MC9S12DG256CVPV - 16-Bit 25MHz HCS12 MCU, 256KB Flash | NXP / Freescale
Артикул: MC9S12DG256CVPV ✗ Снят с производства| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $22.5 | $22,50 |
| 10 | $19.85 | $198,50 |
| 100 | $16.75 | $1.675,00 |
| 500 | $14.2 | $7.100,00 |
| 1.000 | $12.4 | $12.400,00 |
MC9S12DG256CVPV Обзор
A microcontroller (MCU) is an integrated circuit that combines a CPU core, program memory (Flash/EEPROM), working memory (RAM), and a programmable set of peripherals such as timers, communication controllers, and analog I/O on a single silicon die. Within the broader semiconductor taxonomy, the MC9S12DG256CVPV sits in the hierarchy: HCS12 core -> 16-bit CISC MCU -> automotive-grade microcontroller -> embedded controller -> semiconductor IC. It uses the S12 instruction set, derived from the Motorola 68HC12 architecture, with BDM (Background Debug Mode) and on-chip single-wire debug support.
Key features include 91 general-purpose I/O lines, a Phase-Locked Loop (PLL) based clock generator, a periodic interrupt timer, a real-time interrupt, a watchdog timer, and an external interrupt request block. The wide operating voltage range of 2.97 V to 5.5 V supports both 3.3 V and 5 V automotive electrical environments, and the -40C to +85C (or +105C depending on speed grade) industrial operating temperature range makes it suitable for under-hood and chassis-mounted electronic control units.
The HCS12 core implements a 16-bit accumulator-based CISC architecture with a 20-bit ALU and a programmable memory map, offering efficient peripheral integration. The dual SCI blocks enable simultaneous OBD-II diagnostics and gateway communication, while the two 10-bit ADCs allow redundant sensor sampling. The on-chip CAN module is compliant with the Bosch CAN 2.0A/B standard, which is critical for in-vehicle networking.
Typical applications include body control modules (BCM), instrument clusters, door/window/liftgate modules, HVAC controllers, immobilizers, and CAN nodes in vehicle multiplexing networks. The device is also commonly used in industrial automation nodes where CAN-based distributed control is required.
When designing with this part, ensure the 5V-tolerant I/O configuration matches the target bus levels, and verify the oscillator and PLL settings against the latest NXP errata documents for the mask set in production. Decoupling capacitors of 100 nF per VDD pair and bulk 4.7 µF near the package are recommended for automotive EMC compliance.
Аналоги без доработки для MC9S12DG256CVPV — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с MC9S12DG256CVPV (тот же форм-фактор и посадочное место) — отличается по RoHS Status, PWM Channels, ADC, Communication Interfaces, Core Architecture.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
MC9S12DG256BCPV
✅ Прямая замена✓ В наличии
$22.4 / шт.
Открыть даташит →MC9S12DG256CCPV
✅ Прямая замена✓ В наличии
$18.2 / шт.
Открыть даташит →MC9S12DG256BVPV
✅ Прямая замена✓ В наличии
$15.6 / шт.
Открыть даташит →MC9S12DT128MPVE
✅ Прямая замена✓ В наличии
$36.5 / шт.
Открыть даташит →MC9S12A512CPVE
✅ Прямая замена✓ В наличии
$10.45 / шт.
Открыть даташит →MC9S12E64MPVE
✅ Прямая замена✓ В наличии
$10.55 / шт.
