N25Q128A13E12A0F - 128Mb SPI NOR Flash, 108 MHz | Micron
MPN: N25Q128A13E12A0F ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $3.95 | $3.95 |
| 10 | $3.55 | $35.50 |
| 100 | $3.12 | $312.00 |
| 500 | $2.8 | $1,400.00 |
| 1,000 | $2.52 | $2,520.00 |
Drop-in alternatives for N25Q128A13E12A0F — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
N25Q128A11E12A0F
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
N25Q128A13E1240F
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
N25Q064A13EF8A0F
✅ Drop-In✓ In Stock
$1.38 / Unit
View Datasheet →N25Q128A13E12A0F Maximum Ratings & Electrical Characteristics
| Memory Type | NOR Flash, Serial SPI |
| Density | 128 Mbit (16M x 8 bit) |
| Supply Voltage | 2.7 V to 3.6 V (3 V / 3.3 V class) |
| Max Clock Frequency | 108 MHz |
| Interface | SPI, Dual SPI, Quad SPI |
| Access Time | 7 ns |
| Word Size | 8 bit |
| Subsector Erase | 4 KB (boot sectors) |
| XiP Support | Yes (execute-in-place) |
| Operating Temperature | -40C to +125C |
| Package | 24-ball TBGA (T-PBGA), 6x8 mm |
| Maximum Seated Height | 1.2 mm |
| Mounting Type | Surface Mount |
| Packaging | Tape & Reel |
| Qualification | Automotive, AEC-Q100 (per distributor listing) |
| RoHS Status | Compliant |
N25Q128A13E12A0F 24-ball tbga (t-pbga), 6x8 mm Pin Configuration Guide
Complete pinout information for N25Q128A13E12A0F (24-ball tbga (t-pbga), 6x8 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for N25Q128A13E12A0F.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
N25Q128A13E12A0F is suitable for 6 applications: FPGA Configuration Storage, Embedded Processor Boot Code, Automotive Telematics and Infotainment, Networking Equipment Firmware Storage, Industrial Automation Controllers, Test and Measurement Instrumentation.
FPGA Configuration Storage
The N25Q128A13E12A0F stores FPGA configuration bitstreams, where its 128Mb (16 MB) density accommodates large mid-range FPGA images plus a golden-fallback image for field recovery. Its 108 MHz quad SPI interface cuts configuration time dramatically versus 33 MHz single-bit alternatives: at 4 bits per clock the device streams roughly 432 Mbit/s, so a 40-Mbit bitstream loads in under 0.1 s. The 4-Kbyte subsector erase granularity lets designers keep revision metadata and boot headers alongside the bitstream without full-chip erase cycles. Place the device close to the FPGA bank with short, length-matched CLK/DQ traces and series resistors to preserve signal integrity at 108 MHz, and verify the FPGA configuration controller supports the N25Q extended-address commands for addresses above 16 MB boundaries.
Recommended
Embedded Processor Boot Code
The N25Q128A13E12A0F serves as the boot medium for embedded Linux and RTOS processors, storing U-Boot, device tree, and kernel images. Its execute-in-place (XiP) capability allows early boot stages to read code directly over the SPI bus without copying to RAM, shortening time-to-kernel, and the 7 ns access time supports fast random reads. The 16 MB capacity comfortably hosts multi-stage boot chains plus redundant images for fail-safe updates. Automotive-range operation from -40C to +125C suits industrial controllers and vehicle ECUs that boot in extreme environments. Designers should implement quad-mode enable once in production firmware, keep the boot sector layout aligned to 4-Kbyte subsectors for OTA-friendly delta updates, and reserve a protected region for the immutable first-stage bootloader.
Recommended
Automotive Telematics and Infotainment
The N25Q128A13E12A0F fits automotive telematics units, instrument clusters, and infotainment head units that demand -40C to +125C operation; distributor listings identify the part as automotive temperature grade with AEC-Q100 qualification. Its 128Mb density holds navigation firmware, codec stacks, and log storage, while the quad SPI bus at 108 MHz provides the read bandwidth needed for fast system resume from deep sleep. The 2.7V to 3.6V supply matches standard automotive 3.3V rails derived from the battery via buck regulators. Engineers should confirm the formal PPAP/qualification grade with Micron for production programs, and derate erase/program endurance margins for the extended cycle counts typical of datalogger partitions.
Recommended
Networking Equipment Firmware Storage
Routers, switches, and industrial gateways use the N25Q128A13E12A0F to hold bootloader, firmware, and configuration files. The 16 MB capacity supports dual-image A/B firmware schemes, enabling seamless over-the-network upgrades with automatic rollback if a new image fails checksum verification - a common requirement in managed network hardware. The 4-Kbyte subsector erase permits frequent, small configuration writes without disturbing firmware partitions, extending effective flash lifetime. Quad SPI reads at 108 MHz reduce boot time in redundant systems where switchover speed matters. Designers should implement sector-protection settings for the immutable bootloader region and budget wear-leveling for the configuration partition, since default NOR erase/program endurance is finite per block.
