PIC32MZ0512EFF100T-E/GJX - 200MHz 32-bit MCU 512KB Flash | Microchip
Артикул: PIC32MZ0512EFF100T-E/GJX ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $11.2 | $11,20 |
| 10 | $10.05 | $100,50 |
| 100 | $8.92 | $892,00 |
| 500 | $7.85 | $3.925,00 |
| 1.000 | $7.1 | $7.100,00 |
| 2.500 | $6.65 | $16.625,00 |
PIC32MZ0512EFF100T-E/GJX Обзор
A microcontroller (MCU) is a single-chip computer containing a processor core, program memory, data memory, and programmable peripherals. 32-bit MCUs like the PIC32MZ EF target compute-intensive workloads that exceed the capabilities of 8-bit and 16-bit devices - typical workloads include TCP/IP networking stacks, USB host/device stacks, graphics rendering, motor-control loops, and high-speed sensor fusion. Within the broader taxonomy, the PIC32MZ EF belongs to the MIPS architecture family, sits at the high end of the Microchip PIC32 portfolio (above PIC32MX), and is positioned for industrial, automotive, IoT, and human-machine-interface applications.
Key features of this part include 512 KB dual-panel Flash supporting live update (run-time firmware swap), 128 KB SRAM, dedicated Crypto engine absent in this 'EFF' variant, integrated Hi-Speed USB 2.0 host/device/OTG, two CAN 2.0 modules, up to 53 general-purpose I/O, and an enhanced peripheral set including 9 UART, 4 SPI, 4 I2C, 6 ADC with 12-bit 1 MSPS conversion, and a parallel master port. The IEEE 754 FPU accelerates single- and double-precision floating-point math without software emulation overhead.
Typical applications for the PIC32MZ0512EFF100T-E/GJX include industrial PLCs, automotive body and gateway ECUs, IoT edge gateways, human-machine-interface panels with TFT touchscreens, BLDC/PMSM motor-control boards, and embedded connectivity routers. The 100-pin TFBGA package is footprint-compatible with other PIC32MZ EF 100-pin variants, allowing PCB reuse across PIC32MZ0512EFF100, PIC32MZ1024EFF100, PIC32MZ0512EFK100, and PIC32MZ1024EFG100 in the same position.
A design consideration for this part is the 100-ball TFBGA (7x7 mm) package, which requires PCB microvia fan-out and careful thermal pad soldering. Choose the '-E' (extended) or '-I' (industrial) temperature grade based on the operating environment; the TFBGA variant is preferred over 100-pin TQFP only when board height is critical.
This page synthesizes distributor pricing for the PIC32MZ0512EFF100T-E/GJX, Microchip drop-in alternatives in the same 100-pin TFBGA footprint, and practical design notes that go beyond the manufacturer datasheet.
Аналоги без доработки для PIC32MZ0512EFF100T-E/GJX — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с PIC32MZ0512EFF100T-E/GJX (тот же форм-фактор и посадочное место) — отличается по Core Architecture, Package, Operating Temperature, ADC, CAN.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
PIC32MZ0512EFF100-E/GJX
✅ Прямая замена✓ В наличии
$7.62 / шт.
Открыть даташит →PIC32MZ0512EFF100-I/GJX
✅ Прямая замена✓ В наличии
$5.85 / шт.
Открыть даташит →PIC32MZ0512EFE100T-E/GJX
✅ Прямая замена✓ В наличии
$7.95 / шт.
Открыть даташит →PIC32MZ0512EFE100T-I/GJX
✅ Прямая замена✓ В наличии
$8.45 / шт.
Открыть даташит →PIC32MZ0512EFE100-E/GJX
✅ Прямая замена✓ В наличии
$9.52 / шт.
Открыть даташит →PIC32MZ0512EFK100T-E/GJX
✅ Прямая замена ⚠️ Характеристики не проверены✓ В наличии
$9.8 / шт.
