PIC32MX570F512LT-I/GJX - 50MHz 32-bit MCU 512KB Flash TFBGA-100
Артикул: PIC32MX570F512LT-I/GJX ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $7.62 | $7,62 |
| 10 | $6.85 | $68,50 |
| 100 | $6.1 | $610,00 |
| 500 | $5.42 | $2.710,00 |
| 1.000 | $4.78 | $4.780,00 |
PIC32MX570F512LT-I/GJX Обзор
A 32-bit microcontroller (MCU) is an integrated circuit that combines a processor core, program memory (Flash), data memory (SRAM), and a rich set of on-chip peripherals such as timers, communication controllers, and analog blocks. In the system hierarchy, an MCU sits above discrete logic and below a system-on-chip (SoC); the PIC32MX570F512L family targets cost-sensitive embedded applications where MIPS architecture, deterministic interrupt response, and Microchip's MPLAB Harmony toolchain deliver faster development cycles than ARM Cortex-M parts at similar Flash densities.
Key differentiating features include the 50 MHz/83 DMIPS M4K core, integrated Full-Speed USB OTG and CAN 2.0B, an on-chip 16-channel 10-bit ADC with up to 1 Msps sampling, three analog comparators plus a CTMU (Charge Time Measurement Unit) for capacitive touch sensing, and a real-time clock/calendar (RTCC). The 100-pin TFBGA (7x7) footprint provides ample I/O for parallel graphics and PMP-driven LCD interfaces while keeping PCB area minimal.
Architecturally, the part uses a 5-stage pipelined M4K core with hardware multiply/divide, dual I-cache/S-cache, a flexible DMA controller, and Microchip's PPS - allowing most digital peripherals to be remapped to a wide choice of physical pins, which simplifies PCB layout and BOM reuse across family members.
Typical applications include industrial USB peripherals, CAN-based automotive body controllers, audio HMI with I2S codecs, capacitive-touch human-machine interfaces, low-cost graphics terminals, and embedded data-acquisition front-ends. The combination of USB device/host/OTG plus CAN in a single 100-pin BGA makes this MCU particularly attractive for industrial-control gateways.
A key design trade-off is the TFBGA-7x7 package: it minimizes PCB area but requires careful via-in-pad design and X-ray inspection during assembly. Engineers should budget for an additional PCB layer and reflow profile tuning to obtain reliable BGA solder joints in production.
This page synthesizes distributor pricing, drop-in alternatives, and design notes not found in the manufacturer datasheet, giving buyers and engineers a single authoritative source for procurement and design decisions.
Аналоги без доработки для PIC32MX570F512LT-I/GJX — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с PIC32MX570F512LT-I/GJX (тот же форм-фактор и посадочное место) — отличается по Package, ADC, Core Architecture, Parallel Master Port (PMP), I/O Pins.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
PIC32MX570F512LT-50I/GJX
✅ Прямая замена✓ В наличии
$5.47 / шт.
Открыть даташит →PIC32MX270F512LT-I/GJX
✅ Прямая замена✓ В наличии
$5.1 / шт.
Открыть даташит →PIC32MX270F512LT-50I/GJX
✅ Прямая замена✓ В наличии
$4.45 / шт.
Открыть даташит →PIC32MX570F512L-I/PT
✅ Прямая замена✓ В наличии
$4.82 / шт.
Открыть даташит →PIC32MX570F512LT-50I/PF
✅ Прямая замена✓ В наличии
$4.61 / шт.
