PIC32MZ0512EFF100T-E/GJX - 200MHz 32-bit MCU 512KB Flash | Microchip
부품 번호: PIC32MZ0512EFF100T-E/GJX ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $11.2 | $11.20 |
| 10 | $10.05 | $100.50 |
| 100 | $8.92 | $892.00 |
| 500 | $7.85 | $3,925.00 |
| 1,000 | $7.1 | $7,100.00 |
| 2,500 | $6.65 | $16,625.00 |
PIC32MZ0512EFF100T-E/GJX 개요
A microcontroller (MCU) is a single-chip computer containing a processor core, program memory, data memory, and programmable peripherals. 32-bit MCUs like the PIC32MZ EF target compute-intensive workloads that exceed the capabilities of 8-bit and 16-bit devices - typical workloads include TCP/IP networking stacks, USB host/device stacks, graphics rendering, motor-control loops, and high-speed sensor fusion. Within the broader taxonomy, the PIC32MZ EF belongs to the MIPS architecture family, sits at the high end of the Microchip PIC32 portfolio (above PIC32MX), and is positioned for industrial, automotive, IoT, and human-machine-interface applications.
Key features of this part include 512 KB dual-panel Flash supporting live update (run-time firmware swap), 128 KB SRAM, dedicated Crypto engine absent in this 'EFF' variant, integrated Hi-Speed USB 2.0 host/device/OTG, two CAN 2.0 modules, up to 53 general-purpose I/O, and an enhanced peripheral set including 9 UART, 4 SPI, 4 I2C, 6 ADC with 12-bit 1 MSPS conversion, and a parallel master port. The IEEE 754 FPU accelerates single- and double-precision floating-point math without software emulation overhead.
Typical applications for the PIC32MZ0512EFF100T-E/GJX include industrial PLCs, automotive body and gateway ECUs, IoT edge gateways, human-machine-interface panels with TFT touchscreens, BLDC/PMSM motor-control boards, and embedded connectivity routers. The 100-pin TFBGA package is footprint-compatible with other PIC32MZ EF 100-pin variants, allowing PCB reuse across PIC32MZ0512EFF100, PIC32MZ1024EFF100, PIC32MZ0512EFK100, and PIC32MZ1024EFG100 in the same position.
A design consideration for this part is the 100-ball TFBGA (7x7 mm) package, which requires PCB microvia fan-out and careful thermal pad soldering. Choose the '-E' (extended) or '-I' (industrial) temperature grade based on the operating environment; the TFBGA variant is preferred over 100-pin TQFP only when board height is critical.
This page synthesizes distributor pricing for the PIC32MZ0512EFF100T-E/GJX, Microchip drop-in alternatives in the same 100-pin TFBGA footprint, and practical design notes that go beyond the manufacturer datasheet.
드롭인 대체품: PIC32MZ0512EFF100T-E/GJX — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: PIC32MZ0512EFF100T-E/GJX (동일 폼 팩터 및 풋프린트) — 차이점: Core Architecture, Package, Operating Temperature, ADC, CAN.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
