NXP Semiconductors

MC9S12H256VFVER - 16-Bit 256KB Flash HCS12 MCU | NXP | 144-LQFP

Артикул: MC9S12H256VFVER ✗ Снят с производства
В наличии Отправка в течение 1–3 рабочих дней
2.5 V core / 5 V I/O Vdss 144-LQFP (20 x 20 mm) Package 16 MHz Speed 256 KB (256K x 8) FLASH Memory
От $10.95 USD / шт.
MOQ: 1 |
Цена обновлена: 2026-10-19
Оптовые цены
Кол-во Цена за ед. Итого
1 $18.5 $18,50
10 $16.2 $162,00
100 $13.85 $1.385,00
500 $12.1 $6.050,00
1.000 $10.95 $10.950,00
ℹ️ Все цены указаны в USD

MC9S12H256VFVER Обзор

The NXP MC9S12H256VFVER is a 16-bit HCS12 CISC microcontroller with 256KB (256K x 8) of on-chip FLASH program memory and 12KB of data RAM, housed in a 144-pin LQFP (20x20 mm) package with tape-and-reel packaging. The CPU12 core runs at up to 16 MHz and integrates rich automotive-grade peripherals including CANbus (2x), two analog timer modules, SCI, SPI and I2C communication interfaces, plus LCD driver, PWM, POR and watchdog functionality.

What is an HCS12 microcontroller? The HCS12 is NXP's (originally Motorola/Freescale) 16-bit CISC microcontroller family targeting automotive body, chassis and gateway applications. It belongs to the broader MCU hierarchy of microcontroller -> embedded MCU -> 16-bit MCU -> automotive-grade MCU -> semiconductor IC. The HCS12 architecture evolved from the HC11 and HC12 families and is widely second-sourced in automotive designs because of its mature toolchain and proven reliability.

Key features include 256KB of in-application programmable FLASH, 4KB EEPROM emulation, 12KB RAM, 99 digital I/O pins routed to the LQFP-144 footprint, and an integrated LCD driver capable of supporting segment displays. The dual-CAN interface enables gateway and body-control networks, while the on-chip LCD module reduces BOM in instrument-cluster designs.

Typical applications for this part include automotive instrument clusters, body controllers, HVAC panels, gateway modules, industrial CAN nodes, and LCD-based human-machine interfaces. The automotive AEC-Q100 qualification and 2.5V/5V dual-voltage I/O make it suitable for 12V automotive power systems.

When designing with the MC9S12H256VFVER, ensure the VREG is bypassed with a 100 nF + 4.7 uF combination as recommended in the Freescale/NXP device user guide, and that the PLL loop filter network follows the reference schematic to keep jitter within spec.

This page synthesizes verified distributor pricing, AEC-Q100-qualified alternatives, and PCB-layout notes not always present in the device user guide - giving procurement engineers and firmware developers a single source for evaluating this part against its HCS12 siblings.

Аналоги без доработки для MC9S12H256VFVER — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.

Варианты в этой серии

Модели той же серии, совместимые без доработки с MC9S12H256VFVER (тот же форм-фактор и посадочное место) — отличается по Package, Operating Temperature, Automotive Qualification, Core, Core Processor.

NXP Semiconductors
Core Processor: HCS12
Сравнить с MC9S12H256VFVER →
NXP Semiconductors
Package: 112-LQFP (20x20 mm)
Operating Temperature: -40C to +125C
Core: HCS12
Сравнить с MC9S12H256VFVER →
NXP Semiconductors
Package: 112-LQFP (20 x 20 mm)
Operating Temperature: -40 °C to +105 °C
Core: HCS12 (16-bit)
Сравнить с MC9S12H256VFVER →
NXP Semiconductors
Package: 112-LQFP
Сравнить с MC9S12H256VFVER →
NXP Semiconductors
Package: 144-pin LQFP (20x20 mm)
Operating Temperature: -40C to +85C
Core: HCS12X (16-bit CISC with XGATE co-processor)
Сравнить с MC9S12H256VFVER →
NXP Semiconductors
Package: 144-LQFP (20x20 mm)
Operating Temperature: -40C to +85C (TA)
Core Processor: HCS12X (16-bit CISC)
Сравнить с MC9S12H256VFVER →
NXP Semiconductors
Package: 144-LQFP (20x20 mm), 0.5 mm pitch
Operating Temperature: -40C to +105C
Automotive Qualification: Yes
Сравнить с MC9S12H256VFVER →
NXP Semiconductors
Package: 144-pin LQFP (20 x 20 mm)
Operating Temperature: -40 °C to +105 °C (automotive)
Automotive Qualification: AEC-Q100 qualified
Сравнить с MC9S12H256VFVER →
NXP Semiconductors
Package: 144-pin QFP
Automotive Qualification: Automotive qualified
Сравнить с MC9S12H256VFVER →
NXP Semiconductors
Automotive Qualification: Automotive Qualified
Core Processor: HCS12 (S12 core)
Сравнить с MC9S12H256VFVER →

Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:

S9S12H256J2VFVER

✅ Прямая замена ⚠️ Характеристики не проверены
NXP Semiconductors
📦 144-LQFP (20x20)
HCS12 (S12 core) · 16-bit · 50 MHz · 256 KB (256K x 8) FLASH · 12 KB · 2 KB · -40C to +105C · 144-LQFP (20x20 mm)

✓ В наличии

Уточнить цену

Открыть даташит →

MC9S12H256VPVE

✅ Прямая замена ⚠️ Характеристики не проверены
NXP Semiconductors
📦 144-LQFP (20x20)
HCS12 (16-bit) · 50 MHz · 256 KB (256K x 8) · 12 KB · 4 KB · 4.5 V to 5.5 V (regulated internally to 2.5 V core) · -40 °C to +105 °C · 112-LQFP (20 x 20 mm)

✓ В наличии

$17.25 / шт.

Открыть даташит →

MC9S12DT128MPVE

✅ Прямая замена ⚠️ Характеристики не проверены
NXP Semiconductors
📦 144-LQFP
HCS12 · 16-bit · 25 MHz · 128KB (128K x 8) · 8KB (8K x 8) · 2KB (2K x 8) · 2.35 V to 5.25 V · 91

✓ В наличии

$36.5 / шт.

Открыть даташит →

MC9S12DG128MPV

✅ Прямая замена ⚠️ Характеристики не проверены
NXP Semiconductors
📦 144-LQFP
HCS12 · 16-Bit · CISC · 25 MHz · 128KB (128K x 8) · FLASH · 8K x 8 · 2K x 8

✓ В наличии

Уточнить цену

Открыть даташит →

MC9S12XDT256CAG

✅ Прямая замена ⚠️ Характеристики не проверены
NXP Semiconductors
📦 144-LQFP
HCS12X (16-bit CISC with XGATE co-processor) · 256 KB Flash · 16 KB · 4 KB · 80 MHz · 2.35 V to 2.75 V · 4.5 V to 5.5 V · 119

✓ В наличии

$17.4 / шт.

Открыть даташит →

MC9S12XEQ384CAG

✅ Прямая замена
NXP Semiconductors
📦 144-LQFP
HCS12X (16-bit CISC) · 16-bit · 50 MHz · XGATE RISC co-processor · 384 KB (384K x 8) · 24K x 8 · Hardware-emulated EEPROM (programmable, flexible) · 12-bit

✓ В наличии

Уточнить цену

Открыть даташит →

MC9S12H256VFVER Максимальные параметры и электрические характеристики

Core Processor HCS12 CPU12
Core Size 16-Bit
Core Architecture CISC
Максимальная тактовая частота 16 MHz
Program Memory Size 256 KB (256K x 8) FLASH
Data RAM 12 KB
EEPROM 4 KB
Number of I/O Pins 99
Напряжение питания 2.5 V core / 5 V I/O
Рабочая температура -40 C to +105 C (automotive)
Корпус 144-LQFP (20 x 20 mm)
Тип монтажа Surface Mount
Connectivity CANbus (2x), I2C, SCI, SPI
Peripherals LCD driver, POR, PWM, WDT
Automotive Qualification AEC-Q100
Уровень MSL 3 (168 hours)

Руководство по цоколевке MC9S12H256VFVER в корпусе 144-lqfp (20 x 20 mm)

Цоколевка для MC9S12H256VFVER (корпус 144-lqfp (20 x 20 mm)). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.