Открыть даташит →PIC32MX570F512LT-I/GJX Максимальные параметры и электрические характеристики
| Core Architecture | MIPS32 M4K 32-bit RISC |
| Maximum CPU Speed | 50 MHz |
| DMIPS Performance | 83 DMIPS |
| Program Memory (Flash) | 512 KB (512K x 8) |
| SRAM | 64 KB |
| Корпус | 100-pin TFBGA (7x7 mm), GJX suffix |
| Число выводов | 100 |
| Диапазон рабочих температур | -40C to +85C (industrial, 'I' grade) |
| Supply Voltage Range | 2.3 V to 3.6 V |
| USB | USB 2.0 Full-Speed OTG controller |
| CAN | CAN 2.0B with DeviceNet addressing |
| SPI Modules | 4 (shared with I2S) |
| I2S Modules | 2 |
| Parallel Master Port (PMP) | Yes, with dual read/write buffers for graphics |
| Peripheral Pin Select (PPS) | Yes |
| ADC | 10-bit, up to 1 Msps, up to 16 channels |
| Analog Comparators | 3 |
| CTMU | Yes (for capacitive touch / time measurement) |
| RTCC | Yes (Real-Time Clock/Calendar) |
| DMA Channels | Yes |
| Тип монтажа | Surface Mount |
| Packaging | Tape & Reel (T suffix) |
| RoHS | Compliant |
| Lead-Free | Yes |
Конфигурация выводов PIC32MX570F512LT-I/GJX
| Контакт A1 | OSC1/CLKI/RC13 — External oscillator input / digital I/O RC13 |
| Контакт A2 | OSC2/CLKO/RC15 — External oscillator output / digital I/O RC15 |
| Контакт A3 | VSS — Ground reference |
| Контакт A4 | PMA0/RG15 — Parallel Master Port address bit 0 / digital I/O RG15 |
| Контакт A5 | PMA1/RG12 — Parallel Master Port address bit 1 / digital I/O RG12 |
| Контакт A6 | PMA2/RG13 — Parallel Master Port address bit 2 / digital I/O RG13 |
| Контакт A7 | PMA3/RG14 — Parallel Master Port address bit 3 / digital I/O RG14 |
| Контакт A8 | VDD — Positive supply voltage (2.3-3.6 V) |
| Контакт A9 | RC14/SOSCO — Secondary oscillator output / digital I/O RC14 |
| Контакт A10 | RC13/SOSCI — Secondary oscillator input / digital I/O RC13 |
| Контакт B1 | PGED1/AN0/RB0 — Programming data / analog input 0 / digital I/O RB0 |
| Контакт B2 | PGEC1/AN1/RB1 — Programming clock / analog input 1 / digital I/O RB1 |
| Контакт B3 | AN2/RB2 — Analog input 2 / digital I/O RB2 |
| Контакт B4 | AN4/RB4 — Analog input 4 / digital I/O RB4 |
| Контакт B5 | AN6/RB6 — Analog input 6 / digital I/O RB6 |
| Контакт B6 | AN8/RB8 — Analog input 8 / digital I/O RB8 |
| Контакт B7 | AN10/RB10 — Analog input 10 / digital I/O RB10 |
| Контакт B8 | AN12/RB12 — Analog input 12 / digital I/O RB12 |
| Контакт B9 | AN14/RB14 — Analog input 14 / digital I/O RB14 |
| Контакт B10 | VDD — Positive supply voltage |
| Контакт C1 | VSS — Ground reference |
| Контакт C2 | CVREF+/AN3/RB3 — Comparator voltage reference+ / analog input 3 / digital I/O RB3 |
| Контакт C3 | CVREF-/AN5/RB5 — Comparator voltage reference- / analog input 5 / digital I/O RB5 |
| Контакт C4 | AN7/RB7 — Analog input 7 / digital I/O RB7 |
