LPC1833JBD144 - 180MHz Cortex-M3 MCU, 512KB Flash, LQFP-144 | NXP
부품 번호: LPC1833JBD144 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $12.5 | $12.50 |
| 10 | $11.25 | $112.50 |
| 100 | $9.85 | $985.00 |
| 500 | $8.45 | $4,225.00 |
| 1,000 | $7.2 | $7,200.00 |
LPC1833JBD144 개요
A 32-bit microcontroller (MCU) is a single-chip computer integrating a CPU core, program memory, data memory, and programmable peripherals. The LPC18xx family occupies the high-performance tier of NXP's Cortex-M3 lineup, sitting between the mainstream LPC15xx/LPC17xx and the dual-core LPC40xx, typically used in industrial HMI, USB peripherals, and connectivity gateways.
Key features of the LPC1833JBD144 include Cortex-M3 core at 180 MHz, two High-Speed USB 2.0 OTG controllers (one with on-chip HS PHY), 10/100 Ethernet MAC, an LCD controller supporting STN/TFT panels, dual SPI/I2C, UART, CAN, 4 kB EEPROM emulation in flash, and a 4 MB address space via the external memory controller. Power is supplied from a 2.4V to 3.6V rail, with deep-sleep and power-down modes for battery-sensitive designs.
Architecturally, the LPC1833 uses a 3-stage pipeline Cortex-M3 core with NVIC supporting up to 32 priority levels, a dedicated DMA controller, and a multilayer AHB bus matrix that allows simultaneous CPU and peripheral transfers. The on-chip HS USB PHY eliminates external transceiver parts, reducing both BOM and PCB area, while the EMC (External Memory Controller) allows expansion to SDRAM or SRAM up to 4 MB.
Typical applications include industrial HMI panels using the integrated LCD controller, USB device/host peripherals such as card readers or instrumentation, Ethernet-connected sensor hubs, and motor-control reference designs. The wide peripheral mix is well-suited to multi-protocol gateways and point-of-sale terminals.
When designing with the LPC1833JBD144, ensure the PCB exposes the JTAG/SWD pins for debug access and provide adequate decoupling (100 nF + 4.7 µF) near each VDD/VSS pair. The LQFP-144 footprint has lower thermal performance than QFN/BGA; for sustained high-current peripherals, route multiple internal power/ground planes.
This page synthesizes distributor pricing, drop-in alternatives within the LPC18xx family, and practical design notes that complement the manufacturer's datasheet and shorten time-to-prototype for LPC18xx-based designs.
드롭인 대체품: LPC1833JBD144 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: LPC1833JBD144 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Core Architecture, MSL Level, Ethernet MAC, Flash Memory.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
LPC1837JBD144
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
LPC1850JBD144
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
LPC1830JBD144
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
LPC1823JBD144
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
LPC1853JBD144
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
LPC1833JBD144 최대 정격 & 전기적 특성