Схема цоколевки корпуса 144-lqfp (20 x 20 mm) для MC9S12H256VFVER

Нет подробных данных о распиновке для MC9S12H256VFVER.

Обратитесь к даташиту для полной конфигурации выводов.

Типичное применение

MC9S12H256VFVER подходит для 6 применениеs: Automotive Instrument Cluster, Automotive Body Controller Module (BCM), HVAC Control Module, CAN Gateway Module, Industrial CAN Node, LCD-Based Human-Machine Interface.

🚗

Automotive Instrument Cluster

The MC9S12H256VFVER is an excellent fit for analog/digital instrument-cluster mainboards thanks to its on-chip LCD segment driver, 256KB FLASH for full cluster graphics plus warning text, and dual MSCAN controllers for receiving vehicle-bus data from the body and chassis CAN networks. Its 99 GPIO allow direct drive of cluster telltale LEDs and stepper-motor gauge outputs without external expander ICs. The 16 MHz HCS12 CPU12 core executes typical cluster refresh loops at 50-100 Hz with comfortable margin, while the 12KB RAM supports trip-computer and odometer state without external memory. AEC-Q100 Grade 2 qualification and -40 C to +105 C operation satisfy dashboard thermal requirements.

🚗

Automotive Body Controller Module (BCM)

Body controllers require multiple LIN/CAN interfaces, abundant GPIO for lighting/door/window loads, and AEC-Q100 reliability - all met by the MC9S12H256VFVER's dual MSCAN, 99 I/O pins, and Grade 2 qualification. The 256KB FLASH accommodates BCM application code plus UDS/NM stacks, while 4KB EEPROM stores variant coding, immobilizer pairing and learned trim positions. The HCS12 core's deterministic interrupt latency ensures wiper, lighting and central-locking responses within 10 ms, critical for vehicle comfort features. Its 2.5V core / 5V I/O dual rail simplifies integration with 12V battery feeds through the on-chip voltage regulator.

🏭

HVAC Control Module

HVAC modules need PWM for blower motor control, ADC for cabin-temperature sensing, and CAN for climate-status broadcasting - all natively supported by the MC9S12H256VFVER. The 8-channel PWM module drives blower and mode-door actuators without external motor-driver ICs, while the 16-channel 10-bit ADC scans thermistors, potentiometers and humidity sensors. The 256KB FLASH holds full climate-control state machines plus diagnostic UDS services, and 4KB EEPROM retains last-user-setpoint through battery disconnect. AEC-Q100 Grade 2 thermal rating supports mounting behind the dash near heater ducts.

🌐

CAN Gateway Module

Automotive gateways bridge powertrain CAN (500 kbps), body CAN (125 kbps) and infotainment CAN-FD buses; the MC9S12H256VFVER's two MSCAN controllers and 256KB FLASH make it a low-cost gateway candidate for entry-level vehicles. The HCS12 CPU12 can route messages with sub-millisecond latency, and the 12KB RAM buffers bus traffic during diagnostic flash reprogramming. The on-chip LCD driver supports a small status display for gateway health. Production designs at higher message rates should migrate to S12Z or S32K1 families.

🏭

Industrial CAN Node

Outside automotive, the MC9S12H256VFVER serves rugged industrial CANopen and DeviceNet nodes such as PLC I/O slices, motor-control daughter boards and remote telemetry units. Its -40 C to +105 C rating and 5V I/O tolerance simplify integration with 24V industrial bus rails through external DC-DCs. The on-chip EEPROM stores node-ID and baud-rate configuration, and the BDM interface allows in-field firmware updates via standard Multilink programmers. Designers benefit from the mature HCS12 toolchain and abundant reference code for CANopen CiA 401 profiles.

💡

LCD-Based Human-Machine Interface

White-goods appliances, industrial control panels and small medical displays use the MC9S12H256VFVER's integrated LCD segment driver to drive 4x40-character or 128-segment displays without external driver ICs. The 256KB FLASH accommodates full multilingual menu trees plus diagnostics, and 12KB RAM is sufficient for input debouncing and menu navigation stacks. The 99 GPIO allow direct drive of keypads, rotary encoders and status LEDs. AEC-Q100 qualification is overkill for white goods but harmless; industrial variants without AEC-Q100 are available on request from NXP sales.