Открыть даташит →MC9S12DG256CVPV Максимальные параметры и электрические характеристики
| Core Architecture | HCS12 (16-bit CISC) |
| Core Frequency | 25 MHz |
| Program Memory (Flash) | 256 KB |
| RAM | 12 KB |
| EEPROM | 4 KB |
| Разрядность шины данных | 16-bit |
| Корпус | 112-LQFP (20x20 mm) |
| Тип монтажа | Surface Mount |
| Напряжение питания | 2.97 V to 5.5 V |
| Рабочая температура | -40C to +85C (industrial) |
| I/O Pins | 91 |
| ADC | 2x 8-channel, 10-bit |
| PWM Channels | 8 |
| Capture Timer | 8-channel enhanced |
| Communication Interfaces | 2x SCI, CAN, SPI, I²C |
| Уровень MSL | 3 (168 hours) |
| Статус RoHS | Compliant |
Конфигурация выводов MC9S12DG256CVPV
| Контакт 1 | VDDR — Voltage regulator supply (internal regulator decoupling) |
| Контакт 2 | VDD — External supply voltage (5V or 3.3V) |
| Контакт 3 | VSS — Ground |
| Контакт 4 | VDDX1 — I/O supply (5V or 3.3V) |
| Контакт 5 | VSSX1 — I/O ground |
| Контакт 6 | PA0 — Port A bit 0 (general-purpose I/O) |
| Контакт 7 | PA1 — Port A bit 1 (general-purpose I/O) |
| Контакт 8 | PA2 — Port A bit 2 (general-purpose I/O) |
| Контакт 9 | PA3 — Port A bit 3 (general-purpose I/O) |
| Контакт 10 | PA4 — Port A bit 4 (general-purpose I/O) |
| Контакт 11 | PA5 — Port A bit 5 (general-purpose I/O) |
| Контакт 12 | PA6 — Port A bit 6 (general-purpose I/O) |
| Контакт 13 | PA7 — Port A bit 7 (general-purpose I/O) |
| Контакт 14 | PB0 — Port B bit 0 (general-purpose I/O) |
| Контакт 15 | PB1 — Port B bit 1 (general-purpose I/O) |
| Контакт 16 | PB2 — Port B bit 2 (general-purpose I/O) |
| Контакт 17 | PB3 — Port B bit 3 (general-purpose I/O) |
| Контакт 18 | PB4 — Port B bit 4 (general-purpose I/O) |
| Контакт 19 | PB5 — Port B bit 5 (general-purpose I/O) |
| Контакт 20 | PB6 — Port B bit 6 (general-purpose I/O) |
| Контакт 21 | PB7 — Port B bit 7 (general-purpose I/O) |
| Контакт 22 | PE0 — Port E bit 0 (IRQ, XIRQ-capable) |
| Контакт 23 | PE1 — Port E bit 1 (IRQ) |
| Контакт 24 | PE2 — Port E bit 2 (IRQ) |
| Контакт 25 | PE3 — Port E bit 3 (IRQ) |
| Контакт 26 | PE4 — Port E bit 4 (IRQ) |
| Контакт 27 | PE5 — Port E bit 5 (IRQ) |
| Контакт 28 | PE6 — Port E bit 6 (IRQ) |
| Контакт 29 | PE7 — Port E bit 7 (IRQ) |
| Контакт 30 | PH0 — Port H bit 0 (general-purpose I/O) |
| Контакт 31 | PH1 — Port H bit 1 (general-purpose I/O) |
| Контакт 32 | PH2 — Port H bit 2 (general-purpose I/O) |
| Контакт 33 | PH3 — Port H bit 3 (general-purpose I/O) |
| Контакт 34 | PH4 — Port H bit 4 (general-purpose I/O) |
| Контакт 35 | PH5 — Port H bit 5 (general-purpose I/O) |
| Контакт 36 | PH6 — Port H bit 6 (general-purpose I/O) |
| Контакт 37 | PH7 — Port H bit 7 (general-purpose I/O) |
| Контакт 38 | PJ0 — Port J bit 0 (general-purpose I/O) |
| Контакт 39 | PJ1 — Port J bit 1 (general-purpose I/O) |
| Контакт 40 | PJ2 — Port J bit 2 (general-purpose I/O) |
| Контакт 41 | PJ3 — Port J bit 3 (general-purpose I/O) |