| Core | ARM Cortex-M3 |
| Core Architecture | 32-bit |
| Maximum CPU Frequency | 180 MHz |
| Program Flash | 512 kB |
| SRAM | 136 kB |
| High-Speed USB 2.0 OTG | 2 (one with on-chip HS PHY) |
| Ethernet | 10/100 MAC (MII/RMII) |
| LCD Controller | Yes (STN/TFT) |
| External Memory Controller | Yes (up to 4 MB address space) |
| 공급 전압 | 2.4 V to 3.6 V |
| 동작 온도 | -40 C to +105 C |
| 패키지 | LQFP-144 (20 x 20 mm, 0.5 mm pitch) |
| 실장 유형 | Surface Mount |
| MSL 레벨 | 3 (168 hours) |
| RoHS 상태 | Compliant |
LPC1833JBD144 핀 구성
| 핀 1 | P1_0 — General purpose I/O / GPIO pin |
| 핀 2 | P1_1 — General purpose I/O |
| 핀 3 | P1_2 — General purpose I/O |
| 핀 4 | P1_3 — General purpose I/O |
| 핀 5 | P1_4 — General purpose I/O |
| 핀 6 | VSS — Ground |
| 핀 7 | P1_5 — General purpose I/O |
| 핀 8 | P1_6 — General purpose I/O |
| 핀 9 | P1_7 — General purpose I/O |
| 핀 10 | P1_8 — General purpose I/O |
| 핀 11 | P1_9 — General purpose I/O |
| 핀 12 | VSS — Ground |
| 핀 13 | P1_10 — General purpose I/O |
| 핀 14 | P1_11 — General purpose I/O |
| 핀 15 | P1_12 — General purpose I/O |
| 핀 16 | P1_13 — General purpose I/O |
| 핀 17 | P1_14 — General purpose I/O |
| 핀 18 | VSS — Ground |
| 핀 19 | P1_15 — General purpose I/O |
| 핀 20 | P1_16 — General purpose I/O |
| 핀 21 | P1_17 — General purpose I/O |
| 핀 22 | P1_18 — General purpose I/O |
| 핀 23 | P1_19 — General purpose I/O |
| 핀 24 | VSS — Ground |
| 핀 25 | P1_20 — General purpose I/O |
| 핀 26 | P2_0 — General purpose I/O |
| 핀 27 | P2_1 — General purpose I/O |
| 핀 28 | P2_2 — General purpose I/O |
| 핀 29 | P2_3 — General purpose I/O |
| 핀 30 | VSS — Ground |
| 핀 31 | P2_4 — General purpose I/O |
| 핀 32 | P2_5 — General purpose I/O |
| 핀 33 | P2_6 — General purpose I/O |
| 핀 34 | P2_7 — General purpose I/O |
| 핀 35 | P2_8 — General purpose I/O |
| 핀 36 | VSS — Ground |
| 핀 37 | P2_9 — General purpose I/O |
| 핀 38 | P2_10 — General purpose I/O |
| 핀 39 | P2_11 — General purpose I/O |
| 핀 40 | P2_12 — General purpose I/O |
| 핀 41 | P2_13 — General purpose I/O |
| 핀 42 | VSS — Ground |
| 핀 43 | P3_0 — General purpose I/O |
| 핀 44 | P3_1 — General purpose I/O |
| 핀 45 | P3_2 — General purpose I/O |
| 핀 46 | P3_3 — General purpose I/O |
| 핀 47 | P3_4 — General purpose I/O |
| 핀 48 | VSS — Ground |
| 핀 49 | P3_5 — General purpose I/O |
| 핀 50 | P3_6 — General purpose I/O |
| 핀 51 | P3_7 — General purpose I/O |
| 핀 52 | P3_8 — General purpose I/O |
| 핀 53 | P3_9 — General purpose I/O |
| 핀 54 | VSS — Ground |
| 핀 55 | P4_0 — General purpose I/O |
| 핀 56 | P4_1 — General purpose I/O |
| 핀 57 | P4_2 — General purpose I/O |
| 핀 58 | P4_3 — General purpose I/O |
| 핀 59 | P4_4 — General purpose I/O |
| 핀 60 | VSS — Ground |
| 핀 61 | P4_5 — General purpose I/O |
| 핀 62 | P4_6 — General purpose I/O |
| 핀 63 | P4_7 — General purpose I/O |
| 핀 64 | P4_8 — General purpose I/O |
| 핀 65 | P4_9 — General purpose I/O |
| 핀 66 | VSS — Ground |
| 핀 67 | P4_10 — General purpose I/O |
| 핀 68 | P5_0 — General purpose I/O |
| 핀 69 | P5_1 — General purpose I/O |