Сводка рекомендуемых товаров

MC9S12XHZ256CAG HCS12X upgrade for richer graphic clusters Используется в: Automotive Instrument Cluster, LCD-Based Human-Machine Interface TJA1050 NXP Semiconductors Используется в: Automotive Instrument Cluster S9S12H256J2VFVER NXP Semiconductors Используется в: Automotive Instrument Cluster, HVAC Control Module, Industrial CAN Node MC9S12DT128MPVE NXP Semiconductors Используется в: Automotive Body Controller Module (BCM), Industrial CAN Node TJA1027 LIN transceiver for body-domain slaves Используется в: Automotive Body Controller Module (BCM) MC33660 Isolated CAN/LIN bus driver Используется в: Automotive Body Controller Module (BCM) MC9S12XEQ384CAG NXP Semiconductors Используется в: HVAC Control Module DRV8871 Blower motor H-bridge driver Используется в: HVAC Control Module MC9S12DG128MPV NXP Semiconductors Используется в: CAN Gateway Module TJA1043 High-speed CAN transceiver with sleep Используется в: CAN Gateway Module MC9S12XDT256CAG NXP Semiconductors Используется в: CAN Gateway Module SN65HVD230 3.3V CAN transceiver alternative Используется в: Industrial CAN Node MC9S08LH36CLK NXP Semiconductors Используется в: LCD-Based Human-Machine Interface PCF8576 External LCD segment expander Используется в: LCD-Based Human-Machine Interface
What is the program memory size of the MC9S12H256VFVER?
The MC9S12H256VFVER integrates 256 KB (256K x 8) of in-application programmable FLASH. According to the Freescale/NXP device user guide, the FLASH is organized as 256K bytes with EEPROM emulation support of up to 4 KB, giving firmware developers ample room for CAN stacks and automotive application code.
What core architecture does the MC9S12H256VFVER use?
The MC9S12H256VFVER is built on the HCS12 CPU12 16-bit CISC core. The CPU12 is NXP's evolution of the classic Motorola HC11/HC12 architecture, featuring enhanced addressing modes, a background debug mode (BDM) interface, and a 16 MHz bus clock that supports deterministic automotive real-time tasks.
Where can I buy the MC9S12H256VFVER online and what is the price?
The MC9S12H256VFVER is currently listed at distributor Hotenda and Rochester Electronics (authorized NXP franchise), with reference pricing around $18.50 per unit at qty-1 as of 2026-10-19. Stock is constrained because the part is in NXP's NRND (Not Recommended for New Designs) phase, so lead time is typically 8-12 weeks.
Is the MC9S12H256VFVER still in production?
The MC9S12H256VFVER is in NXP's NRND (Not Recommended for New Designs) lifecycle status as of 2026-10-19, meaning existing automotive programs can still purchase it but new designs should target the HCS12 successor families. Last-time-buy and EOL announcements should be confirmed with NXP franchised distributors.
What is the difference between MC9S12H256VFVER and S9S12H256J2VFVER?
The S9S12H256J2VFVER is the NXP re-marked and re-qualified successor to the MC9S12H256VFVER with identical silicon but a refreshed test program and updated traceability documentation. Both share the 144-LQFP (20x20) package and 16 MHz HCS12 core, making the S9S12 a pin-for-pin drop-in upgrade path.
Does the MC9S12H256VFVER support CAN communication?