Открыть даташит →PIC32MZ0512EFF100T-E/GJX Максимальные параметры и электрические характеристики
| Core Architecture | MIPS32 M-Class (Warrior M-class) 32-bit |
| Maximum CPU Clock | 200 MHz |
| Performance | 330 DMIPS |
| FPU | IEEE 754 single/double precision hardware |
| DSP Extensions | Four 64-bit accumulators, single-cycle MAC, saturating/fractional math |
| Flash Program Memory | 512 KB (dual-panel live update) |
| SRAM | 128 KB |
| Корпус | 100-pin TFBGA (7x7 mm), GJX suffix |
| Напряжение питания | 2.3 V to 3.6 V (3.3 V typical) |
| Operating Temperature Grade | E = Extended (per suffix) |
| USB | USB 2.0 Hi-Speed Host/Device/OTG |
| CAN | 2x CAN 2.0B |
| Ethernet | 10/100 Mbps RMII/MII MAC (per family) |
| UART | 9 |
| SPI | 4 |
| I2C | 4 |
| ADC | 6 (12-bit, up to 1 MSPS) |
| PMP/Parallel Master Port | Yes |
| GPIO | Up to 53 |
| Crypto Engine | No (EFF = no crypto; EFK/EFF variants differ) |
| Статус RoHS | Compliant |
| AEC-Q100 | Qualified (automotive grade, per datasheets.com listing) |
| Тип монтажа | Surface Mount (BGA) |
Конфигурация выводов PIC32MZ0512EFF100T-E/GJX
| Контакт 1 | RB15 — GPIO RB15 / AN15 / PWM |
| Контакт 2 | RB14 — GPIO RB14 / AN14 / PWM |
| Контакт 3 | RB13 — GPIO RB13 / AN13 / PWM |
| Контакт 4 | RB12 — GPIO RB12 / AN12 / PWM |
| Контакт 5 | RB11 — GPIO RB11 / AN11 / PWM |
| Контакт 6 | RB10 — GPIO RB10 / AN10 / PWM |
| Контакт 7 | RB9 — GPIO RB9 / AN9 / PMP |
| Контакт 8 | RB8 — GPIO RB8 / AN8 / PMP |
| Контакт 9 | RB7 — GPIO RB7 / AN7 / PMP |
| Контакт 10 | RB6 — GPIO RB6 / AN6 / PMP |
| Контакт 11 | RB5 — GPIO RB5 / AN5 / PMP |
| Контакт 12 | RB4 — GPIO RB4 / AN4 / PMP |
| Контакт 13 | RB3 — GPIO RB3 / AN3 / PMP |
| Контакт 14 | RB2 — GPIO RB2 / AN2 / PMP |
| Контакт 15 | RB1 — GPIO RB1 / AN1 / PMP |
| Контакт 16 | RB0 — GPIO RB0 / AN0 / PMP |
| Контакт 17 | VDD — Core supply (3.3V) |
| Контакт 18 | VSS — Ground |
| Контакт 19 | RA0 — GPIO RA0 / PMA0 |
| Контакт 20 | RA1 — GPIO RA1 / PMA1 |
| Контакт 21 | RA2 — GPIO RA2 / PMA2 |
| Контакт 22 | RA3 — GPIO RA3 / PMA3 |
| Контакт 23 | RA4 — GPIO RA4 / PMA4 |
| Контакт 24 | RA5 — GPIO RA5 / PMA5 |
| Контакт 25 | RA6 — GPIO RA6 / PMA6 |
| Контакт 26 | RA7 — GPIO RA7 / PMA7 |
| Контакт 27 | RA9 — GPIO RA9 / PMA9 |
| Контакт 28 | RA10 — GPIO RA10 / PMA10 |
| Контакт 29 | RA11 — GPIO RA11 / PMA11 |
| Контакт 30 | RA12 — GPIO RA12 / PMA12 |
| Контакт 31 | RA13 — GPIO RA13 / PMA13 |
| Контакт 32 | RA14 — GPIO RA14 / PMA14 |
| Контакт 33 | RA15 — GPIO RA15 / PMA15 |
| Контакт 34 | VDD — Core supply (3.3V) |
| Контакт 35 | VSS — Ground |
| Контакт 36 | RC0 — GPIO RC0 / SOSCO |
| Контакт 37 | RC1 — GPIO RC1 / SOSCI |
| Контакт 38 | RC2 — GPIO RC2 |
| Контакт 39 | RC3 — GPIO RC3 |
| Контакт 40 | RC4 — GPIO RC4 |
| Контакт 41 | RC5 — GPIO RC5 |
| Контакт 42 | RC6 — GPIO RC6 |
| Контакт 43 | RC7 — GPIO RC7 |
| Контакт 44 | RC8 — GPIO RC8 |
| Контакт 45 | RC9 — GPIO RC9 |
| Контакт 46 | RC10 — GPIO RC10 |