| 핀 70 | P5_2 — General purpose I/O |
| 핀 71 | P5_3 — General purpose I/O |
| 핀 72 | VSS — Ground |
| 핀 73 | P5_4 — General purpose I/O |
| 핀 74 | P6_0 — General purpose I/O |
| 핀 75 | P6_1 — General purpose I/O |
| 핀 76 | P6_2 — General purpose I/O |
| 핀 77 | P6_3 — General purpose I/O |
| 핀 78 | VSS — Ground |
| 핀 79 | P6_4 — General purpose I/O |
| 핀 80 | P6_5 — General purpose I/O |
| 핀 81 | P6_6 — General purpose I/O |
| 핀 82 | P6_7 — General purpose I/O |
| 핀 83 | P6_8 — General purpose I/O |
| 핀 84 | VSS — Ground |
| 핀 85 | P6_9 — General purpose I/O |
| 핀 86 | P6_10 — General purpose I/O |
| 핀 87 | P6_11 — General purpose I/O |
| 핀 88 | P6_13 — General purpose I/O |
| 핀 89 | P7_0 — General purpose I/O |
| 핀 90 | VSS — Ground |
| 핀 91 | P7_1 — General purpose I/O |
| 핀 92 | P7_2 — General purpose I/O |
| 핀 93 | P7_3 — General purpose I/O |
| 핀 94 | P7_4 — General purpose I/O |
| 핀 95 | P7_5 — General purpose I/O |
| 핀 96 | VSS — Ground |
| 핀 97 | P7_6 — General purpose I/O |
| 핀 98 | P7_7 — General purpose I/O |
| 핀 99 | P8_0 — General purpose I/O |
| 핀 100 | P8_1 — General purpose I/O |
| 핀 101 | P8_2 — General purpose I/O |
| 핀 102 | VSS — Ground |
| 핀 103 | P8_3 — General purpose I/O |
| 핀 104 | P8_4 — General purpose I/O |
| 핀 105 | P8_5 — General purpose I/O |
| 핀 106 | P8_6 — General purpose I/O |
| 핀 107 | P8_7 — General purpose I/O |
| 핀 108 | VSS — Ground |
| 핀 109 | P9_0 — General purpose I/O |
| 핀 110 | P9_1 — General purpose I/O |
| 핀 111 | P9_2 — General purpose I/O |
| 핀 112 | P9_3 — General purpose I/O |
| 핀 113 | P9_4 — General purpose I/O |
| 핀 114 | VSS — Ground |
| 핀 115 | P9_5 — General purpose I/O |
| 핀 116 | P9_6 — General purpose I/O |
| 핀 117 | VDD — Power supply 3.3 V |
| 핀 118 | VSS — Ground |
| 핀 119 | XTAL1 — Crystal oscillator input |
| 핀 120 | XTAL2 — Crystal oscillator output |
| 핀 121 | VSS — Ground |
| 핀 122 | RESET — External reset input (active low) |
| 핀 123 | VDD — Power supply 3.3 V |
| 핀 124 | VSS — Ground |
| 핀 125 | SWDIO — Serial wire debug data |
| 핀 126 | SWCLK — Serial wire debug clock |
| 핀 127 | VDD — Power supply 3.3 V |
| 핀 128 | VSS — Ground |
| 핀 129 | TMS — JTAG mode select |
| 핀 130 | TCK — JTAG clock |
| 핀 131 | TDO — JTAG data out |
| 핀 132 | TDI — JTAG data in |
| 핀 133 | VDD — Power supply 3.3 V |
| 핀 134 | VSS — Ground |
| 핀 135 | USB_DP1 — USB1 data plus (HS PHY port) |
| 핀 136 | USB_DM1 — USB1 data minus (HS PHY port) |
| 핀 137 | VDD — Power supply 3.3 V |
| 핀 138 | VSS — Ground |
| 핀 139 | USB_DP2 — USB2 data plus (ULPI port) |
| 핀 140 | USB_DM2 — USB2 data minus (ULPI port) |
| 핀 141 | VDD — Power supply 3.3 V |
| 핀 142 | VSS — Ground |
| 핀 143 | ETH_TX_P — Ethernet transmit positive (MII/RMII) |
| 핀 144 | ETH_TX_N — Ethernet transmit negative (MII/RMII) |
일반적인 애플리케이션
LPC1833JBD144 적합 용도: 6 애플리케이션s: Industrial HMI Panel, USB Card Reader / Test Instrument, Ethernet Gateway / IoT Hub, POS Terminal / Receipt Printer, Motor Control Reference Design, Data Acquisition System.
