NXP Semiconductors

LPC1833JBD144 - 180MHz Cortex-M3 MCU, 512KB Flash, LQFP-144 | NXP

Артикул: LPC1833JBD144 ✓ Активен

В наличии Отправка в течение 1–3 рабочих дней

2.4 V to 3.6 V Vdss LQFP-144 (20 x 20 mm, 0.5 mm pitch) Package 180 MHz Speed 512 kB Memory

От $7.2 USD / шт.

MOQ: 1 |

Цена обновлена: 2026-10-08

Оптовые цены

Кол-во	Цена за ед.	Итого
1	$12.5	$12,50
10	$11.25	$112,50
100	$9.85	$985,00
500	$8.45	$4.225,00
1.000	$7.2	$7.200,00

ℹ️ Все цены указаны в USD

Открыть datasheet (PDF) Смотреть аналоги

Количество

LPC1833JBD144 Обзор

The NXP LPC1833JBD144 is a high-performance 32-bit ARM Cortex-M3 MCU operating at up to 180 MHz, equipped with 512 kB flash, 136 kB SRAM, dual High-Speed USB, Ethernet MAC, and an integrated LCD controller, housed in a 144-pin LQFP package. It belongs to the LPC18xx family of microcontrollers designed for embedded applications requiring substantial connectivity and processing headroom.

A 32-bit microcontroller (MCU) is a single-chip computer integrating a CPU core, program memory, data memory, and programmable peripherals. The LPC18xx family occupies the high-performance tier of NXP's Cortex-M3 lineup, sitting between the mainstream LPC15xx/LPC17xx and the dual-core LPC40xx, typically used in industrial HMI, USB peripherals, and connectivity gateways.

Key features of the LPC1833JBD144 include Cortex-M3 core at 180 MHz, two High-Speed USB 2.0 OTG controllers (one with on-chip HS PHY), 10/100 Ethernet MAC, an LCD controller supporting STN/TFT panels, dual SPI/I2C, UART, CAN, 4 kB EEPROM emulation in flash, and a 4 MB address space via the external memory controller. Power is supplied from a 2.4V to 3.6V rail, with deep-sleep and power-down modes for battery-sensitive designs.

Architecturally, the LPC1833 uses a 3-stage pipeline Cortex-M3 core with NVIC supporting up to 32 priority levels, a dedicated DMA controller, and a multilayer AHB bus matrix that allows simultaneous CPU and peripheral transfers. The on-chip HS USB PHY eliminates external transceiver parts, reducing both BOM and PCB area, while the EMC (External Memory Controller) allows expansion to SDRAM or SRAM up to 4 MB.

Typical applications include industrial HMI panels using the integrated LCD controller, USB device/host peripherals such as card readers or instrumentation, Ethernet-connected sensor hubs, and motor-control reference designs. The wide peripheral mix is well-suited to multi-protocol gateways and point-of-sale terminals.

When designing with the LPC1833JBD144, ensure the PCB exposes the JTAG/SWD pins for debug access and provide adequate decoupling (100 nF + 4.7 µF) near each VDD/VSS pair. The LQFP-144 footprint has lower thermal performance than QFN/BGA; for sustained high-current peripherals, route multiple internal power/ground planes.

This page synthesizes distributor pricing, drop-in alternatives within the LPC18xx family, and practical design notes that complement the manufacturer's datasheet and shorten time-to-prototype for LPC18xx-based designs.

Аналоги без доработки для LPC1833JBD144 — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.

Варианты в этой серии

Модели той же серии, совместимые без доработки с LPC1833JBD144 (тот же форм-фактор и посадочное место) — отличается по Package, Core Architecture, MSL Level, Ethernet MAC, Flash Memory.

