N25Q128A13E12A0F - 128Mb SPI NOR Flash, 108 MHz | Micron
Артикул: N25Q128A13E12A0F ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $3.95 | $3,95 |
| 10 | $3.55 | $35,50 |
| 100 | $3.12 | $312,00 |
| 500 | $2.8 | $1.400,00 |
| 1.000 | $2.52 | $2.520,00 |
N25Q128A13E12A0F Обзор
Serial NOR flash is a nonvolatile memory technology that stores code and data while allowing direct, addressable random access over the SPI bus. It occupies the memory hierarchy between parallel NOR flash (faster but pin-hungry) and SPI NAND (cheaper but block-oriented). In embedded systems, serial NOR is the standard boot medium for microcontrollers, SoCs, and FPGAs, where execute-in-place (XiP) capability lets the processor run code directly from the flash without copying it to RAM.
Key features of the N25Q128A13E12A0F include single, dual, and quad SPI operation (up to 4-bit wide data transfer), 4-Kbyte subsector erase granularity on boot sectors for fine-grained parameter storage, and XiP enabled operation. The 108 MHz clock rate with quad I/O delivers effective read throughput approaching 432 Mbit/s, minimizing boot latency in XiP systems.
Technically, this device belongs to Micron's N25Q (formerly Numonyx) family of 3V multiple-I/O serial flash memories, which inherits the SPI command set popularized by earlier generations and adds extended address options, deep power-down modes, and advanced sector protection. The part is specified from -40C to +125C and is offered in automotive-qualified flows per distributor listings citing AEC-Q100.
Typical applications include FPGA configuration storage, embedded processor boot code, automotive infotainment and telematics modules, and networking equipment firmware storage. The 128Mb density comfortably hosts U-Boot, Linux kernel images, or large FPGA bitstreams.
A key design consideration: quad-SPI signal integrity requires short, length-matched traces with series termination at 108 MHz; verify hold-time requirements when using a low-speed SPI clock for initial FPGA configuration.
This page synthesizes distributor pricing, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet.
Аналоги без доработки для N25Q128A13E12A0F — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с N25Q128A13E12A0F (тот же форм-фактор и посадочное место) — отличается по Package, Packaging, Supply Voltage, Density, Organization.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
N25Q128A11E12A0F
✅ Прямая замена ⚠️ Характеристики не проверены📋 Справочный аналог (нет в каталоге)
N25Q128A13E1240F
✅ Прямая замена ⚠️ Характеристики не проверены📋 Справочный аналог (нет в каталоге)
N25Q064A13EF8A0F
✅ Прямая замена✓ В наличии
$1.38 / шт.
Открыть даташит →N25Q128A13E12A0F Максимальные параметры и электрические характеристики
| Тип памяти | NOR Flash, Serial SPI |
| Density | 128 Mbit (16M x 8 bit) |
| Напряжение питания | 2.7 V to 3.6 V (3 V / 3.3 V class) |
| Max Clock Frequency | 108 MHz |
| Интерфейс | SPI, Dual SPI, Quad SPI |
| Access Time | 7 ns |
| Word Size | 8 bit |
| Subsector Erase | 4 KB (boot sectors) |
| XiP Support | Yes (execute-in-place) |
| Рабочая температура | -40C to +125C |
| Корпус | 24-ball TBGA (T-PBGA), 6x8 mm |
| Maximum Seated Height | 1.2 mm |
| Тип монтажа | Surface Mount |
| Packaging | Tape & Reel |
| Qualification | Automotive, AEC-Q100 (per distributor listing) |
| Статус RoHS | Compliant |
Руководство по цоколевке N25Q128A13E12A0F в корпусе 24-ball tbga (t-pbga), 6x8 mm
Цоколевка для N25Q128A13E12A0F (корпус 24-ball tbga (t-pbga), 6x8 mm). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.
Нет подробных данных о распиновке для N25Q128A13E12A0F.
Обратитесь к даташиту для полной конфигурации выводов.