| Контакт C5 | AN9/RB9 — Analog input 9 / digital I/O RB9 |
| Контакт C6 | AN11/RB11 — Analog input 11 / digital I/O RB11 |
| Контакт C7 | AN13/RB13 — Analog input 13 / digital I/O RB13 |
| Контакт C8 | AN15/RB15 — Analog input 15 / digital I/O RB15 |
| Контакт C9 | VSS — Ground reference |
| Контакт C10 | VBUS — USB VBUS sense input |
| Контакт D1 | PGED2/RF0 — Alternate programming data / digital I/O RF0 |
| Контакт D2 | PGEC2/RF1 — Alternate programming clock / digital I/O RF1 |
| Контакт D3 | CN0/RD8 — Change notification input / digital I/O RD8 |
| Контакт D4 | CN1/RD9 — Change notification input / digital I/O RD9 |
| Контакт D5 | CN2/RD10 — Change notification input / digital I/O RD10 |
| Контакт D6 | CN3/RD11 — Change notification input / digital I/O RD11 |
| Контакт D7 | PMRD/CN4/RD4 — Parallel Master Port read / digital I/O RD4 |
| Контакт D8 | PMWR/CN5/RD5 — Parallel Master Port write / digital I/O RD5 |
| Контакт D9 | D-/RF3 — USB D- data line / digital I/O RF3 |
| Контакт D10 | D+/RF2 — USB D+ data line / digital I/O RF2 |
| Контакт E1 | RG6 — Digital I/O RG6 |
| Контакт E2 | RG7 — Digital I/O RG7 |
| Контакт E3 | RG8 — Digital I/O RG8 |
| Контакт E4 | RG9 — Digital I/O RG9 |
| Контакт E5 | RG0 — Digital I/O RG0 |
| Контакт E6 | RG1 — Digital I/O RG1 |
| Контакт E7 | RD6 — Digital I/O RD6 |
| Контакт E8 | RD7 — Digital I/O RD7 |
| Контакт E9 | RF5 — Digital I/O RF5 |
| Контакт E10 | RF4 — Digital I/O RF4 |
| Контакт F1 | PMD0/RE0 — Parallel Master Port data bit 0 / digital I/O RE0 |
| Контакт F2 | PMD1/RE1 — Parallel Master Port data bit 1 / digital I/O RE1 |
| Контакт F3 | PMD2/RE2 — Parallel Master Port data bit 2 / digital I/O RE2 |
| Контакт F4 | PMD3/RE3 — Parallel Master Port data bit 3 / digital I/O RE3 |
| Контакт F5 | PMD4/RE4 — Parallel Master Port data bit 4 / digital I/O RE4 |
| Контакт F6 | PMD5/RE5 — Parallel Master Port data bit 5 / digital I/O RE5 |
| Контакт F7 | PMD6/RE6 — Parallel Master Port data bit 6 / digital I/O RE6 |
| Контакт F8 | PMD7/RE7 — Parallel Master Port data bit 7 / digital I/O RE7 |
| Контакт F9 | RD0 — Digital I/O RD0 |
| Контакт F10 | RD1 — Digital I/O RD1 |
| Контакт G1 | RF6 — Digital I/O RF6 |
| Контакт G2 | RF7 — Digital I/O RF7 |
| Контакт G3 | RF8 — Digital I/O RF8 |
| Контакт G4 | RG2 — Digital I/O RG2 |
| Контакт G5 | RG3 — Digital I/O RG3 |
| Контакт G6 | PMCS1/RD12 — PMP chip select 1 / digital I/O RD12 |
| Контакт G7 | PMCS2/RD13 — PMP chip select 2 / digital I/O RD13 |
| Контакт G8 | PMD8/RD2 — PMP data bit 8 / digital I/O RD2 |
| Контакт G9 | PMD9/RD3 — PMP data bit 9 / digital I/O RD3 |
| Контакт G10 | PMD10/RC1 — PMP data bit 10 / digital I/O RC1 |
| Контакт H1 | PMD11/RC2 — PMP data bit 11 / digital I/O RC2 |
| Контакт H2 | PMD12/RC3 — PMP data bit 12 / digital I/O RC3 |
| Контакт H3 | PMD13/RC4 — PMP data bit 13 / digital I/O RC4 |