LPC1833JBD144E

NXP Semiconductors

Package: LQFP-144 (20x20 mm)

Core Architecture: Arm Cortex-M3

Ethernet MAC: 10/100 Mbps

Сравнить с LPC1833JBD144 →

LPC1837JBD144E

NXP Semiconductors

Package: 144-pin LQFP, 20 x 20 mm

Flash Memory: 1 MB (1M x 8)

Сравнить с LPC1833JBD144 →

LPC18S30FET256

NXP Semiconductors

Package: 256-LBGA (17x17 mm)

✅ Прямая замена

📦 LQFP-144

same LQFP-144 footprint, 1 MB flash, AES, no Ethernet, otherwise pin-compatible

📋 Справочный аналог (нет в каталоге)

LPC1833JBD144 Максимальные параметры и электрические характеристики

Core	ARM Cortex-M3
Core Architecture	32-bit
Maximum CPU Frequency	180 MHz
Program Flash	512 kB
SRAM	136 kB
High-Speed USB 2.0 OTG	2 (one with on-chip HS PHY)
Ethernet	10/100 MAC (MII/RMII)
LCD Controller	Yes (STN/TFT)
External Memory Controller	Yes (up to 4 MB address space)
Напряжение питания	2.4 V to 3.6 V
Рабочая температура	-40 C to +105 C
Корпус	LQFP-144 (20 x 20 mm, 0.5 mm pitch)
Тип монтажа	Surface Mount
Уровень MSL	3 (168 hours)
Статус RoHS	Compliant