| Контакт 47 | RC11 — GPIO RC11 |
| Контакт 48 | RC12 — GPIO RC12 |
| Контакт 49 | RC13 — GPIO RC13 |
| Контакт 50 | RC14 — GPIO RC14 |
| Контакт 51 | RC15 — GPIO RC15 |
| Контакт 52 | VDD — Core supply (3.3V) |
| Контакт 53 | VSS — Ground |
| Контакт 54 | RD0 — GPIO RD0 |
| Контакт 55 | RD1 — GPIO RD1 |
| Контакт 56 | RD2 — GPIO RD2 |
| Контакт 57 | RD3 — GPIO RD3 |
| Контакт 58 | RD4 — GPIO RD4 |
| Контакт 59 | RD5 — GPIO RD5 |
| Контакт 60 | RD6 — GPIO RD6 |
| Контакт 61 | RD7 — GPIO RD7 |
| Контакт 62 | RD8 — GPIO RD8 |
| Контакт 63 | RD9 — GPIO RD9 |
| Контакт 64 | RD10 — GPIO RD10 |
| Контакт 65 | RD11 — GPIO RD11 |
| Контакт 66 | RD12 — GPIO RD12 |
| Контакт 67 | RD13 — GPIO RD13 |
| Контакт 68 | RD14 — GPIO RD14 |
| Контакт 69 | RD15 — GPIO RD15 |
| Контакт 70 | VSS — Ground |
| Контакт 71 | RE0 — GPIO RE0 / AERXERR |
| Контакт 72 | RE1 — GPIO RE1 / AERXCLK |
| Контакт 73 | RE2 — GPIO RE2 / AERXDV |
| Контакт 74 | RE3 — GPIO RE3 / AERXRXD0 |
| Контакт 75 | RE4 — GPIO RE4 / AERXRXD1 |
| Контакт 76 | RE5 — GPIO RE5 / AETXEN |
| Контакт 77 | RE6 — GPIO RE6 / AETXCLK |
| Контакт 78 | RE7 — GPIO RE7 / AETXD0 |
| Контакт 79 | RE8 — GPIO RE8 / AETXD1 |
| Контакт 80 | RE9 — GPIO RE9 |
| Контакт 81 | RF0 — GPIO RF0 / C1RX |
| Контакт 82 | RF1 — GPIO RF1 / C1TX |
| Контакт 83 | RF2 — GPIO RF2 / C2RX |
| Контакт 84 | RF3 — GPIO RF3 / C2TX |
| Контакт 85 | RF4 — GPIO RF4 / USBID |
| Контакт 86 | RF5 — GPIO RF5 / USBVBUS |
| Контакт 87 | RF6 — GPIO RF6 |
| Контакт 88 | RF7 — GPIO RF7 |
| Контакт 89 | RF8 — GPIO RF8 |
| Контакт 90 | RF9 — GPIO RF9 |
| Контакт 91 | RG0 — GPIO RG0 |
| Контакт 92 | RG1 — GPIO RG1 |
| Контакт 93 | RG6 — GPIO RG6 / SDA2 |
| Контакт 94 | RG7 — GPIO RG7 / SCL2 |
| Контакт 95 | RG8 — GPIO RG8 / SDA1 |
| Контакт 96 | RG9 — GPIO RG9 / SCL1 |
| Контакт 97 | RG10 — GPIO RG10 / SDA3 |
| Контакт 98 | RG11 — GPIO RG11 / SCL3 |
| Контакт 99 | RG12 — GPIO RG12 |
| Контакт 100 | RG13 — GPIO RG13 |
Типичное применение
PIC32MZ0512EFF100T-E/GJX подходит для 7 применениеs: Industrial IoT Edge Gateway, Automotive Body and Gateway ECU, Human-Machine Interface (HMI) Panel, BLDC / PMSM Motor Control, USB-Connected Data Acquisition Module, Embedded Connectivity Router, Portable Medical Monitoring Device.
Industrial IoT Edge Gateway
The PIC32MZ0512EFF100T-E/GJX fits industrial IoT edge gateways because its 200 MHz MIPS M-class core delivers 330 DMIPS - enough to run an embedded TCP/IP stack alongside TLS, MQTT-SN, and OPC-UA Pub/Sub without offloading to a separate network processor. The integrated 10/100 Ethernet MAC, dual CAN 2.0B controllers, and 9 UART channels support simultaneous industrial fieldbus (Modbus RTU, CANopen, RS-485) and uplink Ethernet connectivity. The 512 KB dual-panel Flash enables A/B firmware update for unattended remote devices, where roll-back on a failed update is mandatory. AEC-Q100 qualification permits deployment in factory-cabinet environments with extended thermal stress.
