PIC32MZ0512EFF100T-E/GJX - 200MHz 32-bit MCU 512KB Flash | Microchip
Référence : PIC32MZ0512EFF100T-E/GJX ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $11.2 | $11,20 |
| 10 | $10.05 | $100,50 |
| 100 | $8.92 | $892,00 |
| 500 | $7.85 | $3 925,00 |
| 1 000 | $7.1 | $7 100,00 |
| 2 500 | $6.65 | $16 625,00 |
PIC32MZ0512EFF100T-E/GJX Présentation
A microcontroller (MCU) is a single-chip computer containing a processor core, program memory, data memory, and programmable peripherals. 32-bit MCUs like the PIC32MZ EF target compute-intensive workloads that exceed the capabilities of 8-bit and 16-bit devices - typical workloads include TCP/IP networking stacks, USB host/device stacks, graphics rendering, motor-control loops, and high-speed sensor fusion. Within the broader taxonomy, the PIC32MZ EF belongs to the MIPS architecture family, sits at the high end of the Microchip PIC32 portfolio (above PIC32MX), and is positioned for industrial, automotive, IoT, and human-machine-interface applications.
Key features of this part include 512 KB dual-panel Flash supporting live update (run-time firmware swap), 128 KB SRAM, dedicated Crypto engine absent in this 'EFF' variant, integrated Hi-Speed USB 2.0 host/device/OTG, two CAN 2.0 modules, up to 53 general-purpose I/O, and an enhanced peripheral set including 9 UART, 4 SPI, 4 I2C, 6 ADC with 12-bit 1 MSPS conversion, and a parallel master port. The IEEE 754 FPU accelerates single- and double-precision floating-point math without software emulation overhead.
Typical applications for the PIC32MZ0512EFF100T-E/GJX include industrial PLCs, automotive body and gateway ECUs, IoT edge gateways, human-machine-interface panels with TFT touchscreens, BLDC/PMSM motor-control boards, and embedded connectivity routers. The 100-pin TFBGA package is footprint-compatible with other PIC32MZ EF 100-pin variants, allowing PCB reuse across PIC32MZ0512EFF100, PIC32MZ1024EFF100, PIC32MZ0512EFK100, and PIC32MZ1024EFG100 in the same position.
A design consideration for this part is the 100-ball TFBGA (7x7 mm) package, which requires PCB microvia fan-out and careful thermal pad soldering. Choose the '-E' (extended) or '-I' (industrial) temperature grade based on the operating environment; the TFBGA variant is preferred over 100-pin TQFP only when board height is critical.
This page synthesizes distributor pricing for the PIC32MZ0512EFF100T-E/GJX, Microchip drop-in alternatives in the same 100-pin TFBGA footprint, and practical design notes that go beyond the manufacturer datasheet.
Alternatives de remplacement direct pour PIC32MZ0512EFF100T-E/GJX — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MZ0512EFF100T-E/GJX (même facteur de forme et même empreinte) — différant par Core Architecture, Package, Operating Temperature, ADC, CAN.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MZ0512EFF100-E/GJX
✅ Remplacement direct✓ En stock
$7.62 / unité
Voir la fiche technique →PIC32MZ0512EFF100-I/GJX
✅ Remplacement direct✓ En stock
$5.85 / unité
Voir la fiche technique →PIC32MZ0512EFE100T-E/GJX