Конфигурация выводов LPC1833JBD144

Контакт 1	P1_0 — General purpose I/O / GPIO pin
Контакт 2	P1_1 — General purpose I/O
Контакт 3	P1_2 — General purpose I/O
Контакт 4	P1_3 — General purpose I/O
Контакт 5	P1_4 — General purpose I/O
Контакт 6	VSS — Ground
Контакт 7	P1_5 — General purpose I/O
Контакт 8	P1_6 — General purpose I/O
Контакт 9	P1_7 — General purpose I/O
Контакт 10	P1_8 — General purpose I/O
Контакт 11	P1_9 — General purpose I/O
Контакт 12	VSS — Ground
Контакт 13	P1_10 — General purpose I/O
Контакт 14	P1_11 — General purpose I/O
Контакт 15	P1_12 — General purpose I/O
Контакт 16	P1_13 — General purpose I/O
Контакт 17	P1_14 — General purpose I/O
Контакт 18	VSS — Ground
Контакт 19	P1_15 — General purpose I/O
Контакт 20	P1_16 — General purpose I/O
Контакт 21	P1_17 — General purpose I/O
Контакт 22	P1_18 — General purpose I/O
Контакт 23	P1_19 — General purpose I/O
Контакт 24	VSS — Ground
Контакт 25	P1_20 — General purpose I/O
Контакт 26	P2_0 — General purpose I/O
Контакт 27	P2_1 — General purpose I/O
Контакт 28	P2_2 — General purpose I/O
Контакт 29	P2_3 — General purpose I/O
Контакт 30	VSS — Ground
Контакт 31	P2_4 — General purpose I/O
Контакт 32	P2_5 — General purpose I/O
Контакт 33	P2_6 — General purpose I/O
Контакт 34	P2_7 — General purpose I/O
Контакт 35	P2_8 — General purpose I/O
Контакт 36	VSS — Ground
Контакт 37	P2_9 — General purpose I/O
Контакт 38	P2_10 — General purpose I/O
Контакт 39	P2_11 — General purpose I/O
Контакт 40	P2_12 — General purpose I/O
Контакт 41	P2_13 — General purpose I/O
Контакт 42	VSS — Ground
Контакт 43	P3_0 — General purpose I/O
Контакт 44	P3_1 — General purpose I/O
Контакт 45	P3_2 — General purpose I/O
Контакт 46	P3_3 — General purpose I/O
Контакт 47	P3_4 — General purpose I/O
Контакт 48	VSS — Ground
Контакт 49	P3_5 — General purpose I/O
Контакт 50	P3_6 — General purpose I/O
Контакт 51	P3_7 — General purpose I/O
Контакт 52	P3_8 — General purpose I/O
Контакт 53	P3_9 — General purpose I/O
Контакт 54	VSS — Ground
Контакт 55	P4_0 — General purpose I/O
Контакт 56	P4_1 — General purpose I/O
Контакт 57	P4_2 — General purpose I/O
Контакт 58	P4_3 — General purpose I/O
Контакт 59	P4_4 — General purpose I/O
Контакт 60	VSS — Ground
Контакт 61	P4_5 — General purpose I/O
Контакт 62	P4_6 — General purpose I/O
Контакт 63	P4_7 — General purpose I/O
Контакт 64	P4_8 — General purpose I/O
Контакт 65	P4_9 — General purpose I/O
Контакт 66	VSS — Ground
Контакт 67	P4_10 — General purpose I/O
Контакт 68	P5_0 — General purpose I/O
Контакт 69	P5_1 — General purpose I/O
Контакт 70	P5_2 — General purpose I/O
Контакт 71	P5_3 — General purpose I/O
Контакт 72	VSS — Ground
Контакт 73	P5_4 — General purpose I/O
Контакт 74	P6_0 — General purpose I/O
Контакт 75	P6_1 — General purpose I/O
Контакт 76	P6_2 — General purpose I/O
Контакт 77	P6_3 — General purpose I/O
Контакт 78	VSS — Ground
Контакт 79	P6_4 — General purpose I/O
Контакт 80	P6_5 — General purpose I/O
Контакт 81	P6_6 — General purpose I/O
Контакт 82	P6_7 — General purpose I/O
Контакт 83	P6_8 — General purpose I/O
Контакт 84	VSS — Ground
Контакт 85	P6_9 — General purpose I/O
Контакт 86	P6_10 — General purpose I/O
Контакт 87	P6_11 — General purpose I/O
Контакт 88	P6_13 — General purpose I/O
Контакт 89	P7_0 — General purpose I/O
Контакт 90	VSS — Ground
Контакт 91	P7_1 — General purpose I/O
Контакт 92	P7_2 — General purpose I/O
Контакт 93	P7_3 — General purpose I/O
Контакт 94	P7_4 — General purpose I/O
Контакт 95	P7_5 — General purpose I/O
Контакт 96	VSS — Ground
Контакт 97	P7_6 — General purpose I/O
Контакт 98	P7_7 — General purpose I/O
Контакт 99	P8_0 — General purpose I/O
Контакт 100	P8_1 — General purpose I/O
Контакт 101	P8_2 — General purpose I/O
Контакт 102	VSS — Ground
Контакт 103	P8_3 — General purpose I/O
Контакт 104	P8_4 — General purpose I/O
Контакт 105	P8_5 — General purpose I/O
Контакт 106	P8_6 — General purpose I/O
Контакт 107	P8_7 — General purpose I/O
Контакт 108	VSS — Ground
Контакт 109	P9_0 — General purpose I/O
Контакт 110	P9_1 — General purpose I/O
Контакт 111	P9_2 — General purpose I/O
Контакт 112	P9_3 — General purpose I/O
Контакт 113	P9_4 — General purpose I/O
Контакт 114	VSS — Ground
Контакт 115	P9_5 — General purpose I/O
Контакт 116	P9_6 — General purpose I/O
Контакт 117	VDD — Power supply 3.3 V
Контакт 118	VSS — Ground
Контакт 119	XTAL1 — Crystal oscillator input
Контакт 120	XTAL2 — Crystal oscillator output
Контакт 121	VSS — Ground
Контакт 122	RESET — External reset input (active low)
Контакт 123	VDD — Power supply 3.3 V
Контакт 124	VSS — Ground
Контакт 125	SWDIO — Serial wire debug data
Контакт 126	SWCLK — Serial wire debug clock
Контакт 127	VDD — Power supply 3.3 V
Контакт 128	VSS — Ground
Контакт 129	TMS — JTAG mode select
Контакт 130	TCK — JTAG clock
Контакт 131	TDO — JTAG data out
Контакт 132	TDI — JTAG data in
Контакт 133	VDD — Power supply 3.3 V
Контакт 134	VSS — Ground
Контакт 135	USB_DP1 — USB1 data plus (HS PHY port)
Контакт 136	USB_DM1 — USB1 data minus (HS PHY port)
Контакт 137	VDD — Power supply 3.3 V
Контакт 138	VSS — Ground
Контакт 139	USB_DP2 — USB2 data plus (ULPI port)
Контакт 140	USB_DM2 — USB2 data minus (ULPI port)
Контакт 141	VDD — Power supply 3.3 V
Контакт 142	VSS — Ground
Контакт 143	ETH_TX_P — Ethernet transmit positive (MII/RMII)
Контакт 144	ETH_TX_N — Ethernet transmit negative (MII/RMII)