| Контакт H4 | PMD14/RC5 — PMP data bit 14 / digital I/O RC5 |
| Контакт H5 | PMD15/RC6 — PMP data bit 15 / digital I/O RC6 |
| Контакт H6 | PMA4/RF13 — Parallel Master Port address bit 4 / digital I/O RF13 |
| Контакт H7 | PMA5/RF12 — Parallel Master Port address bit 5 / digital I/O RF12 |
| Контакт H8 | PMA6/RD15 — Parallel Master Port address bit 6 / digital I/O RD15 |
| Контакт H9 | PMA7/RD14 — Parallel Master Port address bit 7 / digital I/O RD14 |
| Контакт H10 | PMA8/RC7 — Parallel Master Port address bit 8 / digital I/O RC7 |
| Контакт J1 | PMD/RE8 — PMP data/control signal / digital I/O RE8 |
| Контакт J2 | PMALL/RE9 — PMP address latch low / digital I/O RE9 |
| Контакт J3 | PMALH/RE10 — PMP address latch high / digital I/O RE10 |
| Контакт J4 | RF0 — Digital I/O RF0 (alternate function) |
| Контакт J5 | RF1 — Digital I/O RF1 (alternate function) |
| Контакт J6 | PMA9/RG0 — PMP address bit 9 / digital I/O RG0 |
| Контакт J7 | PMA10/RG1 — PMP address bit 10 / digital I/O RG1 |
| Контакт J8 | PMA11/RF5 — PMP address bit 11 / digital I/O RF5 |
| Контакт J9 | PMA12/RF4 — PMP address bit 12 / digital I/O RF4 |
| Контакт J10 | PMA13/RG14 — PMP address bit 13 / digital I/O RG14 |
| Контакт K1 | TCK/RPA0 — JTAG Test Clock / digital I/O |
| Контакт K2 | TDO/RPA1 — JTAG Test Data Out / digital I/O |
| Контакт K3 | TDI/RPA2 — JTAG Test Data In / digital I/O |
| Контакт K4 | TMS/RPA3 — JTAG Test Mode Select / digital I/O |
| Контакт K5 | MCLR/RPA8 — Master Clear reset input / digital I/O |
| Контакт K6 | RA0 — Digital I/O RA0 |
| Контакт K7 | RA1 — Digital I/O RA1 |
| Контакт K8 | RA2 — Digital I/O RA2 |
| Контакт K9 | RA3 — Digital I/O RA3 |
| Контакт K10 | RA4 — Digital I/O RA4 |
Типичное применение
PIC32MX570F512LT-I/GJX подходит для 6 применениеs: Industrial USB-CAN Communication Gateway, Capacitive-Touch Human-Machine Interface (HMI), Audio HMI with I2S Codec and DSP Pre-Processing, Low-Cost Graphics Terminal with PMP, Automotive Body and Comfort Module (CAN Bus Node), Embedded Data Acquisition Front-End.
Industrial USB-CAN Communication Gateway
The PIC32MX570F512LT-I/GJX's integrated USB 2.0 Full-Speed OTG controller and CAN 2.0B module with DeviceNet addressing make it ideal for industrial USB-to-CAN gateways used in factory automation and SCADA systems. At 50 MHz/83 DMIPS, the M4K core can simultaneously service USB HID/CDC bulk transfers and run a 1 Mbps CAN bus with full error handling, leaving headroom for protocol translation. The 512 KB Flash fits a complete USB-CAN bridge stack plus Microchip's free TCP/IP libraries for Ethernet-over-USB variants. Designers typically pair this MCU with an MCP2551 CAN transceiver and USB type-B connector; the TFBGA-100 7x7 footprint enables compact DIN-rail enclosures.