Recommended
Industrial Automation Controllers
Programmable logic controllers, motor drives, and factory automation nodes deploy the N25Q128A13E12A0F for firmware and recipe storage in electrically noisy environments. The -40C to +125C rating tolerates cabinet temperatures near drives and power electronics, while the 3V SPI interface resists the ground bounce typical of cabinets with high-current switching loads. Its 128Mb density holds deterministic real-time control firmware plus parameter sets retained across power cycles. The deep power-down mode trims standby consumption in always-on installations. Layout should route the SPI bus away from IGBT/gate-driver nodes, add local 100 nF decoupling at each supply ball, and use the sector-protection feature to lock the safety-critical bootloader against accidental writes during field parameter updates.
Recommended
Test and Measurement Instrumentation
Bench instruments, oscilloscope front ends, and data acquisition systems use the N25Q128A13E12A0F to store calibration constants, FPGA personality images, and instrument firmware. The 4-Kbyte subsector erase is particularly valuable here: calibration tables can be rewritten independently in fine 4-KB increments without erasing the large firmware image, minimizing downtime for calibration updates. The 108 MHz quad SPI interface supports rapid self-test reads at power-up, and XiP lets the instrument's main processor run directly from flash during early boot. The 6x8 mm 24-ball TBGA fits dense stacked-PCB instrument architectures with a 1.2 mm seated height. Designers should timestamp calibration writes and implement CRC checking on readback to guard against rare bit errors in the analog-front-end calibration data.
Recommended
Recommended Products Summary
Engineering reference data for N25Q128A13E12A0F — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | N25Q128A11E12A0F | N25Q128A13E1240F | N25Q064A13EF8A0F |
|---|---|---|---|---|
| Package | 24-ball TBGA (T-PBGA, 6x8 mm) | 24-ball TBGA - same | 24-ball TBGA - same | 24-ball BGA family - same footprint class |
| Brand | Micron Technology | Micron Technology | Micron Technology | Micron Technology |
| Density | 128 Mbit (16M x 8) | 128 Mbit | 128 Mbit | 64 Mbit |
| Max Clock Frequency | 108 MHz | 108 MHz | 108 MHz | 108 MHz |
| Supply Voltage | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V |
| Operating Temperature | -40C to +125C | [DATA_NEEDED] | [DATA_NEEDED] | -40C to +85C |
| Interface | SPI, Dual SPI, Quad SPI | SPI, Dual SPI, Quad SPI | SPI, Dual SPI, Quad SPI | SPI, Dual SPI, Quad SPI |
| Subsector Erase | 4 KB | 4 KB | 4 KB | 4 KB |
Key Differentiators
- 128Mb density with 4-Kbyte boot-sector subsector erase (vs N25Q064A13EF8A0F)
- Automotive-range -40C to +125C operation (vs N25Q128A11E12A0F)
- Quad SPI at 108 MHz with XiP (vs Cross-brand SOIC-8 SPI flash (e.g., W25Q128 class))
Design Notes
At 108 MHz quad SPI, treat the flash bus as a controlled-impedance interconnect: keep CLK and DQ0-DQ3 traces under 100 mm where possible, length-match data lines to the clock within a few millimeters, and place 22-33 ohm series resistors near the driver to damp reflections. Verify mode-bit (M7-M0) timing for quad-mode read commands, since hold-time violations on DQ3/WP during mode-bit sampling are the most common cause of intermittent quad-read failures on N25Q devices.
Decouple each supply ball with 100 nF ceramic capacitance placed within 2 mm of the ball, plus a 4.7-10 uF bulk capacitor shared per rail. Program and erase operations draw current pulses on VCC; an under-decoupled rail can sag below the 2.7V minimum and corrupt in-flight program operations. Estimated: a page program pulse of tens of mA for a few microseconds on a 0.1 ohm supply path causes only a few mV drop, but shared rails with switching regulators need local bulk storage to absorb the transient.
The N25Q128A uses an extended-address scheme (3-byte vs 4-byte addressing) controlled by the extended address register; software that assumes simple 3-byte SPI addressing will silently wrap above the 16 MB boundary. Always set the address mode explicitly at init and verify the status register after power-on. Additionally, the WP/DQ3 ball is multiplexed - driving it low in quad mode disables data line DQ3, so ensure the host releases WP before enabling quad commands.
Serial NOR flash at this density dissipates minimal power during read operation (quiescent plus I/O switching, typically in the low-mW range per datasheet family data), so the 6x8 mm TBGA needs no heatsink or dedicated thermal vias for normal use. Ensure the PCB land pattern follows the Micron recommended footprint with solder-mask-defined or non-solder-mask-defined pads as specified, since reflow voids under BGA balls can cause intermittent solder-joint failures in high-vibration automotive environments.
Compliance Information
RoHS compliant and automotive grade per distributor listings (Ampheo: RoHS; Jotrin: Automotive AEC-Q100). REACH, halogen-free, and conflict-minerals status not stated in provided data - confirm via Micron product pages.