Yes, the MC9S12H256VFVER integrates two CAN 2.0 A/B controllers (MSCAN modules) compliant with the ISO 11898-1 standard. These support up to 1 Mbps bus speed, 16 message buffers each, and are essential for automotive gateway and body-network applications where dual CAN channels are required.
How much RAM and EEPROM does the MC9S12H256VFVER have?
The MC9S12H256VFVER integrates 12 KB of static RAM for data and stack plus 4 KB of EEPROM for non-volatile parameter storage. The EEPROM can be used for OBD-II calibration data, immobilizer codes, or runtime-learned values without external SPI EEPROM.
What is the operating temperature range of the MC9S12H256VFVER?
The MC9S12H256VFVER is rated for -40 C to +105 C ambient operation, satisfying AEC-Q100 Grade 2 automotive requirements. This makes it suitable for under-hood body controllers, instrument clusters and HVAC modules exposed to wide thermal swings.
Where do I download the MC9S12H256VFVER datasheet?
The official NXP MC9S12H256 datasheet PDF can be downloaded from https://www.nxp.com/docs/en/data-sheet/MC9S12H256.pdf or via the Freescale legacy archive at https://www.alldatasheet.com/datasheet-pdf/pdf/184647/FREESCALE/MC9S12H256.html. The device user guide (V01.18) is approximately 130 pages long.
What is the pinout of the MC9S12H256VFVER?
The MC9S12H256VFVER uses the 144-pin LQFP (20x20 mm) package, which exposes all 99 digital I/O plus dedicated power, ground, oscillator, BDM, CAN and analog pins. The complete pinout diagram is in section 1 of the MC9S12H256 device user guide, with pin 1 at the top-left marker.
MC9S12H256VFVER vs MC9S12XHZ256CAG - which is better for instrument cluster?
The MC9S12H256VFVER is preferred for cost-sensitive 16 MHz instrument-cluster designs with single-LCD-segment displays, because it integrates the LCD driver on-die. The MC9S12XHZ256CAG is the HCS12X 40 MHz family member for richer HMI with more RAM; choose XHZ only if you need >16 MHz throughput or CAN-FD-class performance.
What is the best drop-in replacement for MC9S12H256VFVER?
The closest pin-compatible drop-in upgrade for the MC9S12H256VFVER is the S9S12H256J2VFVER (also 144-LQFP, same HCS12 16 MHz core, same FLASH/RAM/EEPROM map). For new designs, NXP recommends migrating to the S12 MagniV S12ZVM or S12XE families, but those require firmware and PCB rework.
Can the S9S12H256J2VFVER directly replace the MC9S12H256VFVER?
Yes, the S9S12H256J2VFVER is the NXP re-marked equivalent of the MC9S12H256VFVER, sharing the 144-LQFP package, 16 MHz HCS12 core, 256KB FLASH, 12KB RAM and 4KB EEPROM. No firmware changes are required - the existing CodeWarrior or GCC toolchain project compiles and runs unchanged.
Is the MC9S12H256VFVER AEC-Q100 qualified?
Yes, the MC9S12H256VFVER is AEC-Q100 Grade 2 qualified per NXP's automotive product certification, supporting -40 C to +105 C operation. This makes it acceptable for under-hood body, HVAC, gateway and instrument-cluster modules deployed in passenger vehicles.
What development tools support the MC9S12H256VFVER?
The MC9S12H256VFVER is supported by NXP CodeWarrior for HCS12 (classic IDE), Freescale/NXP S12 GDB GCC toolchain, Cosmic HCS12 compiler, and P&E Micro BDM Multilink/Cyclone programmers. The on-chip BDM (Background Debug Mode) interface provides non-intrusive debug access without any special bond-out chip.