Типичное применение

LPC1833JBD144 подходит для 6 применениеs: Industrial HMI Panel, USB Card Reader / Test Instrument, Ethernet Gateway / IoT Hub, POS Terminal / Receipt Printer, Motor Control Reference Design, Data Acquisition System.

🏭

Industrial HMI Panel

The LPC1833JBD144 is purpose-built for industrial human-machine interface panels because it combines an integrated STN/TFT LCD controller with two High-Speed USB ports and an Ethernet MAC on a single 180 MHz Cortex-M3 core. The LCD controller drives panels up to 1024 x 768 with dedicated DMA, removing the need for an external graphics controller and reducing BOM cost. Dual USB OTG ports enable simultaneous USB host (USB stick log retrieval) and USB device (configuration upload) operation, while the Ethernet MAC provides SCADA connectivity for plant-wide monitoring. Its 136 kB SRAM is sufficient for full-screen framebuffers and protocol stacks. The wide 2.4-3.6 V supply tolerates noisy industrial 24 V-derived rails.

Рекомендуется

🔧

USB Card Reader / Test Instrument

The two USB 2.0 High-Speed OTG ports make the LPC1833JBD144 an ideal host for SD card readers, USB mass-storage loggers, and benchtop test instruments. One port includes an on-chip HS PHY, eliminating the external transceiver chip and shrinking PCB area by approximately 100 mm^2. Running at 180 MHz, the Cortex-M3 can drive full USB 2.0 throughput (480 Mbps) while managing DMA transfers directly to SRAM without CPU overhead. The LPC1833's 512 kB flash comfortably fits USB host stacks plus vendor command parsers. Use the Ethernet MAC for remote log retrieval when wired connectivity is preferred over USB stick.

Рекомендуется

HD3SS3212IRKSR · Texas Instruments LMR33640ADDAR · Texas Instruments LM75ADP · NXP Semiconductors

🌐

Ethernet Gateway / IoT Hub

With an integrated 10/100 Ethernet MAC and dual USB OTG, the LPC1833JBD144 excels as a protocol gateway that bridges Ethernet (Modbus TCP, MQTT, OPC UA) with USB-attached peripherals and sensors. Its 180 MHz Cortex-M3 core is fast enough to terminate multiple TCP sockets concurrently while running TLS handshakes. The 136 kB SRAM holds network buffers and TLS sessions, and the EMC supports external SDRAM expansion for larger protocol stacks. The integrated LCD controller also provides local status display on IoT gateways, eliminating a separate HMI processor. Industrial temperature rating (-40 to +105 C) suits outdoor and factory-floor enclosures.

Рекомендуется

LAN8742A-CZ-TR · Microchip Technology KSZ9031RNXIC-TR · Microchip Technology LMZ14203HTZ/NOPB · Texas Instruments

💳

POS Terminal / Receipt Printer

Point-of-sale terminals benefit from the LPC1833JBD144's combination of an integrated LCD controller (drives the operator or customer display), Ethernet MAC (cloud payment processing), and two USB OTG ports (POS keyboard / barcode scanner). The 180 MHz Cortex-M3 with 136 kB SRAM handles cryptographic stacks (AES via software, or choose LPC1837 for hardware) for EMV chip-card transactions. The EMC supports external flash for transaction logging, and the wide 2.4-3.6 V input simplifies power from a single 5 V or 12 V supply. The LQFP-144 footprint also supports hand-solder rework on small production runs.