✅ Remplacement direct✓ En stock
$7.95 / unité
Voir la fiche technique →PIC32MZ0512EFE100T-I/GJX
✅ Remplacement direct✓ En stock
$8.45 / unité
Voir la fiche technique →PIC32MZ0512EFE100-E/GJX
✅ Remplacement direct✓ En stock
$9.52 / unité
Voir la fiche technique →PIC32MZ0512EFK100T-E/GJX
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$9.8 / unité
Voir la fiche technique →PIC32MZ0512EFF100T-E/GJX Valeurs maximales et caractéristiques électriques
| Core Architecture | MIPS32 M-Class (Warrior M-class) 32-bit |
| Maximum CPU Clock | 200 MHz |
| Performance | 330 DMIPS |
| FPU | IEEE 754 single/double precision hardware |
| DSP Extensions | Four 64-bit accumulators, single-cycle MAC, saturating/fractional math |
| Flash Program Memory | 512 KB (dual-panel live update) |
| SRAM | 128 KB |
| Boîtier | 100-pin TFBGA (7x7 mm), GJX suffix |
| Tension d'alimentation | 2.3 V to 3.6 V (3.3 V typical) |
| Operating Temperature Grade | E = Extended (per suffix) |
| USB | USB 2.0 Hi-Speed Host/Device/OTG |
| CAN | 2x CAN 2.0B |
| Ethernet | 10/100 Mbps RMII/MII MAC (per family) |
| UART | 9 |
| SPI | 4 |
| I2C | 4 |
| ADC | 6 (12-bit, up to 1 MSPS) |
| PMP/Parallel Master Port | Yes |
| GPIO | Up to 53 |
| Crypto Engine | No (EFF = no crypto; EFK/EFF variants differ) |
| Statut RoHS | Compliant |
| AEC-Q100 | Qualified (automotive grade, per datasheets.com listing) |
| Type de montage | Surface Mount (BGA) |
Configuration des broches de PIC32MZ0512EFF100T-E/GJX
| Broche 1 | RB15 — GPIO RB15 / AN15 / PWM |
| Broche 2 | RB14 — GPIO RB14 / AN14 / PWM |
| Broche 3 | RB13 — GPIO RB13 / AN13 / PWM |
| Broche 4 | RB12 — GPIO RB12 / AN12 / PWM |
| Broche 5 | RB11 — GPIO RB11 / AN11 / PWM |
| Broche 6 | RB10 — GPIO RB10 / AN10 / PWM |
| Broche 7 | RB9 — GPIO RB9 / AN9 / PMP |
| Broche 8 | RB8 — GPIO RB8 / AN8 / PMP |
| Broche 9 | RB7 — GPIO RB7 / AN7 / PMP |
| Broche 10 | RB6 — GPIO RB6 / AN6 / PMP |
| Broche 11 | RB5 — GPIO RB5 / AN5 / PMP |
| Broche 12 | RB4 — GPIO RB4 / AN4 / PMP |
| Broche 13 | RB3 — GPIO RB3 / AN3 / PMP |
| Broche 14 | RB2 — GPIO RB2 / AN2 / PMP |
| Broche 15 | RB1 — GPIO RB1 / AN1 / PMP |
| Broche 16 | RB0 — GPIO RB0 / AN0 / PMP |
| Broche 17 | VDD — Core supply (3.3V) |
| Broche 18 | VSS — Ground |
| Broche 19 | RA0 — GPIO RA0 / PMA0 |
| Broche 20 | RA1 — GPIO RA1 / PMA1 |
| Broche 21 | RA2 — GPIO RA2 / PMA2 |
| Broche 22 | RA3 — GPIO RA3 / PMA3 |
| Broche 23 | RA4 — GPIO RA4 / PMA4 |
| Broche 24 | RA5 — GPIO RA5 / PMA5 |
| Broche 25 | RA6 — GPIO RA6 / PMA6 |
| Broche 26 | RA7 — GPIO RA7 / PMA7 |
| Broche 27 | RA9 — GPIO RA9 / PMA9 |
| Broche 28 | RA10 — GPIO RA10 / PMA10 |
| Broche 29 | RA11 — GPIO RA11 / PMA11 |
| Broche 30 | RA12 — GPIO RA12 / PMA12 |
| Broche 31 | RA13 — GPIO RA13 / PMA13 |
| Broche 32 | RA14 — GPIO RA14 / PMA14 |
| Broche 33 | RA15 — GPIO RA15 / PMA15 |
| Broche 34 | VDD — Core supply (3.3V) |
| Broche 35 | VSS — Ground |
| Broche 36 | RC0 — GPIO RC0 / SOSCO |
| Broche 37 | RC1 — GPIO RC1 / SOSCI |
| Broche 38 | RC2 — GPIO RC2 |
| Broche 39 | RC3 — GPIO RC3 |
| Broche 40 | RC4 — GPIO RC4 |
| Broche 41 | RC5 — GPIO RC5 |