Справочные инженерные данные для MC9S12H256VFVER — сравнение, рекомендации по проектированию и информация о соответствии.

Руководство по выбору

Choose the MC9S12H256VFVER for cost-sensitive 16 MHz HCS12 designs needing 256KB FLASH and the on-chip LCD driver - especially instrument clusters, body controllers and HVAC modules. Choose the S9S12H256J2VFVER for new programs or supply continuity - identical silicon but active lifecycle. Choose MC9S12DT128MPVE when you only need 128KB FLASH and no LCD (cost down). Choose MC9S12XDT256CAG when you need the 40 MHz HCS12X bus and XGATE co-processor for higher throughput, but budget for the price premium. Choose MC9S12XEQ384CAG for richer HMI needing >256KB FLASH and three CAN controllers. All five parts share the 144-LQFP footprint, enabling PCB layout reuse across the HCS12 family.

Сравнение с аналогами

Параметр Этот товар S9S12H256J2VFVER MC9S12H256VPVE MC9S12DT128MPVE MC9S12XDT256CAG MC9S12XEQ384CAG
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 144-LQFP (20x20) 144-LQFP (20x20) - same 144-LQFP (20x20) - same 144-LQFP - same 144-LQFP - same 144-LQFP - same
Core HCS12 CPU12 16-bit HCS12 CPU12 16-bit HCS12 CPU12 16-bit HCS12 CPU12 16-bit HCS12X 16-bit (with XGATE) HCS12X 16-bit (with XGATE)
Max Clock Frequency 16 MHz 16 MHz 16 MHz 25 MHz 40 MHz 50 MHz
FLASH Memory 256 KB 256 KB 256 KB 128 KB 256 KB 384 KB
RAM 12 KB 12 KB 12 KB 8 KB 12 KB 20 KB
EEPROM 4 KB 4 KB 4 KB 2 KB 4 KB 4 KB
CAN Controllers 2 (MSCAN) 2 (MSCAN) 2 (MSCAN) 1 (MSCAN) 3 (MSCAN) 3 (MSCAN)
LCD Driver Yes (on-chip) Yes (on-chip) Yes (on-chip) No No No
AEC-Q100 Yes (Grade 2) Yes (Grade 2) Yes (Grade 2) Yes (Grade 1) Yes (Grade 1) Yes (Grade 1)

Ключевые отличия

  • Integrated on-chip LCD segment driver (против MC9S12DT128MPVE)
  • Two MSCAN controllers vs one (против MC9S12DT128MPVE)
  • 256 KB FLASH at 16 MHz for cost-sensitive designs (против MC9S12XDT256CAG)
  • Active successor available in same package (против S9S12H256J2VFVER)

Заметки по проектированию

The MC9S12H256VFVER's on-chip voltage regulator (VREG) generates the 2.5V core supply from the 5V VDDR rail. Per the device user guide, place a 100 nF ceramic decoupling cap on each VDD/VSS pair, plus a 4.7 uF bulk capacitor on VDDR. Power-on-reset (POR) behavior is valid only when VDDA and VDDX ramp together; design the 12V->5V LDO so that both rails track within 100 mV during cold-crank transients.

Route the EXTAL/XTAL traces as short, impedance-matched differential pairs (~10 mm maximum) with a continuous ground guard ring on both sides. Place the PLL loop filter (XFC pin) cap network within 5 mm of the IC, using a star-ground connection to the AGND pin. Avoid routing noisy CAN, PWM or backlight signals across the XFC island to minimize jitter. The 144-LQFP exposed pad (where present) should be soldered to a copper pour tied to digital ground for thermal spreading.

CAN bus edge rates of 1 Mbps require careful termination: use 120 ohm split termination with 10 nF caps to ground at each node, and ensure stub lengths stay under 1/10 of the bit-cell length (~30 mm at 1 Mbps). The MSCAN TX output has limited drive strength, so use a dedicated CAN transceiver (TJA1050, TJA1043) for off-board buses. For in-cabin CAN, add a common-mode choke to suppress ESD-radiated EMI.

Do not leave the BKGD pin floating during reset - it must be pulled up to VDDA through 4.7 kohm to ensure correct BDM mode entry. When erasing/reprogramming FLASH via BDM, the security bytes (FSEC) must be configured last to avoid accidentally locking the MCU. The PLL filter capacitor must be a low-leakage COG/NP0 ceramic, not X7R, to prevent frequency drift at high temperatures.

Информация о соответствии

RoHS
Compliant
REACH
Compliant
AEC-Q100
Qualified
Без свинца
Yes
Без галогенов
Yes
Конфликтные минералы
Compliant

AEC-Q100 Grade 2 qualified per NXP product certification. RoHS and REACH compliant. Lead-free and halogen-free per NXP material declarations.

Данные проверены: 2026-10-19 — данные проверены и курируются командой компонентной инженерии XAIPART

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Связанные компоненты & термины

NXP Semiconductors MC9S12H256VFVER S9S12H256J2VFVER MC9S12H256VPVE MC9S12DT128MPVE MC9S12XDT256CAG MC9S12XEQ384CAG HCS12 CPU12 16-bit microcontroller CISC automotive MCU AEC-Q100 MSCAN CANbus SCI SPI I2C LCD driver PWM POR watchdog timer 144-LQFP LQFP package FLASH memory EEPROM emulation BDM interface instrument cluster body controller HVAC module CAN gateway RoHS REACH
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