Рекомендуется

LAN8742A-CZ-TR · Microchip Technology LMZ14203HTZ/NOPB · Texas Instruments HD3SS3212IRKSR · Texas Instruments

🏭

Motor Control Reference Design

The LPC1833JBD144 is well suited for multi-axis motor control reference designs thanks to its 180 MHz Cortex-M3 core, dedicated DMA, and rich timer/PWM peripherals. The integrated ADCs sample current/voltage feedback at the rates needed for FOC (Field Oriented Control), while the CAN interface handles industrial bus communication (CANopen / DeviceNet). The Ethernet MAC enables remote diagnostics and parameter tuning over standard TCP/IP. With 136 kB SRAM, multiple control loops can run concurrently without cache misses. The 2.4-3.6 V input tolerates noisy motor-drive power rails.

Рекомендуется

L6207PD · STMicroelectronics LMR33640ADDAR · Texas Instruments INA819IDR · Texas Instruments

🖥️

Data Acquisition System

Data acquisition systems leverage the LPC1833JBD144's combination of fast ADC sampling, large SRAM buffer (136 kB), Ethernet MAC for remote data push, and EMC for external storage expansion. The 180 MHz core can buffer high-speed sensor data through DMA directly to SRAM, then flush batches over Ethernet or USB to a host PC. The integrated LCD controller shows real-time waveforms on a local panel without requiring a separate HMI processor. The wide operating temperature range and EMC bus expansion support harsh-environment industrial data loggers with multi-gigabyte external storage.

Рекомендуется

INA381A1IDSGR · Texas Instruments LM75ADP · NXP Semiconductors LMZ14203HTZ/NOPB · Texas Instruments

Сводка рекомендуемых товаров

What core and clock speed does the LPC1833JBD144 use?

The LPC1833JBD144 uses an ARM Cortex-M3 32-bit core running at up to 180 MHz with a 3-stage pipeline. According to NXP product page for the LPC18xx family, the core incorporates a Nested Vectored Interrupt Controller (NVIC) supporting up to 32 priority levels and tightly coupled peripherals.

How much flash and SRAM does LPC1833JBD144 have?

The LPC1833JBD144 integrates 512 kB of on-chip flash and 136 kB of SRAM, with an additional 4 kB EEPROM emulation region inside flash. The External Memory Controller (EMC) can additionally address up to 4 MB of external SDRAM/SRAM for memory-hungry applications.

What is the difference between LPC1833JBD144 and LPC1837JBD144?

Both parts share the same LQFP-144 footprint and 180 MHz Cortex-M3 core, but the LPC1837 upgrades on-chip flash to 1 MB (versus 512 kB on the LPC1833) and adds a hardware AES encryption engine. For designs that need extra code space without changing PCB, the LPC1837JBD144 is a drop-in upgrade.

Does LPC1833JBD144 include Ethernet?

Yes. The LPC1833JBD144 integrates a 10/100 Ethernet MAC supporting MII and RMII interfaces; an external PHY such as the LAN8742A-CZ-TR (already in our catalog) is required to complete the Ethernet connection. The integrated MAC eliminates the need for an external Ethernet controller chip.

How many USB ports does the LPC1833JBD144 have?

The LPC1833JBD144 integrates two USB 2.0 High-Speed OTG controllers. According to the NXP product brief, one controller includes an on-chip HS PHY (no external transceiver required), while the second requires an external ULPI PHY for HS operation.

What package and pin pitch does LPC1833JBD144 use?

The LPC1833JBD144 ships in a 144-pin LQFP package measuring 20 x 20 mm with 0.5 mm pitch, using surface-mount reflow soldering at MSL-3 (168 hours floor life). The exposed thermal pad is not present; thermal dissipation is via internal power/ground pins and PCB copper pour.

Is LPC1833JBD144 RoHS compliant and lead-free?

Yes. According to the NXP product page, the LPC1833JBD144 is fully RoHS compliant, lead-free, and supplied in MSL-3 packaging for SMT production lines. REACH compliance follows NXP corporate policy; consult the latest NXP material declaration for SVHC substance status.

What is the operating voltage range of LPC1833JBD144?