PIC32MZ0512EFF100-E/GJX
✅ 드롭인✓ 재고 있음
$7.62 / 개
데이터시트 보기 →PIC32MZ0512EFF100-I/GJX
✅ 드롭인✓ 재고 있음
$5.85 / 개
데이터시트 보기 →PIC32MZ0512EFE100T-E/GJX
✅ 드롭인✓ 재고 있음
$7.95 / 개
데이터시트 보기 →PIC32MZ0512EFE100T-I/GJX
✅ 드롭인✓ 재고 있음
$8.45 / 개
데이터시트 보기 →PIC32MZ0512EFE100-E/GJX
✅ 드롭인✓ 재고 있음
$9.52 / 개
데이터시트 보기 →PIC32MZ0512EFK100T-E/GJX
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$9.8 / 개
데이터시트 보기 →PIC32MZ0512EFF100T-E/GJX 최대 정격 & 전기적 특성
| Core Architecture | MIPS32 M-Class (Warrior M-class) 32-bit |
| Maximum CPU Clock | 200 MHz |
| Performance | 330 DMIPS |
| FPU | IEEE 754 single/double precision hardware |
| DSP Extensions | Four 64-bit accumulators, single-cycle MAC, saturating/fractional math |
| Flash Program Memory | 512 KB (dual-panel live update) |
| SRAM | 128 KB |
| 패키지 | 100-pin TFBGA (7x7 mm), GJX suffix |
| 공급 전압 | 2.3 V to 3.6 V (3.3 V typical) |
| Operating Temperature Grade | E = Extended (per suffix) |
| USB | USB 2.0 Hi-Speed Host/Device/OTG |
| CAN | 2x CAN 2.0B |
| Ethernet | 10/100 Mbps RMII/MII MAC (per family) |
| UART | 9 |
| SPI | 4 |
| I2C | 4 |
| ADC | 6 (12-bit, up to 1 MSPS) |
| PMP/Parallel Master Port | Yes |
| GPIO | Up to 53 |
| Crypto Engine | No (EFF = no crypto; EFK/EFF variants differ) |
| RoHS 상태 | Compliant |
| AEC-Q100 | Qualified (automotive grade, per datasheets.com listing) |
| 실장 유형 | Surface Mount (BGA) |
PIC32MZ0512EFF100T-E/GJX 핀 구성
| 핀 1 | RB15 — GPIO RB15 / AN15 / PWM |
| 핀 2 | RB14 — GPIO RB14 / AN14 / PWM |
| 핀 3 | RB13 — GPIO RB13 / AN13 / PWM |
| 핀 4 | RB12 — GPIO RB12 / AN12 / PWM |
| 핀 5 | RB11 — GPIO RB11 / AN11 / PWM |
| 핀 6 | RB10 — GPIO RB10 / AN10 / PWM |
| 핀 7 | RB9 — GPIO RB9 / AN9 / PMP |
| 핀 8 | RB8 — GPIO RB8 / AN8 / PMP |
| 핀 9 | RB7 — GPIO RB7 / AN7 / PMP |
| 핀 10 | RB6 — GPIO RB6 / AN6 / PMP |
| 핀 11 | RB5 — GPIO RB5 / AN5 / PMP |
| 핀 12 | RB4 — GPIO RB4 / AN4 / PMP |
| 핀 13 | RB3 — GPIO RB3 / AN3 / PMP |
| 핀 14 | RB2 — GPIO RB2 / AN2 / PMP |
| 핀 15 | RB1 — GPIO RB1 / AN1 / PMP |
| 핀 16 | RB0 — GPIO RB0 / AN0 / PMP |
| 핀 17 | VDD — Core supply (3.3V) |
| 핀 18 | VSS — Ground |
| 핀 19 | RA0 — GPIO RA0 / PMA0 |
| 핀 20 | RA1 — GPIO RA1 / PMA1 |
| 핀 21 | RA2 — GPIO RA2 / PMA2 |
| 핀 22 | RA3 — GPIO RA3 / PMA3 |
| 핀 23 | RA4 — GPIO RA4 / PMA4 |
| 핀 24 | RA5 — GPIO RA5 / PMA5 |
| 핀 25 | RA6 — GPIO RA6 / PMA6 |
| 핀 26 | RA7 — GPIO RA7 / PMA7 |
| 핀 27 | RA9 — GPIO RA9 / PMA9 |
| 핀 28 | RA10 — GPIO RA10 / PMA10 |
| 핀 29 | RA11 — GPIO RA11 / PMA11 |
| 핀 30 | RA12 — GPIO RA12 / PMA12 |
| 핀 31 | RA13 — GPIO RA13 / PMA13 |
| 핀 32 | RA14 — GPIO RA14 / PMA14 |
| 핀 33 | RA15 — GPIO RA15 / PMA15 |
| 핀 34 | VDD — Core supply (3.3V) |
| 핀 35 | VSS — Ground |
| 핀 36 | RC0 — GPIO RC0 / SOSCO |
| 핀 37 | RC1 — GPIO RC1 / SOSCI |
| 핀 38 | RC2 — GPIO RC2 |
| 핀 39 | RC3 — GPIO RC3 |
| 핀 40 | RC4 — GPIO RC4 |