Рекомендуется
Capacitive-Touch Human-Machine Interface (HMI)
The PIC32MX570F512LT-I/GJX integrates Microchip's CTMU (Charge Time Measurement Unit) and up to 16 ADC channels, enabling robust capacitive-touch keypads and sliders for white-goods HMI panels and consumer appliances. The CTMU measures capacitance deltas at microsecond resolution using a constant current source, supporting projected-capacitive (PCAP) overlays and proximity sensing without an external touch controller. With 64 KB SRAM and a hardware PMP, the part can drive small TFT displays for visual feedback alongside touch input. Engineers commonly pair this MCU with the Microchip MTCH6301 touch firmware library and route the TFBGA-100 to a 7-inch TFT via the PMP parallel interface.
Рекомендуется
Audio HMI with I2S Codec and DSP Pre-Processing
The PIC32MX570F512LT-I/GJX provides two I2S interfaces plus four SPI/I2S modules, supporting direct connection to 24-bit audio codecs for voice-prompt and audio playback HMI applications. At 83 DMIPS the M4K core can run audio sample-rate conversion, basic AEC (acoustic echo cancellation), and MP3 decoding concurrently with USB host mass-storage playback. The 512 KB Flash is sufficient for ADPCM audio libraries and bootloader images, while the 64 KB SRAM accommodates double-buffered I2S sample streams without external memory. Typical designs pair this MCU with a Microchip LAN8740A Ethernet PHY for networked audio HMI panels in industrial intercom systems.
Рекомендуется
Low-Cost Graphics Terminal with PMP
The PIC32MX570F512LT-I/GJX's Parallel Master Port (PMP) with dual read/write buffers can drive 3.5-inch to 4.3-inch TFT displays at refresh rates sufficient for menu-driven graphics terminals used in point-of-sale kiosks, vending machines, and industrial operator panels. With 64 KB SRAM the part can store a full graphics framebuffer for WQVGA 480x272 panels in 16-bit color, and the 50 MHz core sustains smooth scrolling animations. Microchip's free MLA graphics library provides primitives, fonts, and widgets to accelerate development. Designers typically pair this MCU with an SPI NOR flash for asset images and route the PMP data bus through the TFBGA's generous I/O count.
Рекомендуется
Automotive Body and Comfort Module (CAN Bus Node)
While not AEC-Q100 qualified, the PIC32MX570F512LT-I/GJX is widely used in non-safety automotive body electronics such as door modules, seat controllers, and interior lighting nodes where its CAN 2.0B with DeviceNet addressing provides seamless integration with the vehicle bus. The 50 MHz/83 DMIPS core handles LIN-to-CAN bridging, LED-matrix driving via PWM, and peripheral diagnostics with low interrupt latency. The 100-pin TFBGA footprint and industrial -40C to +85C temperature range suit behind-the-dashboard enclosures where PCB area is constrained but full automotive certification is not required. For safety-critical ECUs, designers should migrate to AEC-Q100-qualified PIC32MK or SAM E70 family parts instead.