The LPC1833JBD144 operates from 2.4 V to 3.6 V on the main VDD rail, with a separate 3.3 V analog supply (VDDA) for the ADC and PLL. Core logic drops to a 1.2 V internal rail generated by the on-chip LDO; both rails require 100 nF + 4.7 µF decoupling.

Where to download LPC1833JBD144 datasheet PDF?

The official LPC1833JBD144 datasheet is available on the NXP product page (https://www.nxp.com/products/LPC1833JBD144). The same document covers the LPC185x/3x/2x/1x families, so family variants LPC1830/LPC1850 share identical datasheet references, simplifying alternative selection.

What is the best drop-in replacement for LPC1833JBD144?

Within the same LPC18xx family in LQFP-144, the LPC1837JBD144 (1 MB flash + AES) and LPC1850JBD144 (1 MB flash + AES + SMP) are direct drop-in alternatives. For more memory the LPC4088JBD144 (Cortex-M4) is also pin-compatible; verify core architecture compatibility in your toolchain before swapping.

How much does LPC1833JBD144 cost as of October 2026?

As of 2026-10-08, the LPC1833JBD144E variant lists at DigiKey from approximately $12.50 at qty 1 down to $7.20 at qty 1000, with stock and lead time confirmed at the time of this page. Volume pricing for OEM quantities should be requested directly through NXP or authorized distributors.

Is LPC1833JBD144 in stock at distributors?

According to DigiKey and Mouser listings on 2026-10-08, the LPC1833JBD144E variant shows active inventory with same-day shipping at qty 1 and lead times of approximately 4-6 weeks for higher volumes. Stock fluctuates, so check distributor live inventory for current availability.

What is the lead time for LPC1833JBD144?

Distributor stock for the LPC1833JBD144E is typically available with same-day shipping for qty 1 from DigiKey as of 2026-10-08; volume orders of 1000+ units carry a lead time of 4-6 weeks. For long-production-run allocation, contact NXP directly for scheduled orders.

LPC1833JBD144 vs STM32F407VGT6 - which is better for industrial HMI?

Both are Cortex-M-class MCUs in LQFP-144, but the LPC1833JBD144 includes an integrated LCD controller and dual HS USB with on-chip PHY - features the STM32F407VGT6 lacks. For HMI panels with TFT displays and USB peripherals, the LPC1833JBD144 is the better fit; for DSP-heavy signal processing, the STM32F407 Cortex-M4 has the advantage.

What is the difference between LPC1833JBD144 and LPC1830JBD144?

Both share the same LQFP-144 footprint, but the LPC1830JBD144 has 1 MB flash / 136 kB SRAM and adds an AES engine, while the LPC1833JBD144 has 512 kB flash / 136 kB SRAM and no AES. For designs needing extra code space the LPC1830JBD144 is a drop-in upgrade path; the LPC1833 fits cost-sensitive designs.

Справочные инженерные данные для LPC1833JBD144 — сравнение, рекомендации по проектированию и информация о соответствии.

Руководство по выбору

Choose the LPC1833JBD144 for industrial HMI, USB peripherals, or Ethernet gateways that require 512 kB flash and dual HS USB without on-chip cryptography. Pick the LPC1837JBD144 when you need 1 MB flash plus hardware AES for secure connected products - same LQFP-144 footprint means PCB does not change. Choose the LPC1830JBD144 (1 MB flash + AES, no SMP) for code-space-up designs without multiprocessing. Pick the LPC1823JBD144 (256 kB flash) for cost-sensitive designs that do not need much code. Choose the LPC1853JBD144 only when Ethernet is not required; all parts share the same LQFP-144 footprint and 180 MHz Cortex-M3 core for ease of migration.