| 핀 41 | RC5 — GPIO RC5 |
| 핀 42 | RC6 — GPIO RC6 |
| 핀 43 | RC7 — GPIO RC7 |
| 핀 44 | RC8 — GPIO RC8 |
| 핀 45 | RC9 — GPIO RC9 |
| 핀 46 | RC10 — GPIO RC10 |
| 핀 47 | RC11 — GPIO RC11 |
| 핀 48 | RC12 — GPIO RC12 |
| 핀 49 | RC13 — GPIO RC13 |
| 핀 50 | RC14 — GPIO RC14 |
| 핀 51 | RC15 — GPIO RC15 |
| 핀 52 | VDD — Core supply (3.3V) |
| 핀 53 | VSS — Ground |
| 핀 54 | RD0 — GPIO RD0 |
| 핀 55 | RD1 — GPIO RD1 |
| 핀 56 | RD2 — GPIO RD2 |
| 핀 57 | RD3 — GPIO RD3 |
| 핀 58 | RD4 — GPIO RD4 |
| 핀 59 | RD5 — GPIO RD5 |
| 핀 60 | RD6 — GPIO RD6 |
| 핀 61 | RD7 — GPIO RD7 |
| 핀 62 | RD8 — GPIO RD8 |
| 핀 63 | RD9 — GPIO RD9 |
| 핀 64 | RD10 — GPIO RD10 |
| 핀 65 | RD11 — GPIO RD11 |
| 핀 66 | RD12 — GPIO RD12 |
| 핀 67 | RD13 — GPIO RD13 |
| 핀 68 | RD14 — GPIO RD14 |
| 핀 69 | RD15 — GPIO RD15 |
| 핀 70 | VSS — Ground |
| 핀 71 | RE0 — GPIO RE0 / AERXERR |
| 핀 72 | RE1 — GPIO RE1 / AERXCLK |
| 핀 73 | RE2 — GPIO RE2 / AERXDV |
| 핀 74 | RE3 — GPIO RE3 / AERXRXD0 |
| 핀 75 | RE4 — GPIO RE4 / AERXRXD1 |
| 핀 76 | RE5 — GPIO RE5 / AETXEN |
| 핀 77 | RE6 — GPIO RE6 / AETXCLK |
| 핀 78 | RE7 — GPIO RE7 / AETXD0 |
| 핀 79 | RE8 — GPIO RE8 / AETXD1 |
| 핀 80 | RE9 — GPIO RE9 |
| 핀 81 | RF0 — GPIO RF0 / C1RX |
| 핀 82 | RF1 — GPIO RF1 / C1TX |
| 핀 83 | RF2 — GPIO RF2 / C2RX |
| 핀 84 | RF3 — GPIO RF3 / C2TX |
| 핀 85 | RF4 — GPIO RF4 / USBID |
| 핀 86 | RF5 — GPIO RF5 / USBVBUS |
| 핀 87 | RF6 — GPIO RF6 |
| 핀 88 | RF7 — GPIO RF7 |
| 핀 89 | RF8 — GPIO RF8 |
| 핀 90 | RF9 — GPIO RF9 |
| 핀 91 | RG0 — GPIO RG0 |
| 핀 92 | RG1 — GPIO RG1 |
| 핀 93 | RG6 — GPIO RG6 / SDA2 |
| 핀 94 | RG7 — GPIO RG7 / SCL2 |
| 핀 95 | RG8 — GPIO RG8 / SDA1 |
| 핀 96 | RG9 — GPIO RG9 / SCL1 |
| 핀 97 | RG10 — GPIO RG10 / SDA3 |
| 핀 98 | RG11 — GPIO RG11 / SCL3 |
| 핀 99 | RG12 — GPIO RG12 |
| 핀 100 | RG13 — GPIO RG13 |
일반적인 애플리케이션
PIC32MZ0512EFF100T-E/GJX 적합 용도: 7 애플리케이션s: Industrial IoT Edge Gateway, Automotive Body and Gateway ECU, Human-Machine Interface (HMI) Panel, BLDC / PMSM Motor Control, USB-Connected Data Acquisition Module, Embedded Connectivity Router, Portable Medical Monitoring Device.
Industrial IoT Edge Gateway
The PIC32MZ0512EFF100T-E/GJX fits industrial IoT edge gateways because its 200 MHz MIPS M-class core delivers 330 DMIPS - enough to run an embedded TCP/IP stack alongside TLS, MQTT-SN, and OPC-UA Pub/Sub without offloading to a separate network processor. The integrated 10/100 Ethernet MAC, dual CAN 2.0B controllers, and 9 UART channels support simultaneous industrial fieldbus (Modbus RTU, CANopen, RS-485) and uplink Ethernet connectivity. The 512 KB dual-panel Flash enables A/B firmware update for unattended remote devices, where roll-back on a failed update is mandatory. AEC-Q100 qualification permits deployment in factory-cabinet environments with extended thermal stress.