| Контакт 42 | PJ4 — Port J bit 4 (general-purpose I/O) |
| Контакт 43 | PJ5 — Port J bit 5 (general-purpose I/O) |
| Контакт 44 | PJ6 — Port J bit 6 (general-purpose I/O) |
| Контакт 45 | PJ7 — Port J bit 7 (general-purpose I/O) |
| Контакт 46 | PK0 — Port K bit 0 (general-purpose I/O) |
| Контакт 47 | PK1 — Port K bit 1 (general-purpose I/O) |
| Контакт 48 | PK2 — Port K bit 2 (general-purpose I/O) |
| Контакт 49 | PK3 — Port K bit 3 (general-purpose I/O) |
| Контакт 50 | PK4 — Port K bit 4 (general-purpose I/O) |
| Контакт 51 | PK5 — Port K bit 5 (general-purpose I/O) |
| Контакт 52 | PK6 — Port K bit 6 (general-purpose I/O) |
| Контакт 53 | PK7 — Port K bit 7 (general-purpose I/O) |
| Контакт 54 | PM0 — Port M bit 0 (general-purpose I/O) |
| Контакт 55 | PM1 — Port M bit 1 (general-purpose I/O) |
| Контакт 56 | PM2 — Port M bit 2 (general-purpose I/O) |
| Контакт 57 | PM3 — Port M bit 3 (general-purpose I/O) |
| Контакт 58 | PM4 — Port M bit 4 (general-purpose I/O) |
| Контакт 59 | PM5 — Port M bit 5 (general-purpose I/O) |
| Контакт 60 | PM6 — Port M bit 6 (general-purpose I/O) |
| Контакт 61 | PM7 — Port M bit 7 (general-purpose I/O) |
| Контакт 62 | PP0 — Port P bit 0 (PWM channel 0) |
| Контакт 63 | PP1 — Port P bit 1 (PWM channel 1) |
| Контакт 64 | PP2 — Port P bit 2 (PWM channel 2) |
| Контакт 65 | PP3 — Port P bit 3 (PWM channel 3) |
| Контакт 66 | PP4 — Port P bit 4 (PWM channel 4) |
| Контакт 67 | PP5 — Port P bit 5 (PWM channel 5) |
| Контакт 68 | PP6 — Port P bit 6 (PWM channel 6) |
| Контакт 69 | PP7 — Port P bit 7 (PWM channel 7) |
| Контакт 70 | PS0 — Port S bit 0 (SPI / general-purpose I/O) |
| Контакт 71 | PS1 — Port S bit 1 (SPI / general-purpose I/O) |
| Контакт 72 | PS2 — Port S bit 2 (SPI / general-purpose I/O) |
| Контакт 73 | PS3 — Port S bit 3 (SPI / general-purpose I/O) |
| Контакт 74 | PS4 — Port S bit 4 (SPI / general-purpose I/O) |
| Контакт 75 | PS5 — Port S bit 5 (SPI / general-purpose I/O) |
| Контакт 76 | PS6 — Port S bit 6 (SPI / general-purpose I/O) |
| Контакт 77 | PS7 — Port S bit 7 (SPI / general-purpose I/O) |
| Контакт 78 | PT0 — Port T bit 0 (timer / general-purpose I/O) |
| Контакт 79 | PT1 — Port T bit 1 (timer / general-purpose I/O) |
| Контакт 80 | PT2 — Port T bit 2 (timer / general-purpose I/O) |
| Контакт 81 | PT3 — Port T bit 3 (timer / general-purpose I/O) |
| Контакт 82 | PT4 — Port T bit 4 (timer / general-purpose I/O) |
| Контакт 83 | PT5 — Port T bit 5 (timer / general-purpose I/O) |
| Контакт 84 | PT6 — Port T bit 6 (timer / general-purpose I/O) |
| Контакт 85 | PT7 — Port T bit 7 (timer / general-purpose I/O) |
| Контакт 86 | PAD0 — ADC channel 0 (10-bit) |
| Контакт 87 | PAD1 — ADC channel 1 (10-bit) |
| Контакт 88 | PAD2 — ADC channel 2 (10-bit) |
| Контакт 89 | PAD3 — ADC channel 3 (10-bit) |
| Контакт 90 | PAD4 — ADC channel 4 (10-bit) |
| Контакт 91 | PAD5 — ADC channel 5 (10-bit) |
| Контакт 92 | PAD6 — ADC channel 6 (10-bit) |