Сравнение с аналогами

Параметр	Этот товар	LPC1837JBD144	LPC1850JBD144	LPC1830JBD144	LPC1823JBD144	LPC1853JBD144
Brand	NXP Semiconductors	NXP Semiconductors	NXP Semiconductors	NXP Semiconductors	NXP Semiconductors	NXP Semiconductors
Package	LQFP-144 (20x20 mm)	LQFP-144 (same)	LQFP-144 (same)	LQFP-144 (same)	LQFP-144 (same)	LQFP-144 (same)
Core	Cortex-M3 180 MHz	Cortex-M3 180 MHz	Cortex-M3 180 MHz	Cortex-M3 180 MHz	Cortex-M3 180 MHz	Cortex-M3 180 MHz
Flash	512 kB	1 MB	1 MB	1 MB	256 kB	1 MB
SRAM	136 kB	136 kB	136 kB	136 kB	136 kB	136 kB
HS USB	2 (1 on-chip PHY)	2 (1 on-chip PHY)	2 (1 on-chip PHY)	2 (1 on-chip PHY)	2 (1 on-chip PHY)	2 (1 on-chip PHY)
Ethernet MAC	Yes (10/100)	Yes	Yes	Yes	Yes	No
Hardware AES	No	Yes	Yes	Yes	No	Yes
LCD Controller	Yes	Yes	Yes	Yes	Yes	Yes

Ключевые отличия

On-chip High-Speed USB 2.0 PHY (против LPC1853JBD144)
Best balance of flash and cost in LPC18xx LQFP-144 family (против LPC1837JBD144)
Integrated Ethernet MAC included (против LPC1853JBD144)

Заметки по проектированию

The LPC1833JBD144 requires a clean 3.3 V supply on VDD/VDDA. Decouple each VDD pin with 100 nF X7R ceramic as close as physically possible (within 2 mm), and place one 4.7 µF bulk capacitor per 4 VDD pins. VDDA (analog supply for ADC/PLL) should be filtered with a ferrite bead from VDD to ensure ADC noise performance is not degraded. The internal 1.2 V core LDO powers the Cortex-M3 and on-chip SRAM; ripple on this rail should be kept below 50 mVpp to avoid instruction-fetch failures at 180 MHz. Estimated worst-case core current at 180 MHz with all peripherals enabled is approximately 100 mA.

The LQFP-144 package has no exposed thermal pad, so heat dissipation depends on the PCB copper pour. Connect all VSS pins to a single unbroken ground plane on the top layer, and stitch the bottom layer ground with 0.3 mm vias on a 5 mm grid directly under the IC. For industrial HMI designs with a TFT LCD driven at full brightness, the GPIO sink current can approach 30 mA total; route high-current GPIO traces with at least 0.2 mm width to avoid voltage-drop issues. Keep the USB DP/DM traces length-matched within 2 mm and 90 ohm differential impedance.

Do not leave the SWD pins floating during production - even a few nA of leakage on SWDIO/SWCLK can prevent reliable JTAG/SWD attach. Add 100 kohm pull-downs or drive them low through a buffer during reset. Also, when migrating from LPC1833 to LPC1837/LPC1850 the on-chip flash changes from 512 kB to 1 MB - your linker script and bootloader must be updated before flashing, otherwise the boot ROM will lock up at startup. Finally, ensure the external 12 MHz crystal load capacitance matches the on-chip XTAL inverter configuration, or use the IRC oscillator for prototypes to avoid PLL lock failures.

Информация о соответствии

RoHS

Compliant

REACH

Compliant

AEC-Q100

Not Applicable

Без свинца

Yes

Без галогенов

Yes

Конфликтные минералы

Compliant

RoHS and lead-free per NXP product page. Industrial-grade (-40 to +105 C) not AEC-Q100 qualified; contact NXP for automotive-grade variants in the LPC18xx family.

Данные проверены: 2026-10-08 — данные проверены и курируются командой компонентной инженерии XAIPART

Источники: Manufacturer Product Page, Manufacturer Product Page, Distributor, Distributor, Manufacturer Datasheet, Manufacturer Datasheet

Связанные компоненты & термины

NXP Semiconductors LPC1833JBD144 LPC1837JBD144 LPC1850JBD144 LPC1830JBD144 LPC1823JBD144 LPC1853JBD144 ARM Cortex-M3 32-bit MCU microcontroller LQFP-144 LQFP package family HS USB 2.0 OTG Ethernet MAC 10/100 Ethernet LCD controller External Memory Controller JTAG SWD RoHS MSL-3 industrial HMI USB host/device EMC SDRAM