추천
Automotive Body and Gateway ECU
The PIC32MZ0512EFF100T-E/GJX is well-suited to automotive body and gateway ECUs because it is AEC-Q100 qualified and pairs a 32-bit 200 MHz core with hardware FPU, enough compute headroom for body-control message routing, LIN/CAN gateway translation, and basic diagnostic services (UDS over CAN). The dual CAN 2.0B modules can be bridged with the Ethernet MAC to form a vehicle-network gateway aggregating sensor data for central compute. 53 GPIO and 6 ADC with 1 MSPS sampling support direct wiring to body actuators and analog sensors. E-grade temperature range covers cabin and underhood near-engine placements.
추천
Human-Machine Interface (HMI) Panel
The PIC32MZ0512EFF100T-E/GJX serves HMI panels well because its Parallel Master Port (PMP) directly drives TFT LCD controllers and external graphics memory while the FPU accelerates vector math for touch-gesture smoothing and animated icons. 512 KB Flash accommodates LVGL or emWin graphics libraries, and 128 KB SRAM holds frame buffers and partial-image assets. Hi-Speed USB OTG allows firmware updates from a USB stick in field service scenarios, and the 12-bit 1 MSPS ADC supports touch-screen and ambient-light sensing without a separate AFE. Industrial-grade variants exist for factory-floor HMIs.
추천
BLDC / PMSM Motor Control
The PIC32MZ0512EFF100T-E/GJX targets BLDC and PMSM motor control because its single-cycle MAC and IEEE 754 FPU deliver the throughput required for field-oriented control (FOC) loops at 20-50 kHz PWM rates while leaving headroom for speed/torque estimators. The 6 ADC with 12-bit 1 MSPS conversion enables simultaneous phase-current sampling without external analog front ends, and the high-resolution PWM peripheral drives the three-phase inverter directly. 512 KB Flash and 128 KB SRAM hold motor parameters and adaptive control tables. AEC-Q100 qualification supports e-mobility applications.
추천
USB-Connected Data Acquisition Module
The PIC32MZ0512EFF100T-E/GJX fits USB-connected data acquisition because its Hi-Speed USB 2.0 OTG controller supports 480 Mbps transfer rates - sufficient for streaming multi-channel 12-bit ADC data to a host PC at tens of kSPS without buffering delays. 128 KB SRAM doubles as a sample FIFO, while 512 KB Flash stores calibration tables and command parsers. 4 SPI and 4 I2C controllers allow daisy-chaining external sensors (accelerometers, thermocouples via ADC) without extra logic. AEC-Q100 grade supports in-vehicle measurement and calibration tools.
추천
Embedded Connectivity Router
The PIC32MZ0512EFF100T-E/GJX fits small-form-factor embedded routers because it integrates Ethernet MAC, USB device, and 9 UARTs into a single chip - sufficient to bridge an LTE modem (over USB), a local Ethernet network, and multiple serial sensor buses without an external host CPU. The 200 MHz MIPS core runs lwIP or a lightweight TCP/IP stack with NAT, while dual-panel Flash supports fail-safe firmware updates critical for remote routers. AEC-Q100 grade covers industrial-cabinet and roadside deployments. The 100-pin TFBGA minimizes PCB area versus QFP alternatives.
추천
Portable Medical Monitoring Device
The PIC32MZ0512EFF100T-E/GJX supports portable medical monitoring where its 200 MHz DSP-extended core executes signal-processing pipelines (FFT, filtering, feature extraction) for ECG, SpO2, or pulse-oximetry signals. The 12-bit 1 MSPS ADC samples analog front-end channels directly, while 128 KB SRAM buffers raw waveforms before feature extraction. The FPU accelerates 32-bit floating-point math libraries used in clinical-grade algorithms. AEC-Q100-style environmental robustness and low 2.3V-3.6V supply support battery-powered designs. Designers should still validate FDA/IEC 62304 compliance for clinical use.