Типичное применение
N25Q128A13E12A0F подходит для 6 применениеs: FPGA Configuration Storage, Embedded Processor Boot Code, Automotive Telematics and Infotainment, Networking Equipment Firmware Storage, Industrial Automation Controllers, Test and Measurement Instrumentation.
FPGA Configuration Storage
The N25Q128A13E12A0F stores FPGA configuration bitstreams, where its 128Mb (16 MB) density accommodates large mid-range FPGA images plus a golden-fallback image for field recovery. Its 108 MHz quad SPI interface cuts configuration time dramatically versus 33 MHz single-bit alternatives: at 4 bits per clock the device streams roughly 432 Mbit/s, so a 40-Mbit bitstream loads in under 0.1 s. The 4-Kbyte subsector erase granularity lets designers keep revision metadata and boot headers alongside the bitstream without full-chip erase cycles. Place the device close to the FPGA bank with short, length-matched CLK/DQ traces and series resistors to preserve signal integrity at 108 MHz, and verify the FPGA configuration controller supports the N25Q extended-address commands for addresses above 16 MB boundaries.
Рекомендуется
Embedded Processor Boot Code
The N25Q128A13E12A0F serves as the boot medium for embedded Linux and RTOS processors, storing U-Boot, device tree, and kernel images. Its execute-in-place (XiP) capability allows early boot stages to read code directly over the SPI bus without copying to RAM, shortening time-to-kernel, and the 7 ns access time supports fast random reads. The 16 MB capacity comfortably hosts multi-stage boot chains plus redundant images for fail-safe updates. Automotive-range operation from -40C to +125C suits industrial controllers and vehicle ECUs that boot in extreme environments. Designers should implement quad-mode enable once in production firmware, keep the boot sector layout aligned to 4-Kbyte subsectors for OTA-friendly delta updates, and reserve a protected region for the immutable first-stage bootloader.
Рекомендуется
Automotive Telematics and Infotainment
The N25Q128A13E12A0F fits automotive telematics units, instrument clusters, and infotainment head units that demand -40C to +125C operation; distributor listings identify the part as automotive temperature grade with AEC-Q100 qualification. Its 128Mb density holds navigation firmware, codec stacks, and log storage, while the quad SPI bus at 108 MHz provides the read bandwidth needed for fast system resume from deep sleep. The 2.7V to 3.6V supply matches standard automotive 3.3V rails derived from the battery via buck regulators. Engineers should confirm the formal PPAP/qualification grade with Micron for production programs, and derate erase/program endurance margins for the extended cycle counts typical of datalogger partitions.
Рекомендуется
Networking Equipment Firmware Storage
Routers, switches, and industrial gateways use the N25Q128A13E12A0F to hold bootloader, firmware, and configuration files. The 16 MB capacity supports dual-image A/B firmware schemes, enabling seamless over-the-network upgrades with automatic rollback if a new image fails checksum verification - a common requirement in managed network hardware. The 4-Kbyte subsector erase permits frequent, small configuration writes without disturbing firmware partitions, extending effective flash lifetime. Quad SPI reads at 108 MHz reduce boot time in redundant systems where switchover speed matters. Designers should implement sector-protection settings for the immutable bootloader region and budget wear-leveling for the configuration partition, since default NOR erase/program endurance is finite per block.
Рекомендуется
Industrial Automation Controllers
Programmable logic controllers, motor drives, and factory automation nodes deploy the N25Q128A13E12A0F for firmware and recipe storage in electrically noisy environments. The -40C to +125C rating tolerates cabinet temperatures near drives and power electronics, while the 3V SPI interface resists the ground bounce typical of cabinets with high-current switching loads. Its 128Mb density holds deterministic real-time control firmware plus parameter sets retained across power cycles. The deep power-down mode trims standby consumption in always-on installations. Layout should route the SPI bus away from IGBT/gate-driver nodes, add local 100 nF decoupling at each supply ball, and use the sector-protection feature to lock the safety-critical bootloader against accidental writes during field parameter updates.