| Broche 42 | RC6 — GPIO RC6 |
| Broche 43 | RC7 — GPIO RC7 |
| Broche 44 | RC8 — GPIO RC8 |
| Broche 45 | RC9 — GPIO RC9 |
| Broche 46 | RC10 — GPIO RC10 |
| Broche 47 | RC11 — GPIO RC11 |
| Broche 48 | RC12 — GPIO RC12 |
| Broche 49 | RC13 — GPIO RC13 |
| Broche 50 | RC14 — GPIO RC14 |
| Broche 51 | RC15 — GPIO RC15 |
| Broche 52 | VDD — Core supply (3.3V) |
| Broche 53 | VSS — Ground |
| Broche 54 | RD0 — GPIO RD0 |
| Broche 55 | RD1 — GPIO RD1 |
| Broche 56 | RD2 — GPIO RD2 |
| Broche 57 | RD3 — GPIO RD3 |
| Broche 58 | RD4 — GPIO RD4 |
| Broche 59 | RD5 — GPIO RD5 |
| Broche 60 | RD6 — GPIO RD6 |
| Broche 61 | RD7 — GPIO RD7 |
| Broche 62 | RD8 — GPIO RD8 |
| Broche 63 | RD9 — GPIO RD9 |
| Broche 64 | RD10 — GPIO RD10 |
| Broche 65 | RD11 — GPIO RD11 |
| Broche 66 | RD12 — GPIO RD12 |
| Broche 67 | RD13 — GPIO RD13 |
| Broche 68 | RD14 — GPIO RD14 |
| Broche 69 | RD15 — GPIO RD15 |
| Broche 70 | VSS — Ground |
| Broche 71 | RE0 — GPIO RE0 / AERXERR |
| Broche 72 | RE1 — GPIO RE1 / AERXCLK |
| Broche 73 | RE2 — GPIO RE2 / AERXDV |
| Broche 74 | RE3 — GPIO RE3 / AERXRXD0 |
| Broche 75 | RE4 — GPIO RE4 / AERXRXD1 |
| Broche 76 | RE5 — GPIO RE5 / AETXEN |
| Broche 77 | RE6 — GPIO RE6 / AETXCLK |
| Broche 78 | RE7 — GPIO RE7 / AETXD0 |
| Broche 79 | RE8 — GPIO RE8 / AETXD1 |
| Broche 80 | RE9 — GPIO RE9 |
| Broche 81 | RF0 — GPIO RF0 / C1RX |
| Broche 82 | RF1 — GPIO RF1 / C1TX |
| Broche 83 | RF2 — GPIO RF2 / C2RX |
| Broche 84 | RF3 — GPIO RF3 / C2TX |
| Broche 85 | RF4 — GPIO RF4 / USBID |
| Broche 86 | RF5 — GPIO RF5 / USBVBUS |
| Broche 87 | RF6 — GPIO RF6 |
| Broche 88 | RF7 — GPIO RF7 |
| Broche 89 | RF8 — GPIO RF8 |
| Broche 90 | RF9 — GPIO RF9 |
| Broche 91 | RG0 — GPIO RG0 |
| Broche 92 | RG1 — GPIO RG1 |
| Broche 93 | RG6 — GPIO RG6 / SDA2 |
| Broche 94 | RG7 — GPIO RG7 / SCL2 |
| Broche 95 | RG8 — GPIO RG8 / SDA1 |
| Broche 96 | RG9 — GPIO RG9 / SCL1 |
| Broche 97 | RG10 — GPIO RG10 / SDA3 |
| Broche 98 | RG11 — GPIO RG11 / SCL3 |
| Broche 99 | RG12 — GPIO RG12 |
| Broche 100 | RG13 — GPIO RG13 |
Applications typiques
PIC32MZ0512EFF100T-E/GJX convient pour 7 applications: Industrial IoT Edge Gateway, Automotive Body and Gateway ECU, Human-Machine Interface (HMI) Panel, BLDC / PMSM Motor Control, USB-Connected Data Acquisition Module, Embedded Connectivity Router, Portable Medical Monitoring Device.
Industrial IoT Edge Gateway
The PIC32MZ0512EFF100T-E/GJX fits industrial IoT edge gateways because its 200 MHz MIPS M-class core delivers 330 DMIPS - enough to run an embedded TCP/IP stack alongside TLS, MQTT-SN, and OPC-UA Pub/Sub without offloading to a separate network processor. The integrated 10/100 Ethernet MAC, dual CAN 2.0B controllers, and 9 UART channels support simultaneous industrial fieldbus (Modbus RTU, CANopen, RS-485) and uplink Ethernet connectivity. The 512 KB dual-panel Flash enables A/B firmware update for unattended remote devices, where roll-back on a failed update is mandatory. AEC-Q100 qualification permits deployment in factory-cabinet environments with extended thermal stress.