Рекомендуется
Embedded Data Acquisition Front-End
The PIC32MX570F512LT-I/GJX integrates a 10-bit ADC with up to 1 Msps sampling across 16 input channels, suitable for low-to-mid-speed data acquisition front-ends in process-control and instrumentation applications. Combined with three on-chip analog comparators and the CTMU, the part can condition signals from thermocouples, RTDs, and 4-20 mA current loops while the USB OTG port streams digitized data to a host PC for analysis. The 512 KB Flash accommodates calibration tables and Look-Up-RoMs for linearization. Designers commonly pair this MCU with an external SPI 24-bit ADC like the MCP3564 for higher-precision applications where the on-chip 10-bit ADC is insufficient.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для PIC32MX570F512LT-I/GJX — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | PIC32MX570F512LT-50I/GJX | PIC32MX270F512LT-I/GJX | PIC32MX270F512LT-50I/GJX | PIC32MX570F512L-I/PT |
|---|---|---|---|---|---|
| Package | 100-pin TFBGA (7x7 mm) | 100-pin TFBGA (7x7) - same | 100-pin TFBGA (7x7) - same | 100-pin TFBGA (7x7) - same | 100-pin TQFP (12x12) - different footprint |
| Brand | Microchip Technology | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same |
| Core | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit |
| Maximum CPU Speed | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 40 MHz |
| Flash Memory | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB |
| SRAM | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB |
| USB OTG | Yes (Full-Speed) | Yes | No | No | Yes |
| CAN 2.0B | Yes (with DeviceNet) | Yes | Yes | Yes | Yes |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
| Approx. Price (qty 1, USD) | $7.62 | $8.10 - $8.50 (as of 2026-10-03) | $6.50 - $7.20 (as of 2026-10-03) | $7.30 (as of 2026-10-03) | $7.85 (as of 2026-10-03) |
Ключевые отличия
- Combines USB 2.0 OTG and CAN 2.0B in single TFBGA-100 (против PIC32MX270F512LT-I/GJX)
- Higher-grade 50 MHz speed bin available in same package (против PIC32MX570F512LT-50I/GJX)
- Smallest 100-pin footprint in PIC32MX5XX family (против PIC32MX570F512L-I/PT (TQFP-100 12x12))
Заметки по проектированию
The TFBGA-100 (7x7 mm) package requires a carefully designed PCB land pattern with via-in-pad for the BGA balls. Use a 0.4 mm ball pitch and 0.5 mm pad diameter per IPC-7351, with filled-and-capped microvias (typically 0.2-0.25 mm diameter) under each ball for signal escape. Solder mask defined (SMD) pads are preferred over non-solder mask defined (NSMD) pads for BGA packages because they reduce the risk of pad lifting during rework. Plan for at least 4 PCB layers (top signal, ground, power, bottom signal) to provide adequate routing channels between BGA escape vias.
The PIC32MX570F512LT-I/GJX operates from a single 2.3 V to 3.6 V supply. Decouple each VDD/VSS pair with a 100 nF X7R ceramic capacitor placed within 2 mm of the corresponding balls, plus a 4.7 uF bulk capacitor near the package. The USB transceiver pins (D+, D-, VBUS) require separate 100 nF decoupling close to the package to meet USB 2.0 Full-Speed signal-integrity specifications. For battery-powered designs, the on-chip LDO regulator and brown-out reset (BOR) should be enabled in the configuration bits to ensure clean startup; disable the secondary oscillator (SOSC) if not used to reduce quiescent current by approximately 30 uA.
Estimated: at the maximum 50 MHz clock with USB and CAN active and all peripherals enabled, the PIC32MX570F512LT-I/GJX dissipates approximately 75 mW. The TFBGA-100 package has a theta_JA of approximately 35 C/W on a standard JEDEC 4-layer test board, resulting in a junction temperature rise of only 2.6 C above ambient - well within the 125 C maximum junction rating. For sealed enclosures without airflow, ensure that ambient temperature plus this modest self-heating margin does not exceed 85 C, which is the upper limit of the industrial temperature grade. No heatsink is required under any reasonable operating condition.
Three common pitfalls with this MCU: (1) the 'I' suffix in the part number denotes the industrial temperature grade, but does NOT imply USB peripheral is present - some PIC32MX5XX variants ship without USB and the engineer must verify the full MPN against the datasheet ordering table; (2) the Peripheral Pin Select (PPS) feature requires unlock sequences to remap peripheral functions - forgetting the PPSUnlock macro in MPLAB Harmony causes silent I/O failures that are difficult to debug; (3) the 100-pin TFBGA is NOT pin-compatible with the 100-pin TQFP (12x12) or TQFP (14x14) variants, so footprint differences must be verified before substituting PF-suffix or PT-suffix parts onto a GJX-design PCB.
Информация о соответствии
Per Microchip product page; -40C to +85C industrial temperature grade; Pb-free and RoHS compliant; not AEC-Q100 qualified (use PIC32MK family for automotive).