Рекомендуется
Test and Measurement Instrumentation
Bench instruments, oscilloscope front ends, and data acquisition systems use the N25Q128A13E12A0F to store calibration constants, FPGA personality images, and instrument firmware. The 4-Kbyte subsector erase is particularly valuable here: calibration tables can be rewritten independently in fine 4-KB increments without erasing the large firmware image, minimizing downtime for calibration updates. The 108 MHz quad SPI interface supports rapid self-test reads at power-up, and XiP lets the instrument's main processor run directly from flash during early boot. The 6x8 mm 24-ball TBGA fits dense stacked-PCB instrument architectures with a 1.2 mm seated height. Designers should timestamp calibration writes and implement CRC checking on readback to guard against rare bit errors in the analog-front-end calibration data.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для N25Q128A13E12A0F — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | N25Q128A11E12A0F | N25Q128A13E1240F | N25Q064A13EF8A0F |
|---|---|---|---|---|
| Package | 24-ball TBGA (T-PBGA, 6x8 mm) | 24-ball TBGA - same | 24-ball TBGA - same | 24-ball BGA family - same footprint class |
| Brand | Micron Technology | Micron Technology | Micron Technology | Micron Technology |
| Density | 128 Mbit (16M x 8) | 128 Mbit | 128 Mbit | 64 Mbit |
| Max Clock Frequency | 108 MHz | 108 MHz | 108 MHz | 108 MHz |
| Supply Voltage | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V |
| Interface | SPI, Dual SPI, Quad SPI | SPI, Dual SPI, Quad SPI | SPI, Dual SPI, Quad SPI | SPI, Dual SPI, Quad SPI |
| Subsector Erase | 4 KB | 4 KB | 4 KB | 4 KB |
Ключевые отличия
- 128Mb density with 4-Kbyte boot-sector subsector erase (против N25Q064A13EF8A0F)
- Automotive-range -40C to +125C operation (против N25Q128A11E12A0F)
- Quad SPI at 108 MHz with XiP (против Cross-brand SOIC-8 SPI flash (e.g., W25Q128 class))
Заметки по проектированию
At 108 MHz quad SPI, treat the flash bus as a controlled-impedance interconnect: keep CLK and DQ0-DQ3 traces under 100 mm where possible, length-match data lines to the clock within a few millimeters, and place 22-33 ohm series resistors near the driver to damp reflections. Verify mode-bit (M7-M0) timing for quad-mode read commands, since hold-time violations on DQ3/WP during mode-bit sampling are the most common cause of intermittent quad-read failures on N25Q devices.
Decouple each supply ball with 100 nF ceramic capacitance placed within 2 mm of the ball, plus a 4.7-10 uF bulk capacitor shared per rail. Program and erase operations draw current pulses on VCC; an under-decoupled rail can sag below the 2.7V minimum and corrupt in-flight program operations. Estimated: a page program pulse of tens of mA for a few microseconds on a 0.1 ohm supply path causes only a few mV drop, but shared rails with switching regulators need local bulk storage to absorb the transient.
The N25Q128A uses an extended-address scheme (3-byte vs 4-byte addressing) controlled by the extended address register; software that assumes simple 3-byte SPI addressing will silently wrap above the 16 MB boundary. Always set the address mode explicitly at init and verify the status register after power-on. Additionally, the WP/DQ3 ball is multiplexed - driving it low in quad mode disables data line DQ3, so ensure the host releases WP before enabling quad commands.
Serial NOR flash at this density dissipates minimal power during read operation (quiescent plus I/O switching, typically in the low-mW range per datasheet family data), so the 6x8 mm TBGA needs no heatsink or dedicated thermal vias for normal use. Ensure the PCB land pattern follows the Micron recommended footprint with solder-mask-defined or non-solder-mask-defined pads as specified, since reflow voids under BGA balls can cause intermittent solder-joint failures in high-vibration automotive environments.
Информация о соответствии
RoHS compliant and automotive grade per distributor listings (Ampheo: RoHS; Jotrin: Automotive AEC-Q100). REACH, halogen-free, and conflict-minerals status not stated in provided data - confirm via Micron product pages.