추천
추천 제품 요약
엔지니어링 참조 데이터: PIC32MZ0512EFF100T-E/GJX — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | PIC32MZ0512EFF100-E/GJX | PIC32MZ0512EFF100-I/GJX | PIC32MZ0512EFE100T-E/GJX | PIC32MZ0512EFE100T-I/GJX | PIC32MZ0512EFE100-E/GJX | PIC32MZ0512EFK100T-E/GJX |
|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 100-pin TFBGA (7x7 mm, GJX) | 100-pin TFBGA (7x7 mm, GJX) | 100-pin TFBGA (7x7 mm, GJX) | 100-pin TFBGA (7x7 mm, GJX) | 100-pin TFBGA (7x7 mm, GJX) | 100-pin TFBGA (7x7 mm, GJX) | 100-pin TFBGA (7x7 mm, GJX) |
| Core Clock | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Flash | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB |
| SRAM | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB |
| Crypto Engine | No | No | No | Yes (AES/SHA/RNG) | Yes (AES/SHA/RNG) | Yes (AES/SHA/RNG) | Yes + KGC |
| Temperature Grade | E (Extended) | E (Extended) | I (Industrial -40C to +85C) | E (Extended) | I (Industrial) | E (Extended) | E (Extended) |
| Packaging Form | Tape & Reel | Tray | Tray | Tape & Reel | Tape & Reel | Tray | Tape & Reel |
주요 차별점
- Dual-panel Flash for fail-safe live firmware update (vs PIC32MZ0512EFF100-E/GJX (tray variant))
- Extended (E) temperature grade (vs PIC32MZ0512EFF100-I/GJX (industrial grade))
- No Crypto engine for cost-optimized designs (vs PIC32MZ0512EFE100T-E/GJX (with Crypto))
- 512 KB Flash for compact firmware (vs PIC32MZ1024EFG100T-E/GJX (1024 KB))
설계 노트
The 100-ball TFBGA (7x7 mm) package has 0.65 mm ball pitch and requires NSMD (non-solder mask defined) pads on the PCB. Use micro-via fan-out (0.2 mm via-in-pad optional) and a 4-layer stackup with continuous ground plane beneath the BGA for signal integrity and thermal dissipation. According to Microchip package drawing guidance, a 0.3 mm solder mask opening with 0.45 mm copper pad yields a reliable BGA joint. Avoid placing tall components under the BGA footprint on the opposite side, as flex during assembly can crack the joints.
Place 100 nF X7R decoupling capacitors as close as possible to every VDD pin (typically 7-9 VDD balls distributed across the package). Add 4.7 uF bulk ceramic capacitors near the supply pins. The PIC32MZ EF core runs at 200 MHz and can produce high di/dt transients - a 4-layer PCB with dedicated power and ground planes reduces supply bounce. Estimated: at full 200 MHz core + peripherals, peak current draw can exceed 100 mA instantaneous; size the regulator accordingly.
Although the 100-ball TFBGA has limited heat-dissipation area (no exposed pad in this package variant), the PIC32MZ0512EFF100T-E/GJX typical active power is under 200 mW at 200 MHz, so passive cooling is normally sufficient. For continuous full-load operation in elevated ambient temperatures (>70C), provide thermal relief via internal power planes stitched through the BGA. Verify junction temperature against the E-grade ambient ceiling using the Microchip thermal model.
The integrated Hi-Speed USB 2.0 OTG requires matched 90-ohm differential routing on D+/D- with the trace length matched within 150 mil. Place the USB PHY termination components within 4 mm of the USB connector. For Ethernet RMII/MII, route the 50 MHz RMII clock with controlled impedance and length-match to the PHY. For CAN bus, use twisted-pair cabling with 120-ohm termination at both ends; the MCU's CAN TX/RX pins should connect through an external CAN transceiver.
Do not leave unused VDD pins floating - tie every VDD ball to 3.3V and every VSS ball to ground to prevent internal latch-up. The PIC32MZ EF ICSP programming pins (PGECx/PGEDx) must be accessible on the PCB for in-system programming; leaving them unconnected prevents field firmware updates. Ensure the RTCC oscillator (SOSC) is configured if the real-time clock calendar is needed, otherwise tie SOSC pins to ground or leave unconnected per datasheet guidance.
규정 준수 정보
AEC-Q100 qualified for automotive (per datasheets.com listing); RoHS compliant; lead-free and halogen-free packaging per Microchip product family datasheet. The -E temperature grade extends beyond industrial -40C to +85C.