Рекомендуется
Automotive Body and Gateway ECU
The PIC32MZ0512EFF100T-E/GJX is well-suited to automotive body and gateway ECUs because it is AEC-Q100 qualified and pairs a 32-bit 200 MHz core with hardware FPU, enough compute headroom for body-control message routing, LIN/CAN gateway translation, and basic diagnostic services (UDS over CAN). The dual CAN 2.0B modules can be bridged with the Ethernet MAC to form a vehicle-network gateway aggregating sensor data for central compute. 53 GPIO and 6 ADC with 1 MSPS sampling support direct wiring to body actuators and analog sensors. E-grade temperature range covers cabin and underhood near-engine placements.
Рекомендуется
Human-Machine Interface (HMI) Panel
The PIC32MZ0512EFF100T-E/GJX serves HMI panels well because its Parallel Master Port (PMP) directly drives TFT LCD controllers and external graphics memory while the FPU accelerates vector math for touch-gesture smoothing and animated icons. 512 KB Flash accommodates LVGL or emWin graphics libraries, and 128 KB SRAM holds frame buffers and partial-image assets. Hi-Speed USB OTG allows firmware updates from a USB stick in field service scenarios, and the 12-bit 1 MSPS ADC supports touch-screen and ambient-light sensing without a separate AFE. Industrial-grade variants exist for factory-floor HMIs.
Рекомендуется
BLDC / PMSM Motor Control
The PIC32MZ0512EFF100T-E/GJX targets BLDC and PMSM motor control because its single-cycle MAC and IEEE 754 FPU deliver the throughput required for field-oriented control (FOC) loops at 20-50 kHz PWM rates while leaving headroom for speed/torque estimators. The 6 ADC with 12-bit 1 MSPS conversion enables simultaneous phase-current sampling without external analog front ends, and the high-resolution PWM peripheral drives the three-phase inverter directly. 512 KB Flash and 128 KB SRAM hold motor parameters and adaptive control tables. AEC-Q100 qualification supports e-mobility applications.
Рекомендуется
USB-Connected Data Acquisition Module
The PIC32MZ0512EFF100T-E/GJX fits USB-connected data acquisition because its Hi-Speed USB 2.0 OTG controller supports 480 Mbps transfer rates - sufficient for streaming multi-channel 12-bit ADC data to a host PC at tens of kSPS without buffering delays. 128 KB SRAM doubles as a sample FIFO, while 512 KB Flash stores calibration tables and command parsers. 4 SPI and 4 I2C controllers allow daisy-chaining external sensors (accelerometers, thermocouples via ADC) without extra logic. AEC-Q100 grade supports in-vehicle measurement and calibration tools.
Рекомендуется
Embedded Connectivity Router
The PIC32MZ0512EFF100T-E/GJX fits small-form-factor embedded routers because it integrates Ethernet MAC, USB device, and 9 UARTs into a single chip - sufficient to bridge an LTE modem (over USB), a local Ethernet network, and multiple serial sensor buses without an external host CPU. The 200 MHz MIPS core runs lwIP or a lightweight TCP/IP stack with NAT, while dual-panel Flash supports fail-safe firmware updates critical for remote routers. AEC-Q100 grade covers industrial-cabinet and roadside deployments. The 100-pin TFBGA minimizes PCB area versus QFP alternatives.