Recommandé
Automotive Body and Gateway ECU
The PIC32MZ0512EFF100T-E/GJX is well-suited to automotive body and gateway ECUs because it is AEC-Q100 qualified and pairs a 32-bit 200 MHz core with hardware FPU, enough compute headroom for body-control message routing, LIN/CAN gateway translation, and basic diagnostic services (UDS over CAN). The dual CAN 2.0B modules can be bridged with the Ethernet MAC to form a vehicle-network gateway aggregating sensor data for central compute. 53 GPIO and 6 ADC with 1 MSPS sampling support direct wiring to body actuators and analog sensors. E-grade temperature range covers cabin and underhood near-engine placements.
Recommandé
Human-Machine Interface (HMI) Panel
The PIC32MZ0512EFF100T-E/GJX serves HMI panels well because its Parallel Master Port (PMP) directly drives TFT LCD controllers and external graphics memory while the FPU accelerates vector math for touch-gesture smoothing and animated icons. 512 KB Flash accommodates LVGL or emWin graphics libraries, and 128 KB SRAM holds frame buffers and partial-image assets. Hi-Speed USB OTG allows firmware updates from a USB stick in field service scenarios, and the 12-bit 1 MSPS ADC supports touch-screen and ambient-light sensing without a separate AFE. Industrial-grade variants exist for factory-floor HMIs.
Recommandé
BLDC / PMSM Motor Control
The PIC32MZ0512EFF100T-E/GJX targets BLDC and PMSM motor control because its single-cycle MAC and IEEE 754 FPU deliver the throughput required for field-oriented control (FOC) loops at 20-50 kHz PWM rates while leaving headroom for speed/torque estimators. The 6 ADC with 12-bit 1 MSPS conversion enables simultaneous phase-current sampling without external analog front ends, and the high-resolution PWM peripheral drives the three-phase inverter directly. 512 KB Flash and 128 KB SRAM hold motor parameters and adaptive control tables. AEC-Q100 qualification supports e-mobility applications.
Recommandé
USB-Connected Data Acquisition Module
The PIC32MZ0512EFF100T-E/GJX fits USB-connected data acquisition because its Hi-Speed USB 2.0 OTG controller supports 480 Mbps transfer rates - sufficient for streaming multi-channel 12-bit ADC data to a host PC at tens of kSPS without buffering delays. 128 KB SRAM doubles as a sample FIFO, while 512 KB Flash stores calibration tables and command parsers. 4 SPI and 4 I2C controllers allow daisy-chaining external sensors (accelerometers, thermocouples via ADC) without extra logic. AEC-Q100 grade supports in-vehicle measurement and calibration tools.
Recommandé
Embedded Connectivity Router
The PIC32MZ0512EFF100T-E/GJX fits small-form-factor embedded routers because it integrates Ethernet MAC, USB device, and 9 UARTs into a single chip - sufficient to bridge an LTE modem (over USB), a local Ethernet network, and multiple serial sensor buses without an external host CPU. The 200 MHz MIPS core runs lwIP or a lightweight TCP/IP stack with NAT, while dual-panel Flash supports fail-safe firmware updates critical for remote routers. AEC-Q100 grade covers industrial-cabinet and roadside deployments. The 100-pin TFBGA minimizes PCB area versus QFP alternatives.