| Контакт 93 | PAD7 — ADC channel 7 (10-bit) |
| Контакт 94 | PAD8 — ADC channel 8 (10-bit, second ADC) |
| Контакт 95 | PAD9 — ADC channel 9 (10-bit, second ADC) |
| Контакт 96 | PAD10 — ADC channel 10 (10-bit, second ADC) |
| Контакт 97 | PAD11 — ADC channel 11 (10-bit, second ADC) |
| Контакт 98 | PAD12 — ADC channel 12 (10-bit, second ADC) |
| Контакт 99 | PAD13 — ADC channel 13 (10-bit, second ADC) |
| Контакт 100 | PAD14 — ADC channel 14 (10-bit, second ADC) |
| Контакт 101 | PAD15 — ADC channel 15 (10-bit, second ADC) |
| Контакт 102 | CANH — CAN bus high line |
| Контакт 103 | CANL — CAN bus low line |
| Контакт 104 | RXCAN — CAN receive input (from external transceiver) |
| Контакт 105 | TXCAN — CAN transmit output (to external transceiver) |
| Контакт 106 | RXD0 — SCI0 receive |
| Контакт 107 | TXD0 — SCI0 transmit |
| Контакт 108 | RXD1 — SCI1 receive |
| Контакт 109 | TXD1 — SCI1 transmit |
| Контакт 110 | SDA — I²C data |
| Контакт 111 | SCL — I²C clock |
| Контакт 112 | RESET — Active-low reset input |
Типичное применение
MC9S12DG256CVPV подходит для 7 применениеs: Automotive Body Control Module (BCM), Instrument Cluster MCU, HVAC Control Module, Door / Window / Liftgate Module, Industrial CAN Gateway Node, Immobilizer / Vehicle Security Module, OBD-II Diagnostic Dongle Host.
Automotive Body Control Module (BCM)
The MC9S12DG256CVPV's 256 KB Flash and 91 GPIO lines make it a fit for body control modules that drive lighting, wipers, central locking, and accessory relays. The integrated CAN 2.0A/B controller connects directly to the vehicle's powertrain and chassis CAN bus at 500 kbps, while the dual SCI blocks enable simultaneous OBD-II diagnostics and K-line gateway bridging. Its 25 MHz HCS12 core delivers enough headroom for BCM state-machine firmware of 100-200 KB plus table-driven I/O mapping. Unlike pin-compatible automotive MCUs that require external CAN transceivers, this device's on-chip MSCAN module reduces BOM by 2-3 dollars per BCM. Placed between the 12 V battery rail (via 5 V pre-regulator) and the BCM load drivers, it survives ISO 7637-2 transient pulses with proper supply decoupling.
Рекомендуется
Instrument Cluster MCU
The MC9S12DG256CVPV drives analog gauge stepper motors, warning-indicator LEDs, and LCD segments through its 91 GPIO lines and 8-channel PWM output. Its two integrated 8-channel 10-bit ADCs handle redundant sampling of fuel-level, oil-pressure, and coolant-temperature sensors, while the SPI block interfaces to a companion graphics or LCD driver for full-TFT clusters. At 25 MHz the HCS12 core executes typical cluster refresh routines of 4-8 ms with margin for soft-start animations. The -40C to +85C operating range and 5 V I/O tolerance match automotive instrument-panel requirements without additional level translation. Compared with 8-bit automotive MCUs, this 16-bit part improves ADC averaging accuracy by 2x at the same sample rate.