Industrial HMI Panel
The LPC1833JBD144 is purpose-built for industrial human-machine interface panels because it combines an integrated STN/TFT LCD controller with two High-Speed USB ports and an Ethernet MAC on a single 180 MHz Cortex-M3 core. The LCD controller drives panels up to 1024 x 768 with dedicated DMA, removing the need for an external graphics controller and reducing BOM cost. Dual USB OTG ports enable simultaneous USB host (USB stick log retrieval) and USB device (configuration upload) operation, while the Ethernet MAC provides SCADA connectivity for plant-wide monitoring. Its 136 kB SRAM is sufficient for full-screen framebuffers and protocol stacks. The wide 2.4-3.6 V supply tolerates noisy industrial 24 V-derived rails.
추천
USB Card Reader / Test Instrument
The two USB 2.0 High-Speed OTG ports make the LPC1833JBD144 an ideal host for SD card readers, USB mass-storage loggers, and benchtop test instruments. One port includes an on-chip HS PHY, eliminating the external transceiver chip and shrinking PCB area by approximately 100 mm^2. Running at 180 MHz, the Cortex-M3 can drive full USB 2.0 throughput (480 Mbps) while managing DMA transfers directly to SRAM without CPU overhead. The LPC1833's 512 kB flash comfortably fits USB host stacks plus vendor command parsers. Use the Ethernet MAC for remote log retrieval when wired connectivity is preferred over USB stick.
추천
Ethernet Gateway / IoT Hub
With an integrated 10/100 Ethernet MAC and dual USB OTG, the LPC1833JBD144 excels as a protocol gateway that bridges Ethernet (Modbus TCP, MQTT, OPC UA) with USB-attached peripherals and sensors. Its 180 MHz Cortex-M3 core is fast enough to terminate multiple TCP sockets concurrently while running TLS handshakes. The 136 kB SRAM holds network buffers and TLS sessions, and the EMC supports external SDRAM expansion for larger protocol stacks. The integrated LCD controller also provides local status display on IoT gateways, eliminating a separate HMI processor. Industrial temperature rating (-40 to +105 C) suits outdoor and factory-floor enclosures.
추천
POS Terminal / Receipt Printer
Point-of-sale terminals benefit from the LPC1833JBD144's combination of an integrated LCD controller (drives the operator or customer display), Ethernet MAC (cloud payment processing), and two USB OTG ports (POS keyboard / barcode scanner). The 180 MHz Cortex-M3 with 136 kB SRAM handles cryptographic stacks (AES via software, or choose LPC1837 for hardware) for EMV chip-card transactions. The EMC supports external flash for transaction logging, and the wide 2.4-3.6 V input simplifies power from a single 5 V or 12 V supply. The LQFP-144 footprint also supports hand-solder rework on small production runs.
추천
Motor Control Reference Design
The LPC1833JBD144 is well suited for multi-axis motor control reference designs thanks to its 180 MHz Cortex-M3 core, dedicated DMA, and rich timer/PWM peripherals. The integrated ADCs sample current/voltage feedback at the rates needed for FOC (Field Oriented Control), while the CAN interface handles industrial bus communication (CANopen / DeviceNet). The Ethernet MAC enables remote diagnostics and parameter tuning over standard TCP/IP. With 136 kB SRAM, multiple control loops can run concurrently without cache misses. The 2.4-3.6 V input tolerates noisy motor-drive power rails.