Recommandé
Portable Medical Monitoring Device
The PIC32MZ0512EFF100T-E/GJX supports portable medical monitoring where its 200 MHz DSP-extended core executes signal-processing pipelines (FFT, filtering, feature extraction) for ECG, SpO2, or pulse-oximetry signals. The 12-bit 1 MSPS ADC samples analog front-end channels directly, while 128 KB SRAM buffers raw waveforms before feature extraction. The FPU accelerates 32-bit floating-point math libraries used in clinical-grade algorithms. AEC-Q100-style environmental robustness and low 2.3V-3.6V supply support battery-powered designs. Designers should still validate FDA/IEC 62304 compliance for clinical use.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MZ0512EFF100T-E/GJX — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MZ0512EFF100-E/GJX | PIC32MZ0512EFF100-I/GJX | PIC32MZ0512EFE100T-E/GJX | PIC32MZ0512EFE100T-I/GJX | PIC32MZ0512EFE100-E/GJX | PIC32MZ0512EFK100T-E/GJX |
|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 100-pin TFBGA (7x7 mm, GJX) | 100-pin TFBGA (7x7 mm, GJX) | 100-pin TFBGA (7x7 mm, GJX) | 100-pin TFBGA (7x7 mm, GJX) | 100-pin TFBGA (7x7 mm, GJX) | 100-pin TFBGA (7x7 mm, GJX) | 100-pin TFBGA (7x7 mm, GJX) |
| Core Clock | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Flash | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB |
| SRAM | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB |
| Crypto Engine | No | No | No | Yes (AES/SHA/RNG) | Yes (AES/SHA/RNG) | Yes (AES/SHA/RNG) | Yes + KGC |
| Temperature Grade | E (Extended) | E (Extended) | I (Industrial -40C to +85C) | E (Extended) | I (Industrial) | E (Extended) | E (Extended) |
| Packaging Form | Tape & Reel | Tray | Tray | Tape & Reel | Tape & Reel | Tray | Tape & Reel |
Principaux différenciateurs
- Dual-panel Flash for fail-safe live firmware update (vs PIC32MZ0512EFF100-E/GJX (tray variant))
- Extended (E) temperature grade (vs PIC32MZ0512EFF100-I/GJX (industrial grade))
- No Crypto engine for cost-optimized designs (vs PIC32MZ0512EFE100T-E/GJX (with Crypto))
- 512 KB Flash for compact firmware (vs PIC32MZ1024EFG100T-E/GJX (1024 KB))
Notes de conception
The 100-ball TFBGA (7x7 mm) package has 0.65 mm ball pitch and requires NSMD (non-solder mask defined) pads on the PCB. Use micro-via fan-out (0.2 mm via-in-pad optional) and a 4-layer stackup with continuous ground plane beneath the BGA for signal integrity and thermal dissipation. According to Microchip package drawing guidance, a 0.3 mm solder mask opening with 0.45 mm copper pad yields a reliable BGA joint. Avoid placing tall components under the BGA footprint on the opposite side, as flex during assembly can crack the joints.
Place 100 nF X7R decoupling capacitors as close as possible to every VDD pin (typically 7-9 VDD balls distributed across the package). Add 4.7 uF bulk ceramic capacitors near the supply pins. The PIC32MZ EF core runs at 200 MHz and can produce high di/dt transients - a 4-layer PCB with dedicated power and ground planes reduces supply bounce. Estimated: at full 200 MHz core + peripherals, peak current draw can exceed 100 mA instantaneous; size the regulator accordingly.
Although the 100-ball TFBGA has limited heat-dissipation area (no exposed pad in this package variant), the PIC32MZ0512EFF100T-E/GJX typical active power is under 200 mW at 200 MHz, so passive cooling is normally sufficient. For continuous full-load operation in elevated ambient temperatures (>70C), provide thermal relief via internal power planes stitched through the BGA. Verify junction temperature against the E-grade ambient ceiling using the Microchip thermal model.
The integrated Hi-Speed USB 2.0 OTG requires matched 90-ohm differential routing on D+/D- with the trace length matched within 150 mil. Place the USB PHY termination components within 4 mm of the USB connector. For Ethernet RMII/MII, route the 50 MHz RMII clock with controlled impedance and length-match to the PHY. For CAN bus, use twisted-pair cabling with 120-ohm termination at both ends; the MCU's CAN TX/RX pins should connect through an external CAN transceiver.
Do not leave unused VDD pins floating - tie every VDD ball to 3.3V and every VSS ball to ground to prevent internal latch-up. The PIC32MZ EF ICSP programming pins (PGECx/PGEDx) must be accessible on the PCB for in-system programming; leaving them unconnected prevents field firmware updates. Ensure the RTCC oscillator (SOSC) is configured if the real-time clock calendar is needed, otherwise tie SOSC pins to ground or leave unconnected per datasheet guidance.
Informations de conformité
AEC-Q100 qualified for automotive (per datasheets.com listing); RoHS compliant; lead-free and halogen-free packaging per Microchip product family datasheet. The -E temperature grade extends beyond industrial -40C to +85C.