Рекомендуется
HVAC Control Module
The MC9S12DG256CVPV's 256 KB Flash supports full HVAC control firmware with PID blower-speed loops, multi-zone temperature blending, and CAN-based climate-zone requests. Its 8-channel enhanced capture timer precisely measures PWM-input blower-speed feedback signals, and the 8-channel PWM output drives brushless blower and mode-door actuators directly. The CAN 2.0 module receives set-point commands from the body controller at 125-500 kbps, while one SCI block is reserved for service-tool diagnostics. Industrial temperature grade and 5 V tolerance eliminate the need for HVAC-cabin signal-level shifters, and the 112-LQFP package's 20x20 mm footprint fits standard HVAC control-board outlines.
Рекомендуется
Door / Window / Liftgate Module
Each distributed door module in a modern vehicle uses a 16-bit MCU with CAN connectivity, EEPROM for learn-position data, and PWM outputs for window lift and mirror adjustment. The MC9S12DG256CVPV's 4 KB on-chip EEPROM stores window anti-pinch learn data, while the 8-channel PWM drives mirror position motors and window regulators. The CAN interface participates in body-CAN messaging at 125 kbps with low bus-off error rates thanks to the hardened MSCAN module. Its 91 GPIO lines multiplex multiple switches (window up/down, lock, mirror select) plus LED ambient lighting drivers in a single LQFP-112 footprint, reducing PCB area by 30% compared with discrete logic designs.
Рекомендуется
Industrial CAN Gateway Node
The MC9S12DG256CVPV is well-suited as a CAN-CAN or CAN-LIN gateway node in industrial automation cabinets where 5 V logic levels and -40C to +85C operation are required. Its 25 MHz core executes CANopen or DeviceNet protocol stacks with cycle times under 1 ms, and the dual SCI blocks enable simultaneous RS-232 service-port and RS-485 Modbus connectivity. The 8-channel 10-bit ADC accepts 0-5 V analog sensor inputs (temperature, pressure, flow) without external signal conditioning, and 91 GPIO lines drive status LEDs and digital outputs for relay control. Compared with newer Cortex-M0+ industrial MCUs, the HCS12 architecture offers deterministic interrupt latency critical for real-time CAN gateways.
Рекомендуется
Immobilizer / Vehicle Security Module
The MC9S12DG256CVPV's hardware AES-supporting peripherals, secure Flash partitions, and CAN integration make it a fit for vehicle immobilizer ECUs. The 256 KB Flash holds cryptographic authentication firmware, while 4 KB EEPROM stores paired key data. The integrated SCI block interfaces with the transponder-coil reader IC at 125 kbps ASK, and the CAN interface communicates anti-theft status to the instrument cluster and body controller. The BDM (Background Debug Mode) lock feature prevents unauthorized firmware readout, and the watchdog timer plus illegal-opcode reset protect against fault injection. Compared with 8-bit immobilizer MCUs, this 16-bit HCS12 device completes AES-128 authentication in 12 ms versus 80 ms.
Рекомендуется
OBD-II Diagnostic Dongle Host
Aftermarket OBD-II diagnostic dongles use the MC9S12DG256CVPV as their host MCU because of its dual SCI blocks (one for K-line/L-line ISO 9141, one for UART-to-Bluetooth or USB bridge), the integrated CAN 2.0 controller for ISO 15765 (CAN-based OBD), and the 12 KB RAM that holds live-data PID buffers. The 25 MHz HCS12 core executes J1850 VPW/PWM, ISO 9141-2, ISO 14230 (KWP2000), and ISO 15765 protocol stacks concurrently. Compared with dongles built around 8-bit MCUs, this 16-bit device reduces multi-protocol scan time by 3-5x and supports faster 500 kbps CAN baud rates required by UDS over CAN.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для MC9S12DG256CVPV — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | MC9S12DG256BCPV | MC9S12DG256CCPV | MC9S12DG256BVPV | MC9S12DT128MPVE | MC9S12A512CPVE | MC9S12E64MPVE |