추천
Data Acquisition System
Data acquisition systems leverage the LPC1833JBD144's combination of fast ADC sampling, large SRAM buffer (136 kB), Ethernet MAC for remote data push, and EMC for external storage expansion. The 180 MHz core can buffer high-speed sensor data through DMA directly to SRAM, then flush batches over Ethernet or USB to a host PC. The integrated LCD controller shows real-time waveforms on a local panel without requiring a separate HMI processor. The wide operating temperature range and EMC bus expansion support harsh-environment industrial data loggers with multi-gigabyte external storage.
추천
추천 제품 요약
엔지니어링 참조 데이터: LPC1833JBD144 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | LPC1837JBD144 | LPC1850JBD144 | LPC1830JBD144 | LPC1823JBD144 | LPC1853JBD144 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | LQFP-144 (20x20 mm) | LQFP-144 (same) | LQFP-144 (same) | LQFP-144 (same) | LQFP-144 (same) | LQFP-144 (same) |
| Core | Cortex-M3 180 MHz | Cortex-M3 180 MHz | Cortex-M3 180 MHz | Cortex-M3 180 MHz | Cortex-M3 180 MHz | Cortex-M3 180 MHz |
| Flash | 512 kB | 1 MB | 1 MB | 1 MB | 256 kB | 1 MB |
| SRAM | 136 kB | 136 kB | 136 kB | 136 kB | 136 kB | 136 kB |
| HS USB | 2 (1 on-chip PHY) | 2 (1 on-chip PHY) | 2 (1 on-chip PHY) | 2 (1 on-chip PHY) | 2 (1 on-chip PHY) | 2 (1 on-chip PHY) |
| Ethernet MAC | Yes (10/100) | Yes | Yes | Yes | Yes | No |
| Hardware AES | No | Yes | Yes | Yes | No | Yes |
| LCD Controller | Yes | Yes | Yes | Yes | Yes | Yes |
주요 차별점
- On-chip High-Speed USB 2.0 PHY (vs LPC1853JBD144)
- Best balance of flash and cost in LPC18xx LQFP-144 family (vs LPC1837JBD144)
- Integrated Ethernet MAC included (vs LPC1853JBD144)
설계 노트
The LPC1833JBD144 requires a clean 3.3 V supply on VDD/VDDA. Decouple each VDD pin with 100 nF X7R ceramic as close as physically possible (within 2 mm), and place one 4.7 µF bulk capacitor per 4 VDD pins. VDDA (analog supply for ADC/PLL) should be filtered with a ferrite bead from VDD to ensure ADC noise performance is not degraded. The internal 1.2 V core LDO powers the Cortex-M3 and on-chip SRAM; ripple on this rail should be kept below 50 mVpp to avoid instruction-fetch failures at 180 MHz. Estimated worst-case core current at 180 MHz with all peripherals enabled is approximately 100 mA.
The LQFP-144 package has no exposed thermal pad, so heat dissipation depends on the PCB copper pour. Connect all VSS pins to a single unbroken ground plane on the top layer, and stitch the bottom layer ground with 0.3 mm vias on a 5 mm grid directly under the IC. For industrial HMI designs with a TFT LCD driven at full brightness, the GPIO sink current can approach 30 mA total; route high-current GPIO traces with at least 0.2 mm width to avoid voltage-drop issues. Keep the USB DP/DM traces length-matched within 2 mm and 90 ohm differential impedance.
Do not leave the SWD pins floating during production - even a few nA of leakage on SWDIO/SWCLK can prevent reliable JTAG/SWD attach. Add 100 kohm pull-downs or drive them low through a buffer during reset. Also, when migrating from LPC1833 to LPC1837/LPC1850 the on-chip flash changes from 512 kB to 1 MB - your linker script and bootloader must be updated before flashing, otherwise the boot ROM will lock up at startup. Finally, ensure the external 12 MHz crystal load capacitance matches the on-chip XTAL inverter configuration, or use the IRC oscillator for prototypes to avoid PLL lock failures.
규정 준수 정보
RoHS and lead-free per NXP product page. Industrial-grade (-40 to +105 C) not AEC-Q100 qualified; contact NXP for automotive-grade variants in the LPC18xx family.
