routing and per-byte data-group matching. Choose this x16 device when the module schematic defines a 16-bit channel; select the x8 family sibling for 64-bit multi-device channels.
Recommended
Network Appliances and Routers
Enterprise routers, switches, and firewalls use DDR4 as packet-buffer and control-plane memory. The 16Gb H5ANAG6NCR-XNC supplies deep buffering per device, and its x16 organization matches 16-bit-wide buffer interfaces common in network processors. Burst length 8 accesses sustain the sequential bandwidth needed for queue management, while dynamic OT terminates impedance adaptively as bus loading changes during read/write turnaround. The asynchronous reset input allows the management controller to reinitialize the buffer memory independently during link flap recovery. Thermal design matters: sustained traffic keeps the device in active currents near the top of the IDD range, so airflow or copper pours under the FBGA-96 body are recommended in 1U chassis with restricted convection.
Recommended
Test and Measurement Instrumentation
Oscilloscopes, logic analyzers, and signal generators need large acquisition buffers that stream digitizer samples at high sustained rates. The H5ANAG6NCR-XNC's 16Gb capacity provides deep record length per device, and DDR4-3200-class sequential bandwidth sustains streaming from front-end ADCs into memory. Auto precharge reduces controller overhead during purely sequential capture writes, maximizing effective bandwidth. The x16 data mask enables efficient compaction of filtered sample streams. Instruments benefit from the 1.14V-1.26V supply's low rail noise sensitivity when paired with a point-of-load regulator and heavy local decoupling. Per Micron's own DRAM cross-reference positioning, 16Gb DDR4 devices of this class are standard buffer memory across the T&M industry, aiding second-source planning.
Recommended
Automotive-Adjacent Telematics and Logging
Telematics units, event data recorders, and in-vehicle infotainment head units use DDR4 for runtime memory and circular event logging. The H5ANAG6NCR-XNC's auto self-refresh retains buffers during ignition-off micro-power states, and the CRC function detects errors induced by the electrically noisy 12V automotive environment, complementing software ECC in the host SoC. Wide temperature variants in the same family (VKC suffix class) support extended ambient requirements. The 16Gb density holds multi-hour sensor logs before offload to NAND. Note that the standard (non-Q1) suffix is not AEC-Q100 qualified; for instrument-cluster or powertrain sockets, select SK hynix automotive-qualified DDR4 variants and verify component qualification level with the manufacturer before design-in.
Recommended
Replacement Sourcing and BOM Continuity
Legacy DDR4-based platforms in industrial and networking deployments outlive original sourcing channels, driving replacement-demand purchases of exact-family DRAM. The H5ANAG6NCR-XNC and its verified siblings (NCJR, NCMR, VKC/UHC/RDC/PBC suffixes) share the FBGA-96 footprint and 1G x 16 organization, allowing procurement to pivot among suffixes when one bin is allocated, provided controller training tolerates the speed-grade delta. Distributor data as of 2026-09-05 shows the family in stock at LCSC (from $85.228) with Octopart reporting 17,475 pcs of the NCJR sibling, indicating viable continuity. Always verify the ordering-code decoder table in the SK hynix datasheet before substituting suffixes in certified or validated systems.
Recommended
Recommended Products Summary
Engineering reference data for H5ANAG6NCR-XNC — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | H5ANAG6NCJR-XNC | H5ANAG6NCMR-XNC | H5ANAG6NCR-VKC | H5ANAG6NCR-PBC |
|---|---|---|---|---|---|
| Brand | SK hynix | SK hynix | SK hynix | SK hynix | SK hynix |
| Package | FBGA-96 | FBGA-96 - same | FBGA-96 - same | FBGA-96 - same | FBGA-96 - same |
| Memory Size | 16 Gbit | 16 Gbit | 16 Gbit | 16 Gbit | 16 Gbit |
| Organization | 1G x 16 | 1G x 16 | 1G x 16 | 1G x 16 | 1G x 16 |
| Supply Voltage | 1.14 V to 1.26 V | 1.14 V to 1.26 V | 1.14 V to 1.26 V | 1.14 V to 1.26 V | 1.14 V to 1.26 V |
| Speed Grade | XNC suffix (per datasheet decoder) | DDR4-3200 class (verified) | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Key Features | Auto self-refresh, ODT, ZQ cal, CRC, write leveling | Same feature set (family) | Same feature set (family) | Same feature set (family) | Same feature set (family) |
| Price (qty 1) | $85.23 as of 2026-09-05 | from $85.228 (LCSC) | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- x16 organization halves device count on 16-bit channels (vs H5ANAG8NCR-XNC)
- DDR4-3200-class bandwidth available in same footprint (vs H5ANAG6NCR-PBC)
- Rich signal-integrity feature set (CRC, ZQ cal, write leveling, dynamic ODT) (vs Legacy DDR3 16Gb-class devices)
Design Notes
DDR4 routing requires controlled impedance (approximately 40 ohms for single-ended, 80 ohms differential clocks for x16 point-to-point or fly-by topologies per your stackup) and length matching: data groups within +/-25 mils to their DQS strobe, address/command within clock-based flight-time skew windows. Route VREF as a quiet plane reference and place the ZQ calibration resistor (240 ohm, 1%) within a short dedicated trace to the ZQ ball with no other signals nearby. Follow the SK hynix DDR4 package layout guidelines and your SoC vendor's memory design guide for topology specifics.
Power the 1.14V-1.26V rail from a DDR-specific point-of-load regulator with a dedicated VTT termination rail. Estimated: a 16Gb DDR4-3200 x16 device draws on the order of 1-2W active (using approximate family IDD figures), so budget the VRM for peak read/write burst currents with at least 10uF bulk plus 0.1uF/0.01uF ceramic decoupling at each supply ball. Sequence VDD before or with VPP per DDR4 requirements, and confirm IDD values in the SK hynix datasheet for your exact speed bin rather than using this estimate for final power budgets.
Do not substitute DDR4 suffixes (XNC, NCJR, VKC, UHC, RDC, PBC) blindly: speed grade and temperature coding differ and controller memory training must be re-validated per suffix. Verify the ordering-code decoder table in the official SK hynix datasheet - the -XNC suffix speed bin is not decodable from the MPN alone. Cross-brand DDR4 swaps (e.g., to Micron MT40A1G16-class parts) require footprint review because ball maps differ subtly between vendors, plus full retraining and signal-integrity simulation.
Compliance Information
RoHS compliance stated on JLCPCB listing for H5ANAG6NCJR-XNC family member. AEC-Q100 status set not_qualified pending automotive-qualified variant confirmation; REACH/lead-free/halogen-free not stated in verified data.