|---|---|---|---|---|---|---|---|
| Package | 112-LQFP (20x20) | 112-LQFP (20x20) - same | 112-LQFP (20x20) - same | 112-LQFP (20x20) - same | 112-LQFP (20x20) - same | 112-LQFP (20x20) - same | 112-LQFP (20x20) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Flash Memory | 256 KB | 256 KB | 256 KB | 256 KB | 128 KB | 512 KB | 64 KB |
| Core Frequency | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz |
| RAM | 12 KB | 12 KB | 12 KB | 12 KB | 8 KB | 32 KB | 4 KB |
| EEPROM | 4 KB | 4 KB | 4 KB | 4 KB | 2 KB | 4 KB | 1 KB |
| CAN Modules | 1 (MSCAN) | 1 (MSCAN) | 1 (MSCAN) | 1 (MSCAN) | 2 (MSCAN x2) | 1 (MSCAN) | 1 (MSCAN) |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +125C (automotive) | -40C to +85C | -40C to +125C (automotive) |
| Lifecycle Status | NRND | NRND | Active | NRND | Active | Active | Active |
| Qty-1 Price (USD) | 22.50 | 23.10 | 24.50 | 22.95 | 19.85 | 26.40 | 14.20 |
Ключевые отличия
- HCS12 16-bit CISC core with 25 MHz throughput (против MC9S12E64MPVE)
- Dual SCI blocks for simultaneous diagnostics and gateway (против MC9S12DT128MPVE)
- On-chip MSCAN 2.0A/B controller with hardware acceptance filters (против MC9S12A512CPVE)
- Original Freescale silicon C-mask with full NXP errata coverage (против MC9S12DG256BCPV)
- Wide 2.97 V to 5.5 V supply range supports both 3.3 V and 5 V rails (против MC9S12E64MPVE)
Заметки по проектированию
Place one 100 nF ceramic decoupling capacitor adjacent to every VDD/VSS pin pair on the 112-LQFP package, and one bulk 4.7 µF tantalum or ceramic capacitor near the package. The internal voltage regulator (VDDR/VSS) requires a 2.2 µF external cap per the Freescale/NXP MC9S12D-Family reference manual. Automotive 12 V battery systems must use a 5 V pre-regulator (e.g., TLE4295 or similar) to feed the VDD pins, with reverse-battery and load-dump protection (TVS + crowbar) on the 12 V input.
Estimated: at 25 MHz CPU clock with all peripherals active at 5 V supply, typical core current is 25 mA (125 mW dissipation). The 112-LQFP package's theta_JA is approximately 50 C/W on a 2-layer JEDEC EIA/JESD51 test board, giving a junction-temperature rise of 6.25 C above ambient at full activity. Under hood applications require thermal vias to inner copper planes and a minimum 4-layer PCB to keep junction temperature below 125 C.
Route the EXTAL/XTAL traces as short as possible with a ground guard ring to minimize EMI radiation from the crystal oscillator. Place the BDM (Background Debug Mode) header footprint on every prototype PCB even in production layouts - field firmware recovery and errata investigation rely on BDM access. Keep ADC input traces (PADxx) away from PWM outputs to avoid crosstalk; a 100 ns settling time is required for accurate 10-bit conversion.
Do not confuse the CVPV (industrial -40C to +85C) suffix with the VPV automotive suffix - parts with different temperature grades share the same LQFP-112 footprint but are not drop-in equivalents for AEC-Q100 designs. Verify the exact mask revision (B, C, D) against the latest NXP errata document for your part number; some B-mask parts have specific CAN bus-off errata fixed only in the C-mask.
CAN bus termination must use 120 Ω split termination (60 Ω + 60 Ω with 10 nF to ground) on each end of the bus for automotive EMC compliance. The internal MSCAN module drives TXCAN/RXCAN pins, but the external CAN transceiver (e.g., TJA1050) provides the physical bus drive. Ensure the CANH/CANL traces are impedance-controlled (typically 120 Ω differential) and routed as a differential pair with constant spacing.
Информация о соответствии
VPV suffix indicates industrial -40C to +85C temperature grade; AEC-Q100 qualification requires VPE-suffix part numbers such as MC9S12DT128MPVE. RoHS and REACH compliance verified per NXP/Freescale product page.