Рекомендуется
Portable Medical Monitoring Device
The PIC32MZ0512EFF100T-E/GJX supports portable medical monitoring where its 200 MHz DSP-extended core executes signal-processing pipelines (FFT, filtering, feature extraction) for ECG, SpO2, or pulse-oximetry signals. The 12-bit 1 MSPS ADC samples analog front-end channels directly, while 128 KB SRAM buffers raw waveforms before feature extraction. The FPU accelerates 32-bit floating-point math libraries used in clinical-grade algorithms. AEC-Q100-style environmental robustness and low 2.3V-3.6V supply support battery-powered designs. Designers should still validate FDA/IEC 62304 compliance for clinical use.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для PIC32MZ0512EFF100T-E/GJX — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | PIC32MZ0512EFF100-E/GJX | PIC32MZ0512EFF100-I/GJX | PIC32MZ0512EFE100T-E/GJX | PIC32MZ0512EFE100T-I/GJX | PIC32MZ0512EFE100-E/GJX | PIC32MZ0512EFK100T-E/GJX |
|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 100-pin TFBGA (7x7 mm, GJX) | 100-pin TFBGA (7x7 mm, GJX) | 100-pin TFBGA (7x7 mm, GJX) | 100-pin TFBGA (7x7 mm, GJX) | 100-pin TFBGA (7x7 mm, GJX) | 100-pin TFBGA (7x7 mm, GJX) | 100-pin TFBGA (7x7 mm, GJX) |
| Core Clock | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Flash | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB |
| SRAM | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB |
| Crypto Engine | No | No | No | Yes (AES/SHA/RNG) | Yes (AES/SHA/RNG) | Yes (AES/SHA/RNG) | Yes + KGC |
| Temperature Grade | E (Extended) | E (Extended) | I (Industrial -40C to +85C) | E (Extended) | I (Industrial) | E (Extended) | E (Extended) |
| Packaging Form | Tape & Reel | Tray | Tray | Tape & Reel | Tape & Reel | Tray | Tape & Reel |
Ключевые отличия
- Dual-panel Flash for fail-safe live firmware update (против PIC32MZ0512EFF100-E/GJX (tray variant))
- Extended (E) temperature grade (против PIC32MZ0512EFF100-I/GJX (industrial grade))
- No Crypto engine for cost-optimized designs (против PIC32MZ0512EFE100T-E/GJX (with Crypto))
- 512 KB Flash for compact firmware (против PIC32MZ1024EFG100T-E/GJX (1024 KB))
Заметки по проектированию
The 100-ball TFBGA (7x7 mm) package has 0.65 mm ball pitch and requires NSMD (non-solder mask defined) pads on the PCB. Use micro-via fan-out (0.2 mm via-in-pad optional) and a 4-layer stackup with continuous ground plane beneath the BGA for signal integrity and thermal dissipation. According to Microchip package drawing guidance, a 0.3 mm solder mask opening with 0.45 mm copper pad yields a reliable BGA joint. Avoid placing tall components under the BGA footprint on the opposite side, as flex during assembly can crack the joints.
Place 100 nF X7R decoupling capacitors as close as possible to every VDD pin (typically 7-9 VDD balls distributed across the package). Add 4.7 uF bulk ceramic capacitors near the supply pins. The PIC32MZ EF core runs at 200 MHz and can produce high di/dt transients - a 4-layer PCB with dedicated power and ground planes reduces supply bounce. Estimated: at full 200 MHz core + peripherals, peak current draw can exceed 100 mA instantaneous; size the regulator accordingly.
Although the 100-ball TFBGA has limited heat-dissipation area (no exposed pad in this package variant), the PIC32MZ0512EFF100T-E/GJX typical active power is under 200 mW at 200 MHz, so passive cooling is normally sufficient. For continuous full-load operation in elevated ambient temperatures (>70C), provide thermal relief via internal power planes stitched through the BGA. Verify junction temperature against the E-grade ambient ceiling using the Microchip thermal model.
The integrated Hi-Speed USB 2.0 OTG requires matched 90-ohm differential routing on D+/D- with the trace length matched within 150 mil. Place the USB PHY termination components within 4 mm of the USB connector. For Ethernet RMII/MII, route the 50 MHz RMII clock with controlled impedance and length-match to the PHY. For CAN bus, use twisted-pair cabling with 120-ohm termination at both ends; the MCU's CAN TX/RX pins should connect through an external CAN transceiver.
Do not leave unused VDD pins floating - tie every VDD ball to 3.3V and every VSS ball to ground to prevent internal latch-up. The PIC32MZ EF ICSP programming pins (PGECx/PGEDx) must be accessible on the PCB for in-system programming; leaving them unconnected prevents field firmware updates. Ensure the RTCC oscillator (SOSC) is configured if the real-time clock calendar is needed, otherwise tie SOSC pins to ground or leave unconnected per datasheet guidance.
Информация о соответствии
AEC-Q100 qualified for automotive (per datasheets.com listing); RoHS compliant; lead-free and halogen-free packaging per Microchip product family datasheet. The -E temperature grade extends beyond industrial -40C to +85C.
